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Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023 		CA SiteMinder Federation Security Services r12 sp1 CR3
CCEVS-VR-VID-10365-2010
name Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 CA SiteMinder Federation Security Services r12 sp1 CR3
category Other Devices and Systems Access Control Devices and Systems
scheme DE US
status active archived
not_valid_after 03.03.2028 01.11.2014
not_valid_before 03.03.2023 28.06.2010
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid10365-vr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid10365-st.pdf
manufacturer Qualcomm Technologies Inc. CA Technologies
manufacturer_web https://www.qualcomm.com https://www.ca.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_FLR.1, EAL3+
dgst ac18c15a88b4b1bd cf7d039856b13bd4
heuristics/cert_id BSI-DSZ-CC-1045-V2-2023 CCEVS-VR-VID-10365-2010
heuristics/cert_lab BSI US
heuristics/extracted_sars ALC_DVS.2, ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_CMC.4 ATE_DPT.1, ACO_VUL.2, ACO_COR.1, ATE_COV.2, AGD_OPE.1, ACO_DEV.2, ALC_DEL.1, ACO_CTT.2, ALC_FLR.1, ASE_INT.1, AVA_VAN.2, ALC_DVS.1, ADV_ARC.1, ACO_REL.1, ASE_ECD.1, ALC_LCD.1, ASE_REQ.2, ASE_OBJ.2, ATE_IND.2, ATE_FUN.1, ASE_TSS.2, ALC_CMS.3, ASE_SPD.1, AGD_PRE.1, ADV_TDS.2, ADV_FSP.3, ASE_CCL.1, ALC_CMC.3
heuristics/extracted_versions 1.1.2 -
heuristics/report_references/directly_referencing BSI-DSZ-CC-1045-2019 {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1045-2019 {}
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045V2a_pdf.pdf st_vid10365-vr.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • US:
  • DE:
  • US:
    • cert_id: CCEVS-VR-VID10365-2010
    • cert_item: CA SiteMinder® Federation Security Services r12 SP1 CR3
    • cert_lab: US NIAP
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
  • US:
    • CCEVS-VR-VID10365-2010: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
  • EAL:
    • EAL 3: 1
    • EAL3: 3
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ACO:
    • ACO_COR.1: 1
    • ACO_CTT.2: 1
    • ACO_DEV.2: 1
    • ACO_REL.1: 1
    • ACO_VUL.2: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.3: 1
    • ADV_TDS.2: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.3: 1
    • ALC_CMS.3: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_FLR.1: 2
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 3
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 4
  • R:
    • R.O: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
  • Microsoft:
    • Microsoft: 9
pdf_data/report_keywords/eval_facility
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
  • BoozAllenHamilton:
    • Booz Allen Hamilton: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
  • AES_competition:
    • AES:
      • AES: 5
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
pdf_data/report_keywords/crypto_protocol
  • TLS:
    • SSL:
      • SSL: 8
      • SSL v3.0: 6
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
  • /Author: Eric Winterton
  • /CreationDate: D:20100713162142
  • /Creator: Microsoft® Office Word 2007
  • /ModDate: D:20100713162142
  • /Producer: Microsoft® Office Word 2007
  • /Title: National Information Assurance Partnership
  • pdf_file_size_bytes: 469678
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 33
pdf_data/st_filename 1045V2b_pdf.pdf st_vid10365-st.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 3: 1
    • EAL3: 14
    • EAL3 augmented: 4
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ACO:
    • ACO_COR.1: 6
    • ACO_CTT.2: 14
    • ACO_DEV.2: 9
    • ACO_REL.1: 8
    • ACO_VUL.2: 10
  • ADV:
    • ADV_ARC.1: 14
    • ADV_FSP.3: 14
    • ADV_TDS.2: 15
  • AGD:
    • AGD_OPE.1: 15
    • AGD_PRE.1: 11
  • ALC:
    • ALC_CMC.3: 17
    • ALC_CMS.3: 10
    • ALC_DEL.1: 10
    • ALC_DVS.1: 7
    • ALC_FLR.1: 12
    • ALC_LCD.1: 8
  • ASE:
    • ASE_CCL.1: 13
    • ASE_ECD.1: 12
    • ASE_INT.1: 14
    • ASE_OBJ.2: 12
    • ASE_REQ.2: 15
    • ASE_SPD.1: 9
    • ASE_TSS.2: 13
  • ATE:
    • ATE_COV.2: 7
    • ATE_DPT.1: 7
    • ATE_FUN.1: 10
    • ATE_IND.2: 9
  • AVA:
    • AVA_VAN.2: 9
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 11
    • FAU_GEN.1.1: 1
    • FAU_GEN.1.2: 1
    • FAU_GEN.2: 7
    • FAU_GEN.2.1: 1
  • FCS:
    • FCS_CKM.1: 8
    • FCS_CKM.4: 6
    • FCS_COP.1: 38
    • FCS_COP.1.1: 4
  • FDP:
    • FDP_ACC.1: 4
    • FDP_ACF.1: 2
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
  • FIA:
    • FIA_AFL.1: 1
    • FIA_ATD.1: 17
    • FIA_ATD.1.1: 2
    • FIA_SOS.1: 1
    • FIA_UAU: 1
    • FIA_UAU.1: 3
    • FIA_UAU.2: 16
    • FIA_UAU.2.1: 2
    • FIA_UAU.5: 9
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UAU.6: 9
    • FIA_UAU.6.1: 1
    • FIA_UAU_EXT: 1
    • FIA_UAU_EXT.5: 1
    • FIA_UID: 1
    • FIA_UID.1: 6
    • FIA_UID.2: 14
    • FIA_UID.2.1: 2
    • FIA_USB.1: 8
    • FIA_USB.1.1: 1
    • FIA_USB.1.2: 1
    • FIA_USB.1.3: 1
  • FMT:
    • FMT_MOF.1: 8
    • FMT_MOF.1.1: 1
    • FMT_MSA: 1
    • FMT_MSA.1: 5
    • FMT_MSA.2: 1
    • FMT_MTD.1: 7
    • FMT_MTD.1.1: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 11
    • FMT_SMF.1.1: 1
    • FMT_SMR: 1
    • FMT_SMR.1: 7
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 1
    • FPT_ITC.1: 8
    • FPT_ITC.1.1: 1
    • FPT_ITC.1.2: 1
    • FPT_ITC.1.3: 1
    • FPT_ITT.1: 8
    • FPT_ITT.1.1: 1
    • FPT_RPL.1: 8
    • FPT_RPL.1.1: 1
    • FPT_RPL.1.2: 1
    • FPT_STM.1: 3
  • FRU:
    • FRU_FLT: 1
  • FTA:
    • FTA_SSL.4: 8
    • FTA_SSL.4.1: 1
    • FTA_TSE.1: 8
    • FTA_TSE.1.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • A:
    • A.ADMIN: 2
    • A.FILESYS: 3
    • A.LOCATE: 3
    • A.NOEVIL: 3
    • A.PASSWORD: 3
    • A.PATCHES: 2
  • O:
    • O.AUDIT: 4
    • O.AUTH: 4
    • O.EAVESDROPPING: 4
    • O.MANAGE: 4
    • O.ROBUST_ADMIN_GUIDA: 2
    • O.ROBUST_ADMIN_GUIDANC: 1
    • O.ROBUST_ADMIN_GUIDANCE: 1
  • OE:
    • OE.ADMIN: 3
    • OE.FILESYS: 3
    • OE.LOCATE: 3
    • OE.NOEVIL: 3
    • OE.PASSWORD: 3
  • T:
    • T.ADMIN_ERROR: 4
    • T.EAVESDROPPING: 3
    • T.MASK: 3
    • T.UNAUTH: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 22
  • Microsoft:
    • Microsoft: 7
pdf_data/st_keywords/eval_facility
  • BoozAllenHamilton:
    • Booz Allen Hamilton: 2
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
  • AES_competition:
    • AES:
      • AES: 25
      • AES-: 1
      • AES-128: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
  • SHA:
    • SHA2:
      • SHA-256: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/crypto_protocol
  • TLS:
    • SSL:
      • SSL: 23
      • SSL v3.0: 11
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
  • CBC:
    • CBC: 9
  • OFB:
    • OFB: 5
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
  • CC:
    • CCMB-2009-07-004: 1
  • PKCS:
    • PKCS #1: 3
    • PKCS #12: 3
    • PKCS #5: 3
    • PKCS #8: 3
    • PKCS#1: 1
    • PKCS#8: 1
  • RFC:
    • RFC 3602: 3
  • X509:
    • X.509: 6
    • x.509: 1
pdf_data/st_metadata
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
  • /Author: christine kivett
  • /CreationDate: D:20100713162226
  • /Creator: Microsoft® Office Word 2007
  • /ModDate: D:20100713162226
  • /Producer: Microsoft® Office Word 2007
  • pdf_file_size_bytes: 1150678
  • pdf_hyperlinks: http://www.niap-ccevs.org/cc-scheme/st/st_vid10317-st.pdf
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 119
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