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Common Criteria
Searchfound 6995 records, displaying 1141 - 1160
| ID | Name | Manufacturer | Cert. lab | Scheme | EAL | Status | Cert. date | Archive date |
|---|---|---|---|---|---|---|---|---|
| BSI-DSZ-CC-1139-V4-2024 | D-TRUST Web-Dienst TSE-CSP, Version 1.4.1 | D-Trust GmbH |
BSI | 🇩🇪 DE | EAL2+ | active | 13.02.2024 | 12.02.2029 |
| BSI-DSZ-CC-1137-V4-2024 | D-TRUST TSE-SMAERS, Version 1.4.3 | Bundesdruckerei GmbH |
BSI | 🇩🇪 DE | EAL2+ | archived | 13.02.2024 | 12.02.2024 |
| ANSSI-CC-2023/10-R01 | ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52) ( ANSSI-CC-2023/10-R01 ) | NXP Semiconductors Germany GmbH |
🇫🇷 FR | EAL4+ | active | 09.02.2024 | 09.02.2029 | |
| ANSSI-CC-2023/11-R01 | ChipDoc v4 on JCOP 4.5 P71 in ICAO EAC(1&2) with PACE configuration (Version 4.0.1.52) (ANSSI-CC-2023/11-R01) | NXP Semiconductors Germany GmbH |
🇫🇷 FR | EAL5+ | active | 09.02.2024 | 09.02.2029 | |
| ANSSI-CC-2023/57 | IAS Classic V4.4.2 with MOC Server 1.1 on MultiApp V4.1 version IAS : 4.4.2.A, version MOC Server : 1.1.1A (ANSSI-CC-2023/57 ) | THALES DIS FRANCE SA |
🇫🇷 FR | EAL5+ | active | 09.02.2024 | 09.02.2029 | |
| ANSSI-CC-2023/12-R01 | ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration (Version 4.0.1.52) (ANSSI-CC-2023/12-R01) | NXP Semiconductors Germany GmbH |
🇫🇷 FR | EAL5+ | active | 09.02.2024 | 09.02.2029 | |
| CCEVS-VR-VID-11450-2024 | TheJoin, Inc., Join-Virtual Mobile Platform 6.1.0 | TheJoin, Inc. |
US | 🇺🇸 US | EAL1 | archived | 08.02.2024 | 08.02.2026 |
| BSI-DSZ-CC-0918-V6-2024 | CONEXA 3.0, SW: v3.80.0-cc, HW V01.00 & V01.01 | Theben Smart Energy GmbH |
BSI | 🇩🇪 DE | EAL4+ | active | 08.02.2024 | 07.02.2032 |
| KECS-CISS-1288-2024 | Pass-Ni SSO v5.0 | UbiNtisLab Co., Ltd. |
🇰🇷 KR | EAL1+ | active | 07.02.2024 | 07.02.2029 | |
| ISCB-3-RPT-C129-CR-v1a | SECIRON – Android mobile Application Hardening Sandbox Module (AMAHSM) version: 7.0 | SecIron (Malaysia) Sdn. Bhd. |
🇲🇾 MY | EAL2 | active | 06.02.2024 | 06.02.2029 | |
| CCEVS-VR-VID-11347-2024 | Apple macOS 13 Ventura | Apple Inc. |
US | 🇺🇸 US | EAL1 | archived | 06.02.2024 | 06.02.2026 |
| OCSI/CERT/CCL/12/2022/RC | Tresorit Core Interface v5.0 | Tresorit Kft |
🇮🇹 IT | EAL4+ | active | 06.02.2024 | 06.02.2029 | |
| ANSSI-CC-2023/71 | Samsung TEEgris on Exynos 2200 (Version 5.0.0.0) (ANSSI-CC-2023/71) | Samsung Electronics Co., Ltd. |
🇫🇷 FR | EAL2+ | active | 01.02.2024 | 01.02.2029 | |
| JISEC-CC-CRP-C0805-01-2024 | RICOH IM 7000/8000/9000,SAVIN IM 7000/8000/9000,LANIER IM 7000/8000/9000,nashuatec IM 7000/8000/9000,Rex Rotary IM 7000/8000/9000,Gestetner IM 7000/8000/9000E-2.00 | Ricoh Company, Ltd. |
🇯🇵 JP | EAL2+ | active | 31.01.2024 | 31.01.2029 | |
| JISEC-CC-CRP-C0804-01-2024 | RICOH IM 9000/9000T/8000/7000J-2.00 | Ricoh Company, Ltd. |
🇯🇵 JP | EAL2+ | active | 31.01.2024 | 31.01.2029 | |
| NSCIB-CC-2300054-01-CR | DocuSign QSCD for remote signing version 1.2.0.7 | DocuSign, Inc. |
🇳🇱 NL | EAL4+ | active | 30.01.2024 | 30.01.2029 | |
| NSCIB-CC-2300052-01-CR | DocuSign QSCD for local signing version 1.2.0.7 | DocuSign, Inc. |
🇳🇱 NL | EAL4+ | active | 30.01.2024 | 30.01.2029 | |
| NSCIB-CC-2300177-01-CR | STMicroelectronics NesLib 6.7.4 on ST33K1M5A and ST33K1M5M B02 | STMicroelectronics |
🇳🇱 NL | EAL5+ | active | 29.01.2024 | 29.01.2029 | |
| 614-LSS | Oracle VM Server for SPARC 3.6 and Oracle Solaris 11.4 | Oracle Corporation |
🇨🇦 CA | EAL1 | active | 25.01.2024 | 25.01.2029 | |
| BSI-DSZ-CC-1229-2024 | Infineon Security Controller IFX_CCI_00007Dh, IFX_CCI_00007Eh, IFX_CCI_00007Fh, design step H11 with firmware version 80.506.04.1, optional CryptoSuite version 4.06.002, optional HSL version 04.05.0030, optional UMSLC version 02.01.0040, optional NRGâ„¢ version 06.10.0003 and user guidance documents | Infineon Technologies AG |
BSI | 🇩🇪 DE | EAL6+ | active | 25.01.2024 | 25.01.2029 |
found 6995 records, displaying 1141 - 1160