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S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219)
ANSSI-CC-2023/09 		S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
ANSSI-CC-2019/19
name S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219) S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
not_valid_before 2023-02-16 2019-04-18
not_valid_after 2028-02-16 2024-04-18
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-2023_09en.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-cc-2019_19en.pdf
status active archived
security_level ASE_TSS.2, EAL6+ EAL5+, AVA_VAN.5, ALC_DVS.2
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2023_09.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2019_19fr.pdf
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-cc-2023_09.pdf None
protection_profiles frozendict({'_type': 'sec_certs.sample.protection_profile.ProtectionProfile', 'pp_name': 'Security IC Platform Protection Profile with Augmentation Packages', 'pp_eal': 'EAL4+', 'pp_link': 'https://www.commoncriteriaportal.org/files/ppfiles/pp0084b_pdf.pdf', 'pp_ids': frozenset({'BAROC_SC_PP_V1.0', 'SECURITY_IC_AUGP_V1.0', 'JAVA_OC'})}) frozendict({'_type': 'sec_certs.sample.protection_profile.ProtectionProfile', 'pp_name': 'Security IC Platform Protection Profile, Version 1.0', 'pp_eal': 'EAL4+', 'pp_link': 'https://www.commoncriteriaportal.org/files/ppfiles/pp0035b.pdf', 'pp_ids': frozenset({'PKISKPP', 'SECURITY_IC_V1.0'})})
state/cert/convert_ok True False
state/cert/download_ok True False
state/cert/pdf_hash 120d113282f604377188f3a2976995aefa0fb9f6fa7b0bd6130688630557491d None
state/cert/txt_hash 834e6e1925beee7a5564796b761c6668ab1983aaba34b655b2cec2568a2e0242 None
state/report/extract_ok False True
state/report/pdf_hash a1a2c08e49684e39cf237c2ce3ae3a5d917a9d74e4e529b64e9def6e549be866 e1691498d9a8587559346d0e11573c29a3c4dd25135d0a8b0abbb35f5aca5d73
state/report/txt_hash 69d15de8ca3115ebb4d06df75b370fee2eb2cf1ee2077b6b646ccdd6c1fc01fa 9e8efc22d918f1b7e02e119b79c6040191730b084ff081487d0057885fbcbef7
state/st/extract_ok False True
state/st/pdf_hash a3aad4175054424bff4a90b6a7956fc8e7be1cdb6bba271a1cbe1ea33dd6a5d9 d57227717aeb7bec157f618bd0635bb3dc3bafa1b513700356a939b37b2eb0c4
state/st/txt_hash d967e0acd96510fc9de740d15c49399ebe0dbd82caf0a0413432246d39f01e05 8bbccdf223fc178b29eaca96dd1ea50cd3e9716f1c2a5e9259ae4ee03b88d1ae
heuristics/cert_id ANSSI-CC-2023/09 ANSSI-CC-2019/19
heuristics/cert_lab None CEA
heuristics/report_references/directly_referencing None ANSSI-CC-2018/26
heuristics/report_references/indirectly_referencing None ANSSI-CC-2013/46, ANSSI-CC-2018/26, ANSSI-CC-2014/59, ANSSI-CC-2014/37
heuristics/scheme_data
  • product: S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219)
  • url: https://cyber.gouv.fr/produits-certifies/s3ft9mfs3ft9mts3ft9ms-16-bit-risc-microcontroller-smart-card-optional-secure-2
  • description: Le produit évalué est la famille de microcontrôleurs « S3FT9MF/S3FT9MT/S3FT9MS, version S3FT9MF_20221219 » développée par SAMSUNG ELECTRONICS. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont m
  • sponsor: SAMSUNG ELECTRONICS
  • developer: SAMSUNG ELECTRONICS
  • cert_id: ANSSI-CC-2023/09
  • level: EAL6+
  • expiration_date: 15 Février 2028
  • enhanced:
    • cert_id: ANSSI-CC-2023/09
    • certification_date: 16/02/2023
    • expiration_date: 15/02/2028
    • category: Micro-circuits
    • cc_version: Critères Communs version 3.1r5
    • developer: SAMSUNG ELECTRONICS
    • sponsor: SAMSUNG ELECTRONICS
    • evaluation_facility: CEA - LETI
    • level: EAL6+
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Loader dedicated for usage in Secured Environment only”, “Loader dedicated for usage by authorized users only”
    • mutual_recognition: CCRA SOG-IS
    • augmented: ASE_TSS.2
    • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/Certificat-CC-2023_09.pdf
  • product: S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
  • url: https://cyber.gouv.fr/produits-certifies/s3ft9pe-samsung-16-bit-risc-microcontroller-smart-card-optional-secure-rsaeccsha
  • description: Le produit évalué est la famille des microcontrôleurs « S3FT9PE » de référence S3FT9PE_20190329, développée par Samsung Electronics Co Ltd. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont multiples
  • sponsor: Samsung Electronics Co.Ltd.
  • developer: Samsung Electronics Co.Ltd.
  • cert_id: 2019/19
  • level: EAL5+
  • enhanced:
    • cert_id: 2019/19
    • certification_date: 18/04/2019
    • category: Micro-circuits
    • cc_version: Critères Communs version 3.1r5
    • developer: Samsung Electronics Co.Ltd.
    • sponsor: Samsung Electronics Co.Ltd.
    • evaluation_facility: CEA-LETI
    • level: EAL5+
    • protection_profile: Security IC Platform Protection Profile version 1.0, BSI-PP-0035
    • mutual_recognition: SOG-IS CCRA
    • augmented: ALC_DVS.2, AVA_VAN.5
    • report_link: https://cyber.gouv.fr/sites/default/files/2019/05/anssi-cc-2019_19fr.pdf
    • target_link: https://cyber.gouv.fr/sites/default/files/2019/05/anssi-cible-cc-2019_19en.pdf
heuristics/scheme_data/cert_id ANSSI-CC-2023/09 2019/19
heuristics/scheme_data/description Le produit évalué est la famille de microcontrôleurs « S3FT9MF/S3FT9MT/S3FT9MS, version S3FT9MF_20221219 » développée par SAMSUNG ELECTRONICS. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont m Le produit évalué est la famille des microcontrôleurs « S3FT9PE » de référence S3FT9PE_20190329, développée par Samsung Electronics Co Ltd. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont multiples
heuristics/scheme_data/developer SAMSUNG ELECTRONICS Samsung Electronics Co.Ltd.
heuristics/scheme_data/enhanced
  • cert_id: ANSSI-CC-2023/09
  • certification_date: 16/02/2023
  • expiration_date: 15/02/2028
  • category: Micro-circuits
  • cc_version: Critères Communs version 3.1r5
  • developer: SAMSUNG ELECTRONICS
  • sponsor: SAMSUNG ELECTRONICS
  • evaluation_facility: CEA - LETI
  • level: EAL6+
  • protection_profile: Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Loader dedicated for usage in Secured Environment only”, “Loader dedicated for usage by authorized users only”
  • mutual_recognition: CCRA SOG-IS
  • augmented: ASE_TSS.2
  • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/Certificat-CC-2023_09.pdf
  • cert_id: 2019/19
  • certification_date: 18/04/2019
  • category: Micro-circuits
  • cc_version: Critères Communs version 3.1r5
  • developer: Samsung Electronics Co.Ltd.
  • sponsor: Samsung Electronics Co.Ltd.
  • evaluation_facility: CEA-LETI
  • level: EAL5+
  • protection_profile: Security IC Platform Protection Profile version 1.0, BSI-PP-0035
  • mutual_recognition: SOG-IS CCRA
  • augmented: ALC_DVS.2, AVA_VAN.5
  • report_link: https://cyber.gouv.fr/sites/default/files/2019/05/anssi-cc-2019_19fr.pdf
  • target_link: https://cyber.gouv.fr/sites/default/files/2019/05/anssi-cible-cc-2019_19en.pdf
heuristics/scheme_data/enhanced/augmented ASE_TSS.2 ALC_DVS.2, AVA_VAN.5
heuristics/scheme_data/enhanced/cert_id ANSSI-CC-2023/09 2019/19
heuristics/scheme_data/enhanced/certification_date 16/02/2023 18/04/2019
heuristics/scheme_data/enhanced/developer SAMSUNG ELECTRONICS Samsung Electronics Co.Ltd.
heuristics/scheme_data/enhanced/evaluation_facility CEA - LETI CEA-LETI
heuristics/scheme_data/enhanced/level EAL6+ EAL5+
heuristics/scheme_data/enhanced/mutual_recognition CCRA SOG-IS SOG-IS CCRA
heuristics/scheme_data/enhanced/protection_profile Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Loader dedicated for usage in Secured Environment only”, “Loader dedicated for usage by authorized users only” Security IC Platform Protection Profile version 1.0, BSI-PP-0035
heuristics/scheme_data/enhanced/sponsor SAMSUNG ELECTRONICS Samsung Electronics Co.Ltd.
heuristics/scheme_data/level EAL6+ EAL5+
heuristics/scheme_data/product S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219) S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
heuristics/scheme_data/sponsor SAMSUNG ELECTRONICS Samsung Electronics Co.Ltd.
heuristics/scheme_data/url https://cyber.gouv.fr/produits-certifies/s3ft9mfs3ft9mts3ft9ms-16-bit-risc-microcontroller-smart-card-optional-secure-2 https://cyber.gouv.fr/produits-certifies/s3ft9pe-samsung-16-bit-risc-microcontroller-smart-card-optional-secure-rsaeccsha
pdf_data/cert_filename certificat-cc-2023_09.pdf None
pdf_data/cert_keywords
  • cc_cert_id:
    • FR:
      • ANSSI-CC-2023/09: 2
  • cc_protection_profile_id:
    • BSI:
      • BSI-CC-PP-0084-2014: 1
  • cc_security_level:
    • EAL:
      • EAL6: 1
      • EAL2: 1
  • cc_sar:
    • ASE:
      • ASE_TSS.2: 1
  • cc_sfr:
  • cc_claims:
  • vendor:
  • eval_facility:
    • CEA-LETI:
      • CEA - LETI: 1
      • CEA-LETI: 1
  • symmetric_crypto:
  • asymmetric_crypto:
  • pq_crypto:
  • hash_function:
  • crypto_scheme:
  • crypto_protocol:
  • randomness:
  • cipher_mode:
  • ecc_curve:
  • crypto_engine:
  • tls_cipher_suite:
  • crypto_library:
  • vulnerability:
  • side_channel_analysis:
  • technical_report_id:
  • device_model:
  • tee_name:
  • os_name:
  • cplc_data:
  • ic_data_group:
  • standard_id:
  • javacard_version:
  • javacard_api_const:
  • javacard_packages:
  • certification_process:
None
pdf_data/report_filename anssi-cc-2023_09.pdf anssi-cc-2019_19fr.pdf
pdf_data/report_frontpage/FR
  • match_rules: Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables
  • cert_id: ANSSI-CC-2019/19
  • cert_item: S3FT9PE
  • cert_item_version: S3FT9PE_20190329
  • ref_protection_profiles: Security IC Platform Protection Profile version 1.0, BSI-PP-0035
  • cc_version: Critères Communs version 3.1 révision 5
  • cc_security_level: EAL 5 augmenté ALC_DVS.2, AVA_VAN.5
  • developer: Samsung Electronics Co. Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud Commanditaire Samsung Electronics Co. Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud
  • cert_lab: CEA - LETI 17 avenue des martyrs, 38054 Grenoble Cedex 9, France
pdf_data/report_keywords/cc_cert_id/FR
  • ANSSI-CC-2023/09: 2
  • ANSSI-CC-2019/19: 15
  • ANSSI-CC-2018/26: 2
pdf_data/report_keywords/cc_protection_profile_id/BSI
  • BSI-CC-PP-0084-2014: 1
  • BSI-PP-0084-2014: 1
  • BSI-PP-0035: 1
  • BSI-PP-0035-2007: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
    • ALC_CMC: 1
  • AVA:
    • AVA_VAN: 1
  • ASE:
    • ASE_TSS.2: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_TAT: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN.5: 3
    • AVA_VAN: 2
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
pdf_data/report_keywords/cc_sar/ALC
  • ALC_FLR: 1
  • ALC_CMC: 1
  • ALC_DVS.2: 2
  • ALC_FLR: 2
  • ALC_CMC: 1
  • ALC_CMS: 1
  • ALC_DEL: 1
  • ALC_DVS: 1
  • ALC_TAT: 1
pdf_data/report_keywords/cc_sar/ALC/ALC_FLR 1 2
pdf_data/report_keywords/cc_sar/ASE
  • ASE_TSS.2: 1
  • ASE_CCL: 1
  • ASE_ECD: 1
  • ASE_INT: 1
  • ASE_OBJ: 1
  • ASE_REQ: 1
  • ASE_SPD: 1
  • ASE_TSS: 1
pdf_data/report_keywords/cc_sar/AVA
  • AVA_VAN: 1
  • AVA_VAN.5: 3
  • AVA_VAN: 2
pdf_data/report_keywords/cc_sar/AVA/AVA_VAN 1 2
pdf_data/report_keywords/cc_security_level/EAL
  • EAL6: 1
  • EAL2: 2
  • EAL7: 1
  • EAL 5: 3
  • EAL2: 2
  • EAL7: 1
  • EAL 1: 1
  • EAL 3: 1
  • EAL 7: 1
pdf_data/report_keywords/cplc_data
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 3
pdf_data/report_keywords/eval_facility/CESTI/CESTI 4 3
pdf_data/report_keywords/randomness
  • TRNG:
    • DTRNG: 10
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • BSI:
    • AIS 31: 2
    • AIS31: 1
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
pdf_data/report_keywords/standard_id/CC
  • CCMB-2017-04-001: 1
  • CCMB-2017-04-002: 1
  • CCMB-2017-04-003: 1
  • CCMB-2017-04-001: 1
  • CCMB-2017-04-002: 1
  • CCMB-2017-04-003: 1
  • CCMB-2017-04-004: 1
pdf_data/report_keywords/symmetric_crypto/AES_competition/AES/AES 1 2
pdf_data/report_keywords/symmetric_crypto/DES
  • DES:
    • DES: 1
  • 3DES:
    • TDES: 1
  • DES:
    • DES: 2
pdf_data/report_keywords/symmetric_crypto/DES/DES/DES 1 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 6
pdf_data/report_metadata None
  • pdf_file_size_bytes: 196952
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
  • /Category: S3FT9PE_20190329
  • /Comments: Samsung Electronics Co. Ltd.
  • /Company: SGDSN/ANSSI
  • /CreationDate: D:20190503143100+02'00'
  • /Creator: Acrobat PDFMaker 11 pour Word
  • /Keywords: ANSSI-CC-CER-F-07.28.1
  • /ModDate: D:20190503143310+02'00'
  • /Producer: Adobe PDF Library 11.0
  • /SourceModified: D:20190503123057
  • /Subject: S3FT9PE
  • /Title: ANSSI-CC-2019/19
  • pdf_hyperlinks: mailto:[email protected], http://www.ssi.gouv.fr/
pdf_data/st_filename anssi-cible-2023_09en.pdf anssi-cible-cc-2019_19en.pdf
pdf_data/st_keywords/asymmetric_crypto/ECC/ECC/ECC 22 25
pdf_data/st_keywords/asymmetric_crypto/ECC/ECDH/ECDH 18 7
pdf_data/st_keywords/asymmetric_crypto/ECC/ECDSA/ECDSA 24 14
pdf_data/st_keywords/asymmetric_crypto/FF/DH/Diffie-Hellman 6 2
pdf_data/st_keywords/asymmetric_crypto/FF/DSA/DSA 7 2
pdf_data/st_keywords/cc_claims/O
  • O.RSA: 8
  • O.ECDSA: 6
  • O.ECDH: 7
  • O.SHA: 7
  • O.RND: 6
  • O.TDES: 7
  • O.AES: 5
  • O.MEM_ACCESS: 1
  • O.RNG: 1
  • O.RND: 5
  • O.MEM_ACCESS: 1
pdf_data/st_keywords/cc_claims/O/O.RND 6 5
pdf_data/st_keywords/cc_protection_profile_id/BSI
  • BSI-CC-PP-0084: 2
  • BSI-PP-0084: 1
  • BSI-CC-PP-0084-: 1
  • BSI-PP-0035: 5
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 2
    • ADV_IMP: 1
    • ADV_ARC.1: 5
    • ADV_SPM.1: 2
    • ADV_FSP.5: 3
    • ADV_IMP.2: 1
    • ADV_INT.3: 1
    • ADV_TDS.5: 1
    • ADV_FSP.4: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_DVS.2: 2
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_CMS: 2
    • ALC_CMC: 1
    • ALC_CMC.5: 1
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
    • ALC_CMS.4: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 1
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 5
    • AVA_VAN: 1
  • APE:
    • APE_ECD: 1
  • ASE:
    • ASE_TSS.2: 11
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 2
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_REQ.1: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 2
    • ADV_IMP: 1
    • ADV_VAN: 1
    • ADV_ARC.1: 7
    • ADV_FSP.5: 3
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
    • ADV_FSP.4: 2
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_DVS.2: 7
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_CMS: 2
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
    • ALC_DVS.1: 1
    • ALC_CMS.4: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
    • ATE_DPT.1: 1
  • AVA:
    • AVA_VAN.5: 13
    • AVA_VAN: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
pdf_data/st_keywords/cc_sar/ADV
  • ADV_ARC: 1
  • ADV_FSP: 2
  • ADV_IMP: 1
  • ADV_ARC.1: 5
  • ADV_SPM.1: 2
  • ADV_FSP.5: 3
  • ADV_IMP.2: 1
  • ADV_INT.3: 1
  • ADV_TDS.5: 1
  • ADV_FSP.4: 1
  • ADV_ARC: 1
  • ADV_FSP: 2
  • ADV_IMP: 1
  • ADV_VAN: 1
  • ADV_ARC.1: 7
  • ADV_FSP.5: 3
  • ADV_IMP.1: 2
  • ADV_INT.2: 1
  • ADV_TDS.4: 1
  • ADV_FSP.4: 2
  • ADV_TDS.3: 1
pdf_data/st_keywords/cc_sar/ADV/ADV_ARC.1 5 7
pdf_data/st_keywords/cc_sar/ADV/ADV_FSP.4 1 2
pdf_data/st_keywords/cc_sar/AGD/AGD_OPE.1 1 2
pdf_data/st_keywords/cc_sar/AGD/AGD_PRE.1 1 2
pdf_data/st_keywords/cc_sar/ALC
  • ALC_DVS.2: 2
  • ALC_DEL: 1
  • ALC_DVS: 1
  • ALC_CMS: 2
  • ALC_CMC: 1
  • ALC_CMC.5: 1
  • ALC_CMS.5: 3
  • ALC_DEL.1: 1
  • ALC_LCD.1: 1
  • ALC_TAT.3: 1
  • ALC_CMS.4: 1
  • ALC_DVS.2: 7
  • ALC_DEL: 1
  • ALC_DVS: 1
  • ALC_CMS: 2
  • ALC_CMC: 1
  • ALC_CMC.4: 1
  • ALC_CMS.5: 3
  • ALC_DEL.1: 1
  • ALC_LCD.1: 1
  • ALC_TAT.2: 1
  • ALC_DVS.1: 1
  • ALC_CMS.4: 1
pdf_data/st_keywords/cc_sar/ALC/ALC_DVS.2 2 7
pdf_data/st_keywords/cc_sar/ASE
  • ASE_TSS.2: 11
  • ASE_CCL.1: 1
  • ASE_ECD.1: 1
  • ASE_INT.1: 2
  • ASE_OBJ.2: 1
  • ASE_REQ.2: 1
  • ASE_SPD.1: 1
  • ASE_REQ.1: 1
  • ASE_CCL.1: 1
  • ASE_ECD.1: 1
  • ASE_INT.1: 1
  • ASE_OBJ.2: 1
  • ASE_REQ.2: 1
  • ASE_SPD.1: 1
  • ASE_TSS.1: 1
pdf_data/st_keywords/cc_sar/ASE/ASE_INT.1 2 1
pdf_data/st_keywords/cc_sar/ATE
  • ATE_COV: 1
  • ATE_COV.3: 1
  • ATE_DPT.3: 1
  • ATE_FUN.2: 1
  • ATE_IND.2: 1
  • ATE_COV: 1
  • ATE_COV.2: 1
  • ATE_DPT.3: 1
  • ATE_FUN.1: 1
  • ATE_IND.2: 1
  • ATE_DPT.1: 1
pdf_data/st_keywords/cc_sar/AVA/AVA_VAN.5 5 13
pdf_data/st_keywords/cc_security_level/EAL
  • EAL6+: 2
  • EAL6: 5
  • EAL 4: 1
  • EAL 5: 2
  • EAL6 augmented: 1
  • EAL 4 augmented: 1
  • EAL 5 augmented: 2
  • EAL5: 6
  • EAL 4: 1
  • EAL 5: 2
  • EAL5 augmented: 1
  • EAL 4 augmented: 1
  • EAL 5 augmented: 2
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS: 8
    • FAU_GEN: 2
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
    • FAU_GEN.1: 1
  • FCS:
    • FCS_RNG: 25
    • FCS_RNG.1: 18
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
    • FCS_COP.1: 21
    • FCS_COP: 51
    • FCS_CKM.1: 40
    • FCS_CKM.4: 25
    • FCS_CKM: 38
    • FCS_CKM.2: 4
    • FCS_CMK: 5
  • FDP:
    • FDP_SDC: 4
    • FDP_ACF: 14
    • FDP_SDC.1: 14
    • FDP_SDI: 1
    • FDP_SDC.1.1: 2
    • FDP_SDI.2: 8
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_ITT.1: 18
    • FDP_ITT.1.1: 1
    • FDP_ACC.1: 20
    • FDP_IFC.1: 23
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ACF.1: 17
    • FDP_ACC.1.1: 1
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ITC.1: 21
    • FDP_ITC.2: 21
    • FDP_UCT.1: 9
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 9
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
    • FDP_ACC: 10
    • FDP_SDI.1: 1
    • FDP_IFC: 1
    • FDP_ITT: 1
  • FIA:
    • FIA_API: 6
    • FIA_API.1: 12
    • FIA_API.1.1: 2
  • FMT:
    • FMT_LIM: 22
    • FMT_LIM.1: 28
    • FMT_LIM.2: 32
    • FMT_LIM.1.1: 2
    • FMT_LIM.2.1: 2
    • FMT_MSA.3: 16
    • FMT_MSA.1: 12
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 6
    • FMT_MSA.1.1: 1
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 1
    • FMT_MSA: 2
    • FMT_SMF: 1
  • FPT:
    • FPT_FLS.1: 22
    • FPT_FLS.1.1: 1
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
    • FPT_PHP: 3
    • FPT_ITT.1: 16
    • FPT_ITT.1.1: 1
    • FPT_FLS: 1
    • FPT_ITT: 1
  • FRU:
    • FRU_FLT.2: 17
    • FRU_FLT.1: 1
    • FRU_FLT.2.1: 1
    • FRU_FLT: 1
  • FTP:
    • FTP_ITC.1: 13
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 4
  • FAU:
    • FAU_SAS: 8
    • FAU_GEN: 2
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
    • FAU_GEN.1: 1
  • FCS:
    • FCS_RNG: 6
    • FCS_RNG.1: 14
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
    • FCS_COP.1: 24
    • FCS_COP: 33
    • FCS_CKM.1: 27
    • FCS_CKM.4: 15
    • FCS_CKM: 9
    • FCS_CKM.2: 4
  • FDP:
    • FDP_ACF: 2
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_ACC.1: 14
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ACF.1: 10
    • FDP_ACC.1.1: 1
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ITC.1: 12
    • FDP_ITC.2: 12
    • FDP_SDI.1: 1
    • FDP_ACC: 1
    • FDP_IFC: 1
    • FDP_ITT: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.2: 28
    • FMT_LIM.1.1: 2
    • FMT_LIM.2.1: 2
    • FMT_MSA.3: 13
    • FMT_MSA.1: 12
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 6
    • FMT_MSA.1.1: 1
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 1
    • FMT_CKM.4: 1
    • FMT_MSA: 2
    • FMT_SMF: 1
  • FPT:
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
    • FPT_PHP: 3
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_FLS: 1
    • FPT_ITT: 1
  • FRU:
    • FRU_FLT.2: 17
    • FRU_FLT.1: 1
    • FRU_FLT: 1
pdf_data/st_keywords/cc_sfr/FCS
  • FCS_RNG: 25
  • FCS_RNG.1: 18
  • FCS_RNG.1.1: 1
  • FCS_RNG.1.2: 1
  • FCS_COP.1: 21
  • FCS_COP: 51
  • FCS_CKM.1: 40
  • FCS_CKM.4: 25
  • FCS_CKM: 38
  • FCS_CKM.2: 4
  • FCS_CMK: 5
  • FCS_RNG: 6
  • FCS_RNG.1: 14
  • FCS_RNG.1.1: 2
  • FCS_RNG.1.2: 2
  • FCS_COP.1: 24
  • FCS_COP: 33
  • FCS_CKM.1: 27
  • FCS_CKM.4: 15
  • FCS_CKM: 9
  • FCS_CKM.2: 4
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM 38 9
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM.1 40 27
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM.4 25 15
pdf_data/st_keywords/cc_sfr/FCS/FCS_COP 51 33
pdf_data/st_keywords/cc_sfr/FCS/FCS_COP.1 21 24
pdf_data/st_keywords/cc_sfr/FCS/FCS_RNG 25 6
pdf_data/st_keywords/cc_sfr/FCS/FCS_RNG.1 18 14
pdf_data/st_keywords/cc_sfr/FCS/FCS_RNG.1.1 1 2
pdf_data/st_keywords/cc_sfr/FCS/FCS_RNG.1.2 1 2
pdf_data/st_keywords/cc_sfr/FDP
  • FDP_SDC: 4
  • FDP_ACF: 14
  • FDP_SDC.1: 14
  • FDP_SDI: 1
  • FDP_SDC.1.1: 2
  • FDP_SDI.2: 8
  • FDP_SDI.2.1: 1
  • FDP_SDI.2.2: 1
  • FDP_ITT.1: 18
  • FDP_ITT.1.1: 1
  • FDP_ACC.1: 20
  • FDP_IFC.1: 23
  • FDP_IFC.1.1: 1
  • FDP_IFF.1: 3
  • FDP_ACF.1: 17
  • FDP_ACC.1.1: 1
  • FDP_ACF.1.1: 1
  • FDP_ACF.1.2: 1
  • FDP_ACF.1.3: 1
  • FDP_ACF.1.4: 1
  • FDP_ITC.1: 21
  • FDP_ITC.2: 21
  • FDP_UCT.1: 9
  • FDP_UCT.1.1: 1
  • FDP_UIT.1: 9
  • FDP_UIT.1.1: 1
  • FDP_UIT.1.2: 1
  • FDP_ACC: 10
  • FDP_SDI.1: 1
  • FDP_IFC: 1
  • FDP_ITT: 1
  • FDP_ACF: 2
  • FDP_ITT.1: 17
  • FDP_ITT.1.1: 1
  • FDP_ACC.1: 14
  • FDP_IFC.1: 18
  • FDP_IFC.1.1: 1
  • FDP_IFF.1: 3
  • FDP_ACF.1: 10
  • FDP_ACC.1.1: 1
  • FDP_ACF.1.1: 1
  • FDP_ACF.1.2: 1
  • FDP_ACF.1.3: 1
  • FDP_ACF.1.4: 1
  • FDP_ITC.1: 12
  • FDP_ITC.2: 12
  • FDP_SDI.1: 1
  • FDP_ACC: 1
  • FDP_IFC: 1
  • FDP_ITT: 1
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACC 10 1
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACC.1 20 14
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF 14 2
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1 17 10
pdf_data/st_keywords/cc_sfr/FDP/FDP_IFC.1 23 18
pdf_data/st_keywords/cc_sfr/FDP/FDP_ITC.1 21 12
pdf_data/st_keywords/cc_sfr/FDP/FDP_ITC.2 21 12
pdf_data/st_keywords/cc_sfr/FDP/FDP_ITT.1 18 17
pdf_data/st_keywords/cc_sfr/FMT
  • FMT_LIM: 22
  • FMT_LIM.1: 28
  • FMT_LIM.2: 32
  • FMT_LIM.1.1: 2
  • FMT_LIM.2.1: 2
  • FMT_MSA.3: 16
  • FMT_MSA.1: 12
  • FMT_MSA.3.1: 1
  • FMT_MSA.3.2: 1
  • FMT_SMR.1: 6
  • FMT_MSA.1.1: 1
  • FMT_SMF.1: 9
  • FMT_SMF.1.1: 1
  • FMT_MSA: 2
  • FMT_SMF: 1
  • FMT_LIM: 8
  • FMT_LIM.1: 24
  • FMT_LIM.2: 28
  • FMT_LIM.1.1: 2
  • FMT_LIM.2.1: 2
  • FMT_MSA.3: 13
  • FMT_MSA.1: 12
  • FMT_MSA.3.1: 1
  • FMT_MSA.3.2: 1
  • FMT_SMR.1: 6
  • FMT_MSA.1.1: 1
  • FMT_SMF.1: 9
  • FMT_SMF.1.1: 1
  • FMT_CKM.4: 1
  • FMT_MSA: 2
  • FMT_SMF: 1
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM 22 8
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM.1 28 24
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM.2 32 28
pdf_data/st_keywords/cc_sfr/FMT/FMT_MSA.3 16 13
pdf_data/st_keywords/cc_sfr/FPT/FPT_FLS.1 22 21
pdf_data/st_keywords/cc_sfr/FPT/FPT_ITT.1 16 15
pdf_data/st_keywords/cc_sfr/FRU
  • FRU_FLT.2: 17
  • FRU_FLT.1: 1
  • FRU_FLT.2.1: 1
  • FRU_FLT: 1
  • FRU_FLT.2: 17
  • FRU_FLT.1: 1
  • FRU_FLT: 1
pdf_data/st_keywords/crypto_engine/TORNADO/TORNADO 1 12
pdf_data/st_keywords/crypto_scheme/KA/Key Agreement 3 2
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP192r1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP192t1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP224r1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP224t1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP256r1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP256t1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP320r1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP320t1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP384r1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP384t1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP512r1 3 4
pdf_data/st_keywords/ecc_curve/Brainpool/brainpoolP512t1 3 4
pdf_data/st_keywords/ecc_curve/NIST/P-192 6 8
pdf_data/st_keywords/ecc_curve/NIST/P-224 6 8
pdf_data/st_keywords/ecc_curve/NIST/P-384 6 8
pdf_data/st_keywords/ecc_curve/NIST/secp192k1 3 4
pdf_data/st_keywords/ecc_curve/NIST/secp192r1 3 4
pdf_data/st_keywords/ecc_curve/NIST/secp224k1 3 4
pdf_data/st_keywords/ecc_curve/NIST/secp224r1 3 4
pdf_data/st_keywords/ecc_curve/NIST/secp256k1 3 4
pdf_data/st_keywords/ecc_curve/NIST/secp256r1 3 4
pdf_data/st_keywords/ecc_curve/NIST/secp384r1 3 4
pdf_data/st_keywords/hash_function/SHA/SHA1
  • SHA1: 2
  • SHA1: 2
  • SHA-1: 1
pdf_data/st_keywords/hash_function/SHA/SHA2
  • SHA224: 6
  • SHA256: 6
  • SHA384: 6
  • SHA512: 5
  • SHA224: 6
  • SHA256: 6
  • SHA384: 6
  • SHA512: 5
  • SHA-224: 2
  • SHA-256: 2
  • SHA-384: 2
  • SHA-512: 2
pdf_data/st_keywords/randomness/RNG/RND 11 10
pdf_data/st_keywords/randomness/RNG/RNG 8 3
pdf_data/st_keywords/randomness/TRNG/DTRNG 54 40
pdf_data/st_keywords/side_channel_analysis/FI
  • physical tampering: 3
  • Malfunction: 26
  • malfunction: 13
  • DFA: 5
  • physical tampering: 2
  • Malfunction: 27
  • malfunction: 11
  • DFA: 5
  • fault injection: 2
pdf_data/st_keywords/side_channel_analysis/FI/Malfunction 26 27
pdf_data/st_keywords/side_channel_analysis/FI/malfunction 13 11
pdf_data/st_keywords/side_channel_analysis/FI/physical tampering 3 2
pdf_data/st_keywords/side_channel_analysis/SCA/DPA 6 9
pdf_data/st_keywords/side_channel_analysis/SCA/Leak-Inherent 24 23
pdf_data/st_keywords/side_channel_analysis/SCA/SPA 5 8
pdf_data/st_keywords/side_channel_analysis/SCA/side-channel 3 2
pdf_data/st_keywords/side_channel_analysis/SCA/timing attack 2 5
pdf_data/st_keywords/side_channel_analysis/other/reverse engineering 4 2
pdf_data/st_keywords/standard_id/BSI/AIS31 10 4
pdf_data/st_keywords/standard_id/BSI/BSI-AIS31 3 6
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-002 3 2
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-003 3 2
pdf_data/st_keywords/symmetric_crypto/AES_competition/AES/AES 30 14
pdf_data/st_keywords/symmetric_crypto/DES/3DES
  • Triple-DES: 5
  • TDES: 16
  • TDEA: 1
  • 3DES: 6
  • Triple-DES: 1
  • TDEA: 1
pdf_data/st_keywords/symmetric_crypto/DES/3DES/Triple-DES 5 1
pdf_data/st_keywords/symmetric_crypto/DES/DES/DES 11 8
pdf_data/st_keywords/vendor/Samsung/Samsung 17 3
pdf_data/st_metadata None
  • pdf_file_size_bytes: 891877
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 69
  • /CreationDate: D:20190313174707+09'00'
  • /Creator: Microsoft® Word 2010
  • /ModDate: D:20190408145508+02'00'
  • /Producer: Microsoft® Word 2010
  • /Title:
  • pdf_hyperlinks: http://www.ecc-brainpool.org/
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