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Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023 		Passeport MorphoePass EAC CC with BAC, AA and EAC RSA or EAC ECC, on STMicroelectronics ST19NR66-A/1.1.0
ANSSI-CC-2009/14
name Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 Passeport MorphoePass EAC CC with BAC, AA and EAC RSA or EAC ECC, on STMicroelectronics ST19NR66-A/1.1.0
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
status active archived
not_valid_after 03.03.2028 01.09.2019
not_valid_before 03.03.2023 23.07.2009
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-2009_14en.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible2009_14en.pdf
manufacturer Qualcomm Technologies Inc. Sagem Sécurité / STMicroelectronics
manufacturer_web https://www.qualcomm.com https://www.st.com/
security_level ALC_DVS.2, AVA_VAN.5, EAL4+ ALC_DVS.2, AVA_VLA.4, ADV_IMP.2, EAL4+, AVA_MSU.3
dgst ac18c15a88b4b1bd 4ba50f11a2a044f6
heuristics/cert_id BSI-DSZ-CC-1045-V2-2023 ANSSI-CC-2009/14
heuristics/cert_lab BSI CEA
heuristics/extracted_sars ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_TAT.1, ALC_CMC.4, ALC_LCD.1, ALC_DVS.2 ADV_IMP.2, AVA_MSU.3, ALC_DVS.2, AVA_VLA.4
heuristics/extracted_versions 1.1.2 1.1.0
heuristics/report_references/directly_referencing BSI-DSZ-CC-1045-2019 {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1045-2019 {}
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045V2a_pdf.pdf anssi-2009_14en.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
    • cc_security_level: EAL 4 augmented ADV_IMP.2, ALC_DVS.2, AVA_MSU.3, AVA_VLA.4
    • cc_version: Common Criteria version 2.3 compliant with ISO 15408:2005
    • cert_id: ANSSI-2009/14
    • cert_item: Passeport MorphoePass EAC CC with BAC, AA and EAC RSA or EAC ECC, on STMicroelectronics ST19NR66- A/1.1.0
    • cert_item_version: MORPHOEPASSCC/ST19NR66-A/1.1.0
    • cert_lab: CEA - LETI 17 rue des martyrs, 38054 Grenoble Cedex 9, France Tél : +33 (0)4 38 78 40 87, mél : [email protected]
    • developer: Sagem Sécurité SA Etablissement d’Osny, 18 Chaussée Jules César, 95520 Osny, France STMicroelectronics Smartcard IC division, ZI de Rousset, BP2, 13106 Rousset Cedex, France Sponsor Sagem Sécurité SA Etablissement d’Osny, 18 Chaussée Jules César, 95520 Osny, France
    • match_rules: ['Certification report reference(.+)Product name(.+)Product reference(.+)Protection profile conformity(.+)Evaluation criteria and version(.+)Evaluation level(.+)Developers(.+)Evaluation facility(.+)Recognition arrangements']
    • ref_protection_profiles: PP EAC] Common Criteria Protection Profile - Machine Readable Travel Document with “ICAO Application”, Extended Access Control
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
  • FR:
    • ANSSI-2009/14: 18
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
  • BSI:
    • BSI-PP-0002-2001: 1
    • BSI-PP-0026: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
    • EAL 7: 1
    • EAL4: 4
    • EAL4 augmented: 1
    • EAL5: 1
    • EAL5+: 1
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 and: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ACM:
    • ACM_AUT: 1
    • ACM_CAP: 1
    • ACM_SCP: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_IGS: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_HLD: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_LLD: 1
    • ADV_RCR: 1
    • ADV_SPM: 1
  • AGD:
    • AGD_ADM: 1
    • AGD_USR: 1
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_MSU: 1
    • AVA_MSU.3: 2
    • AVA_SOF: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 2
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 4
  • R:
    • R.O: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
  • Gemalto:
    • Gemalto: 6
  • Morpho:
    • Morpho: 1
  • NXP:
    • NXP: 6
  • STMicroelectronics:
    • STMicroelectronics: 25
  • Sagem:
    • Sagem: 6
pdf_data/report_keywords/eval_facility
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
  • CEA-LETI:
    • CEA - LETI: 1
  • CESTI:
    • CESTI: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
  • DES:
    • 3DES:
      • TDES: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
  • ECC:
    • ECC:
      • ECC: 23
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
  • FF:
    • DH:
      • DH: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
  • BSI:
    • AIS 34: 2
    • AIS34: 1
  • CC:
    • CCMB-2005-08-001: 1
    • CCMB-2005-08-002: 1
    • CCMB-2005-08-003: 1
    • CCMB-2005-08-004: 1
  • ICAO:
    • ICAO: 16
  • ISO:
    • ISO/IEC 15408:2005: 1
    • ISO/IEC 18045:2005: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
  • /Author: J. Chuzel
  • /Company: SGDN/DCSSI
  • /CreationDate: D:20090723103614+02'00'
  • /Creator: Acrobat PDFMaker 8.0 for Word
  • /Keywords: CER/F/07.5
  • /ModDate: D:20090723103630+02'00'
  • /Producer: Acrobat Distiller 8.0.0 (Windows)
  • /SourceModified: D:20090723083605
  • /Subject: Passeport MorphoePass EAC CC with BAC, AA and EAC RSA or EAC ECC, on STMicroelectronics ST19NR66-A/1.1.0
  • /Title: ANSSI-2009/14
  • pdf_file_size_bytes: 199170
  • pdf_hyperlinks: mailto:[email protected], http://www.ssi.gouv.fr/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 17
pdf_data/st_filename 1045V2b_pdf.pdf anssi-cible2009_14en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0026: 1
    • BSI-PP-0026: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 4: 1
    • EAL4: 3
    • EAL4 augmented: 2
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_IGS: 1
  • ADV:
    • ADV_IMP.2: 4
  • ALC:
    • ALC_DVS.2: 4
  • AVA:
    • AVA_MSU.3: 4
    • AVA_VLA.2: 2
    • AVA_VLA.4: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS.1: 3
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 12
    • FCS_CKM.1: 3
    • FCS_CKM.1.1: 5
    • FCS_CKM.4: 3
    • FCS_CKM.4.1: 2
    • FCS_COP: 22
    • FCS_COP.1: 4
    • FCS_COP.1.1: 13
    • FCS_RND: 4
    • FCS_RND.1: 4
    • FCS_RND.1.1: 3
  • FDP:
    • FDP_ACC.1: 2
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 3
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_DAU: 2
    • FDP_DAU.1: 1
    • FDP_DAU.1.1: 2
    • FDP_UCT: 3
    • FDP_UCT.1: 2
    • FDP_UCT.1.1: 2
    • FDP_UIT: 3
    • FDP_UIT.1: 2
    • FDP_UIT.1.1: 2
    • FDP_UIT.1.2: 2
  • FIA:
    • FIA_AFL.1: 3
    • FIA_AFL.1.1: 1
    • FIA_AFL.1.2: 1
    • FIA_API: 10
    • FIA_API.1: 3
    • FIA_API.1.1: 4
    • FIA_UAU: 30
    • FIA_UAU.1: 2
    • FIA_UAU.1.1: 1
    • FIA_UAU.1.2: 1
    • FIA_UAU.4: 7
    • FIA_UAU.4.1: 4
    • FIA_UAU.5: 3
    • FIA_UAU.5.1: 2
    • FIA_UAU.5.2: 3
    • FIA_UAU.6: 3
    • FIA_UAU.6.1: 3
    • FIA_UID.1: 2
    • FIA_UID.1.1: 1
    • FIA_UID.1.2: 1
  • FMT:
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MTD: 14
    • FMT_MTD.1: 2
    • FMT_MTD.1.1: 9
    • FMT_MTD.3: 5
    • FMT_MTD.3.1: 1
    • FMT_SMF.1: 3
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 3
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_PHP.3: 4
    • FPT_PHP.3.1: 1
    • FPT_RVM.1: 3
    • FPT_RVM.1.1: 1
    • FPT_SEP.1: 3
    • FPT_SEP.1.1: 1
    • FPT_SEP.1.2: 1
    • FPT_TST.1: 6
    • FPT_TST.1.1: 1
    • FPT_TST.2.1: 1
    • FPT_TST.3.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 22
  • STMicroelectronics:
    • STMicroelectronics: 3
  • Sagem:
    • Sagem: 3
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
  • DES:
    • 3DES:
      • TDES: 4
      • Triple-DES: 21
    • DES:
      • DES: 7
  • constructions:
    • MAC:
      • KMAC: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
  • ECC:
    • ECDH:
      • ECDH: 5
    • ECDSA:
      • ECDSA: 8
  • FF:
    • DH:
      • DH: 5
      • Diffie-Hellman: 9
  • RSA:
    • RSA 1024: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
  • SHA:
    • SHA1:
      • SHA-1: 10
    • SHA2:
      • SHA-224: 3
      • SHA-256: 4
      • SHA224: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 10
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
  • RNG:
    • RND: 3
    • RNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
  • CBC:
    • CBC: 3
  • ECB:
    • ECB: 1
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 1
    • Physical Tampering: 2
    • Physical tampering: 2
    • fault injection: 1
    • malfunction: 4
    • physical tampering: 2
  • SCA:
    • DPA: 1
    • physical probing: 4
    • side channel: 1
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI 2006: 1
    • BSI TR-03110: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/ic_data_group
  • EF:
    • EF.COM: 8
    • EF.DG1: 21
    • EF.DG13: 3
    • EF.DG14: 8
    • EF.DG15: 6
    • EF.DG16: 20
    • EF.DG2: 9
    • EF.DG3: 11
    • EF.DG4: 10
    • EF.DG5: 6
    • EF.SOD: 8
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
  • BSI:
    • AIS31: 4
  • CC:
    • CCMB-2005-08-001: 2
    • CCMB-2005-08-002: 2
    • CCMB-2005-08-003: 3
  • FIPS:
    • FIPS 180-2: 4
    • FIPS 46-3: 3
    • FIPS PUB 46-3: 1
  • ICAO:
    • ICAO: 27
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 15946: 2
    • ISO/IEC 7816-4: 1
  • PKCS:
    • PKCS#3: 5
  • RFC:
    • RFC 2631: 1
    • RFC3369: 1
pdf_data/st_metadata
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
  • /Author: dechoudens
  • /CreationDate: D:20090820142301+02'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /ModDate: D:20090820142301+02'00'
  • /Producer: Acrobat Distiller 5.0.5 (Windows)
  • /Title: Microsoft Word - SSE-0000070468 - Security Target lite - Morpho-ePass V3.doc
  • pdf_file_size_bytes: 443743
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 71
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