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S3FT9MH/S3FT9MV/S3FT9MG 16-bit RISC Microcontroller for Smart Card with optional Secure RSA and ECC Library including specific IC Dedicated Software
ANSSI-CC-2017/24 		S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
BSI-DSZ-CC-0882-2013
name S3FT9MH/S3FT9MV/S3FT9MG 16-bit RISC Microcontroller for Smart Card with optional Secure RSA and ECC Library including specific IC Dedicated Software S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
scheme FR DE
not_valid_after 11.05.2022 01.09.2019
not_valid_before 11.05.2017 04.12.2013
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2017_24fr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi_cible2017_24en.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882b_pdf.pdf
security_level ASE_TSS.2, EAL6+ AVA_VAN.5, ALC_DVS.2, EAL5+
dgst b13211f522604a24 db89c868db0d272f
heuristics/cert_id ANSSI-CC-2017/24 BSI-DSZ-CC-0882-2013
heuristics/cert_lab CEA BSI
heuristics/extracted_sars ASE_CCL.1, ALC_DEL.1, ADV_FSP.5, ALC_CMS.5, ALC_DVS.2, AVA_VAN.5, ALC_CMC.5, ATE_IND.2, ADV_ARC.1, ADV_IMP.2, ATE_FUN.2, ASE_SPD.1, ASE_REQ.2, ASE_TSS.2, AGD_OPE.1, ATE_COV.3, ALC_TAT.3, ASE_ECD.1, ADV_INT.3, ADV_SPM.1, ASE_INT.1, AGD_PRE.1, ADV_TDS.5, ALC_LCD.1, ATE_DPT.3, ASE_OBJ.2 ASE_CCL.1, ALC_DEL.1, ADV_FSP.5, ALC_CMC.4, ALC_CMS.5, ALC_DVS.2, AVA_VAN.5, ATE_FUN.1, ATE_IND.2, ADV_ARC.1, ASE_TSS.1, ALC_TAT.2, ASE_SPD.1, ASE_REQ.2, ADV_INT.2, ADV_IMP.1, ADV_TDS.4, ATE_COV.2, APE_INT.1, ALC_FLR.3, AGD_OPE.1, APE_CCL.1, APE_REQ.2, APE_ECD.1, ASE_ECD.1, ADV_SPM.1, ASE_INT.1, APE_OBJ.2, AGD_PRE.1, APE_SPD.1, ALC_LCD.1, ATE_DPT.3, ASE_OBJ.2
heuristics/extracted_versions 16 0, 32
heuristics/report_references/directly_referenced_by ANSSI-CC-2018/58v2, ANSSI-CC-2019/31, ANSSI-CC-2018/32, ANSSI-CC-2019/07, ANSSI-CC-2018/56, ANSSI-CC-2018/32v2, ANSSI-CC-2018/53, ANSSI-CC-2018/56v2, ANSSI-CC-2018/57, ANSSI-CC-2018/57v2, ANSSI-CC-2018/33, ANSSI-CC-2018/58 BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/directly_referencing ANSSI-CC-2016/59 BSI-DSZ-CC-0801-2012
heuristics/report_references/indirectly_referenced_by ANSSI-CC-2018/58v2, ANSSI-CC-2019/31, ANSSI-CC-2020/12, ANSSI-CC-2018/32, ANSSI-CC-2019/07, ANSSI-CC-2020/93, ANSSI-CC-2018/56, ANSSI-CC-2018/32v2, ANSSI-CC-2018/53, ANSSI-CC-2018/56v2, ANSSI-CC-2018/57, ANSSI-CC-2018/57v2, ANSSI-CC-2018/33, ANSSI-CC-2018/58 BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/indirectly_referencing ANSSI-CC-2016/59, ANSSI-CC-2015/66 BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0801-2012, BSI-DSZ-CC-0547-2009, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0720-2011
heuristics/scheme_data
  • cert_id: ANSSI-CC-2017/24
  • description: Le produit certifié est le microcontrôleur « S3FT9MH/S3FT9MV/S3FT9MG 16-bit RISC Microcontroller for Smart Card with optional Secure RSA and ECC Library including specific IC Dedicated Software », référence S3FT9MH/S3FT9MV/S3FT9MG_rev0-1_SW10-49-50-70-10-103-202_GU113-16-005-201-133-24-22-24-14, développé par SAMSUNG ELECTRONICS CO. LTD et TRUSTED LABS. Le microcontrôleur seul n’est pas un prod
  • developer: Samsung Electronics Co. Ltd., Trusted Labs
  • enhanced:
    • augmented: ASE_TSS.2
    • category: Micro-circuits
    • cc_version: Critères Communs version 3.1r4
    • cert_id: ANSSI-CC-2017/24
    • certification_date: 2017-05-11
    • developer: Samsung Electronics Co. Ltd., Trusted Labs
    • evaluation_facility: CEA - LETI
    • level: EAL6+
    • mutual_recognition: SOG-IS CCRA
    • protection_profile: BSI-CC-PP-0084-2014
    • report_link: https://cyber.gouv.fr/sites/default/files/2017/05/anssi-cc-2017_24fr.pdf
    • sponsor: Samsung Electronics Co. Ltd.
    • target_link: https://cyber.gouv.fr/sites/default/files/2017/05/anssi_cible2017_24en.pdf
  • level: EAL6+
  • product: S3FT9MH/S3FT9MV/S3FT9MG 16-bit RISC Microcontroller for Smart Card with optional Secure RSA and ECC Library including specific IC Dedicated Software
  • sponsor: Samsung Electronics Co. Ltd.
  • url: https://cyber.gouv.fr/produits-certifies/s3ft9mhs3ft9mvs3ft9mg-16-bit-risc-microcontroller-smart-card-optional-secure-1
heuristics/st_references/directly_referenced_by ANSSI-CC-2018/58v2, ANSSI-CC-2019/31, ANSSI-CC-2018/58, ANSSI-CC-2018/32, ANSSI-CC-2018/32v2, ANSSI-CC-2018/56v2, ANSSI-CC-2018/57, ANSSI-CC-2018/57v2, ANSSI-CC-2018/56 {}
heuristics/st_references/indirectly_referenced_by ANSSI-CC-2018/58v2, ANSSI-CC-2019/31, ANSSI-CC-2018/58, ANSSI-CC-2018/32, ANSSI-CC-2018/32v2, ANSSI-CC-2018/56v2, ANSSI-CC-2018/57, ANSSI-CC-2018/57v2, ANSSI-CC-2018/56 {}
maintenance_updates
protection_profiles
pdf_data/report_filename anssi-cc-2017_24fr.pdf 0882a_pdf.pdf
pdf_data/report_frontpage
  • FR:
    • cc_security_level: EAL 6 augmenté ASE_TSS.2
    • cc_version: Critères Communs version 3.1 révision 4
    • cert_id: ANSSI-CC-2017/24
    • cert_item: S3FT9MH/S3FT9MV/S3FT9MG 16-bit RISC Microcontroller for Smart Card with optional Secure RSA and ECC Library including specific IC Dedicated Software
    • cert_item_version: Référence, Version
    • cert_lab: CEA - LETI 17 rue des martyrs, 38054 Grenoble Cedex 9, France
    • developer: Samsung Electronics Co. Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330 Corée du Sud Trusted Labs 5, rue du Baillage 78000 Versailles, France Commanditaire Samsung Electronics Co. Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.*)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeurs(.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité à “Package 1: Loader dedicated for usage in Secured Environment only” “Package 2: Loader dedicated for usage by authorized users only
  • DE:
  • FR:
  • DE:
    • cert_id: BSI-DSZ-CC-0882-2013
    • cert_item: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • FR:
    • ANSSI-CC-2016/59: 2
    • ANSSI-CC-2017/24: 19
  • DE:
    • BSI-DSZ-CC-0801-2012: 3
    • BSI-DSZ-CC-0882: 1
    • BSI-DSZ-CC-0882-2013: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0084-2014: 1
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 6: 2
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
  • EAL:
    • EAL 4: 2
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL1: 7
    • EAL2: 3
    • EAL3: 4
    • EAL4: 7
    • EAL5: 7
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 2
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
    • ASE_TSS.2: 2
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 2
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 15
  • Samsung:
    • Samsung: 24
pdf_data/report_keywords/eval_facility
  • CEA-LETI:
    • CEA - LETI: 1
    • CEA-LETI: 2
  • CESTI:
    • CESTI: 3
  • TrustedLabs:
    • Trusted Labs: 1
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 2
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
      • Triple-DES: 2
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 25
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/report_keywords/randomness
  • TRNG:
    • DTRNG: 16
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 12
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS 46: 1
    • AIS31: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 2013-11-27, TÜViT (confidential document) [11] Project < Kansa > Life Cycle Definition (Class ALC_CMC.4/CMS.5), Version 1.4, 2013-10-21: 1
    • Electronics (confidential document) [12] S3CS9AB 32-Bit CMOS Microcontroller for Smart Card User’s manual, Version 1.00, April 2013: 1
    • Report Summary (ETR Summary), BSI-DSZ-CC-0882, S3CS9AB Revision 0, Version 3, 2013-11-27, TÜViT (confidential document) [10] ETR for composite evaluation according to AIS 36 for the Product S3CS9AB Revision 0, Version: 1
    • Software (Project Kansa), BSI-DSZ-CC-0882-2013, Version 1.9, 2013-10-21, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [8: 1
pdf_data/report_metadata
  • /CreationDate: D:20170512153909+02'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /ModDate: D:20170515150711+02'00'
  • /Producer: Acrobat Distiller 11.0 (Windows)
  • /Title:
  • pdf_file_size_bytes: 218847
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 18
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20140205100058+01'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software, Samsung Electronics"
  • /ModDate: D:20140206085959+01'00'
  • /Producer: LibreOffice 3.6
  • /Subject: Common Criteria Certification
  • /Title: Certification Report BSI-DSZ-CC-0882-2013
  • pdf_file_size_bytes: 996795
  • pdf_hyperlinks: https://www.bsi.bund.de/zertifizierung, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 38
pdf_data/st_filename anssi_cible2017_24en.pdf 0882b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084: 2
    • BSI-CC-PP-0084-: 1
    • BSI-PP-0084: 1
  • BSI:
    • BSI-PP-0035: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL6: 5
    • EAL6 augmented: 1
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 5
    • ADV_FSP: 2
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.2: 1
    • ADV_INT.3: 1
    • ADV_SPM.1: 2
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • APE:
    • APE_ECD: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 2
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 11
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 1
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 5
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 16
    • FCS_CKM.1: 24
    • FCS_CKM.2: 4
    • FCS_CKM.4: 11
    • FCS_COP: 49
    • FCS_COP.1: 21
    • FCS_RNG: 24
    • FCS_RNG.1: 16
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 10
    • FDP_ACC.1: 19
    • FDP_ACC.1.1: 1
    • FDP_ACF: 13
    • FDP_ACF.1: 17
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 23
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 11
    • FDP_ITC.2: 11
    • FDP_ITT: 1
    • FDP_ITT.1: 18
    • FDP_ITT.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 14
    • FDP_SDI: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 8
    • FDP_UCT.1: 9
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 9
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_API: 6
    • FIA_API.1: 12
    • FIA_API.1.1: 2
  • FMT:
    • FMT_CKM.4: 1
    • FMT_LIM: 22
    • FMT_LIM.1: 28
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 32
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 12
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 15
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 22
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 16
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 21
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
  • FTP:
    • FTP_ITC.1: 13
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 12
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 4
    • FCS_COP: 8
    • FCS_COP.1: 9
    • FCS_RNG: 6
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 5
    • O.ECC: 7
    • O.MEM_ACCESS: 1
    • O.RND: 6
    • O.RSA: 7
    • O.SHA: 7
    • O.TDES: 6
  • T:
    • T.RND: 5
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 17
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 18
      • Triple-DES: 6
    • DES:
      • DES: 10
  • constructions:
    • MAC:
      • HMAC: 2
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 40
    • ECDH:
      • ECDH: 9
    • ECDSA:
      • ECDSA: 14
  • FF:
    • DH:
      • Diffie-Hellman: 3
    • DSA:
      • DSA: 4
  • RSA:
    • RSA-CRT: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 3
    • SHA2:
      • SHA-224: 2
      • SHA-256: 2
      • SHA-384: 2
      • SHA-512: 2
      • SHA224: 6
      • SHA256: 6
      • SHA384: 6
      • SHA512: 5
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 3
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 11
    • RNG: 17
  • TRNG:
    • DTRNG: 40
    • TRNG: 1
  • RNG:
    • RND: 10
  • TRNG:
    • DTRNG: 18
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • ECB:
    • ECB: 3
  • CBC:
    • CBC: 3
  • ECB:
    • ECB: 4
  • OFB:
    • OFB: 2
pdf_data/st_keywords/ecc_curve
  • Brainpool:
    • brainpoolP192r1: 4
    • brainpoolP192t1: 4
    • brainpoolP224r1: 4
    • brainpoolP224t1: 4
    • brainpoolP256r1: 4
    • brainpoolP256t1: 4
    • brainpoolP320r1: 4
    • brainpoolP320t1: 4
    • brainpoolP384r1: 4
    • brainpoolP384t1: 4
    • brainpoolP512r1: 4
    • brainpoolP512t1: 4
  • NIST:
    • P-192: 8
    • P-224: 8
    • P-256: 8
    • P-384: 8
    • secp192k1: 4
    • secp192r1: 4
    • secp224k1: 4
    • secp224r1: 4
    • secp256k1: 4
    • secp256r1: 4
    • secp384r1: 4
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 4
pdf_data/st_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 26
    • malfunction: 13
    • physical tampering: 3
  • SCA:
    • DPA: 8
    • Leak-Inherent: 23
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 7
    • physical probing: 9
    • side channel: 2
    • side-channel: 4
    • timing attack: 2
    • timing attacks: 1
  • other:
    • reverse engineering: 5
  • FI:
    • Malfunction: 24
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/cplc_data
  • ICVersion:
    • IC Version: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 11
    • BSI-AIS31: 2
  • CC:
    • CCMB-2012-09-001: 3
    • CCMB-2012-09-002: 3
    • CCMB-2012-09-003: 3
    • CCMB-2012-09-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS PUB 180-3: 7
    • FIPS197: 1
  • BSI:
    • AIS 31: 2
    • AIS31: 1
    • BSI-AIS31: 3
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_metadata
  • /Company: Samsung Electronics
  • /CreationDate: D:20170327181204+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Document_Name: Document Name
  • /Document_Type: UM
  • /ModDate: D:20170515151037+02'00'
  • /Preliminary: (Preliminary Spec)
  • /Producer: Adobe PDF Library 10.0
  • /Product_Description: Product Description (Sub-Title)
  • /Product_Name: Product Name
  • /Revision_Date: January 2013
  • /Revision_Number: 1.18
  • /Security_Level: Samsung Confidential
  • /SourceModified: D:20170327091105
  • /Title:
  • /Year: 2013
  • /_DocHome: 1177583831
  • pdf_file_size_bytes: 1304435
  • pdf_hyperlinks: http://www.ecc-brainpool.org/, http://www.ssi.gouv.fr/uploads/2015/01/RGS_v-2-0_B1.pdf, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 110
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company: Samsung Electronics
  • /CreationDate: D:20131021190305+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /ModDate: D:20140206090253+01'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20131021100233
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1315207
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 57
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