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S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0)
ANSSI-CC-2018/30 		NXP Secure Smart Card Controller P5CT072V0N, P5CD072V0N, P5CD036V0N, including specific Inlay Packages OM95xx, each with specific IC Dedicated Software
BSI-DSZ-CC-0375-2007
name S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0) NXP Secure Smart Card Controller P5CT072V0N, P5CD072V0N, P5CD036V0N, including specific Inlay Packages OM95xx, each with specific IC Dedicated Software
category Trusted Computing ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme FR DE
not_valid_after 27.09.2023 01.09.2019
not_valid_before 27.09.2018 26.06.2007
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2018-30fr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0375a.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-2018_30en.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0312b.pdf
manufacturer Samsung NXP Semiconductors Germany GmbH Business Line Identification
manufacturer_web https://www.samsung.com/ https://www.nxp.com
security_level EAL6+, ASE_TSS.2 AVA_VLA.4, AVA_MSU.3, EAL5+, ALC_DVS.2
dgst 62d9255011b76367 b66f28a809c6b8c0
heuristics/cert_id ANSSI-CC-2018/30 BSI-DSZ-CC-0375-2007
heuristics/cert_lab CEA BSI
heuristics/extracted_sars ALC_CMC.5, ALC_CMS.5, ASE_INT.1, ASE_ECD.1, ADV_SPM.1, ATE_DPT.3, ASE_TSS.2, ADV_IMP.2, ATE_FUN.2, AGD_PRE.1, ASE_CCL.1, ALC_DVS.2, ADV_INT.3, AVA_VAN.5, ASE_SPD.1, ASE_OBJ.2, ASE_REQ.2, ADV_FSP.5, ADV_ARC.1, ADV_TDS.5, ALC_DEL.1, ATE_COV.3, AGD_OPE.1, ALC_LCD.1, ATE_IND.2, ALC_TAT.3 ADV_LLD.1, ASE_INT.1, ATE_FUN.1, ADV_HLD.3, AVA_VLA.4, ASE_PPC.1, AVA_SOF.1, ASE_OBJ.1, ASE_TSS.1, ADV_IMP.2, AGD_ADM.1, ASE_DES.1, AGD_USR.1, ALC_DVS.2, ATE_DPT.2, ASE_ENV.1, ASE_SRE.1, AVA_CCA.1, ATE_COV.2, ASE_REQ.1, ADV_INT.1, ALC_TAT.2, ALC_LCD.2, AVA_MSU.3, ADV_RCR.2, ADV_SPM.3, ATE_IND.2, ADV_FSP.3
heuristics/extracted_versions 32, 0 -
heuristics/report_references/directly_referenced_by ANSSI-CC-2019/39, ANSSI-CC-2019/29 {}
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0348-2006, BSI-DSZ-CC-0312-2005, BSI-DSZ-CC-0349-2006
heuristics/report_references/indirectly_referenced_by ANSSI-CC-2021/30, ANSSI-CC-2019/29, ANSSI-CC-2019/39, ANSSI-CC-2021/30-R01 {}
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0227-2004, BSI-DSZ-CC-0348-2006, BSI-DSZ-CC-0312-2005, BSI-DSZ-CC-0349-2006
heuristics/scheme_data
protection_profiles
pdf_data/report_filename anssi-cc-2018-30fr.pdf 0375a.pdf
pdf_data/report_frontpage
  • FR:
    • cc_security_level: EAL 6 augmenté ASE_TSS.2
    • cc_version: Critères Communs version 3.1 révision 5
    • cert_id: ANSSI-CC-2018/30
    • cert_item: S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software
    • cert_item_version: revision 0
    • cert_lab: CEA - LETI 17 avenue des martyrs, 38054 Grenoble Cedex 9, France
    • developer: Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud Commanditaire Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité à “Package 1 : Loader dedicated for usage in Secured Environment only” “Package 2: Loader dedicated for usage by authorized users only
  • DE:
  • FR:
  • DE:
    • cert_id: BSI-DSZ-CC-0375-2007
    • cert_item: NXP Secure Smart Card Controller P5CT072V0N, P5CD072V0N, P5CD036V0N, including specific Inlay Packages OM95xx, each with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH Business Line Identification
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • FR:
    • ANSSI-CC-2018/30: 18
  • DE:
    • BSI-DSZ-CC-0312: 4
    • BSI-DSZ-CC-0312-: 1
    • BSI-DSZ-CC-0312-2005: 3
    • BSI-DSZ-CC-0348-2006: 1
    • BSI-DSZ-CC-0349-2006: 4
    • BSI-DSZ-CC-0375: 1
    • BSI-DSZ-CC-0375-2007: 25
  • NL:
    • CC-0348-2006: 3
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 1
  • BSI:
    • BSI-PP- 0002-2001: 2
    • BSI-PP-0002-: 1
    • BSI-PP-0002-2001: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 6: 2
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
  • EAL:
    • EAL 1: 1
    • EAL 4: 1
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 10
    • EAL5: 11
    • EAL5 augmented: 2
    • EAL6: 3
    • EAL7: 4
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
    • ASE_TSS.2: 2
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 1
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 2
    • ACM_CAP: 2
    • ACM_CAP.4: 2
    • ACM_SCP: 2
    • ACM_SCP.3: 3
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_FSP.3: 2
    • ADV_HLD: 2
    • ADV_HLD.3: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 2
    • ADV_INT: 2
    • ADV_INT.1: 2
    • ADV_LLD: 2
    • ADV_LLD.1: 1
    • ADV_RCR: 2
    • ADV_RCR.2: 2
    • ADV_SPM: 2
    • ADV_SPM.3: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 1
    • AGD_USR: 2
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 6
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.2: 3
    • ALC_TAT: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_COV.2: 1
    • ATE_DPT: 2
    • ATE_DPT.2: 2
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_IND: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 2
    • AVA_CCA.1: 2
    • AVA_MSU: 2
    • AVA_MSU.3: 5
    • AVA_SOF: 3
    • AVA_SOF.1: 1
    • AVA_VLA: 3
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 6
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_COP.1: 1
    • FCS_RND.1: 1
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF.1: 3
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
  • FMT:
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMF.1: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_SEP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 2
  • R:
    • R.O: 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 2
  • NXP:
    • NXP: 26
    • NXP Semiconductors: 15
  • Philips:
    • Philips: 19
pdf_data/report_keywords/eval_facility
  • CEA-LETI:
    • CEA - LETI: 1
    • CEA-LETI: 1
  • CESTI:
    • CESTI: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 2
  • miscellaneous:
    • SM4:
      • SM4: 1
  • AES_competition:
    • AES:
      • AES: 3
  • DES:
    • 3DES:
      • TDEA: 3
      • Triple-DES: 13
    • DES:
      • DEA: 2
      • DES: 5
pdf_data/report_keywords/randomness
  • TRNG:
    • DTRNG: 7
  • RNG:
    • RNG: 5
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 6
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 2
    • side channel: 1
    • timing attacks: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 31: 2
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
  • BSI:
    • AIS 25: 1
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 36: 4
  • FIPS:
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 15408:2005: 3
    • ISO/IEC15408: 2005: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • BSI-DSZ-CC-0312, Version 1.0, 29 August 2005, Philips Semiconductors, Business Line Identification (confidential document) [17] Instruction Set SmartMX-Family, Secure and PKI Smart Card Controller, Objective Specification: 1
    • Philips Semiconductors, Revision 3.3, 25 May 2005 (confidential document) [15] FIPS PUB 46-3 FEDERAL INFORMATION PROCESSING STANDARDS PUBLICATION DATA ENCRYPTION STANDARD: 1
    • Philips Semiconductors, Revision 3.3, 31 May 2005 (confidential document) [14] Data Sheet, P5CD036, SmartMX, Secure Dual Interface Smart Card Controller, Product Data Sheet: 1
    • Secure 8-bit Smart Card Controller, BSI-DSZ-CC-0375, T-Systems GEI GmbH, Version 2.2, 18 May 2007 (confidential document) [11] Guidance, Delivery and Operation Manual for the P5CT072V0N, BSI- DSZ-CC-0312, Version 1.0: 1
    • Secure 8-bit Smart Card Controller, Philips Semiconductors, Business Line Identification (confidential document) [7] Security Target Lite BSI-DSZ-CC-0312, Version 1.0, 25 August 2005, Evaluation of the Philips: 1
    • Secure 8-bit Smart Card Controller, Philips Semiconductors, Business Line Identification (confidential document). The evaluators verified, that the requirements for the TOE life cycle phases up to delivery (as: 1
    • Smart Card Controller, Product Data Sheet, Philips Semiconductors, Revision 3.3, 25 May 2005 (confidential document) [13] Data Sheet, P5CD072, SmartMX, Secure Dual Interface Smart Card Controller, Product Data Sheet: 1
    • Technical Report, Philips P5CT072V0N Secure Smart Card Controller, Version 1.2, 22 May 2007 (confidential document) [9] Smartcard IC Platform Protection Profile, Version 1.0, July 2001, registered at the German: 1
pdf_data/report_metadata
  • /CreationDate: D:20181009091716+02'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: ANSSI-CC-CER-F-07.026
  • /ModDate: D:20181017164259+02'00'
  • /Producer: Microsoft® Word 2010
  • /Subject:
  • /Title:
  • pdf_file_size_bytes: 822740
  • pdf_hyperlinks: mailto:[email protected], http://www.ssi.gouv.fr/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 17
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Company: BSI, Postfach 200363, 53133 Bonn
  • /CreationDate: D:20070628070712+02'00'
  • /Creator: Acrobat PDFMaker 7.0.7 für Word
  • /Keywords: Common Criteria, Certification, Zertifizierung, NXP,NXP Secure Smart Card Controller
  • /ModDate: D:20070628071341+02'00'
  • /Producer: Acrobat Distiller 7.0.5 (Windows)
  • /SourceModified: D:20070628050650
  • /Title: Certification Report BSI-DSZ-CC-0375-2007
  • pdf_file_size_bytes: 335519
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 52
pdf_data/st_filename anssi-cible-2018_30en.pdf 0312b.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0312: 79
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084: 2
    • BSI-CC-PP-0084-: 1
    • BSI-PP-0084: 1
  • BSI:
    • BSI-PP-0002-2001: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL6: 7
    • EAL6 augmented: 3
  • EAL:
    • EAL 5: 4
    • EAL 5 augmented: 2
    • EAL4: 4
    • EAL4 augmented: 1
    • EAL4+: 1
    • EAL5: 34
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 5
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.2: 1
    • ADV_INT.3: 1
    • ADV_SPM.1: 2
    • ADV_TDS.5: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • APE:
    • APE_ECD: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 2
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 11
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 1
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 5
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 1
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 3
    • ACM_SCP.2: 4
    • ACM_SCP.3: 5
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 3
    • ADV_FSP.2: 4
    • ADV_FSP.3: 6
    • ADV_HLD: 1
    • ADV_HLD.3: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 4
    • ADV_RCR.2: 1
    • ADV_SPM: 1
    • ADV_SPM.3: 1
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 2
    • AGD_USR: 2
    • AGD_USR.1: 2
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_LCD: 1
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.2: 1
  • ATE:
    • ATE_COV.2: 2
    • ATE_DPT.2: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA.1: 1
    • AVA_MSU: 2
    • AVA_MSU.3: 1
    • AVA_SOF.1: 2
    • AVA_VLA.4: 3
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 7
    • FCS_CKM.4: 5
    • FCS_COP: 15
    • FCS_COP.1: 9
    • FCS_RNG: 17
    • FCS_RNG.1: 14
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 10
    • FDP_ACC.1: 20
    • FDP_ACC.1.1: 1
    • FDP_ACF: 14
    • FDP_ACF.1: 17
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 23
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 18
    • FDP_ITT.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 14
    • FDP_SDI: 1
    • FDP_SDI.1: 2
    • FDP_SDI.2: 8
    • FDP_UCT.1: 9
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 9
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_API: 6
    • FIA_API.1: 12
    • FIA_API.1.1: 2
  • FMT:
    • FMT_LIM: 22
    • FMT_LIM.1: 28
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 32
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 12
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 16
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 22
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 16
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 13
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 4
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_CKM: 1
    • FCS_CKM.1: 4
    • FCS_CKM.4: 3
    • FCS_COP.1: 13
    • FCS_COP.1.1: 1
    • FCS_RND.1: 5
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC.1: 33
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 30
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 10
    • FDP_ITC.1: 4
    • FDP_ITT.1: 6
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 3
    • FMT_MSA.1: 29
    • FMT_MSA.1.1: 2
    • FMT_MSA.2: 4
    • FMT_MSA.3: 22
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 14
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 8
  • FPT:
    • FPT_AMT.1: 1
    • FPT_FLS.1: 7
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
    • FPT_SEP.1: 6
  • FRU:
    • FRU_FLT.2: 7
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 5
    • O.MEM_ACCESS: 1
    • O.RND: 6
    • O.TDES: 7
  • T:
    • T.RND: 5
  • O:
    • O.MEM_ACCESS: 8
    • O.MF_FW: 8
    • O.RND: 3
    • O.SFR_ACCESS: 8
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 19
  • Philips:
    • Philips: 111
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 27
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 13
      • Triple-DES: 6
    • DES:
      • DES: 9
  • constructions:
    • MAC:
      • HMAC: 1
  • miscellaneous:
    • SM4:
      • SM4: 2
  • AES_competition:
    • AES:
      • AES: 10
  • DES:
    • 3DES:
      • TDEA: 3
      • Triple-DEA: 1
      • Triple-DES: 10
    • DES:
      • DEA: 2
      • DES: 29
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 11
    • RNG: 8
  • TRNG:
    • DTRNG: 24
    • TRNG: 1
  • RNG:
    • RND: 5
    • RNG: 12
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • ECB:
    • ECB: 3
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 3
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 26
    • malfunction: 11
    • physical tampering: 3
  • SCA:
    • DPA: 4
    • Leak-Inherent: 23
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side channel: 1
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
  • FI:
    • Malfunction: 10
    • fault injection: 3
    • malfunction: 1
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • Leak-Inherent: 14
    • Physical Probing: 2
    • physical probing: 1
    • timing attacks: 2
pdf_data/st_keywords/cplc_data
  • ICVersion:
    • IC Version: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 1
    • BSI-AIS31: 2
  • CC:
    • CCMB-2017-04-001: 6
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 180-4: 1
    • FIPS 197: 1
    • FIPS PUB 180-3: 3
    • FIPS197: 1
  • BSI:
    • AIS31: 3
  • FIPS:
    • FIPS PUB 197: 1
    • FIPS PUB 46: 1
    • FIPS PUB 46-3: 3
pdf_data/st_metadata
  • /Company: Samsung Electronics
  • /CreationDate: D:20180518122957+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Document_Name: Document Name
  • /Document_Type: UM
  • /ModDate: D:20181017164328+02'00'
  • /Preliminary: (Preliminary Spec)
  • /Producer: Adobe PDF Library 10.0
  • /Product_Description: Product Description (Sub-Title)
  • /Product_Name: Product Name
  • /Revision_Date: January 2013
  • /Revision_Number: 1.18
  • /Security_Level: Samsung Confidential
  • /SourceModified: D:20180518032927
  • /Title:
  • /Year: 2013
  • /_DocHome: 1177583831
  • pdf_file_size_bytes: 1337228
  • pdf_hyperlinks: mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 101
  • /Author: HGA
  • /Company: Philips Semiconductors BL ID
  • /CreationDate: D:20050825173407+02'00'
  • /Creator: Acrobat PDFMaker 6.0 for Word
  • /ModDate: D:20050825173438+02'00'
  • /Producer: Acrobat Distiller 6.0 (Windows)
  • /Title: Security Target
  • pdf_file_size_bytes: 473340
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 77
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