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Infineon Technologies Smart Card IC (Security Controller) M9900 A22/G11/C22/D22, M9905 A11, M9906 A11 with optional RSA v1.03.006/v2.05.005/v2.07.003, EC v1.03.006/v2.05.005/v2.07.003, Toolbox v1.03.006/v2.05.005/v2.07.003, Flash Translation Layer V1.01.0008, SCL v2.01.011/v2.02.010 and PSL v4.00.09 libraries with specific IC dedicated software
BSI-DSZ-CC-0827-V6-2017 		S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
ANSSI-CC-2019/19
name Infineon Technologies Smart Card IC (Security Controller) M9900 A22/G11/C22/D22, M9905 A11, M9906 A11 with optional RSA v1.03.006/v2.05.005/v2.07.003, EC v1.03.006/v2.05.005/v2.07.003, Toolbox v1.03.006/v2.05.005/v2.07.003, Flash Translation Layer V1.01.0008, SCL v2.01.011/v2.02.010 and PSL v4.00.09 libraries with specific IC dedicated software S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
scheme DE FR
not_valid_after 02.11.2022 18.04.2024
not_valid_before 02.11.2017 18.04.2019
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V6a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2019_19fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V6b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-cc-2019_19en.pdf
manufacturer Infineon Technologies AG Samsung Electronics Co., Ltd.
manufacturer_web https://www.infineon.com/ https://www.samsung.com
dgst 1488058bfef0a8b3 d46b6688d5914229
heuristics/cert_id BSI-DSZ-CC-0827-V6-2017 ANSSI-CC-2019/19
heuristics/cert_lab BSI CEA
heuristics/extracted_sars ALC_CMS.5, APE_REQ.2, ASE_INT.1, APE_INT.1, ATE_FUN.1, ADV_IMP.1, ADV_SPM.1, ATE_DPT.3, ASE_TSS.1, APE_SPD.1, APE_ECD.1, AGD_PRE.1, ASE_CCL.1, ALC_DVS.2, ATE_IND.2, AVA_VAN.5, ASE_SPD.1, ASE_OBJ.2, ATE_COV.2, ALC_TAT.2, ASE_REQ.2, ADV_INT.2, ALC_CMC.4, ADV_FSP.5, ADV_ARC.1, ALC_FLR.3, ALC_DEL.1, APE_OBJ.2, AGD_OPE.1, ALC_LCD.1, ADV_TDS.4, APE_CCL.1, ASE_ECD.1 ALC_CMS.5, ASE_INT.1, ASE_ECD.1, ATE_FUN.1, ADV_IMP.1, ATE_DPT.3, ASE_TSS.1, AGD_PRE.1, ASE_CCL.1, ALC_DVS.2, AVA_VAN.5, ASE_SPD.1, ASE_OBJ.2, ATE_COV.2, ALC_TAT.2, ASE_REQ.2, ADV_INT.2, ALC_CMC.4, ADV_FSP.5, ADV_ARC.1, ALC_DEL.1, AGD_OPE.1, ALC_LCD.1, ADV_TDS.4, ATE_IND.2
heuristics/extracted_versions 4.00.09, 2.01.011, 1.03.006, 2.05.005, 2.02.010, 1.01.0008, 2.07.003 16
heuristics/prev_certificates BSI-DSZ-CC-0827-2013, BSI-DSZ-CC-0827-V2-2014, BSI-DSZ-CC-0827-V3-2015, BSI-DSZ-CC-0827-V4-2016, BSI-DSZ-CC-0827-V5-2017 {}
heuristics/next_certificates BSI-DSZ-CC-0827-V7-2018, BSI-DSZ-CC-0827-V8-2020 {}
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-0827-V7-2018 {}
heuristics/report_references/directly_referencing BSI-DSZ-CC-0827-V5-2017 ANSSI-CC-2018/26
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1069-2018, BSI-DSZ-CC-1158-V2-2023, BSI-DSZ-CC-0827-V8-2020, BSI-DSZ-CC-0827-V7-2018, BSI-DSZ-CC-1158-2020 {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0827-V5-2017, BSI-DSZ-CC-0827-V3-2015, BSI-DSZ-CC-0827-V4-2016, BSI-DSZ-CC-0827-2013, BSI-DSZ-CC-0791-2012, BSI-DSZ-CC-0827-V2-2014 ANSSI-CC-2014/37, ANSSI-CC-2014/59, ANSSI-CC-2013/46, ANSSI-CC-2018/26
heuristics/scheme_data
  • cert_id: ANSSI-CC-2019/19
  • description: Le produit évalué est la famille des microcontrôleurs « S3FT9PE » de référence S3FT9PE_20190329, développée par Samsung Electronics Co Ltd. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont multiples
  • developer: Samsung Electronics Co.Ltd.
  • enhanced:
  • level: EAL5+
  • product: S3FT9PE Samsung 16-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries, including specific IC Dedicated Software, version S3FT9PE_20190329
  • sponsor: Samsung Electronics Co.Ltd.
  • url: https://cyber.gouv.fr/produits-certifies/s3ft9pe-samsung-16-bit-risc-microcontroller-smart-card-optional-secure-rsaeccsha
heuristics/st_references/directly_referenced_by CSEC2017020 {}
heuristics/st_references/indirectly_referenced_by CSEC2017020 {}
pdf_data/report_filename 0827V6a_pdf.pdf anssi-cc-2019_19fr.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0827-V6-2017
    • cert_item: Infineon Technologies Smart Card IC (Security Controller) M9900 A22/G11/C22/D22, M9905 A11, M9906 A11 with optional RSA v1.03.006/v2.05.005/v2.07.003, EC v1.03.006/v2.05.005/v2.07.003, Toolbox v1.03.006/v2.05.005/v2.07.003, Flash Translation Layer V1.01.0008, SCL v2.01.011/v2.02.010 and PSL v4.00.09 libraries with specific IC dedicated software
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
  • FR:
    • cc_security_level: EAL 5 augmenté ALC_DVS.2, AVA_VAN.5
    • cc_version: Critères Communs version 3.1 révision 5
    • cert_id: ANSSI-CC-2019/19
    • cert_item: S3FT9PE
    • cert_item_version: S3FT9PE_20190329
    • cert_lab: CEA - LETI 17 avenue des martyrs, 38054 Grenoble Cedex 9, France
    • developer: Samsung Electronics Co. Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud Commanditaire Samsung Electronics Co. Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Security IC Platform Protection Profile version 1.0, BSI-PP-0035
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0827-V5-: 1
    • BSI-DSZ-CC-0827-V5-2017: 1
    • BSI-DSZ-CC-0827-V6-2017: 25
  • FR:
    • ANSSI-CC-2018/26: 2
    • ANSSI-CC-2019/19: 15
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0035-2007: 1
    • BSI-CC-PP-0035-2007: 2
  • BSI:
    • BSI-PP-0035: 1
    • BSI-PP-0035-2007: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 7
    • EAL 2: 6
    • EAL 3: 4
    • EAL 4: 5
    • EAL 5: 14
    • EAL 5 augmented: 3
    • EAL 6: 3
    • EAL 7: 4
    • EAL5+: 1
    • EAL6: 1
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 3
    • EAL 7: 1
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 1
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 1
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 2
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 6
    • ALC_FLR: 3
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 2
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 1
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 5
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 1
  • R:
    • R.O: 1
pdf_data/report_keywords/vendor
  • GD:
    • G&D: 1
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 21
    • Infineon Technologies: 17
    • Infineon Technologies AG: 12
  • Samsung:
    • Samsung: 6
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
  • CEA-LETI:
    • CEA - LETI: 1
  • CESTI:
    • CESTI: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • Triple-DES: 2
    • DES:
      • DES: 9
  • AES_competition:
    • AES:
      • AES: 2
  • DES:
    • DES:
      • DES: 2
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 7
    • ECDSA:
      • ECDSA: 3
  • RSA:
    • RSA2048: 2
    • RSA4096: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 10
pdf_data/report_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 3
pdf_data/report_keywords/crypto_library
  • Generic:
    • Crypto Library 12.2: 1
    • Crypto Library 2.01.011: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 6
    • physical tampering: 1
  • SCA:
    • DPA: 6
    • SPA: 4
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 19: 1
    • AIS 20: 1
    • AIS 23: 1
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 4
    • AIS 37: 1
    • AIS 38: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS32: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 31: 2
    • AIS31: 1
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • M9906 including optional Software Libraries RSA-EC-SCL-PSL”, Infineon (confidential document) [12] M9900 Security Guidelines User’s Manual, 2017-06-30, Infineon [13] SLE97 M9900 Hardware: 1
    • REPORT SUMMARY (ETR SUMMARY)”, TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [9: 1
    • Target M9900, M9905, M9906 including optional Software Libraries RSA-EC-SCL-PSL”, Infineon (confidential document) [7] Evaluation Technical Report, BSI-DSZ-CC-0827-V6-2017 Version 1, Date 2017-08- 23, “EVALUATION: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • “EVALUATION TECHNICAL REPORT FOR COMPOSITE EVALUATION (ETR COMP)”, TÜV Informationstechnik GmbH (confidential document) [11] Configuration list for the TOE, 1.1, 2017-05-24, “Configuration Management Scope M9900, M9905: 1
pdf_data/report_metadata
  • /Category: S3FT9PE_20190329
  • /Comments: Samsung Electronics Co. Ltd.
  • /Company: SGDSN/ANSSI
  • /CreationDate: D:20190503143100+02'00'
  • /Creator: Acrobat PDFMaker 11 pour Word
  • /Keywords: ANSSI-CC-CER-F-07.28.1
  • /ModDate: D:20190503143310+02'00'
  • /Producer: Adobe PDF Library 11.0
  • /SourceModified: D:20190503123057
  • /Subject: S3FT9PE
  • /Title: ANSSI-CC-2019/19
  • pdf_file_size_bytes: 196952
  • pdf_hyperlinks: mailto:[email protected], http://www.ssi.gouv.fr/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename 0827V6b_pdf.pdf anssi-cible-cc-2019_19en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-: 1
    • BSI-CC-PP-0035-2007: 3
  • BSI:
    • BSI-PP-0035: 5
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 5: 2
    • EAL5: 7
    • EAL5 augmented: 3
    • EAL5+: 1
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 9
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL: 2
    • ASE_CCL.1: 1
    • ASE_ECD: 2
    • ASE_ECD.1: 1
    • ASE_INT: 2
    • ASE_INT.1: 1
    • ASE_OBJ: 2
    • ASE_OBJ.2: 1
    • ASE_REQ: 2
    • ASE_REQ.2: 1
    • ASE_SPD: 2
    • ASE_SPD.1: 1
    • ASE_TSS: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 11
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 7
    • ADV_FSP: 2
    • ADV_FSP.4: 2
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 5
    • FAU_SAS.1: 10
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 21
    • FCS_CKM.1: 47
    • FCS_CKM.2: 5
    • FCS_CKM.4: 34
    • FCS_COP: 140
    • FCS_COP.1: 38
    • FCS_RNG: 29
    • FCS_RNG.1: 25
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 23
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 20
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 14
    • FDP_ITC.1: 28
    • FDP_ITC.2: 28
    • FDP_ITT.1: 11
    • FDP_PHP.3: 1
    • FDP_SDI.1: 17
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 15
    • FDP_SDI.2.1: 2
    • FDP_SDI.2.2: 2
  • FIA:
    • FIA_SOS.2: 3
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 2
  • FMT:
    • FMT_LIM: 3
    • FMT_LIM.1: 7
    • FMT_LIM.2: 8
    • FMT_MSA.1: 19
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 20
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 15
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 8
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 18
    • FPT_ITT.1: 13
    • FPT_PHP.3: 14
    • FPT_TST: 5
    • FPT_TST.1: 12
    • FPT_TST.2: 34
    • FPT_TST.2.1: 2
  • FRU:
    • FRU_FLT.2: 8
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 9
    • FCS_CKM.1: 27
    • FCS_CKM.2: 4
    • FCS_CKM.4: 15
    • FCS_COP: 33
    • FCS_COP.1: 24
    • FCS_RNG: 6
    • FCS_RNG.1: 14
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 14
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 10
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 12
    • FDP_ITC.2: 12
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_CKM.4: 1
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 12
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 13
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 1
  • T:
    • T.RND: 1
  • O:
    • O.MEM_ACCESS: 1
    • O.RND: 5
    • O.RNG: 1
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 8
    • Infineon Technologies: 7
    • Infineon Technologies AG: 19
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 54
  • DES:
    • 3DES:
      • 3DES: 31
      • TDEA: 3
      • TDES: 8
      • Triple-DES: 3
    • DES:
      • DES: 16
  • AES_competition:
    • AES:
      • AES: 14
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 8
  • constructions:
    • MAC:
      • HMAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 81
    • ECDH:
      • ECDH: 8
    • ECDSA:
      • ECDSA: 17
  • FF:
    • DH:
      • Diffie-Hellman: 7
    • DSA:
      • DSA: 2
  • RSA:
    • RSA-2048: 1
    • RSA2048: 4
    • RSA4096: 4
  • ECC:
    • ECC:
      • ECC: 25
    • ECDH:
      • ECDH: 7
    • ECDSA:
      • ECDSA: 14
  • FF:
    • DH:
      • Diffie-Hellman: 2
    • DSA:
      • DSA: 2
  • RSA:
    • RSA-CRT: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 2
    • SHA2:
      • SHA-224: 2
      • SHA-256: 2
      • SHA-384: 2
      • SHA-512: 2
      • SHA224: 6
      • SHA256: 6
      • SHA384: 6
      • SHA512: 5
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 4
  • MAC:
    • MAC: 22
  • KA:
    • Key Agreement: 2
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 2
    • RNG: 17
  • TRNG:
    • TRNG: 14
  • RNG:
    • RND: 10
    • RNG: 3
  • TRNG:
    • DTRNG: 40
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 26
  • CFB:
    • CFB: 7
  • CTR:
    • CTR: 11
  • ECB:
    • ECB: 17
  • ECB:
    • ECB: 3
pdf_data/st_keywords/ecc_curve
  • NIST:
    • K-163: 1
    • K-233: 1
    • P-192: 4
    • P-224: 2
  • Brainpool:
    • brainpoolP192r1: 4
    • brainpoolP192t1: 4
    • brainpoolP224r1: 4
    • brainpoolP224t1: 4
    • brainpoolP256r1: 4
    • brainpoolP256t1: 4
    • brainpoolP320r1: 4
    • brainpoolP320t1: 4
    • brainpoolP384r1: 4
    • brainpoolP384t1: 4
    • brainpoolP512r1: 4
    • brainpoolP512t1: 4
  • NIST:
    • P-192: 8
    • P-224: 8
    • P-256: 6
    • P-384: 8
    • secp192k1: 4
    • secp192r1: 4
    • secp224k1: 4
    • secp224r1: 4
    • secp256k1: 4
    • secp256r1: 4
    • secp384r1: 4
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 12
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 7
    • Malfunction: 12
    • malfunction: 1
  • SCA:
    • DPA: 7
    • Leak-Inherent: 10
    • Physical Probing: 2
    • SPA: 6
    • Side-channel: 1
    • Timing Attack: 1
    • physical probing: 1
    • side channel: 7
  • other:
    • reverse engineering: 1
  • FI:
    • DFA: 5
    • Malfunction: 27
    • fault injection: 2
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 9
    • Leak-Inherent: 23
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 8
    • physical probing: 9
    • side channel: 2
    • side-channel: 2
    • timing attack: 5
    • timing attacks: 1
  • other:
    • reverse engineering: 2
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/tee_name
  • IBM:
    • SSC: 4
pdf_data/st_keywords/cplc_data
  • ICVersion:
    • IC Version: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 5
    • AIS32: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
  • FIPS:
    • FIPS PUB 197: 3
  • ISO:
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9797-1: 2
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC 5639: 1
    • RFC3447: 15
  • BSI:
    • AIS31: 4
    • BSI-AIS31: 6
  • CC:
    • CCMB-2017-04-001: 3
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS PUB 180-3: 6
    • FIPS197: 1
pdf_data/st_metadata
  • /CreationDate: D:20190313174707+09'00'
  • /Creator: Microsoft® Word 2010
  • /ModDate: D:20190408145508+02'00'
  • /Producer: Microsoft® Word 2010
  • /Title:
  • pdf_file_size_bytes: 891877
  • pdf_hyperlinks: http://www.ecc-brainpool.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 69
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