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THD89 1.0.3 Secure Element version 1.0
2021-36-INF-4157 		S3CC9LC 16-bit RISC Microcontroller for Smart Card, Revision 2
BSI-DSZ-CC-0501-2008
name THD89 1.0.3 Secure Element version 1.0 S3CC9LC 16-bit RISC Microcontroller for Smart Card, Revision 2
scheme ES DE
status active archived
not_valid_after 26.09.2028 01.09.2019
not_valid_before 26.09.2023 01.07.2008
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-36_Certificado.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-36%20INF-4157.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0501a.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-36%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0501b.pdf
manufacturer Tongxin Microelectronics Co., Ltd. Samsung Electronics Co., Ltd.
manufacturer_web https://www.tsinghuaic.com/english/article/article.asp?id=483248&bid=8610# https://www.samsung.com
security_level EAL5+, AVA_VAN.5, ALC_DVS.2 EAL5+, AVA_VLA.4, AVA_MSU.3, ALC_DVS.2
dgst f030b4c2adc03fa7 3f287c94d1039f0b
heuristics/cert_id 2021-36-INF-4157 BSI-DSZ-CC-0501-2008
heuristics/cert_lab [] BSI
heuristics/extracted_sars ASE_CCL.1, ATE_FUN.1, ASE_OBJ.2, ATE_DPT.3, AVA_VAN.5, ASE_INT.1, ALC_CMC.4, ASE_REQ.2, ADV_INT.2, AGD_PRE.1, ATE_IND.2, ASE_ECD.1, ADV_IMP.1, ADV_TDS.4, ALC_LCD.1, ALC_DVS.2, ASE_SPD.1, ATE_COV.2, ALC_CMS.5, AGD_OPE.1, ADV_FSP.5, ALC_DEL.1, ASE_TSS.1, ADV_ARC.1, ALC_TAT.2 ADV_INT.1, ATE_FUN.1, ADV_LLD.1, ADV_IMP.2, ADV_RCR.2, ATE_IND.2, AGD_USR.1, ADV_HLD.3, ADV_FSP.3, ALC_DVS.2, ATE_DPT.2, AVA_VLA.4, ATE_COV.2, AVA_MSU.3, ALC_LCD.2, ADV_SPM.3, AGD_ADM.1, AVA_SOF.1, ALC_TAT.2, AVA_CCA.1
heuristics/extracted_versions 1.0, 1.0.3 16, 2
heuristics/report_references/directly_referenced_by NSCIB-CC-2400034-01-CR, NSCIB-CC-2400175-01-CR KECS-ISIS-0222-2010, BSI-DSZ-CC-0624-2010
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0452-2007
heuristics/report_references/indirectly_referenced_by NSCIB-CC-2400034-01-CR, NSCIB-CC-2400175-01-CR KECS-ISIS-0222-2010, KECS-ISIS-0378-2012, BSI-DSZ-CC-0624-2010, ANSSI-CC-2012/09
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0400-2007, BSI-DSZ-CC-0438-2007, BSI-DSZ-CC-0452-2007
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 26.09.2023
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1876
    • certification_date: 26.09.2023
    • description: Renovación de certificado (12/08/2025) The TOE consists of hardware and IC dedicated software. The hardware is based on a 32-bit secure CPU with ROM (Non-Volatile Read-Only Memory), NVM (Non-volatile Programmable Memory) and RAM (Volatile Memory). The hardware of the TOE also incorporates communication peripherals and cryptographic coprocessors for execution and acceleration of symmetric and asymmetric cryptographic algorithms. The IC dedicated software consists of boot code and 3 libraries of cryptographic services. Among all the possibilities offered by these software and hardware requirements, the configuration selected for the evaluation is the following: TYPE NAME VERSION PACKAGE Hardware THD89 1.0.3 Module Software Crypto Library 2.1.0 SW library in ROM Crypto SU Library 2.2.0 SW library in NVM CryptoECCSec Library 1.0.0 SW library in NVM Boot code 1.0 Boot code in ROM Header file 0.1 cryptolib.h The TOE TOE THD89 1.0.3 Secure Element version 1.0 has gone through a Certificate Renewal process according to certification procedure PO-005. This process consists in updating the analysis of the certified product’s resistance against updated state of the art attack methods and vulnerabilities. The resistance to attacks has been re-assessed in the course of the Certificate Renewal process, and therefore the date to be considered as an archived certificate is reset in the certificate product list of the certification body considering the date of the renewal of the certificate.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Tongxin Microelectronics Co., Ltd.
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=2316
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1875
    • type: Product
  • manufacturer: Tongxin Microelectronics Co., Ltd.
  • product: THD89 1.0.3 Secure Element version 1.0
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/998-thd89-1-0-3-secure-element-version-1-0
heuristics/st_references/directly_referenced_by {} KECS-ISIS-0222-2010
heuristics/st_references/indirectly_referenced_by {} KECS-ISIS-0222-2010
heuristics/protection_profiles cf0f01bcd7be3e9c {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 2021-36_Certificado.pdf
pdf_data/cert_keywords/cc_cert_id
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /CreationDate: D:20230904141829+02'00'
  • /ModDate: D:20230904141829+02'00'
  • /Producer: GPL Ghostscript 9.27
  • pdf_file_size_bytes: 887800
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 2021-36 INF-4157.pdf 0501a.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cert_id: BSI-DSZ-CC-0501-2008
    • cert_item: S3CC9LC 16-bit RISC Microcontroller for Smart Card, Revision 2
    • cert_lab: BSI
    • developer: Samsung Electronics Co., Ltd
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-S-0201-2022: 1
  • ES:
    • 2021-36-INF-4157- v1: 1
  • DE:
    • BSI-DSZ-CC-0452-2007: 1
    • BSI-DSZ-CC-0501: 1
    • BSI-DSZ-CC-0501-2008: 19
  • NL:
    • CC-0452-2007: 1
    • CC-0501: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 2
  • BSI:
    • BSI-PP-0002-2001: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 4: 5
    • EAL 5: 4
    • EAL 5 augmented: 4
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 6
    • EAL5: 6
    • EAL5+: 1
    • EAL6: 3
    • EAL7: 4
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 1
    • ACM_CAP: 2
    • ACM_CAP.4: 1
    • ACM_SCP: 2
    • ACM_SCP.3: 1
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 1
    • ADO_IGS: 2
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 1
    • ADV_INT: 2
    • ADV_LLD: 2
    • ADV_RCR: 2
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 6
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.2: 1
    • ALC_TAT: 2
    • ALC_TAT.2: 1
  • APE:
    • APE_DES: 1
    • APE_ENV: 1
    • APE_INT: 1
    • APE_OBJ: 1
    • APE_REQ: 1
    • APE_SRE: 1
  • ASE:
    • ASE_DES: 1
    • ASE_ENV: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_PPC: 1
    • ASE_REQ: 1
    • ASE_SRE: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 2
    • AVA_MSU.3: 5
    • AVA_SOF: 3
    • AVA_VLA: 3
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 6
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_COP.1: 4
    • FCS_RNG.1: 1
  • FDP:
    • FDP_ITT.1: 1
    • FDP_SDC.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • Infineon:
    • Infineon Technologies AG: 1
  • Philips:
    • Philips: 1
  • Samsung:
    • Samsung: 17
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 4
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • DES:
    • 3DES:
      • TDES: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • 3DES:
      • Triple-DES: 5
    • DES:
      • DES: 7
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDSA:
      • ECDSA: 1
  • RSA:
    • RSA-CRT: 4
  • ECC:
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 3
pdf_data/report_keywords/randomness
  • TRNG:
    • TRNG: 1
  • RNG:
    • RNG: 1
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/ecc_curve
  • Brainpool:
    • brainpoolP224r1: 1
    • brainpoolP256r1: 1
    • brainpoolP512r1: 1
pdf_data/report_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 2
pdf_data/report_keywords/crypto_library
  • Generic:
    • Crypto Library 2.1.0: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • malfunction: 1
  • other:
    • JIL: 1
  • FI:
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • Bellcore attack: 1
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • FIPS:
    • FIPS PUB 197: 1
  • ISO:
    • ISO/IEC 7816: 4
  • PKCS:
    • PKCS #1: 1
  • RFC:
    • RFC 5639: 1
  • BSI:
    • AIS 25: 3
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 3
    • AIS 35: 2
    • AIS 36: 1
    • AIS 38: 1
    • AIS20: 1
  • ISO:
    • ISO/IEC 15408:2005: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 2, TÜViT (confidential document) [8] Configuration Management Documentation (Class ACM_AUT/CAP/SCP) – Project Cheyenne II, Version: 1
    • 3, 2008-05-09 Samsung Electronics (confidential document) [9] Security Target Lite of S3CC9LC 16-bit RISC Microcontroller for Smart Cards, Version 1.0: 1
    • EVALUATION (ETR-COMP), 8103842493 / BSI-DSZ- CC-0501, S3CC91A, Version 2, 2008-06-03, TÜViT (confidential document) [12] Security Application Note, S3CC9LC, Version 1.1, 2008-05-06, Samsung Electronics 8: 1
    • for Smart Cards – Project Cheyenne II, Version 1.4, 2008-04-29, Samsung Electronics (confidential document) [7] EVALUATION TECHNICAL REPORT-SUMMARY (ETR SUMMARY), 8103842493 / BSI-DSZ-CC-0501, S3CC9LC: 1
pdf_data/report_metadata
  • /Author: 9308
  • /CreationDate: D:20230925160654+02'00'
  • /Creator: Microsoft® Word LTSC
  • /ModDate: D:20230925160654+02'00'
  • /Producer: Microsoft® Word LTSC
  • pdf_file_size_bytes: 418348
  • pdf_hyperlinks: https://www.sogis.eu/, http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 15
  • /Author: Federal Office for Information Security
  • /CreationDate: D:20080717125300+02'00'
  • /Creator: Writer
  • /Keywords: "S3CC9LC 16-bit RISC Microcontroller for Smart Card, Revision 2, BSI-DSZ-CC-0501-2008, Samsung Electronics Co., Ltd."
  • /ModDate: D:20080717145955+02'00'
  • /Producer: StarOffice 8
  • /Subject: Common Criteria Zertifizierung
  • /Title: Zertifizierungsreport BSI-DSZ-CC-0501-2008
  • pdf_file_size_bytes: 569988
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 36
pdf_data/st_filename 2021-36 ST_lite.pdf 0501b.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-PP-0002: 8
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL5: 4
    • EAL5 augmented: 2
    • EAL5+: 4
  • EAL:
    • EAL4: 1
    • EAL5: 8
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE: 3
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 6
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 6
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 1
    • ACM_CAP: 2
    • ACM_CAP.4: 2
    • ACM_SCP: 2
    • ACM_SCP.3: 1
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 3
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.1: 2
    • ADV_FSP.3: 1
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_HLD.3: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 2
    • ADV_RCR: 1
    • ADV_RCR.2: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 4
    • ADV_SPM.3: 1
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 4
    • AGD_USR: 2
    • AGD_USR.1: 4
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 6
    • ALC_LCD: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 2
    • ALC_TAT.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 2
    • ATE_DPT: 1
    • ATE_DPT.2: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_CCA.1: 1
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_MSU.3: 6
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 7
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 9
    • FCS_CKM.4: 9
    • FCS_COP.1: 34
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 7
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_IFC.1: 5
    • FDP_ITC.1: 9
    • FDP_ITC.2: 9
    • FDP_ITT.1: 7
    • FDP_SDC.1: 6
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 4
    • FMT_LIM.2: 4
  • FPT:
    • FPT_FLS.1: 7
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 7
    • FPT_PHP.3: 7
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 8
  • FAU:
    • FAU_GEN: 1
    • FAU_GEN.1: 1
    • FAU_SAS: 3
    • FAU_SAS.1: 8
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 29
    • FCS_CKM.1.1: 3
    • FCS_CKM.2: 4
    • FCS_CKM.4: 19
    • FCS_CKM.4.1: 2
    • FCS_COP: 1
    • FCS_COP.1: 21
    • FCS_COP.1.1: 2
    • FCS_RND: 2
    • FCS_RND.1: 8
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 21
    • FDP_ACC.1.1: 1
    • FDP_ACF: 1
    • FDP_ACF.1: 12
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_CKM.2: 1
    • FDP_IFC: 2
    • FDP_IFC.1: 22
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 15
    • FDP_ITC.1.1: 2
    • FDP_ITC.1.2: 2
    • FDP_ITC.1.3: 2
    • FDP_ITC.2: 17
    • FDP_ITC.2.1: 2
    • FDP_ITC.2.2: 2
    • FDP_ITC.2.3: 2
    • FDP_ITC.2.4: 2
    • FDP_ITC.2.5: 2
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 2
  • FMT:
    • FMT_LIM: 4
    • FMT_LIM.1: 14
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 1
    • FMT_MSA: 2
    • FMT_MSA.1: 12
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 21
    • FMT_MSA.2.1: 2
    • FMT_MSA.3: 13
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 7
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 8
  • FPT:
    • FPT_AMT.1: 1
    • FPT_FLS: 1
    • FPT_FLS.1: 22
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 2
    • FPT_PHP.3: 18
    • FPT_PHP.3.1: 1
    • FPT_SEP: 2
    • FPT_SEP.1: 10
    • FPT_SEP.1.1: 1
    • FPT_SEP.1.2: 1
    • FPT_TDC.1: 2
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 18
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 7
    • O.ECC: 6
    • O.RND: 3
    • O.RSA: 7
    • O.TDES: 8
  • T:
    • T.RND: 2
  • O:
    • O.RND: 5
  • T:
    • T.RND: 4
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 29
      • Triple-DES: 3
    • DES:
      • DES: 1
  • DES:
    • 3DES:
      • 3DES: 13
      • T-DES: 1
      • Triple-DES: 1
    • DES:
      • DES: 12
  • miscellaneous:
    • SEED:
      • SEED: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 33
    • ECDSA:
      • ECDSA: 1
  • RSA:
    • RSA-CRT: 19
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA2:
      • SHA-256: 1
pdf_data/st_keywords/crypto_scheme
  • PKE:
    • PKE: 1
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 6
  • TRNG:
    • TRNG: 3
  • RNG:
    • RND: 10
    • RNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 8
pdf_data/st_keywords/ecc_curve
  • Brainpool:
    • brainpoolP224r1: 3
    • brainpoolP256r1: 1
    • brainpoolP320r1: 3
    • brainpoolP384r1: 1
    • brainpoolP512r1: 1
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 8
pdf_data/st_keywords/crypto_library
  • Generic:
    • Crypto Library 2.1.0: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 7
    • malfunction: 3
    • physical tampering: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 4
    • side channel: 1
  • FI:
    • DFA: 1
    • Malfunction: 24
    • malfunction: 12
    • physical tampering: 2
  • SCA:
    • DPA: 5
    • Leak-Inherent: 20
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 3
    • physical probing: 6
    • side-channel: 2
    • timing attacks: 1
  • other:
    • reverse engineering: 3
pdf_data/st_keywords/tee_name
  • IBM:
    • SE: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS26: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • FIPS:
    • FIPS PUB 197: 1
  • ISO:
    • ISO/IEC 7816: 6
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-67: 1
  • RFC:
    • RFC 5639: 2
  • BSI:
    • AIS 20: 2
    • AIS20: 3
  • FIPS:
    • FIPS PUB 46-3: 2
  • ISO:
    • ISO/IEC 15408-2005: 1
    • ISO/IEC 7816: 4
    • ISO/IEC 9796-1: 3
pdf_data/st_metadata
  • /CreationDate: D:20230627103637+02'00'
  • /Creator: Microsoft® Word 2016
  • /ModDate: D:20230627103637+02'00'
  • /Producer: Microsoft® Word 2016
  • pdf_file_size_bytes: 780001
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 33
  • /Author: Kyungsuk Yi (Bryant)
  • /CreationDate: D:20080604112348+09'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /Keywords: Smartcard, IC, S3CC9LC, 16-bit RISC Microcontroller For Smart Cards, 16-bit CMOS Microcontroller For Smart Cards, Samsung Electronics
  • /ModDate: D:20080609165456+09'00'
  • /Producer: Acrobat Distiller 6.0.1 (Windows)
  • /Subject: Security Target Lite
  • /Title: Security Target Lite of S3CC9LC 16-bit RISC Microcontroller For Smart Cards
  • pdf_file_size_bytes: 536251
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 60
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state/cert/download_ok True False
state/cert/extract_ok True False
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