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S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219)
ANSSI-CC-2023/09 		S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0)
ANSSI-CC-2018/30
name S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219) S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0)
category ICs, Smart Cards and Smart Card-Related Devices and Systems Trusted Computing
not_valid_before 2023-02-16 2018-09-27
not_valid_after 2028-02-16 2023-09-27
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-2023_09en.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-2018_30en.pdf
status active archived
manufacturer Samsung Electronics Co., Ltd. Samsung
manufacturer_web https://www.samsung.com https://www.samsung.com/
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2023_09.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2018-30fr.pdf
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-cc-2023_09.pdf None
state/cert/convert_ok True False
state/cert/download_ok True False
state/cert/pdf_hash 120d113282f604377188f3a2976995aefa0fb9f6fa7b0bd6130688630557491d None
state/cert/txt_hash 834e6e1925beee7a5564796b761c6668ab1983aaba34b655b2cec2568a2e0242 None
state/report/extract_ok False True
state/report/pdf_hash a1a2c08e49684e39cf237c2ce3ae3a5d917a9d74e4e529b64e9def6e549be866 ddc4abc5ce1eb8bc5c9c18537834ad31c5c1a1bf4ae181584f5514ab09ccb437
state/report/txt_hash 69d15de8ca3115ebb4d06df75b370fee2eb2cf1ee2077b6b646ccdd6c1fc01fa 1900990b581e4d8b73116ebb38f213c431b4554c2b6a8e96fa9263d4b98f609e
state/st/extract_ok False True
state/st/pdf_hash a3aad4175054424bff4a90b6a7956fc8e7be1cdb6bba271a1cbe1ea33dd6a5d9 4b9d9ef2eaf10acd689096feabf474676603da038dd06fff5a5e4f29934a8cfd
state/st/txt_hash d967e0acd96510fc9de740d15c49399ebe0dbd82caf0a0413432246d39f01e05 42bdc97352a68738a03a5b7f91cb74de434e6246b95773b886a36f4a78c91d7b
heuristics/cert_id ANSSI-CC-2023/09 ANSSI-CC-2018/30
heuristics/cert_lab None CEA
heuristics/extracted_versions 16 0, 32
heuristics/report_references/directly_referenced_by None ANSSI-CC-2019/29, ANSSI-CC-2019/39
heuristics/report_references/indirectly_referenced_by None ANSSI-CC-2019/29, ANSSI-CC-2021/30, ANSSI-CC-2021/30-R01, ANSSI-CC-2019/39
heuristics/scheme_data
  • product: S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219)
  • url: https://cyber.gouv.fr/produits-certifies/s3ft9mfs3ft9mts3ft9ms-16-bit-risc-microcontroller-smart-card-optional-secure-2
  • description: Le produit évalué est la famille de microcontrôleurs « S3FT9MF/S3FT9MT/S3FT9MS, version S3FT9MF_20221219 » développée par SAMSUNG ELECTRONICS. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont m
  • sponsor: SAMSUNG ELECTRONICS
  • developer: SAMSUNG ELECTRONICS
  • cert_id: ANSSI-CC-2023/09
  • level: EAL6+
  • expiration_date: 15 Février 2028
  • enhanced:
    • cert_id: ANSSI-CC-2023/09
    • certification_date: 16/02/2023
    • expiration_date: 15/02/2028
    • category: Micro-circuits
    • cc_version: Critères Communs version 3.1r5
    • developer: SAMSUNG ELECTRONICS
    • sponsor: SAMSUNG ELECTRONICS
    • evaluation_facility: CEA - LETI
    • level: EAL6+
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Loader dedicated for usage in Secured Environment only”, “Loader dedicated for usage by authorized users only”
    • mutual_recognition: CCRA SOG-IS
    • augmented: ASE_TSS.2
    • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/Certificat-CC-2023_09.pdf
  • product: S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0)
  • url: https://cyber.gouv.fr/produits-certifies/s3m2m5cs3m2m0cs3m1m5c-32-bit-risc-microcontroller-smart-card-including-specific
  • description: Le produit évalué est « S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software, revision 0 » développé par SAMSUNG ELECTRONICS CO LTD.. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puc
  • sponsor: Samsung Electronics Co Ltd.
  • developer: Samsung Electronics Co Ltd.
  • cert_id: 2018/30
  • level: EAL6+
  • enhanced:
    • cert_id: 2018/30
    • certification_date: 27/09/2018
    • category: Micro-circuits
    • cc_version: Critères Communs version 3.1r5
    • developer: Samsung Electronics Co Ltd.
    • sponsor: Samsung Electronics Co Ltd.
    • evaluation_facility: CEA-LETI
    • level: EAL6+
    • protection_profile: BSI-CC-PP-0084-2014
    • mutual_recognition: SOG-IS CCRA
    • augmented: ASE_TSS.2
    • target_link: https://cyber.gouv.fr/sites/default/files/2018/10/anssi-cible-2018_30en.pdf
    • report_link: https://cyber.gouv.fr/sites/default/files/2018/10/anssi-cc-2018-30fr.pdf
heuristics/scheme_data/cert_id ANSSI-CC-2023/09 2018/30
heuristics/scheme_data/description Le produit évalué est la famille de microcontrôleurs « S3FT9MF/S3FT9MT/S3FT9MS, version S3FT9MF_20221219 » développée par SAMSUNG ELECTRONICS. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont m Le produit évalué est « S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software, revision 0 » développé par SAMSUNG ELECTRONICS CO LTD.. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puc
heuristics/scheme_data/developer SAMSUNG ELECTRONICS Samsung Electronics Co Ltd.
heuristics/scheme_data/enhanced
  • cert_id: ANSSI-CC-2023/09
  • certification_date: 16/02/2023
  • expiration_date: 15/02/2028
  • category: Micro-circuits
  • cc_version: Critères Communs version 3.1r5
  • developer: SAMSUNG ELECTRONICS
  • sponsor: SAMSUNG ELECTRONICS
  • evaluation_facility: CEA - LETI
  • level: EAL6+
  • protection_profile: Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Loader dedicated for usage in Secured Environment only”, “Loader dedicated for usage by authorized users only”
  • mutual_recognition: CCRA SOG-IS
  • augmented: ASE_TSS.2
  • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/Certificat-CC-2023_09.pdf
  • cert_id: 2018/30
  • certification_date: 27/09/2018
  • category: Micro-circuits
  • cc_version: Critères Communs version 3.1r5
  • developer: Samsung Electronics Co Ltd.
  • sponsor: Samsung Electronics Co Ltd.
  • evaluation_facility: CEA-LETI
  • level: EAL6+
  • protection_profile: BSI-CC-PP-0084-2014
  • mutual_recognition: SOG-IS CCRA
  • augmented: ASE_TSS.2
  • target_link: https://cyber.gouv.fr/sites/default/files/2018/10/anssi-cible-2018_30en.pdf
  • report_link: https://cyber.gouv.fr/sites/default/files/2018/10/anssi-cc-2018-30fr.pdf
heuristics/scheme_data/enhanced/cert_id ANSSI-CC-2023/09 2018/30
heuristics/scheme_data/enhanced/certification_date 16/02/2023 27/09/2018
heuristics/scheme_data/enhanced/developer SAMSUNG ELECTRONICS Samsung Electronics Co Ltd.
heuristics/scheme_data/enhanced/evaluation_facility CEA - LETI CEA-LETI
heuristics/scheme_data/enhanced/mutual_recognition CCRA SOG-IS SOG-IS CCRA
heuristics/scheme_data/enhanced/protection_profile Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Loader dedicated for usage in Secured Environment only”, “Loader dedicated for usage by authorized users only” BSI-CC-PP-0084-2014
heuristics/scheme_data/enhanced/sponsor SAMSUNG ELECTRONICS Samsung Electronics Co Ltd.
heuristics/scheme_data/product S3FT9MF/S3FT9MT/S3FT9MS 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated software(S3FT9MF_20221219) S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software (Revision 0)
heuristics/scheme_data/sponsor SAMSUNG ELECTRONICS Samsung Electronics Co Ltd.
heuristics/scheme_data/url https://cyber.gouv.fr/produits-certifies/s3ft9mfs3ft9mts3ft9ms-16-bit-risc-microcontroller-smart-card-optional-secure-2 https://cyber.gouv.fr/produits-certifies/s3m2m5cs3m2m0cs3m1m5c-32-bit-risc-microcontroller-smart-card-including-specific
pdf_data/cert_filename certificat-cc-2023_09.pdf None
pdf_data/cert_keywords
  • cc_cert_id:
    • FR:
      • ANSSI-CC-2023/09: 2
  • cc_protection_profile_id:
    • BSI:
      • BSI-CC-PP-0084-2014: 1
  • cc_security_level:
    • EAL:
      • EAL6: 1
      • EAL2: 1
  • cc_sar:
    • ASE:
      • ASE_TSS.2: 1
  • cc_sfr:
  • cc_claims:
  • vendor:
  • eval_facility:
    • CEA-LETI:
      • CEA - LETI: 1
      • CEA-LETI: 1
  • symmetric_crypto:
  • asymmetric_crypto:
  • pq_crypto:
  • hash_function:
  • crypto_scheme:
  • crypto_protocol:
  • randomness:
  • cipher_mode:
  • ecc_curve:
  • crypto_engine:
  • tls_cipher_suite:
  • crypto_library:
  • vulnerability:
  • side_channel_analysis:
  • technical_report_id:
  • device_model:
  • tee_name:
  • os_name:
  • cplc_data:
  • ic_data_group:
  • standard_id:
  • javacard_version:
  • javacard_api_const:
  • javacard_packages:
  • certification_process:
None
pdf_data/report_filename anssi-cc-2023_09.pdf anssi-cc-2018-30fr.pdf
pdf_data/report_frontpage/FR
  • match_rules: Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables
  • cert_id: ANSSI-CC-2018/30
  • cert_item: S3M2M5C/S3M2M0C/S3M1M5C 32-bit RISC Microcontroller for Smart Card including specific IC Dedicated software
  • cert_item_version: revision 0
  • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité à “Package 1 : Loader dedicated for usage in Secured Environment only” “Package 2: Loader dedicated for usage by authorized users only
  • cc_version: Critères Communs version 3.1 révision 5
  • cc_security_level: EAL 6 augmenté ASE_TSS.2
  • developer: Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud Commanditaire Samsung Electronics Co Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud
  • cert_lab: CEA - LETI 17 avenue des martyrs, 38054 Grenoble Cedex 9, France
pdf_data/report_keywords/cc_cert_id/FR
  • ANSSI-CC-2023/09: 2
  • ANSSI-CC-2018/30: 18
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
    • ALC_CMC: 1
  • AVA:
    • AVA_VAN: 1
  • ASE:
    • ASE_TSS.2: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_FLR: 2
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_TAT: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 1
  • ASE:
    • ASE_TSS.2: 2
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
pdf_data/report_keywords/cc_sar/ALC
  • ALC_FLR: 1
  • ALC_CMC: 1
  • ALC_FLR: 2
  • ALC_CMC: 1
  • ALC_CMS: 1
  • ALC_DEL: 1
  • ALC_DVS: 1
  • ALC_TAT: 1
pdf_data/report_keywords/cc_sar/ALC/ALC_FLR 1 2
pdf_data/report_keywords/cc_sar/ASE
  • ASE_TSS.2: 1
  • ASE_TSS.2: 2
  • ASE_CCL: 1
  • ASE_ECD: 1
  • ASE_INT: 1
  • ASE_OBJ: 1
  • ASE_REQ: 1
  • ASE_SPD: 1
  • ASE_TSS: 1
pdf_data/report_keywords/cc_sar/ASE/ASE_TSS.2 1 2
pdf_data/report_keywords/cc_sar/AVA
  • AVA_VAN: 1
  • AVA_VAN: 2
  • AVA_VAN.5: 1
pdf_data/report_keywords/cc_sar/AVA/AVA_VAN 1 2
pdf_data/report_keywords/cc_security_level/EAL
  • EAL6: 1
  • EAL2: 2
  • EAL7: 1
  • EAL 6: 2
  • EAL2: 2
  • EAL7: 1
pdf_data/report_keywords/eval_facility/CEA-LETI
  • CEA - LETI: 1
  • CEA - LETI: 1
  • CEA-LETI: 1
pdf_data/report_keywords/eval_facility/CESTI/CESTI 4 3
pdf_data/report_keywords/randomness
  • TRNG:
    • DTRNG: 7
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • BSI:
    • AIS 31: 2
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
pdf_data/report_keywords/standard_id/CC
  • CCMB-2017-04-001: 1
  • CCMB-2017-04-002: 1
  • CCMB-2017-04-003: 1
  • CCMB-2017-04-001: 1
  • CCMB-2017-04-002: 1
  • CCMB-2017-04-003: 1
  • CCMB-2017-04-004: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 1
    • 3DES:
      • TDES: 1
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 2
  • miscellaneous:
    • SM4:
      • SM4: 1
pdf_data/report_keywords/symmetric_crypto/DES
  • DES:
    • DES: 1
  • 3DES:
    • TDES: 1
  • DES:
    • DES: 2
pdf_data/report_keywords/symmetric_crypto/DES/DES/DES 1 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 2
pdf_data/report_metadata None
  • pdf_file_size_bytes: 822740
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 17
  • /CreationDate: D:20181009091716+02'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: ANSSI-CC-CER-F-07.026
  • /ModDate: D:20181017164259+02'00'
  • /Producer: Microsoft® Word 2010
  • /Subject:
  • /Title:
  • pdf_hyperlinks: mailto:[email protected], http://www.ssi.gouv.fr/
pdf_data/st_filename anssi-cible-2023_09en.pdf anssi-cible-2018_30en.pdf
pdf_data/st_keywords/asymmetric_crypto
  • RSA:
    • RSA-CRT: 1
  • ECC:
    • ECDH:
      • ECDH: 18
    • ECDSA:
      • ECDSA: 24
    • ECC:
      • ECC: 22
  • FF:
    • DH:
      • Diffie-Hellman: 6
    • DSA:
      • DSA: 7
  • ECC:
    • ECC:
      • ECC: 2
pdf_data/st_keywords/asymmetric_crypto/ECC
  • ECDH:
    • ECDH: 18
  • ECDSA:
    • ECDSA: 24
  • ECC:
    • ECC: 22
  • ECC:
    • ECC: 2
pdf_data/st_keywords/asymmetric_crypto/ECC/ECC/ECC 22 2
pdf_data/st_keywords/cc_claims/O
  • O.RSA: 8
  • O.ECDSA: 6
  • O.ECDH: 7
  • O.SHA: 7
  • O.RND: 6
  • O.TDES: 7
  • O.AES: 5
  • O.MEM_ACCESS: 1
  • O.RND: 6
  • O.TDES: 7
  • O.AES: 5
  • O.MEM_ACCESS: 1
pdf_data/st_keywords/cc_sar/ADV
  • ADV_ARC: 1
  • ADV_FSP: 2
  • ADV_IMP: 1
  • ADV_ARC.1: 5
  • ADV_SPM.1: 2
  • ADV_FSP.5: 3
  • ADV_IMP.2: 1
  • ADV_INT.3: 1
  • ADV_TDS.5: 1
  • ADV_FSP.4: 1
  • ADV_ARV: 1
  • ADV_FSP: 2
  • ADV_IMP: 1
  • ADV_VAN: 1
  • ADV_ARC.1: 5
  • ADV_SPM.1: 2
  • ADV_FSP.5: 3
  • ADV_IMP.2: 1
  • ADV_INT.3: 1
  • ADV_TDS.5: 1
  • ADV_FSP.4: 1
pdf_data/st_keywords/cc_security_level/EAL
  • EAL6+: 2
  • EAL6: 5
  • EAL 4: 1
  • EAL 5: 2
  • EAL6 augmented: 1
  • EAL 4 augmented: 1
  • EAL 5 augmented: 2
  • EAL6: 7
  • EAL 4: 1
  • EAL6 augmented: 3
  • EAL 4 augmented: 1
pdf_data/st_keywords/cc_security_level/EAL/EAL6 5 7
pdf_data/st_keywords/cc_security_level/EAL/EAL6 augmented 1 3
pdf_data/st_keywords/cc_sfr/FCS
  • FCS_RNG: 25
  • FCS_RNG.1: 18
  • FCS_RNG.1.1: 1
  • FCS_RNG.1.2: 1
  • FCS_COP.1: 21
  • FCS_COP: 51
  • FCS_CKM.1: 40
  • FCS_CKM.4: 25
  • FCS_CKM: 38
  • FCS_CKM.2: 4
  • FCS_CMK: 5
  • FCS_RNG: 17
  • FCS_RNG.1: 14
  • FCS_RNG.1.1: 1
  • FCS_RNG.1.2: 1
  • FCS_COP.1: 9
  • FCS_COP: 15
  • FCS_CKM.1: 7
  • FCS_CKM.4: 5
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM.1 40 7
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM.4 25 5
pdf_data/st_keywords/cc_sfr/FCS/FCS_COP 51 15
pdf_data/st_keywords/cc_sfr/FCS/FCS_COP.1 21 9
pdf_data/st_keywords/cc_sfr/FCS/FCS_RNG 25 17
pdf_data/st_keywords/cc_sfr/FCS/FCS_RNG.1 18 14
pdf_data/st_keywords/cc_sfr/FDP
  • FDP_SDC: 4
  • FDP_ACF: 14
  • FDP_SDC.1: 14
  • FDP_SDI: 1
  • FDP_SDC.1.1: 2
  • FDP_SDI.2: 8
  • FDP_SDI.2.1: 1
  • FDP_SDI.2.2: 1
  • FDP_ITT.1: 18
  • FDP_ITT.1.1: 1
  • FDP_ACC.1: 20
  • FDP_IFC.1: 23
  • FDP_IFC.1.1: 1
  • FDP_IFF.1: 3
  • FDP_ACF.1: 17
  • FDP_ACC.1.1: 1
  • FDP_ACF.1.1: 1
  • FDP_ACF.1.2: 1
  • FDP_ACF.1.3: 1
  • FDP_ACF.1.4: 1
  • FDP_ITC.1: 21
  • FDP_ITC.2: 21
  • FDP_UCT.1: 9
  • FDP_UCT.1.1: 1
  • FDP_UIT.1: 9
  • FDP_UIT.1.1: 1
  • FDP_UIT.1.2: 1
  • FDP_ACC: 10
  • FDP_SDI.1: 1
  • FDP_IFC: 1
  • FDP_ITT: 1
  • FDP_SDC: 4
  • FDP_ACF: 14
  • FDP_SDC.1: 14
  • FDP_SDI: 1
  • FDP_SDI.2: 8
  • FDP_SDI.1: 2
  • FDP_ITT.1: 18
  • FDP_ITT.1.1: 1
  • FDP_ACC.1: 20
  • FDP_IFC.1: 23
  • FDP_IFC.1.1: 1
  • FDP_IFF.1: 3
  • FDP_ACF.1: 17
  • FDP_ACC.1.1: 1
  • FDP_ACF.1.1: 2
  • FDP_ACF.1.2: 2
  • FDP_ACF.1.3: 2
  • FDP_ACF.1.4: 1
  • FDP_ITC.1: 4
  • FDP_ITC.2: 4
  • FDP_UCT.1: 9
  • FDP_UCT.1.1: 1
  • FDP_UIT.1: 9
  • FDP_UIT.1.1: 1
  • FDP_UIT.1.2: 1
  • FDP_ACC: 10
  • FDP_IFC: 1
  • FDP_ITT: 1
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1.1 1 2
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1.2 1 2
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1.3 1 2
pdf_data/st_keywords/cc_sfr/FDP/FDP_ITC.1 21 4
pdf_data/st_keywords/cc_sfr/FDP/FDP_ITC.2 21 4
pdf_data/st_keywords/cc_sfr/FDP/FDP_SDI.1 1 2
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 1
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 3
pdf_data/st_keywords/ecc_curve
  • NIST:
    • P-192: 6
    • P-224: 6
    • P-256: 6
    • P-384: 6
    • secp192k1: 3
    • secp192r1: 3
    • secp224k1: 3
    • secp224r1: 3
    • secp256k1: 3
    • secp256r1: 3
    • secp384r1: 3
  • Brainpool:
    • brainpoolP192r1: 3
    • brainpoolP192t1: 3
    • brainpoolP224r1: 3
    • brainpoolP224t1: 3
    • brainpoolP256r1: 3
    • brainpoolP256t1: 3
    • brainpoolP320r1: 3
    • brainpoolP320t1: 3
    • brainpoolP384r1: 3
    • brainpoolP384t1: 3
    • brainpoolP512r1: 3
    • brainpoolP512t1: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
    • SHA2:
      • SHA224: 6
      • SHA256: 6
      • SHA384: 6
      • SHA512: 5
pdf_data/st_keywords/randomness/TRNG/DTRNG 54 24
pdf_data/st_keywords/side_channel_analysis/FI
  • physical tampering: 3
  • Malfunction: 26
  • malfunction: 13
  • DFA: 5
  • physical tampering: 3
  • Malfunction: 26
  • malfunction: 11
pdf_data/st_keywords/side_channel_analysis/FI/malfunction 13 11
pdf_data/st_keywords/side_channel_analysis/SCA
  • Leak-Inherent: 24
  • Physical Probing: 4
  • physical probing: 9
  • Physical probing: 2
  • side-channel: 3
  • side channel: 2
  • DPA: 6
  • SPA: 5
  • timing attacks: 1
  • timing attack: 2
  • Leak-Inherent: 23
  • Physical Probing: 4
  • physical probing: 9
  • Physical probing: 2
  • side-channel: 3
  • side channel: 1
  • DPA: 4
  • SPA: 2
  • timing attacks: 1
pdf_data/st_keywords/side_channel_analysis/SCA/DPA 6 4
pdf_data/st_keywords/side_channel_analysis/SCA/Leak-Inherent 24 23
pdf_data/st_keywords/side_channel_analysis/SCA/SPA 5 2
pdf_data/st_keywords/side_channel_analysis/SCA/side channel 2 1
pdf_data/st_keywords/side_channel_analysis/other/reverse engineering 4 5
pdf_data/st_keywords/standard_id/BSI/AIS31 10 1
pdf_data/st_keywords/standard_id/BSI/BSI-AIS31 3 2
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-001 3 6
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-002 3 2
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-003 3 2
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-004 3 2
pdf_data/st_keywords/standard_id/FIPS
  • FIPS PUB 180-3: 6
  • FIPS197: 1
  • FIPS 197: 1
  • FIPS 180-4: 1
  • FIPS197: 1
  • FIPS 197: 1
  • FIPS PUB 180-3: 3
pdf_data/st_keywords/standard_id/FIPS/FIPS PUB 180-3 6 3
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 30
  • DES:
    • DES:
      • DES: 11
    • 3DES:
      • Triple-DES: 5
      • TDES: 16
      • TDEA: 1
  • constructions:
    • MAC:
      • HMAC: 2
  • AES_competition:
    • AES:
      • AES: 27
  • DES:
    • DES:
      • DES: 9
    • 3DES:
      • Triple-DES: 6
      • TDES: 13
      • TDEA: 1
  • miscellaneous:
    • SM4:
      • SM4: 2
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/st_keywords/symmetric_crypto/AES_competition/AES/AES 30 27
pdf_data/st_keywords/symmetric_crypto/DES/3DES/TDES 16 13
pdf_data/st_keywords/symmetric_crypto/DES/3DES/Triple-DES 5 6
pdf_data/st_keywords/symmetric_crypto/DES/DES/DES 11 9
pdf_data/st_keywords/symmetric_crypto/constructions/MAC/HMAC 2 1
pdf_data/st_keywords/vendor/Samsung/Samsung 17 19
pdf_data/st_metadata None
  • pdf_file_size_bytes: 1337228
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 101
  • /Company: Samsung Electronics
  • /CreationDate: D:20180518122957+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Document_Name: Document Name
  • /Document_Type: UM
  • /ModDate: D:20181017164328+02'00'
  • /Preliminary: (Preliminary Spec)
  • /Producer: Adobe PDF Library 10.0
  • /Product_Description: Product Description (Sub-Title)
  • /Product_Name: Product Name
  • /Revision_Date: January 2013
  • /Revision_Number: 1.18
  • /Security_Level: Samsung Confidential
  • /SourceModified: D:20180518032927
  • /Title:
  • /Year: 2013
  • /_DocHome: 1177583831
  • pdf_hyperlinks: mailto:[email protected]
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