Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100

Certificate details

Status active
Valid from 03.03.2023
Valid until 03.03.2028
Scheme 🇩🇪 DE
Manufacturer Qualcomm Technologies Inc.
Category Other Devices and Systems
Security level AVA_VAN.5, ALC_DVS.2, EAL4+
Protection profiles

Certificate

Extracted keywords

Vendor
Qualcomm

Security level
EAL 4, EAL 5, EAL 2, EAL 4 augmented
Security Assurance Requirements (SAR)
ALC_DVS.2, AVA_VAN.5
Protection profiles
BSI-CC-PP-0084-2014
Certificates
BSI-DSZ-CC-1045-V2-2023

Certification report

Extracted keywords

Symmetric Algorithms
AES, DES, TDES, HMAC, HMAC-SHA-384, CMAC
Asymmetric Algorithms
ECDH, ECDSA, ECC
Hash functions
SHA1, SHA-1, SHA-256, SHA-512, SHA-384
Randomness
RNG
Block cipher modes
ECB, CBC, CTR, CCM

Vendor
Qualcomm

Security level
EAL 4, EAL 5, EAL 2, EAL 1, EAL 5+, EAL 6, EAL 4 augmented
Claims
O.C, R.O
Security Assurance Requirements (SAR)
ALC_DVS.2, ALC_FLR, ALC_DEL, ALC_DVS, ALC_CMC.4, ALC_CMS.4, ALC_DEL.1, ALC_LCD.1, ALC_TAT.1, ATE_FUN, ATE_IND, AVA_VAN.5, AVA_VAN
Protection profiles
BSI-CC-PP-0084-2014
Certificates
BSI-DSZ-CC-1045-V2-2023, BSI-DSZ-CC-1045-2019
Evaluation facilities
atsec, Deutsche Telekom Security

Side-channel analysis
physical probing, Side-channel, fault injection, JIL
Certification process
being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification, Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document, Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document, Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document, Island (ARI), Overview for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document, Processing Unit, Enablement, 80-PF777-965 AC, Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document, TOE: Configuration List user guidance, TOE_user_guidance_config_list v13.pdf, 09th December 2021 (confidential document, for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0.xlsx, 04th April 2019 (confidential document, platform, Qualcomm Technologies, Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document, the functional and verification tests of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document, - [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document, - [19] Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document, of the documentation for the hardware development process TOE_SW_HW_process_config_list-10.1.pdf (confidential document, list for the TOE: Configuration list software specifications: TOE_SW_Docs_config_list.txt (confidential document, list functional and verification tests of software: TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document, - [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt (confidential document, list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document, list for the TOE: Site Security Documentation Configuration List: Secproc_config_list.txt (confidential document

Frontpage

Certificate ID BSI-DSZ-CC-1045-V2-2023
Certified item Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 ##
Certification lab BSI
Developer Qualcomm Technologies Inc. BSI -

Cross-references

Outgoing

Security target

Extracted keywords

Symmetric Algorithms
AES, AES-256, TDES, Triple-DES, TDEA, HMAC, HMAC-SHA-384, CMAC
Asymmetric Algorithms
ECDH, ECDSA, ECC, Diffie-Hellman
Hash functions
SHA-1, SHA1, SHA-256, SHA-384, SHA-512
Schemes
MAC
Randomness
DRBG, RND, RNG
Block cipher modes
ECB, CBC, CTR, CCM

Trusted Execution Environments
ARM TrustZone
Vendor
Qualcomm

Security level
EAL4, EAL4 augmented
Claims
O.RND, O.AES, O.TDES, O.SHA, O.RSA_SIGN, O.RSA_ENC, O.ECDSA, O.ECDH, O.HMAC, O.CMAC, O.KDF, T.RND, T.CONFID-TSF-CODE, T.CONFID-APPLI-, T.CONFID-TSF-DATA, T.INTEG-APPLI-, T.INTEG-TSF-CODE, T.INTEG-APPLI-DATA, T.INTEG-TSF-DATA, T.AUTH-TSF-DATA, T.AUTH-APPLI-DATA, T.RBP-TSF-DATA, T.RBP-APPLI-DATA, T.CONFID-APPLI-DATA, T.INTEG-APPLI-CODE, T.INTEGTSF-DATA
Security Assurance Requirements (SAR)
ALC_DEL, ALC_DVS, ALC_DVS.2, AVA_VAN.5
Security Functional Requirements (SFR)
FAU_SAS.1, FAU_GEN, FAU_SAS.1.1, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP, FCS_COP.1, FCS_CKM, FCS_CKM.4, FCS_CKM.1, FCS_CKM.2, FCS_ITC.1, FCS_ITC.2, FDP_SDA, FDP_SDA.1, FDP_SDR, FDP_SDR.1, FDP_SDC.1, FDP_SDI, FDP_SDA.1.1, FDP_SDR.1.1, FDP_SDC.1.1, FDP_SDI.2, FDP_SDI.2.1, FDP_SDI.2.2, FDP_ITT.1, FDP_ITT.1.1, FDP_IFC.1, FDP_IFC.1.1, FDP_IFF.1, FDP_ITC.1, FDP_ITC.1.1, FDP_ITC.1.2, FDP_ITC.1.3, FDP_ACC.2, FDP_ACC.2.1, FDP_ACC.2.2, FDP_ACF.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_RIP, FDP_RIP.1, FDP_ACC, FDP_ACF, FDP_ACC.1, FDP_ICT.1, FMT_CMT, FMT_CMT.1, FMT_LIM.1, FMT_LIM.2, FMT_CMT.1.1, FMT_LIM.1.1, FMT_LIM.2.1, FMT_MSA.3, FMT_MSA, FMT_MSA.1, FMT_SMR.1, FPT_FLS.1, FPT_FLS.1.1, FPT_PHP.3, FPT_PHP.3.1, FPT_ITT.1, FPT_ITT.1.1, FRU_FLT.2, FRU_FLT.2.1
Protection profiles
BSI-CC-PP-0084-2014

Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, side channels, Side-channel, side channel, side-channel, Malfunction, malfunction, DFA, fault injection, cold boot

Automated analysis

Automated inference - use with caution

All attributes shown in this section (e.g., links between certificates, products, vendors, and known CVEs) are generated by automated heuristics and have not been reviewed by humans. These methods can produce false positives or false negatives and should not be treated as definitive without independent verification. This applies equally to the Cross-references section below. If you want to know more about how this data is computed and how reliable it is, see our documentation on automated analysis. If you believe any information here is inaccurate or harmful, please submit feedback.

Certificate ID

BSI-DSZ-CC-1045-V2-2023

Extracted SARs

ALC_CMC.4, ALC_CMS.4, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_TAT.1, AVA_VAN.5

Scheme data

Certificate ID BSI-DSZ-CC-1045-V2-2023
Product Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
Vendor Qualcomm Technologies Inc.
Certification Date 03.03.2023
Category System on a chip (SOC)
URL https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html
Enhanced
Product Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
Applicant Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA
Evaluation Facility T-Systems International GmbH atsec information security GmbH
Assurance Level EAL4+; ALC_DVS.2, AVA_VAN.5
Protection Profile Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
Certification Date 03.03.2023
Expiration Date 02.03.2028
Certification history
BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target Zertifikat / Certificate has been extended by additional cryptographic functions.
BSI Certificate
Report Link https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2
Target Link https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2
Cert Link https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2
Description The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.

Cross-references

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Raw data

{
  "_type": "sec_certs.sample.cc.CCCertificate",
  "category": "Other Devices and Systems",
  "cert_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf",
  "dgst": "ac18c15a88b4b1bd",
  "heuristics": {
    "_type": "sec_certs.sample.cc_eucc_common.Heuristics",
    "annotated_references": null,
    "cert_id": "BSI-DSZ-CC-1045-V2-2023",
    "cert_lab": [
      "BSI"
    ],
    "cpe_matches": null,
    "direct_transitive_cves": null,
    "eal": "EAL4+",
    "extracted_sars": {
      "_type": "Set",
      "elements": [
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_CMC",
          "level": 4
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "AVA_VAN",
          "level": 5
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_CMS",
          "level": 4
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_LCD",
          "level": 1
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_TAT",
          "level": 1
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_DVS",
          "level": 2
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_DEL",
          "level": 1
        }
      ]
    },
    "extracted_versions": {
      "_type": "Set",
      "elements": [
        "1.1.2"
      ]
    },
    "indirect_transitive_cves": null,
    "next_certificates": null,
    "prev_certificates": null,
    "protection_profiles": {
      "_type": "Set",
      "elements": [
        "cf0f01bcd7be3e9c"
      ]
    },
    "related_cves": null,
    "report_references": {
      "_type": "sec_certs.sample.certificate.References",
      "directly_referenced_by": null,
      "directly_referencing": {
        "_type": "Set",
        "elements": [
          "BSI-DSZ-CC-1045-2019"
        ]
      },
      "indirectly_referenced_by": null,
      "indirectly_referencing": {
        "_type": "Set",
        "elements": [
          "BSI-DSZ-CC-1045-2019"
        ]
      }
    },
    "scheme_data": {
      "category": "System on a chip (SOC)",
      "cert_id": "BSI-DSZ-CC-1045-V2-2023",
      "certification_date": "2023-03-03",
      "enhanced": {
        "applicant": "Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA",
        "assurance_level": "EAL4+; ALC_DVS.2, AVA_VAN.5",
        "cert_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile\u0026v=2",
        "certification_date": "2023-03-03",
        "description": "The TOE is the \u201cQualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.",
        "entries": [
          {
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            "id": "BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, g\u00fcltig bis / valid until 02.03.2028) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target Zertifikat / Certificate"
          },
          {
            "description": "Certificate",
            "id": "BSI"
          }
        ],
        "evaluation_facility": "T-Systems International GmbH atsec information security GmbH",
        "expiration_date": "2028-03-02",
        "product": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
        "protection_profile": "Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014",
        "report_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile\u0026v=2",
        "target_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile\u0026v=2"
      },
      "product": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
      "url": "https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html",
      "vendor": "Qualcomm Technologies Inc."
    },
    "st_references": {
      "_type": "sec_certs.sample.certificate.References",
      "directly_referenced_by": null,
      "directly_referencing": null,
      "indirectly_referenced_by": null,
      "indirectly_referencing": null
    },
    "verified_cpe_matches": null
  },
  "maintenance_updates": {
    "_type": "Set",
    "elements": []
  },
  "manufacturer": "Qualcomm Technologies Inc.",
  "manufacturer_web": "https://www.qualcomm.com",
  "name": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
  "not_valid_after": "2028-03-03",
  "not_valid_before": "2023-03-03",
  "pdf_data": {
    "_type": "sec_certs.sample.cc_eucc_common.PdfData",
    "cert_filename": "1045V2c_pdf.pdf",
    "cert_frontpage": null,
    "cert_keywords": {
      "asymmetric_crypto": {},
      "cc_cert_id": {
        "DE": {
          "BSI-DSZ-CC-1045-V2-2023": 1
        }
      },
      "cc_claims": {},
      "cc_protection_profile_id": {
        "BSI": {
          "BSI-CC-PP-0084-2014": 1
        }
      },
      "cc_sar": {
        "ALC": {
          "ALC_DVS.2": 1
        },
        "AVA": {
          "AVA_VAN.5": 1
        }
      },
      "cc_security_level": {
        "EAL": {
          "EAL 2": 1,
          "EAL 4": 1,
          "EAL 4 augmented": 1,
          "EAL 5": 1
        }
      },
      "cc_sfr": {},
      "certification_process": {},
      "cipher_mode": {},
      "cplc_data": {},
      "crypto_engine": {},
      "crypto_library": {},
      "crypto_protocol": {},
      "crypto_scheme": {},
      "device_model": {},
      "ecc_curve": {},
      "eval_facility": {},
      "hash_function": {},
      "ic_data_group": {},
      "javacard_api_const": {},
      "javacard_packages": {},
      "javacard_version": {},
      "os_name": {},
      "pq_crypto": {},
      "randomness": {},
      "side_channel_analysis": {},
      "standard_id": {
        "ISO": {
          "ISO/IEC 15408": 2,
          "ISO/IEC 18045": 2
        }
      },
      "symmetric_crypto": {},
      "technical_report_id": {},
      "tee_name": {},
      "tls_cipher_suite": {},
      "vendor": {
        "Qualcomm": {
          "Qualcomm": 2
        }
      },
      "vulnerability": {}
    },
    "cert_metadata": {
      "/Author": "Bundesamt f\u00fcr Sicherheit in der Informationstechnik",
      "/Subject": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
      "/Title": "Certification Report BSI-DSZ-CC-1045-V2-2023",
      "pdf_file_size_bytes": 289421,
      "pdf_hyperlinks": {
        "_type": "Set",
        "elements": []
      },
      "pdf_is_encrypted": false,
      "pdf_number_of_pages": 1
    },
    "report_filename": "1045V2a_pdf.pdf",
    "report_frontpage": {
      "DE": {
        "cc_security_level": "Qualcomm Technologies Inc. Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014 PP conformant plus product specific extensions Common Criteria Part 2 extended Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2",
        "cc_version": "",
        "cert_id": "BSI-DSZ-CC-1045-V2-2023",
        "cert_item": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 ##",
        "cert_lab": "BSI",
        "developer": "Qualcomm Technologies Inc. BSI -",
        "match_rules": [
          "(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)"
        ],
        "ref_protection_profiles": ""
      }
    },
    "report_keywords": {
      "asymmetric_crypto": {
        "ECC": {
          "ECC": {
            "ECC": 4
          },
          "ECDH": {
            "ECDH": 1
          },
          "ECDSA": {
            "ECDSA": 1
          }
        }
      },
      "cc_cert_id": {
        "DE": {
          "BSI-DSZ-CC-1045-2019": 3,
          "BSI-DSZ-CC-1045-V2-2023": 31
        }
      },
      "cc_claims": {
        "O": {
          "O.C": 4
        },
        "R": {
          "R.O": 4
        }
      },
      "cc_protection_profile_id": {
        "BSI": {
          "BSI-CC-PP-0084-2014": 4
        }
      },
      "cc_sar": {
        "ALC": {
          "ALC_CMC.4": 1,
          "ALC_CMS.4": 1,
          "ALC_DEL": 1,
          "ALC_DEL.1": 1,
          "ALC_DVS": 1,
          "ALC_DVS.2": 5,
          "ALC_FLR": 1,
          "ALC_LCD.1": 1,
          "ALC_TAT.1": 1
        },
        "ATE": {
          "ATE_FUN": 1,
          "ATE_IND": 1
        },
        "AVA": {
          "AVA_VAN": 1,
          "AVA_VAN.5": 4
        }
      },
      "cc_security_level": {
        "EAL": {
          "EAL 1": 1,
          "EAL 2": 3,
          "EAL 4": 5,
          "EAL 4 augmented": 3,
          "EAL 5": 4,
          "EAL 5+": 1,
          "EAL 6": 1
        }
      },
      "cc_sfr": {},
      "certification_process": {
        "ConfidentialDocument": {
          "- [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document": 1,
          "- [19] Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document": 1,
          "- [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt (confidential document": 1,
          "Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document": 1,
          "Island (ARI), Overview for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document": 1,
          "Processing Unit, Enablement, 80-PF777-965 AC, Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document": 1,
          "Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document": 1,
          "TOE: Configuration List user guidance, TOE_user_guidance_config_list v13.pdf, 09th December 2021 (confidential document": 1,
          "Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document": 1,
          "being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification": 1,
          "for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0.xlsx, 04th April 2019 (confidential document": 1,
          "list for the TOE: Configuration list software specifications: TOE_SW_Docs_config_list.txt (confidential document": 1,
          "list for the TOE: Site Security Documentation Configuration List: Secproc_config_list.txt (confidential document": 1,
          "list functional and verification tests of software: TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document": 1,
          "list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document": 1,
          "of the documentation for the hardware development process TOE_SW_HW_process_config_list-10.1.pdf (confidential document": 1,
          "platform, Qualcomm Technologies, Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document": 1,
          "the functional and verification tests of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document": 1
        }
      },
      "cipher_mode": {
        "CBC": {
          "CBC": 2
        },
        "CCM": {
          "CCM": 1
        },
        "CTR": {
          "CTR": 1
        },
        "ECB": {
          "ECB": 2
        }
      },
      "cplc_data": {},
      "crypto_engine": {},
      "crypto_library": {},
      "crypto_protocol": {},
      "crypto_scheme": {},
      "device_model": {},
      "ecc_curve": {
        "NIST": {
          "NIST P-192": 2,
          "NIST P-224": 2,
          "NIST P-256": 2,
          "NIST P-384": 2,
          "NIST P-521": 2,
          "P-192": 2,
          "P-224": 2,
          "P-256": 2,
          "P-384": 2,
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