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NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
CSV information
| Status | archived |
|---|---|
| Valid from | 27.09.2017 |
| Valid until | 27.09.2022 |
| Scheme | 🇩🇪 DE |
| Manufacturer | NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity |
| Category | ICs, Smart Cards and Smart Card-Related Devices and Systems |
| Security level | EAL6+, ASE_TSS.2, ALC_FLR.1 |
| Protection profiles |
Heuristics summary
Certificate ID: BSI-DSZ-CC-0978-V2-2017
Certificate
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Certification report
Extracted keywords
Symmetric Algorithms
AES, DES, Triple-DES, TDESRandomness
TRNG, RNGEngines
SmartMX2Vendor
NXP, NXP SemiconductorsSecurity level
EAL 6, EAL 5, EAL 2, EAL 1, EAL 4, EAL5, EAL 5+, EAL 3, EAL 7, EAL 6 augmentedClaims
O.C, R.OSecurity Assurance Requirements (SAR)
ADV_ARC.1, ADV_FSP.1, ADV_FSP.2, ADV_FSP.3, ADV_FSP.4, ADV_FSP.5, ADV_FSP.6, ADV_IMP.1, ADV_IMP.2, ADV_INT.1, ADV_INT.2, ADV_INT.3, ADV_SPM.1, ADV_TDS.1, ADV_TDS.2, ADV_TDS.3, ADV_TDS.4, ADV_TDS.5, ADV_TDS.6, ADV_ARC, ADV_FSP, ADV_IMP, ADV_INT, ADV_SPM, ADV_TDS, AGD_OPE.1, AGD_PRE.1, AGD_OPE, AGD_PRE, ALC_FLR.1, ALC_FLR, ALC_CMC.1, ALC_CMC.2, ALC_CMC.3, ALC_CMC.4, ALC_CMC.5, ALC_CMS.1, ALC_CMS.2, ALC_CMS.3, ALC_CMS.4, ALC_CMS.5, ALC_DEL.1, ALC_DVS.1, ALC_DVS.2, ALC_FLR.2, ALC_FLR.3, ALC_LCD.1, ALC_LCD.2, ALC_TAT.1, ALC_TAT.2, ALC_TAT.3, ALC_CMC, ALC_CMS, ALC_DEL, ALC_DVS, ALC_TAT, ATE_IND, ATE_FUN, ATE_COV.1, ATE_COV.2, ATE_COV.3, ATE_DPT.1, ATE_DPT.2, ATE_DPT.3, ATE_DPT.4, ATE_FUN.1, ATE_FUN.2, ATE_IND.1, ATE_IND.2, ATE_IND.3, ATE_COV, ATE_DPT, AVA_VAN, AVA_VAN.1, AVA_VAN.2, AVA_VAN.3, AVA_VAN.4, AVA_VAN.5, APE_INT.1, APE_CCL.1, APE_SPD.1, APE_OBJ.1, APE_OBJ.2, APE_ECD.1, APE_REQ.1, APE_REQ.2, ASE_TSS.2, ASE_INT.1, ASE_CCL.1, ASE_SPD.1, ASE_OBJ.1, ASE_OBJ.2, ASE_ECD.1, ASE_REQ.1, ASE_REQ.2, ASE_TSS.1, ASE_CCL, ASE_ECD, ASE_INT, ASE_OBJ, ASE_REQ, ASE_SPD, ASE_TSSProtection profiles
BSI-CC-PP-0035-2007, BSI-CC-PP- 0035-2007Certificates
BSI-DSZ-CC-0978-V2-2017, BSI-DSZ-CC-0978-2016, BSI-DSZ-CC-0978-Evaluation facilities
TÜV Informationstechnik, TÜViTSide-channel analysis
physical probing, SPA, DPA, JILCertification process
being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification, Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE, NXP Semiconductors, Version 2.62, 14 September 2017 (confidential document) [7] Evaluation Technical Report, NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE, Software, BSI-DSZ-CC-0978- V2, TÜV Informationstechnik GmbH, Version 2, 14 September 2017 (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [9, Report Software, BSI-DSZ-CC-0978-V2, TÜV Informationstechnik GmbH, Version 2, 14 September 2017 (confidential document) [11] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Configuration List,NXP, Version 2.7, 25 September 2015 (confidential document) [12] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Evaluation Reference List, NXP, Version 1.44, 14 September 2017 (confidential document) [13] Product data sheet SmartMX2 family P60x080/144 VA/VE, Secure high- performance smart card, NXP Semiconductors Document Number 1658**, NXP Semiconductors, Version 5.4, 14 August 2015 (confidential document) [14] Instruction Set for the SmartMX2 family, Secure smart card controller, NXP Semiconductors, Number 1478**, NXP Semiconductors, Version 3.1, 02 February 2012 (confidential document) [15] Information on Guidance and Operation, NXP Secure Smart Card Controller P60x080/144P VA/VE, Semiconductors, NXP Semiconductors, Version 2.8, 07 July 2017 (confidential document) [16] Product data sheet addendum: SmartMX2 family P60D080/144 VA/VE and P60C080/144 VA/VE, NXP Semiconductors, Document Number 1569**, NXP Semiconductors, Version 3.7, 21 May 2014 (confidential document) [17] Product data sheet addendum: SmartMX2 family Post Delivery Configuration (PDC), NXP, Document Number 2250** ,NXP Semiconductors, Version 3.2, 04 February 2013 (confidential document) [18] Product data sheet addendum: SmartMX2 family Chip Health Mode (CHM), NXP Semiconductors, Number 2244**, NXP Semiconductors, Version 3.1, 01 October 2014 (confidential document) [19] Product data sheet addendum: SmartMX2 family Firmware Interface Specification (FIS), NXP, Document Number 2333**, NXP Semiconductors, Version 4.2, 24 June 2015 (confidential document) [20] Product data sheet SmartMX2 family P60N144 VA, Secure high-performance smart card controller, Semiconductors, Document Number 2408**, NXP Semiconductors, Version 3.2, 14 August 2014 (confidential document) [21] Product data sheet addendum: SmartMX2 family P60N144 VA/VE, Wafer and delivery specification, Semiconductors, Document Number 2414**, NXP Semiconductors, Version 3.2, 06 June 2015 (confidential document) [22] Order Entry Form, P60C144, NXP Semiconductors, Version 3.2, 06 October 2015 [23] Order EntryStandards
AIS 34, AIS 25, AIS 26, AIS 37, AIS 31, AIS 36, AIS31, AIS 35, AIS 32, AIS 38, ISO/IEC 15408, ISO/IEC 18045, ISO/IEC 17065, ISO/IEC 14443, ISO/IEC 7816Technical reports
BSI TR-02102, BSI 7148File metadata
| Title | Certification Report BSI-DSZ-CC-0978-V2-2017 |
|---|---|
| Subject | Common Criteria Certification |
| Keywords | "Common Criteria, Certification, Zertifizierung, BSI, P60x144/080yVA/yVA(Y/B/X)y/VE, Secure Smart Card Controller, EAL6, NXP" |
| Author | Bundesamt für Sicherheit in der Informationstechnik |
| Creation date | D:20171012153909+02'00' |
| Modification date | D:20171013082133+02'00' |
| Pages | 41 |
| Creator | Writer |
| Producer | LibreOffice 5.2 |
Frontpage
| Certificate ID | BSI-DSZ-CC-0978-V2-2017 |
|---|---|
| Certified item | NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software |
| Certification lab | BSI |
| Developer | NXP Semiconductors Germany GmbH |
References
Outgoing- BSI-DSZ-CC-0978-2016 - archived - NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
- BSI-DSZ-CC-0808-V3-2017 - archived - TCOS Passport Version 2.1 Release 3/P60D144
- BSI-DSZ-CC-0978-V3-2019 - archived - NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
- BSI-DSZ-CC-0809-V3-2017 - archived - TCOS Passport Version 2.1 Release 3-BAC/ P60D144
- BSI-DSZ-CC-1035-2017 - archived - TCOS Secure Crypto Module Version 1.0 Release 1/P60C144PVE
Security target
Extracted keywords
Symmetric Algorithms
AES, DES, DEA, Triple-DES, TDEA, Triple-DEAAsymmetric Algorithms
ECCRandomness
TRNG, RND, RNGEngines
SmartMX2, SmartMXVendor
NXP, NXP SemiconductorsSecurity level
EAL6, EAL4, EAL6+, EAL4+, EAL 6, EAL6 augmented, EAL4 augmentedClaims
O.RND, O.HW_AES, O.CUST_RECONFIG, O.EEPROM_INTEGRITY, O.FM_FW, O.MEM_ACCESS, O.SFR_ACCESS, T.RNDSecurity Assurance Requirements (SAR)
ADV_ARC.1, ADV_FSP.5, ADV_IMP.2, ADV_INT.3, ADV_TDS.5, ADV_SPM.1, ADV_ARC, ADV_FSP, ADV_IMP, ADV_FSP.4, ADV_SPM, AGD_OPE.1, AGD_PRE.1, AGD_OPE, AGD_PRE, ALC_FLR.1, ALC_CMC.5, ALC_CMS.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_TAT.3, ALC_DEL, ALC_DVS, ALC_CMS, ALC_CMC, ALC_CMS.4, ALC_CMC.4, ATE_COV.3, ATE_DPT.3, ATE_FUN.2, ATE_IND.2, ATE_COV, AVA_VAN.5, AVA_VAN, ASE_TSS.2, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1Security Functional Requirements (SFR)
FAU_SAS.1, FAU_SAS.1.1, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP.1, FCS_COP.1.1, FCS_CKM.1, FCS_CKM.4, FDP_ITT.1, FDP_IFC.1, FDP_ITC.1, FDP_ITC.2, FDP_SDI.2, FDP_SDI.1, FDP_SDI.2.1, FDP_SDI.2.2, FDP_ACC.1, FDP_ACC.1.1, FDP_ACF.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_FLS.1, FMT_LIM.1, FMT_LIM.2, FMT_MSA.3, FMT_MSA.3.1, FMT_MSA.3.2, FMT_MSA.1, FMT_SMR.1, FMT_MSA.1.1, FMT_SMF.1, FMT_SMF.1.1, FPT_FLS.1, FPT_PHP.3, FPT_ITT.1, FRU_FLT.2Protection profiles
BSI-PP-0035Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, side channel, DPA, timing attacks, physical tampering, Malfunction, malfunction, fault injectionStandards
FIPS PUB 46-3, FIPS PUB 197, FIPS PUB 46, AIS31, ISO/IEC 7816, ISO/IEC 14443, ISO/IEC 18092, CCMB-2012-09-001, CCMB-2012-09-004File metadata
| Title | Security Target Lite |
|---|---|
| Subject | P60x144/080yVA/yVA(Y/B/X)/yVE |
| Keywords | CC Security Evaluation, Security Target, Functional Requirements, Security Functionality, Assurance Level EAL6+, P60D144yVA, P60D080yVA, P60D144yVE, P60D080yVE |
| Author | NXP Semiconductors |
| Creation date | D:20170918092651+02'00' |
| Modification date | D:20170918092812+02'00' |
| Pages | 87 |
| Creator | Acrobat PDFMaker 11 für Word |
| Producer | Adobe PDF Library 11.0 |
References
Incoming- BSI-DSZ-CC-0808-V3-2017 - archived - TCOS Passport Version 2.1 Release 3/P60D144
- BSI-DSZ-CC-0809-V3-2017 - archived - TCOS Passport Version 2.1 Release 3-BAC/ P60D144
- BSI-DSZ-CC-1035-2017 - archived - TCOS Secure Crypto Module Version 1.0 Release 1/P60C144PVE
Heuristics
Automated inference - use with caution
All attributes shown in this section (e.g., links between certificates, products, vendors, and known CVEs) are generated by automated heuristics and have not been reviewed by humans. These methods can produce false positives or false negatives and should not be treated as definitive without independent verification. For details on our data sources and inference methods, see our methodology. If you believe any information here is inaccurate or harmful, please submit feedback.Certificate ID
BSI-DSZ-CC-0978-V2-2017Extracted SARs
ADV_ARC.1, ADV_FSP.5, ADV_IMP.2, ADV_INT.3, ADV_SPM.1, ADV_TDS.5, AGD_OPE.1, AGD_PRE.1, ALC_CMC.5, ALC_CMS.5, ALC_DEL.1, ALC_DVS.2, ALC_FLR.1, ALC_LCD.1, ALC_TAT.3, APE_CCL.1, APE_ECD.1, APE_INT.1, APE_OBJ.2, APE_REQ.2, APE_SPD.1, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1, ASE_TSS.2, ATE_COV.3, ATE_DPT.3, ATE_FUN.2, ATE_IND.2, AVA_VAN.5Similar certificates
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References
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Raw data
{
"_type": "sec_certs.sample.cc.CCCertificate",
"category": "ICs, Smart Cards and Smart Card-Related Devices and Systems",
"cert_link": null,
"dgst": "5e878dec3caea712",
"heuristics": {
"_type": "sec_certs.sample.cc.CCCertificate.Heuristics",
"annotated_references": null,
"cert_id": "BSI-DSZ-CC-0978-V2-2017",
"cert_lab": [
"BSI"
],
"cpe_matches": null,
"direct_transitive_cves": null,
"eal": "EAL6+",
"extracted_sars": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_OBJ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AVA_VAN",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_CCL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_PRE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_TAT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_ECD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_INT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_IMP",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_ARC",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_CCL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_LCD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_IND",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_FLR",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_FUN",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DVS",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_INT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_DPT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_SPD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_TSS",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_OBJ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_INT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_REQ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_FSP",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMC",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_OPE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_SPM",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMS",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_REQ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_SPD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_COV",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_ECD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DEL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_TDS",
"level": 5
}
]
},
"extracted_versions": {
"_type": "Set",
"elements": [
"-"
]
},
"indirect_transitive_cves": null,
"next_certificates": null,
"prev_certificates": null,
"protection_profiles": {
"_type": "Set",
"elements": [
"f6d23054061d72ba"
]
},
"related_cves": null,
"report_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-0978-V3-2019",
"BSI-DSZ-CC-1035-2017",
"BSI-DSZ-CC-0808-V3-2017",
"BSI-DSZ-CC-0809-V3-2017"
]
},
"directly_referencing": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-0978-2016"
]
},
"indirectly_referenced_by": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-0978-V3-2019",
"BSI-DSZ-CC-1035-2017",
"BSI-DSZ-CC-0808-V3-2017",
"BSI-DSZ-CC-0809-V3-2017"
]
},
"indirectly_referencing": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-0978-2016"
]
}
},
"scheme_data": null,
"st_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-1035-2017",
"BSI-DSZ-CC-0808-V3-2017",
"BSI-DSZ-CC-0809-V3-2017"
]
},
"directly_referencing": null,
"indirectly_referenced_by": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-1035-2017",
"BSI-DSZ-CC-0808-V3-2017",
"BSI-DSZ-CC-0809-V3-2017"
]
},
"indirectly_referencing": null
},
"verified_cpe_matches": null
},
"maintenance_updates": {
"_type": "Set",
"elements": []
},
"manufacturer": "NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity",
"manufacturer_web": "https://www.nxp.com",
"name": "NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software",
"not_valid_after": "2022-09-27",
"not_valid_before": "2017-09-27",
"pdf_data": {
"_type": "sec_certs.sample.cc.CCCertificate.PdfData",
"cert_filename": null,
"cert_frontpage": null,
"cert_keywords": null,
"cert_metadata": null,
"report_filename": "0978V2a_pdf.pdf",
"report_frontpage": {
"DE": {
"cc_security_level": "Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2 and ALC_FLR.1",
"cc_version": "PP conformant plus product specific extensions Common Criteria Part 2 extended",
"cert_id": "BSI-DSZ-CC-0978-V2-2017",
"cert_item": "NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software",
"cert_lab": "BSI",
"developer": "NXP Semiconductors Germany GmbH",
"match_rules": [
"(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)"
],
"ref_protection_profiles": "Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007"
}
},
"report_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {
"DE": {
"BSI-DSZ-CC-0978-": 1,
"BSI-DSZ-CC-0978-2016": 2,
"BSI-DSZ-CC-0978-V2-2017": 21
}
},
"cc_claims": {
"O": {
"O.C": 6
},
"R": {
"R.O": 6
}
},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP- 0035-2007": 1,
"BSI-CC-PP-0035-2007": 2
}
},
"cc_sar": {
"ADV": {
"ADV_ARC": 1,
"ADV_ARC.1": 1,
"ADV_FSP": 1,
"ADV_FSP.1": 1,
"ADV_FSP.2": 1,
"ADV_FSP.3": 1,
"ADV_FSP.4": 1,
"ADV_FSP.5": 1,
"ADV_FSP.6": 1,
"ADV_IMP": 1,
"ADV_IMP.1": 1,
"ADV_IMP.2": 1,
"ADV_INT": 1,
"ADV_INT.1": 1,
"ADV_INT.2": 1,
"ADV_INT.3": 1,
"ADV_SPM": 1,
"ADV_SPM.1": 1,
"ADV_TDS": 1,
"ADV_TDS.1": 1,
"ADV_TDS.2": 1,
"ADV_TDS.3": 1,
"ADV_TDS.4": 1,
"ADV_TDS.5": 1,
"ADV_TDS.6": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_OPE.1": 1,
"AGD_PRE": 1,
"AGD_PRE.1": 1
},
"ALC": {
"ALC_CMC": 1,
"ALC_CMC.1": 1,
"ALC_CMC.2": 1,
"ALC_CMC.3": 1,
"ALC_CMC.4": 1,
"ALC_CMC.5": 2,
"ALC_CMS": 1,
"ALC_CMS.1": 1,
"ALC_CMS.2": 1,
"ALC_CMS.3": 1,
"ALC_CMS.4": 1,
"ALC_CMS.5": 2,
"ALC_DEL": 1,
"ALC_DEL.1": 2,
"ALC_DVS": 1,
"ALC_DVS.1": 1,
"ALC_DVS.2": 2,
"ALC_FLR": 4,
"ALC_FLR.1": 6,
"ALC_FLR.2": 1,
"ALC_FLR.3": 1,
"ALC_LCD.1": 2,
"ALC_LCD.2": 1,
"ALC_TAT": 1,
"ALC_TAT.1": 1,
"ALC_TAT.2": 1,
"ALC_TAT.3": 2
},
"APE": {
"APE_CCL.1": 1,
"APE_ECD.1": 1,
"APE_INT.1": 1,
"APE_OBJ.1": 1,
"APE_OBJ.2": 1,
"APE_REQ.1": 1,
"APE_REQ.2": 1,
"APE_SPD.1": 1
},
"ASE": {
"ASE_CCL": 1,
"ASE_CCL.1": 1,
"ASE_ECD": 1,
"ASE_ECD.1": 1,
"ASE_INT": 1,
"ASE_INT.1": 1,
"ASE_OBJ": 1,
"ASE_OBJ.1": 1,
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