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S3NSEN4/S3NSEN3 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 1)
CSV information
| Status | active |
|---|---|
| Valid from | 31.07.2019 |
| Valid until | 09.12.2025 |
| Scheme | 🇫🇷 FR |
| Manufacturer | Samsung Electronics Co., Ltd. |
| Category | ICs, Smart Cards and Smart Card-Related Devices and Systems |
| Security level | EAL6+, ASE_TSS.2 |
| Protection profiles | |
| Maintenance updates | Reassessment report: ANSSI-CC-2019/29-S01 (12.09.2020) Certification report |
Heuristics summary
Certificate ID: ANSSI-CC-2019/29
Certificate
Extracted keywords
Security level
EAL6Security Assurance Requirements (SAR)
ASE_TSS.2Protection profiles
BSI-CC-PP-0084-2014Certificates
ANSSI-CC-2019/29-S01Evaluation facilities
CEA-LETIFile metadata
| Title | Microsoft Word - certificat ANSSI-CC-2019_29-S01.docx |
|---|---|
| Author | jchuzel |
| Creation date | D:20210325162618+01'00' |
| Modification date | D:20210325162618+01'00' |
| Pages | 2 |
| Creator | PScript5.dll Version 5.2.2 |
| Producer | GPL Ghostscript 9.50 |
Certification report
Extracted keywords
Symmetric Algorithms
AES, DES, SM4Randomness
DTRNGVendor
SamsungSecurity level
EAL 6, EAL2, EAL7, ITSEC E6 ElevéSecurity Assurance Requirements (SAR)
ADV_ARC, ADV_FSP, ADV_IMP, ADV_INT, ADV_SPM, ADV_TDS, AGD_OPE, AGD_PRE, ALC_FLR, ALC_CMC, ALC_CMS, ALC_DEL, ALC_DVS, ALC_TAT, ATE_COV, ATE_DPT, ATE_FUN, ATE_IND, AVA_VAN, AVA_VAN.5, ASE_TSS.2, ASE_CCL, ASE_ECD, ASE_INT, ASE_OBJ, ASE_REQ, ASE_SPD, ASE_TSSProtection profiles
BSI-CC-PP-0084-2014, BSI-PP-0084-2014Certificates
ANSSI-CC-2019/29, ANSSI-CC-2018/30Evaluation facilities
CESTI, CEA - LETI, CEA-LETIStandards
AIS 31, CCMB-2017-04-001, CCMB-2017-04-002, CCMB-2017-04-003, CCMB-2017-04-004File metadata
| Title | ANSSI-CC-2019/29 |
|---|---|
| Subject | S3NSEN4/S3NSEN3 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software |
| Keywords | ANSSI-CC-CER-F-07.29 |
| Author | DUCLOS Charlene |
| Creation date | D:20190805100447+02'00' |
| Modification date | D:20190805100447+02'00' |
| Pages | 18 |
| Creator | Microsoft® Word 2010 |
| Producer | Microsoft® Word 2010 |
Frontpage
| Certificate ID | ANSSI-CC-2019/29 |
|---|---|
| Certified item | S3NSEN4/S3NSEN3 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software |
| Certification lab | CEA - LETI 17 avenue des martyrs, 38054 Grenoble Cedex 9, France |
| Developer | Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud Commanditaire Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud |
References
Outgoing- ANSSI-CC-2018/30 - archived - S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0)
- ANSSI-CC-2021/30 - active - S3NSEN4/S3NSEN3 with Bootloader & system API v1.1, DTRNG FRO M libraries v2.2, v3.3 & PTG.1 DTRNG FRO M library v1.4 (Revision 1)
Security target
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Extracted keywords
Symmetric Algorithms
AES, DES, Triple-DES, TDES, TDEA, SM4, HMACAsymmetric Algorithms
ECCRandomness
DTRNG, TRNG, RND, RNGBlock cipher modes
ECBCPLC
IC VersionVendor
SamsungSecurity level
EAL6, EAL 4, EAL6 augmented, EAL 4 augmentedClaims
O.RND, O.TDES, O.AES, O.MEM_ACCESS, T.RNDSecurity Assurance Requirements (SAR)
ADV_ARC, ADV_FSP, ADV_IMP, ADV_ARC.1, ADV_SPM.1, ADV_FSP.5, ADV_IMP.2, ADV_INT.3, ADV_TDS.5, ADV_FSP.4, AGD_OPE, AGD_PRE, AGD_OPE.1, AGD_PRE.1, ALC_DVS.2, ALC_DEL, ALC_DVS, ALC_CMS, ALC_CMC, ALC_CMC.5, ALC_CMS.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ALC_CMS.4, ATE_COV, ATE_COV.3, ATE_DPT.3, ATE_FUN.2, ATE_IND.2, AVA_VAN.5, AVA_VAN, APE_ECD, ASE_TSS.2, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1, ASE_REQ.1Security Functional Requirements (SFR)
FAU_SAS, FAU_GEN, FAU_SAS.1, FAU_SAS.1.1, FAU_GEN.1, FCS_RNG, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP.1, FCS_COP, FCS_CKM.1, FCS_CKM.4, FDP_SDC, FDP_ACF, FDP_SDC.1, FDP_SDI, FDP_SDC.1.1, FDP_SDI.2, FDP_SDI.1, FDP_SDI.2.1, FDP_SDI.2.2, FDP_ITT.1, FDP_ITT.1.1, FDP_ACC.1, FDP_IFC.1, FDP_IFC.1.1, FDP_IFF.1, FDP_ACF.1, FDP_ACC.1.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_ITC.1, FDP_ITC.2, FDP_UCT.1, FDP_UCT.1.1, FDP_UIT.1, FDP_UIT.1.1, FDP_UIT.1.2, FDP_ACC, FDP_IFC, FDP_ITT, FIA_API, FIA_API.1, FIA_API.1.1, FMT_LIM, FMT_LIM.1, FMT_LIM.2, FMT_LIM.1.1, FMT_LIM.2.1, FMT_MSA.3, FMT_MSA.1, FMT_MSA.3.1, FMT_MSA.3.2, FMT_SMR.1, FMT_MSA.1.1, FMT_SMF.1, FMT_SMF.1.1, FMT_MSA, FMT_SMF, FPT_FLS.1, FPT_FLS.1.1, FPT_PHP.3, FPT_PHP.3.1, FPT_PHP, FPT_ITT.1, FPT_ITT.1.1, FPT_FLS, FPT_ITT, FRU_FLT.2, FRU_FLT.1, FRU_FLT.2.1, FRU_FLT, FTP_ITC.1, FTP_ITC.1.1, FTP_ITC.1.2, FTP_ITC.1.3, FTP_TRP.1Protection profiles
BSI-CC-PP-0084, BSI-PP-0084, BSI-CC-PP-0084-Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, Physical probing, side-channel, side channel, DPA, SPA, timing attacks, physical tampering, Malfunction, malfunction, reverse engineeringStandards
FIPS 180-4, FIPS197, FIPS 197, FIPS PUB 180-3, BSI-AIS31, AIS31, ISO/IEC 18092, ISO/IEC 14443, ISO/IEC 15693, CCMB-2017-04-001, CCMB-2017-04-002, CCMB-2017-04-003, CCMB-2017-04-004Heuristics
Automated inference - use with caution
All attributes shown in this section (e.g., links between certificates, products, vendors, and known CVEs) are generated by automated heuristics and have not been reviewed by humans. These methods can produce false positives or false negatives and should not be treated as definitive without independent verification. For details on our data sources and inference methods, see our methodology. If you believe any information here is inaccurate or harmful, please submit feedback.Certificate ID
ANSSI-CC-2019/29Extracted SARs
ADV_ARC.1, ADV_FSP.5, ADV_IMP.2, ADV_INT.3, ADV_SPM.1, ADV_TDS.5, AGD_OPE.1, AGD_PRE.1, ALC_CMC.5, ALC_CMS.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_TAT.3, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1, ASE_TSS.2, ATE_COV.3, ATE_DPT.3, ATE_FUN.2, ATE_IND.2, AVA_VAN.5CPE matches
Similar certificates
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Raw data
{
"_type": "sec_certs.sample.cc.CCCertificate",
"category": "ICs, Smart Cards and Smart Card-Related Devices and Systems",
"cert_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat%20ANSSI-CC-2019_29-S01.pdf",
"dgst": "92f34b9bf024bf35",
"heuristics": {
"_type": "sec_certs.sample.cc.CCCertificate.Heuristics",
"annotated_references": null,
"cert_id": "ANSSI-CC-2019/29",
"cert_lab": [
"CEA"
],
"cpe_matches": {
"_type": "Set",
"elements": [
"cpe:2.3:h:samsung:s3nsen4:-:*:*:*:*:*:*:*"
]
},
"direct_transitive_cves": null,
"eal": "EAL6+",
"extracted_sars": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_TDS",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DEL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_FUN",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMS",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_DPT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_ARC",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_CCL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_ECD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DVS",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_TSS",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_TAT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AVA_VAN",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_IND",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_INT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_LCD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_INT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_OPE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_PRE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMC",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_REQ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_SPD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_FSP",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_COV",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_SPM",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_IMP",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_OBJ",
"level": 2
}
]
},
"extracted_versions": {
"_type": "Set",
"elements": [
"32",
"1"
]
},
"indirect_transitive_cves": null,
"next_certificates": null,
"prev_certificates": null,
"protection_profiles": {
"_type": "Set",
"elements": [
"cf0f01bcd7be3e9c"
]
},
"related_cves": null,
"report_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": {
"_type": "Set",
"elements": [
"ANSSI-CC-2021/30"
]
},
"directly_referencing": {
"_type": "Set",
"elements": [
"ANSSI-CC-2018/30"
]
},
"indirectly_referenced_by": {
"_type": "Set",
"elements": [
"ANSSI-CC-2021/30",
"ANSSI-CC-2021/30-R01"
]
},
"indirectly_referencing": {
"_type": "Set",
"elements": [
"ANSSI-CC-2018/30"
]
}
},
"scheme_data": null,
"st_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": null,
"directly_referencing": null,
"indirectly_referenced_by": null,
"indirectly_referencing": null
},
"verified_cpe_matches": null
},
"maintenance_updates": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.cc.CCCertificate.MaintenanceReport",
"maintenance_date": "2020-09-12",
"maintenance_report_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2019-29-S01.pdf",
"maintenance_st_link": null,
"maintenance_title": "Reassessment report: ANSSI-CC-2019/29-S01"
}
]
},
"manufacturer": "Samsung Electronics Co., Ltd.",
"manufacturer_web": "https://www.samsung.com",
"name": "S3NSEN4/S3NSEN3 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 1)",
"not_valid_after": "2025-12-09",
"not_valid_before": "2019-07-31",
"pdf_data": {
"_type": "sec_certs.sample.cc.CCCertificate.PdfData",
"cert_filename": "certificat ANSSI-CC-2019_29-S01.pdf",
"cert_frontpage": null,
"cert_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {
"FR": {
"ANSSI-CC-2019/29-S01": 2
}
},
"cc_claims": {},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP-0084-2014": 1
}
},
"cc_sar": {
"ASE": {
"ASE_TSS.2": 1
}
},
"cc_security_level": {
"EAL": {
"EAL6": 1
}
},
"cc_sfr": {},
"certification_process": {},
"cipher_mode": {},
"cplc_data": {},
"crypto_engine": {},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {
"CEA-LETI": {
"CEA-LETI": 2
}
},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {},
"side_channel_analysis": {},
"standard_id": {},
"symmetric_crypto": {},
"technical_report_id": {},
"tee_name": {},
"tls_cipher_suite": {},
"vendor": {},
"vulnerability": {}
},
"cert_metadata": {
"/Author": "jchuzel",
"/CreationDate": "D:20210325162618+01\u002700\u0027",
"/Creator": "PScript5.dll Version 5.2.2",
"/ModDate": "D:20210325162618+01\u002700\u0027",
"/Producer": "GPL Ghostscript 9.50",
"/Title": "Microsoft Word - certificat ANSSI-CC-2019_29-S01.docx",
"pdf_file_size_bytes": 1910766,
"pdf_hyperlinks": {
"_type": "Set",
"elements": []
},
"pdf_is_encrypted": false,
"pdf_number_of_pages": 2
},
"report_filename": "anssi-cc-2019-29fr.pdf",
"report_frontpage": {
"FR": {
"cc_security_level": "EAL 6 augment\u00e9 ASE_TSS.2",
"cc_version": "Crit\u00e8res Communs version 3.1 r\u00e9vision 5",
"cert_id": "ANSSI-CC-2019/29",
"cert_item": "S3NSEN4/S3NSEN3 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software",
"cert_item_version": "Revision 1",
"cert_lab": "CEA - LETI 17 avenue des martyrs, 38054 Grenoble Cedex 9, France",
"developer": "Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Cor\u00e9e du Sud Commanditaire Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Cor\u00e9e du Sud",
"match_rules": [
"R\u00e9f\u00e9rence du rapport de certification(.+)Nom du produit(.+)R\u00e9f\u00e9rence/version du produit(.+)Conformit\u00e9 \u00e0 un profil de protection(.+)Crit\u00e8res d\u2019\u00e9valuation et version(.+)Niveau d\u2019\u00e9valuation(.+)D\u00e9veloppeur (.+)Centre d\u2019\u00e9valuation(.+)Accords de reconnaissance applicables"
],
"ref_protection_profiles": "Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifi\u00e9 BSI-CC-PP-0084-2014 le 19 f\u00e9vrier 2014 avec conformit\u00e9 \u00e0 \u201cPackage 1 : Loader dedicated for usage in Secured Environment only\u201d \u201cPackage 2: Loader dedicated for usage by authorized users only"
}
},
"report_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {
"FR": {
"ANSSI-CC-2018/30": 2,
"ANSSI-CC-2019/29": 19
}
},
"cc_claims": {},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP-0084-2014": 1,
"BSI-PP-0084-2014": 1
}
},
"cc_sar": {
"ADV": {
"ADV_ARC": 1,
"ADV_FSP": 1,
"ADV_IMP": 1,
"ADV_INT": 1,
"ADV_SPM": 1,
"ADV_TDS": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_PRE": 1
},
"ALC": {
"ALC_CMC": 1,
"ALC_CMS": 1,
"ALC_DEL": 1,
"ALC_DVS": 1,
"ALC_FLR": 2,
"ALC_TAT": 1
},
"ASE": {
"ASE_CCL": 1,
"ASE_ECD": 1,
"ASE_INT": 1,
"ASE_OBJ": 1,
"ASE_REQ": 1,
"ASE_SPD": 1,
"ASE_TSS": 1,
"ASE_TSS.2": 2
},
"ATE": {
"ATE_COV": 1,
"ATE_DPT": 1,
"ATE_FUN": 1,
"ATE_IND": 1
},
"AVA": {
"AVA_VAN": 2,
"AVA_VAN.5": 1
}
},
"cc_security_level": {
"EAL": {
"EAL 6": 2,
"EAL2": 2,
"EAL7": 1
},
"ITSEC": {
"ITSEC E6 Elev\u00e9": 1
}
},
"cc_sfr": {},
"certification_process": {},
"cipher_mode": {},
"cplc_data": {},
"crypto_engine": {},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {
"CEA-LETI": {
"CEA - LETI": 1,
"CEA-LETI": 1
},
"CESTI": {
"CESTI": 3
}
},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {
"TRNG": {
"DTRNG": 7
}
},
"side_channel_analysis": {},
"standard_id": {
"BSI": {
"AIS 31": 2
},
"CC": {
"CCMB-2017-04-001": 1,
"CCMB-2017-04-002": 1,
"CCMB-2017-04-003": 1,
"CCMB-2017-04-004": 1
}
},
"symmetric_crypto": {
"AES_competition": {
"AES": {
"AES": 1
}
},
"DES": {
"DES": {
"DES": 2
}
},
"miscellaneous": {
"SM4": {
"SM4": 1
}
}
},
"technical_report_id": {},
"tee_name": {},
"tls_cipher_suite": {},
"vendor": {
"Samsung": {
"Samsung": 2
}
},
"vulnerability": {}
},
"report_metadata": {
"/Author": "DUCLOS Charlene",
"/CreationDate": "D:20190805100447+02\u002700\u0027",
"/Creator": "Microsoft\u00ae Word 2010",
"/Keywords": "ANSSI-CC-CER-F-07.29",
"/ModDate": "D:20190805100447+02\u002700\u0027",
"/Producer": "Microsoft\u00ae Word 2010",
"/Subject": "S3NSEN4/S3NSEN3 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software",
"/Title": "ANSSI-CC-2019/29",
"pdf_file_size_bytes": 807088,
"pdf_hyperlinks": {
"_type": "Set",
"elements": [
"http://www.ssi.gouv.fr/",
"mailto:[email protected]"
]
},
"pdf_is_encrypted": false,
"pdf_number_of_pages": 18
},
"st_filename": "anssi-cible-2019_29en.pdf",
"st_frontpage": null,
"st_keywords": {
"asymmetric_crypto": {
"ECC": {
"ECC": {
"ECC": 2
}
}
},
"cc_cert_id": {},
"cc_claims": {
"O": {
"O.AES": 5,
"O.MEM_ACCESS": 1,
"O.RND": 6,
"O.TDES": 7
},
"T": {
"T.RND": 5
}
},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP-0084": 2,
"BSI-CC-PP-0084-": 1,
"BSI-PP-0084": 1
}
},
"cc_sar": {
"ADV": {
"ADV_ARC": 1,
"ADV_ARC.1": 5,
"ADV_FSP": 2,
"ADV_FSP.4": 1,
"ADV_FSP.5": 3,
"ADV_IMP": 1,
"ADV_IMP.2": 1,
"ADV_INT.3": 1,
"ADV_SPM.1": 2,
"ADV_TDS.5": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_OPE.1": 1,
"AGD_PRE": 1,
"AGD_PRE.1": 1
},
"ALC": {
"ALC_CMC": 1,
"ALC_CMC.5": 1,
"ALC_CMS": 2,
"ALC_CMS.4": 1,
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