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Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023 		IAS ECC V2, version 1.3 en configuration #2 sur la plateforme ID-One Cosmo v8.2
ANSSI-CC-2019/34
name Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 IAS ECC V2, version 1.3 en configuration #2 sur la plateforme ID-One Cosmo v8.2
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
status active archived
not_valid_after 03.03.2028 17.09.2024
not_valid_before 03.03.2023 17.09.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2019_34fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-cc-2019_34en.pdf
manufacturer Qualcomm Technologies Inc. Idemia
manufacturer_web https://www.qualcomm.com https://www.idemia.com
security_level ALC_DVS.2, EAL4+, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst ac18c15a88b4b1bd 38ceb95f1e9f2883
heuristics/cert_id BSI-DSZ-CC-1045-V2-2023 ANSSI-CC-2019/34
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_DVS.2, ALC_TAT.1, ALC_CMC.4, ALC_LCD.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1 ADV_FSP.4, AGD_OPE.1, ADV_ARC.1, ALC_DVS.2, ADV_TDS.3, ADV_IMP.1, AVA_VAN.5, ATE_DPT.1
heuristics/extracted_versions 1.1.2 1.3, 8.2
heuristics/report_references/directly_referenced_by {} ANSSI-CC-2019/43, ANSSI-CC-2020/51
heuristics/report_references/directly_referencing BSI-DSZ-CC-1045-2019 ANSSI-CC-2019/28, BSI-DSZ-CC-1059-2018
heuristics/report_references/indirectly_referenced_by {} ANSSI-CC-2019/43, ANSSI-CC-2020/51
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1045-2019 ANSSI-CC-2019/28, BSI-DSZ-CC-0973-V2-2016, ANSSI-CC-2017/49, BSI-DSZ-CC-1059-2018, BSI-DSZ-CC-0973-2016
heuristics/st_references/directly_referenced_by {} ANSSI-CC-2019/43, ANSSI-CC-2019/43-R01
heuristics/st_references/directly_referencing {} ANSSI-CC-2019/28
heuristics/st_references/indirectly_referenced_by {} ANSSI-CC-2019/43, ANSSI-CC-2019/43-R01
heuristics/st_references/indirectly_referencing {} ANSSI-CC-2019/28
heuristics/protection_profiles cf0f01bcd7be3e9c 27abdb9c6ab375a7, d918b28fd7bb5d79
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0059b_pdf.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0075b_pdf.pdf
pdf_data/cert_filename 1045V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045V2a_pdf.pdf anssi-cc-2019_34fr.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
  • DE:
    • BSI-DSZ-CC-1059-2018: 1
  • FR:
    • ANSSI-CC-2019/28: 1
    • ANSSI-CC-2019/34: 17
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
  • BSI:
    • BSI-CC-PP- 0059-2009-MA-01: 1
    • BSI-CC-PP- 0075-2012: 1
    • BSI-CC-PP-0059-2009-MA-01: 1
    • BSI-CC-PP-0075-2012: 1
    • BSI-PP-0084-2014: 1
  • other:
    • PP-SSCD-: 2
    • PP-SSCD-Part2: 1
    • PP-SSCD-Part3: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
  • EAL:
    • EAL 5: 2
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_INT: 1
    • ADV_OPE: 1
    • ADV_PRE: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 3
    • AGD_PALP: 1
    • AGD_PDEV: 1
    • AGD_POPE: 1
    • AGD_PPRE: 1
    • AGD_PRE: 5
    • AGD_QUA: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_DEL: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_GMS: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 2
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 4
  • R:
    • R.O: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
  • Idemia:
    • IDEMIA: 21
    • Idemia: 2
  • NXP:
    • NXP: 8
    • NXP Semiconductors: 2
pdf_data/report_keywords/eval_facility
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
  • CEA-LETI:
    • CEA - LETI: 1
  • CESTI:
    • CESTI: 3
  • Serma:
    • SERMA: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
  • ECC:
    • ECC:
      • ECC: 27
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
  • /Author: chuzel
  • /CreationDate: D:20190925140644+02'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /ModDate: D:20190925140644+02'00'
  • /Producer: Acrobat Distiller 11.0 (Windows)
  • /Title: Microsoft Word - ANSSI-CC-2019_34fr.docx
  • pdf_file_size_bytes: 289674
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 17
pdf_data/st_filename 1045V2b_pdf.pdf anssi-cible-cc-2019_34en.pdf
pdf_data/st_keywords/cc_cert_id
  • FR:
    • ANSSI-CC-2019/28: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0059-2009-MA-01: 1
    • BSI-CC-PP-0075: 1
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 2
    • EAL 5 augmented: 1
    • EAL4: 1
    • EAL4 augmented: 1
    • EAL5: 6
    • EAL5 augmented: 2
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT: 1
    • ADV_TDS: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE: 10
    • AGD_OPE.1: 2
    • AGD_PRE: 14
    • AGD_PRE_PLT: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 2
    • ALC_DVS.2: 7
    • ALC_LCD: 1
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 2
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 8
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_ARP.1: 2
    • FAU_GEN: 1
  • FCS:
    • FCS_CKM: 34
    • FCS_CKM.1: 41
    • FCS_CKM.2: 8
    • FCS_CKM.3: 5
    • FCS_CKM.4: 60
    • FCS_CKM.4.1: 1
    • FCS_COP: 105
    • FCS_COP.1: 38
    • FCS_COP.1.1: 3
    • FCS_RNG: 4
    • FCS_RNG.1: 19
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 3
  • FDP:
    • FDP_ACC: 69
    • FDP_ACC.1: 38
    • FDP_ACF: 48
    • FDP_ACF.1: 36
    • FDP_CKM: 4
    • FDP_CKM.1: 1
    • FDP_ETC: 5
    • FDP_ETC.1: 2
    • FDP_IFC.1: 20
    • FDP_ITC: 21
    • FDP_ITC.1: 42
    • FDP_ITC.2: 35
    • FDP_RIP: 11
    • FDP_RIP.1: 10
    • FDP_RIP.1.1: 3
    • FDP_ROL: 1
    • FDP_SDI: 15
    • FDP_SDI.1: 2
    • FDP_SDI.2: 6
    • FDP_UCT: 7
    • FDP_UCT.1: 1
  • FIA:
    • FIA_AFL: 22
    • FIA_AFL.1: 3
    • FIA_AFL.1.1: 1
    • FIA_UAU.1: 14
    • FIA_UAU.1.1: 1
    • FIA_UAU.1.2: 1
    • FIA_UID.1: 15
    • FIA_UID.1.1: 1
    • FIA_UID.1.2: 1
  • FMT:
    • FMT_MOF.1: 7
    • FMT_MOF.1.1: 1
    • FMT_MSA: 31
    • FMT_MSA.1: 7
    • FMT_MSA.2: 9
    • FMT_MSA.2.1: 1
    • FMT_MSA.3: 31
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_MSA.4: 8
    • FMT_MSA.4.1: 1
    • FMT_MTD: 39
    • FMT_MTD.1: 6
    • FMT_SMF.1: 44
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 42
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNO: 3
    • FPR_UNO.1: 1
  • FPT:
    • FPT_EMS: 7
    • FPT_EMS.1: 9
    • FPT_EMS.1.1: 4
    • FPT_EMS.1.2: 2
    • FPT_FLS: 5
    • FPT_FLS.1: 10
    • FPT_FLS.1.1: 1
    • FPT_PHP: 2
    • FPT_PHP.1: 5
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 7
    • FPT_PHP.3.1: 1
    • FPT_RCV: 2
    • FPT_TST: 1
    • FPT_TST.1: 13
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FTP:
    • FTP_ITC: 10
    • FTP_ITC.1: 5
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • A:
    • A.APPLET: 1
    • A.CGA: 4
    • A.CSP: 4
    • A.PLT: 2
    • A.SCA: 3
    • A.VERIFICATION: 1
  • OE:
    • OE.APPLET: 1
    • OE.CODE-EVIDENCE: 1
    • OE.CODE_EVIDENCE: 2
    • OE.HID_VAD: 4
    • OE.PLT: 2
    • OE.VERIFICATION: 4
  • OSP:
    • OSP.PLT: 1
    • OSP.VERIFICATION: 1
  • T:
    • T.CONFID_APPLI_DATA: 3
    • T.INTEG_APPLI_DATA: 6
    • T.OBJ_DELETION: 3
    • T.PHYSICAL: 3
    • T.RESSOURCES: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 22
  • Idemia:
    • IDEMIA: 18
  • Morpho:
    • Morpho: 1
  • NXP:
    • NXP: 4
  • Oberthur:
    • Oberthur Technologies: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
  • AES_competition:
    • AES:
      • AES: 17
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 10
  • constructions:
    • MAC:
      • CMAC: 3
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
  • ECC:
    • ECC:
      • ECC: 34
    • ECDSA:
      • ECDSA: 2
  • FF:
    • DH:
      • DH: 5
      • Diffie-Hellman: 1
    • DSA:
      • DSA: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
  • SHA:
    • SHA1:
      • SHA-1: 8
    • SHA2:
      • SHA-224: 2
      • SHA-256: 5
      • SHA-384: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 8
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
  • RNG:
    • RNG: 6
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
  • CBC:
    • CBC: 10
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 2
    • fault injection: 2
    • physical tampering: 5
  • SCA:
    • DPA: 1
    • SPA: 1
    • side channel: 1
    • timing attacks: 1
  • other:
    • JIL: 1
    • JIL-COMP: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
  • IBM:
    • SE: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
  • FIPS:
    • FIPS 180-3: 1
    • FIPS PUB 180-3: 1
    • FIPS180-3: 1
  • ISO:
    • ISO/IEC 9796-2: 4
  • PKCS:
    • PKCS #1: 1
    • PKCS#1: 3
    • PKCS#15: 2
    • PKCS#3: 3
  • SCP:
    • SCP02: 2
    • SCP03: 7
pdf_data/st_metadata
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
  • /Author: IDEMIA
  • /CreationDate: D:20190802141816+02'00'
  • /Creator: Microsoft® Word 2016
  • /Keywords: Quality
  • /ModDate: D:20190802141816+02'00'
  • /Producer: Microsoft® Word 2016
  • /Subject: FQR standard
  • pdf_file_size_bytes: 2730871
  • pdf_hyperlinks: ftp://ftp.itc.1/SCD
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 89
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