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Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023 		V2X subsystem on Transceiver module MQBw version 0353
2022-45-INF-4348
name Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 V2X subsystem on Transceiver module MQBw version 0353
scheme DE ES
not_valid_after 03.03.2028 13.08.2029
not_valid_before 03.03.2023 13.08.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2022-45_Certificado.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2022-45_INF-4348.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2022-45_ST.pdf
manufacturer Qualcomm Technologies Inc. LG Electronics, Inc.
manufacturer_web https://www.qualcomm.com https://www.lge.com
security_level EAL4+, AVA_VAN.5, ALC_DVS.2 ALC_FLR.1, EAL2+
dgst ac18c15a88b4b1bd d6f2901097900f2d
heuristics/cert_id BSI-DSZ-CC-1045-V2-2023 2022-45-INF-4348
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_LCD.1, ALC_TAT.1, ALC_DEL.1, AVA_VAN.5, ALC_CMS.4, ALC_DVS.2, ALC_CMC.4 ASE_TSS.1, ALC_CMC.2, AGD_OPE.1, AVA_VAN.2, ATE_COV.1, ALC_DEL.1, ADV_ARC.1, ATE_IND.2, ALC_FLR.1, ASE_CCL.1, ASE_INT.1, ADV_TDS.1, ASE_REQ.2
heuristics/extracted_versions 1.1.2 0353
heuristics/report_references/directly_referencing BSI-DSZ-CC-1045-2019 {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1045-2019 {}
heuristics/scheme_data
  • category: Otras herramientas
  • certification_date: 13.08.2024
  • enhanced:
    • category: Otras herramientas
    • cc_version: Common Methodology for Information Technology Security Evaluation/Common Criteria for Information Technology Security Evaluation version 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=2038
    • certification_date: 21.12.2024
    • description: The TOE is a part of the software code that runs on a compatible hardware platform such as the transceiver module and handles the V2X communications via CAM and DEMN messages. The TOE has to be deployed in a MQBw UNECE configuration pertaining to combustion vehicle. MQB stands for “Modularer Querbaukasten” in German, which translates to “Modular Transverse Matrix” in English. Among the various lines of the MQB platform, MQBw UNECE can be considered as the superset of the TOE and is applied to some vehicle models such as Golf and Passat. Thus, the TOE is a software that acts as a communications system placed in the vehicle in order to provide different ITS services (active road, cooperative traffic efficiency, co-operative local services, Global Internet services, etc.). The TOE is used by integrating it into the application processor (AP) and the microcontroller unit (MCU) elements of the transceiver module. The TOE consists of system interface for communication, C2X stack and service layer. Furthermore, they are packaged in one binary file. Maintained version 601 (21/12/2024) According to the CCRA (Common Criteria Recognition Arrangement) requirements regarding the assurance continuity outlined in [AC] and considering the impact analysis report [IAR] provided by LG ELECTRONICS INC., the changed TOE version V2X subsystem on Transceiver Module MQBw version 0610 maintains the assurance gained in the original TOE certification V2X subsystem on Transceiver Module MQBw, v0353. The baseline for this maintenance have been the certification report [INF-4348], the Security Target V2X subsystem on Transceiver Module MQBw Security Target, v1.5 (2024-05-31), the Evaluation Technical Report [EXT-9086] from the original certified TOE referenced by the file number 2022-45, and the impact analysis report [IAR] from the changed TOE referenced by the file number 2024-46.
    • evaluation_facility: DEKRA Testing and Certification S.A.U.
    • level: EAL2 + (ALC_FLR.1)
    • manufacturer: LG ELECTRONICS INC.
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=2039
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=2086
    • type: Product
  • manufacturer: LG ELECTRONICS INC.
  • product: V2X subsystem on Transceiver module MQBw version 0353 | version 0610
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/1018-v2x-subsystem-on-transceiver-module-mqbw-version-0353
heuristics/protection_profiles cf0f01bcd7be3e9c {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045V2c_pdf.pdf 2022-45_Certificado.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL2+: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR.1: 1
pdf_data/cert_keywords/cc_claims
  • A:
    • A.U: 1
  • O:
    • O.E: 1
  • T:
    • T.I: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880922
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 1045V2a_pdf.pdf 2022-45_INF-4348.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
  • ES:
    • 2022-45-INF-4348- v1: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 8
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC.1: 1
    • ADV_TDS.1: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.2: 1
    • ALC_DEL.1: 1
    • ALC_FLR: 2
    • ALC_FLR.1: 8
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
pdf_data/report_keywords/cc_sfr
  • FCO:
    • FCO_NRO.2: 1
  • FDP:
    • FDP_ACC.1: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 1
    • FDP_IFF.1: 1
  • FIA:
    • FIA_UAU.1: 1
    • FIA_UID.1: 1
  • FMT:
    • FMT_MSA.1: 3
    • FMT_MSA.3: 3
    • FMT_SMF.1: 3
    • FMT_SMR.1: 1
  • FPT:
    • FPT_TDC.1: 2
  • FTP:
    • FTP_ITC.1: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 4
  • R:
    • R.O: 4
  • A:
    • A.U: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
pdf_data/report_keywords/eval_facility
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
  • DEKRA:
    • DEKRA Testing and Certification: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
  • SHA:
    • SHA2:
      • SHA256: 2
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/report_keywords/crypto_protocol
  • VPN:
    • VPN: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
pdf_data/st_filename 1045V2b_pdf.pdf 2022-45_ST.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL2: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_FLR: 1
    • ALC_FLR.1: 2
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FCO:
    • FCO_NRO.2: 5
    • FCO_NRO.2.1: 1
    • FCO_NRO.2.2: 1
    • FCO_NRO.2.3: 1
  • FDP:
    • FDP_ACC: 6
    • FDP_ACC.1: 11
    • FDP_ACC.1.1: 2
    • FDP_ACF: 6
    • FDP_ACF.1: 8
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_AFC.1: 2
    • FDP_IFC.1: 11
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 7
    • FDP_IFF.1.1: 1
    • FDP_IFF.1.2: 1
    • FDP_IFF.1.3: 1
    • FDP_IFF.1.4: 1
    • FDP_IFF.1.5: 1
    • FDP_TDC: 1
  • FIA:
    • FIA_UAU.1: 5
    • FIA_UAU.1.1: 1
    • FIA_UAU.1.2: 1
    • FIA_UID.1: 10
    • FIA_UID.1.1: 1
    • FIA_UID.1.2: 1
  • FMT:
    • FMT_MSA: 17
    • FMT_MSA.1: 13
    • FMT_MSA.1.1: 3
    • FMT_MSA.3: 13
    • FMT_MSA.3.1: 3
    • FMT_MSA.3.2: 3
    • FMT_SMF: 9
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 3
    • FMT_SMR.1: 19
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_TDC: 4
    • FPT_TDC.1: 4
    • FPT_TDC.1.1: 2
    • FPT_TDC.1.2: 2
  • FTP:
    • FTP_ITC.1: 5
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • A:
    • A.PKI: 2
  • O:
    • O.HSM_: 4
  • OE:
    • OE.PKI: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 22
  • NXP:
    • NXP: 6
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
  • ECC:
    • ECDSA:
      • ECDSA: 1
    • ECIES:
      • ECIES: 7
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
  • SHA:
    • SHA2:
      • SHA256: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 3
pdf_data/st_keywords/crypto_protocol
  • VPN:
    • VPN: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
  • SCP:
    • SCP03: 2
pdf_data/st_metadata
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
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