Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100

CSV information ?

Status active
Valid from 03.03.2023
Valid until 03.03.2028
Scheme 🇩🇪 DE
Manufacturer Qualcomm Technologies Inc.
Category Other Devices and Systems
Security level AVA_VAN.5, EAL4+, ALC_DVS.2
Protection profiles

Heuristics summary ?

Certificate ID: BSI-DSZ-CC-1045-V2-2023

Certificate ?

Extracted keywords

Vendor
Qualcomm

Security level
EAL 4, EAL 5, EAL 2, EAL 4 augmented
Security Assurance Requirements (SAR)
ALC_DVS.2, AVA_VAN.5
Protection profiles
BSI-CC-PP-0084-2014
Certificates
BSI-DSZ-CC-1045-V2-2023

Standards
ISO/IEC 15408, ISO/IEC 18045

File metadata

Title Certification Report BSI-DSZ-CC-1045-V2-2023
Subject Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
Author Bundesamt für Sicherheit in der Informationstechnik
Pages 1

Certification report ?

Extracted keywords

Symmetric Algorithms
AES, DES, TDES, HMAC, HMAC-SHA-384, CMAC
Asymmetric Algorithms
ECDH, ECDSA, ECC
Hash functions
SHA1, SHA-1, SHA-256, SHA-512, SHA-384
Randomness
RNG
Elliptic Curves
P-192, P-224, P-256, P-384, P-521, NIST P-192, NIST P-224, NIST P-256, NIST P-384, NIST P-521
Block cipher modes
ECB, CBC, CTR, CCM

Vendor
Qualcomm

Security level
EAL 4, EAL 5, EAL 2, EAL 1, EAL 5+, EAL 6, EAL 4 augmented
Claims
O.C, R.O
Security Assurance Requirements (SAR)
ALC_DVS.2, ALC_FLR, ALC_DEL, ALC_DVS, ALC_CMC.4, ALC_CMS.4, ALC_DEL.1, ALC_LCD.1, ALC_TAT.1, ATE_FUN, ATE_IND, AVA_VAN.5, AVA_VAN
Protection profiles
BSI-CC-PP-0084-2014
Certificates
BSI-DSZ-CC-1045-V2-2023, BSI-DSZ-CC-1045-2019
Evaluation facilities
atsec, Deutsche Telekom Security

Side-channel analysis
physical probing, Side-channel, fault injection, JIL
Certification process
being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification, Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -, Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January, Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI, for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965, Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance, v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0, 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm, Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification, of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document, Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware, process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications, txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of, TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt, list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List, txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the

Standards
FIPS 186-4, FIPS 197, FIPS 180-4, FIPS46-3, FIPS198-1, FIPS 198-1, FIPS186-4, PKCS#1, AIS 31, AIS 26, AIS 34, AIS 25, AIS 37, AIS 36, AIS 35, AIS 20, AIS 32, AIS 38, RFC3447, ISO/IEC 15408, ISO/IEC 18045, ISO/IEC 17065
Technical reports
BSI TR-02102, BSI 7148

File metadata

Title Certification Report BSI-DSZ-CC-1045-V2-2023
Subject BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
Keywords "BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230"
Author Bundesamt für Sicherheit in der Informationstechnik
Pages 29

Frontpage

Certificate ID BSI-DSZ-CC-1045-V2-2023
Certified item Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
Certification lab BSI
Developer Qualcomm Technologies Inc

References

Outgoing

Security target ?

Extracted keywords

Symmetric Algorithms
AES, AES-256, TDES, Triple-DES, TDEA, HMAC, HMAC-SHA-384, CMAC
Asymmetric Algorithms
ECDH, ECDSA, ECC, Diffie-Hellman
Hash functions
SHA-1, SHA1, SHA-256, SHA-384, SHA-512
Schemes
MAC
Randomness
DRBG, RND, RNG
Elliptic Curves
P-192, P-224, P-256, P-384, P-521, NIST P-192, NIST P-224, NIST P-256, NIST P-384, NIST P-521
Block cipher modes
ECB, CBC, CTR, CCM

Trusted Execution Environments
ARM TrustZone
Vendor
Qualcomm

Security level
EAL4, EAL4 augmented
Claims
O.RND, O.AES, O.TDES, O.SHA, O.RSA_SIGN, O.RSA_ENC, O.ECDSA, O.ECDH, O.HMAC, O.CMAC, O.KDF, T.RND, T.CONFID-TSF-CODE, T.CONFID-APPLI-, T.CONFID-TSF-DATA, T.INTEG-APPLI-, T.INTEG-TSF-CODE, T.INTEG-APPLI-DATA, T.INTEG-TSF-DATA, T.AUTH-TSF-DATA, T.AUTH-APPLI-DATA, T.RBP-TSF-DATA, T.RBP-APPLI-DATA, T.CONFID-APPLI-DATA, T.INTEG-APPLI-CODE, T.INTEG-
Security Assurance Requirements (SAR)
ALC_DEL, ALC_DVS, ALC_DVS.2, AVA_VAN.5
Security Functional Requirements (SFR)
FAU_SAS.1, FAU_GEN, FAU_SAS.1.1, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP, FCS_COP.1, FCS_CKM, FCS_CKM.4, FCS_CKM.1, FCS_CKM.2, FCS_ITC.1, FCS_ITC.2, FDP_SDA, FDP_SDA.1, FDP_SDR, FDP_SDR.1, FDP_SDC.1, FDP_SDI, FDP_SDA.1.1, FDP_SDR.1.1, FDP_SDC.1.1, FDP_SDI.2, FDP_SDI.2.1, FDP_SDI.2.2, FDP_ITT.1, FDP_ITT.1.1, FDP_IFC.1, FDP_IFC.1.1, FDP_IFF.1, FDP_ITC.1, FDP_ITC.1.1, FDP_ITC.1.2, FDP_ITC.1.3, FDP_ACC.2, FDP_ACC.2.1, FDP_ACC.2.2, FDP_ACF.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_RIP, FDP_RIP.1, FDP_ACC, FDP_ACF, FDP_ACC.1, FDP_ICT.1, FMT_CMT, FMT_CMT.1, FMT_LIM.1, FMT_LIM.2, FMT_CMT.1.1, FMT_LIM.1.1, FMT_LIM.2.1, FMT_MSA.3, FMT_MSA, FMT_MSA.1, FMT_SMR.1, FPT_FLS.1, FPT_FLS.1.1, FPT_PHP.3, FPT_PHP.3.1, FPT_ITT.1, FPT_ITT.1.1, FRU_FLT.2, FRU_FLT.2.1
Protection profiles
BSI-CC-PP-0084-2014

Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, side channels, Side-channel, side channel, side-channel, Malfunction, malfunction, DFA, fault injection, cold boot

Standards
FIPS PUB 198-1, FIPS PUB 180-4, FIPS PUB 197, FIPS 198-1, FIPS 180-4, FIPS PUB 186-4, FIPS 186-4, FIPS 197, FIPS46-3, FIPS198-1, FIPS186-4, NIST SP 800-108, NIST SP 800-67, NIST SP 800-38A, NIST SP 800-38C, NIST SP 800-38B, NIST SP 800-56A, NIST SP 800-90A, PKCS#1, RFC5639, RFC3447, CCMB-2017-04-001, CCMB-2017-04-002, CCMB-2017-04-003

File metadata

Title Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
Subject 80-NU430-6 Rev.H
Keywords integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
Author QTI
Pages 61

Heuristics ?

Certificate ID: BSI-DSZ-CC-1045-V2-2023

Extracted SARs

ALC_TAT.1, ALC_LCD.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_CMC.4, ALC_DVS.2

Scheme data ?

Cert Id BSI-DSZ-CC-1045-V2-2023
Product Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
Vendor Qualcomm Technologies Inc.
Certification Date 03.03.2023
Category System on a chip (SOC)
Url https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html
Enhanced
Product Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
Applicant Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA
Evaluation Facility T-Systems International GmbH atsec information security GmbH
Assurance Level EAL4+; ALC_DVS.2, AVA_VAN.5
Protection Profile Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
Certification Date 03.03.2023
Expiration Date 02.03.2028
Entries [frozendict({'id': 'BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028)\nZertifizierungsreport / Certification Report\nSicherheitsvorgaben / Security Target\nZertifikat / Certificate', 'description': 'has been extended by additional cryptographic functions.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})]
Report Link https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2
Target Link https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2
Cert Link https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2
Description The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.

References ?

Updates ?

  • 17.10.2024 The certificate data changed.
    Certificate changed

    The Protection Profiles of the certificate were updated.

    • The new value is {'_type': 'Set', 'elements': [{'_type': 'sec_certs.sample.protection_profile.ProtectionProfile', 'pp_name': 'Security IC Platform Protection Profile with Augmentation Packages', 'pp_eal': 'EAL4+', 'pp_link': 'https://www.commoncriteriaportal.org/files/ppfiles/pp0084b_pdf.pdf', 'pp_ids': {'_type': 'Set', 'elements': ['JAVA_OC', 'SECURITY_IC_AUGP_V1.0', 'BAROC_SC_PP_V1.0']}}]}.
  • 22.08.2024 The certificate data changed.
    Certificate changed

    The state of the certificate object was updated.

    • The report property was updated, with the {'download_ok': True, 'convert_ok': True, 'extract_ok': True, 'pdf_hash': 'fe539cd32abddd009a309e4fb1ab93e7eb67868d6f74745b9b0aaf252b7e139b', 'txt_hash': '7e6cd0fb84c1747d2ec5944d35e3b0255d314af2b19a2de2eb3931871b67d801'} data.
    • The st property was updated, with the {'download_ok': True, 'convert_ok': True, 'extract_ok': True, 'pdf_hash': '973569ccf4bb09961a356874a2380d56f7789bc2ee757e7957425967a09b1079', 'txt_hash': '36a03aa8ef2a12b2ccb22b7b2df7732658d8919d738b29e77c6a9885e9f53d9d'} data.
    • The cert property was updated, with the {'download_ok': True, 'convert_ok': True, 'extract_ok': True, 'pdf_hash': '515909c4e8f0a63a6f66236bd8202a91d6abdda5f9e1008e2e9b766172002c57', 'txt_hash': 'b6968a9484f792a95df13d19cad6cbc60607cd6985e5626d808bbe2e1b67b6e9'} data.

    The PDF extraction data was updated.

    • The report_metadata property was set to {'pdf_file_size_bytes': 641231, 'pdf_is_encrypted': False, 'pdf_number_of_pages': 29, '/Author': 'Bundesamt für Sicherheit in der Informationstechnik', '/Keywords': '"BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230"', '/Subject': 'BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230', '/Title': 'Certification Report BSI-DSZ-CC-1045-V2-2023', 'pdf_hyperlinks': {'_type': 'Set', 'elements': ['http://www.commoncriteriaportal.org/cc/', 'https://www.bsi.bund.de/AIS', 'http://www.commoncriteriaportal.org/', 'https://www.bsi.bund.de/zertifizierungsreporte', 'https://www.sogis.eu/', 'https://www.bsi.bund.de/', 'https://www.bsi.bund.de/zertifizierung']}}.
    • The st_metadata property was set to {'pdf_file_size_bytes': 824155, 'pdf_is_encrypted': False, 'pdf_number_of_pages': 61, '/Author': 'QTI', '/Keywords': 'integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230', '/Subject': '80-NU430-6 Rev.H', '/Title': 'Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite', 'pdf_hyperlinks': {'_type': 'Set', 'elements': ['https://createpoint.qti.qualcomm.com/', 'mailto:[email protected]']}}.
    • The cert_metadata property was set to {'pdf_file_size_bytes': 289421, 'pdf_is_encrypted': False, 'pdf_number_of_pages': 1, '/Author': 'Bundesamt für Sicherheit in der Informationstechnik', '/Subject': 'Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100', '/Title': 'Certification Report BSI-DSZ-CC-1045-V2-2023', 'pdf_hyperlinks': {'_type': 'Set', 'elements': []}}.
    • The report_frontpage property was set to {'DE': {'match_rules': ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)'], 'cert_id': 'BSI-DSZ-CC-1045-V2-2023', 'cert_item': 'Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100', 'developer': 'Qualcomm Technologies Inc', 'cert_lab': 'BSI', 'ref_protection_profiles': 'Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014', 'cc_version': 'PP conformant plus product specific extensions Common Criteria Part 2 extended', 'cc_security_level': 'Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2'}}.
    • The report_keywords property was set to {'cc_cert_id': {'DE': {'BSI-DSZ-CC-1045-V2-2023': 17, 'BSI-DSZ-CC-1045-2019': 3}}, 'cc_protection_profile_id': {'BSI': {'BSI-CC-PP-0084-2014': 4}}, 'cc_security_level': {'EAL': {'EAL 4': 5, 'EAL 5': 4, 'EAL 2': 3, 'EAL 1': 1, 'EAL 5+': 1, 'EAL 6': 1, 'EAL 4 augmented': 3}}, 'cc_sar': {'ALC': {'ALC_DVS.2': 5, 'ALC_FLR': 1, 'ALC_DEL': 1, 'ALC_DVS': 1, 'ALC_CMC.4': 1, 'ALC_CMS.4': 1, 'ALC_DEL.1': 1, 'ALC_LCD.1': 1, 'ALC_TAT.1': 1}, 'ATE': {'ATE_FUN': 1, 'ATE_IND': 1}, 'AVA': {'AVA_VAN.5': 4, 'AVA_VAN': 1}}, 'cc_sfr': {}, 'cc_claims': {'O': {'O.C': 4}, 'R': {'R.O': 4}}, 'vendor': {'Qualcomm': {'Qualcomm': 38}}, 'eval_facility': {'atsec': {'atsec': 2}, 'DeutscheTelekom': {'Deutsche Telekom Security': 3}}, 'symmetric_crypto': {'AES_competition': {'AES': {'AES': 6}}, 'DES': {'DES': {'DES': 1}, '3DES': {'TDES': 3}}, 'constructions': {'MAC': {'HMAC': 1, 'HMAC-SHA-384': 1, 'CMAC': 2}}}, 'asymmetric_crypto': {'ECC': {'ECDH': {'ECDH': 1}, 'ECDSA': {'ECDSA': 1}, 'ECC': {'ECC': 4}}}, 'pq_crypto': {}, 'hash_function': {'SHA': {'SHA1': {'SHA1': 1, 'SHA-1': 2}, 'SHA2': {'SHA-256': 6, 'SHA-512': 2, 'SHA-384': 2}}}, 'crypto_scheme': {}, 'crypto_protocol': {}, 'randomness': {'RNG': {'RNG': 2}}, 'cipher_mode': {'ECB': {'ECB': 2}, 'CBC': {'CBC': 2}, 'CTR': {'CTR': 1}, 'CCM': {'CCM': 1}}, 'ecc_curve': {'NIST': {'P-192': 2, 'P-224': 2, 'P-256': 2, 'P-384': 2, 'P-521': 2, 'NIST P-192': 2, 'NIST P-224': 2, 'NIST P-256': 2, 'NIST P-384': 2, 'NIST P-521': 2}}, 'crypto_engine': {}, 'tls_cipher_suite': {}, 'crypto_library': {}, 'vulnerability': {}, 'side_channel_analysis': {'SCA': {'physical probing': 1, 'Side-channel': 1}, 'FI': {'fault injection': 1}, 'other': {'JIL': 3}}, 'technical_report_id': {'BSI': {'BSI TR-02102': 1, 'BSI 7148': 1}}, 'device_model': {}, 'tee_name': {}, 'os_name': {}, 'cplc_data': {}, 'ic_data_group': {}, 'standard_id': {'FIPS': {'FIPS 186-4': 3, 'FIPS 197': 5, 'FIPS 180-4': 2, 'FIPS46-3': 1, 'FIPS198-1': 1, 'FIPS 198-1': 1, 'FIPS186-4': 2}, 'PKCS': {'PKCS#1': 3}, 'BSI': {'AIS 31': 3, 'AIS 26': 3, 'AIS 34': 2, 'AIS 25': 2, 'AIS 37': 1, 'AIS 36': 1, 'AIS 35': 2, 'AIS 20': 1, 'AIS 32': 1, 'AIS 38': 1}, 'RFC': {'RFC3447': 3}, 'ISO': {'ISO/IEC 15408': 4, 'ISO/IEC 18045': 4, 'ISO/IEC 17065': 2}}, 'javacard_version': {}, 'javacard_api_const': {}, 'javacard_packages': {}, 'certification_process': {'ConfidentialDocument': {'being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification': 1, 'Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -': 1, 'Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January': 1, 'Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI': 1, 'for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965': 1, 'Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance': 1, 'v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0': 1, '04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm': 1, 'Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification': 1, 'of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document': 1, 'Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware': 1, 'process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications': 1, 'txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of': 1, 'TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt': 1, 'list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List': 1, 'txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the': 1}}}.
    • The st_keywords property was set to {'cc_cert_id': {}, 'cc_protection_profile_id': {'BSI': {'BSI-CC-PP-0084-2014': 3}}, 'cc_security_level': {'EAL': {'EAL4': 1, 'EAL4 augmented': 1}}, 'cc_sar': {'ALC': {'ALC_DEL': 1, 'ALC_DVS': 1, 'ALC_DVS.2': 1}, 'AVA': {'AVA_VAN.5': 1}}, 'cc_sfr': {'FAU': {'FAU_SAS.1': 4, 'FAU_GEN': 1, 'FAU_SAS.1.1': 1}, 'FCS': {'FCS_RNG.1': 3, 'FCS_RNG.1.1': 1, 'FCS_RNG.1.2': 1, 'FCS_COP': 49, 'FCS_COP.1': 12, 'FCS_CKM': 62, 'FCS_CKM.4': 16, 'FCS_CKM.1': 16, 'FCS_CKM.2': 3, 'FCS_ITC.1': 13, 'FCS_ITC.2': 13}, 'FDP': {'FDP_SDA': 3, 'FDP_SDA.1': 12, 'FDP_SDR': 3, 'FDP_SDR.1': 12, 'FDP_SDC.1': 11, 'FDP_SDI': 2, 'FDP_SDA.1.1': 2, 'FDP_SDR.1.1': 2, 'FDP_SDC.1.1': 2, 'FDP_SDI.2': 18, 'FDP_SDI.2.1': 3, 'FDP_SDI.2.2': 3, 'FDP_ITT.1': 3, 'FDP_ITT.1.1': 1, 'FDP_IFC.1': 5, 'FDP_IFC.1.1': 2, 'FDP_IFF.1': 1, 'FDP_ITC.1': 8, 'FDP_ITC.1.1': 1, 'FDP_ITC.1.2': 1, 'FDP_ITC.1.3': 1, 'FDP_ACC.2': 3, 'FDP_ACC.2.1': 1, 'FDP_ACC.2.2': 1, 'FDP_ACF.1': 4, 'FDP_ACF.1.1': 1, 'FDP_ACF.1.2': 1, 'FDP_ACF.1.3': 1, 'FDP_ACF.1.4': 1, 'FDP_RIP': 10, 'FDP_RIP.1': 2, 'FDP_ACC': 4, 'FDP_ACF': 3, 'FDP_ACC.1': 2, 'FDP_ICT.1': 1}, 'FMT': {'FMT_CMT': 2, 'FMT_CMT.1': 35, 'FMT_LIM.1': 5, 'FMT_LIM.2': 5, 'FMT_CMT.1.1': 7, 'FMT_LIM.1.1': 1, 'FMT_LIM.2.1': 1, 'FMT_MSA.3': 7, 'FMT_MSA': 5, 'FMT_MSA.1': 2, 'FMT_SMR.1': 1}, 'FPT': {'FPT_FLS.1': 5, 'FPT_FLS.1.1': 1, 'FPT_PHP.3': 3, 'FPT_PHP.3.1': 1, 'FPT_ITT.1': 3, 'FPT_ITT.1.1': 1}, 'FRU': {'FRU_FLT.2': 4, 'FRU_FLT.2.1': 1}}, 'cc_claims': {'O': {'O.RND': 1, 'O.AES': 3, 'O.TDES': 3, 'O.SHA': 3, 'O.RSA_SIGN': 4, 'O.RSA_ENC': 4, 'O.ECDSA': 4, 'O.ECDH': 4, 'O.HMAC': 4, 'O.CMAC': 4, 'O.KDF': 4}, 'T': {'T.RND': 1, 'T.CONFID-TSF-CODE': 3, 'T.CONFID-APPLI-': 1, 'T.CONFID-TSF-DATA': 4, 'T.INTEG-APPLI-': 1, 'T.INTEG-TSF-CODE': 3, 'T.INTEG-APPLI-DATA': 5, 'T.INTEG-TSF-DATA': 3, 'T.AUTH-TSF-DATA': 3, 'T.AUTH-APPLI-DATA': 3, 'T.RBP-TSF-DATA': 3, 'T.RBP-APPLI-DATA': 3, 'T.CONFID-APPLI-DATA': 4, 'T.INTEG-APPLI-CODE': 2, 'T.INTEG-': 1}}, 'vendor': {'Qualcomm': {'Qualcomm': 22}}, 'eval_facility': {}, 'symmetric_crypto': {'AES_competition': {'AES': {'AES': 32, 'AES-256': 1}}, 'DES': {'3DES': {'TDES': 25, 'Triple-DES': 3, 'TDEA': 1}}, 'constructions': {'MAC': {'HMAC': 25, 'HMAC-SHA-384': 1, 'CMAC': 16}}}, 'asymmetric_crypto': {'ECC': {'ECDH': {'ECDH': 11}, 'ECDSA': {'ECDSA': 11}, 'ECC': {'ECC': 9}}, 'FF': {'DH': {'Diffie-Hellman': 2}}}, 'pq_crypto': {}, 'hash_function': {'SHA': {'SHA1': {'SHA-1': 10, 'SHA1': 1}, 'SHA2': {'SHA-256': 15, 'SHA-384': 8, 'SHA-512': 8}}}, 'crypto_scheme': {'MAC': {'MAC': 1}}, 'crypto_protocol': {}, 'randomness': {'PRNG': {'DRBG': 1}, 'RNG': {'RND': 2, 'RNG': 17}}, 'cipher_mode': {'ECB': {'ECB': 4}, 'CBC': {'CBC': 4}, 'CTR': {'CTR': 2}, 'CCM': {'CCM': 4}}, 'ecc_curve': {'NIST': {'P-192': 13, 'P-224': 16, 'P-256': 12, 'P-384': 14, 'P-521': 16, 'NIST P-192': 5, 'NIST P-224': 2, 'NIST P-256': 2, 'NIST P-384': 2, 'NIST P-521': 2}}, 'crypto_engine': {}, 'tls_cipher_suite': {}, 'crypto_library': {}, 'vulnerability': {}, 'side_channel_analysis': {'SCA': {'Leak-Inherent': 3, 'Physical Probing': 2, 'physical probing': 4, 'side channels': 1, 'Side-channel': 1, 'side channel': 4, 'side-channel': 2}, 'FI': {'Malfunction': 3, 'malfunction': 3, 'DFA': 4, 'fault injection': 2}, 'other': {'cold boot': 4}}, 'technical_report_id': {}, 'device_model': {}, 'tee_name': {'ARM': {'ARM TrustZone': 1}}, 'os_name': {}, 'cplc_data': {}, 'ic_data_group': {}, 'standard_id': {'FIPS': {'FIPS PUB 198-1': 3, 'FIPS PUB 180-4': 4, 'FIPS PUB 197': 3, 'FIPS 198-1': 2, 'FIPS 180-4': 3, 'FIPS PUB 186-4': 5, 'FIPS 186-4': 4, 'FIPS 197': 5, 'FIPS46-3': 1, 'FIPS198-1': 1, 'FIPS186-4': 2}, 'NIST': {'NIST SP 800-108': 3, 'NIST SP 800-67': 1, 'NIST SP 800-38A': 3, 'NIST SP 800-38C': 1, 'NIST SP 800-38B': 2, 'NIST SP 800-56A': 1, 'NIST SP 800-90A': 1}, 'PKCS': {'PKCS#1': 7}, 'RFC': {'RFC5639': 3, 'RFC3447': 3}, 'CC': {'CCMB-2017-04-001': 1, 'CCMB-2017-04-002': 1, 'CCMB-2017-04-003': 1}}, 'javacard_version': {}, 'javacard_api_const': {}, 'javacard_packages': {}, 'certification_process': {}}.
    • The cert_keywords property was set to {'cc_cert_id': {'DE': {'BSI-DSZ-CC-1045-V2-2023': 1}}, 'cc_protection_profile_id': {'BSI': {'BSI-CC-PP-0084-2014': 1}}, 'cc_security_level': {'EAL': {'EAL 4': 1, 'EAL 5': 1, 'EAL 2': 1, 'EAL 4 augmented': 1}}, 'cc_sar': {'ALC': {'ALC_DVS.2': 1}, 'AVA': {'AVA_VAN.5': 1}}, 'cc_sfr': {}, 'cc_claims': {}, 'vendor': {'Qualcomm': {'Qualcomm': 2}}, 'eval_facility': {}, 'symmetric_crypto': {}, 'asymmetric_crypto': {}, 'pq_crypto': {}, 'hash_function': {}, 'crypto_scheme': {}, 'crypto_protocol': {}, 'randomness': {}, 'cipher_mode': {}, 'ecc_curve': {}, 'crypto_engine': {}, 'tls_cipher_suite': {}, 'crypto_library': {}, 'vulnerability': {}, 'side_channel_analysis': {}, 'technical_report_id': {}, 'device_model': {}, 'tee_name': {}, 'os_name': {}, 'cplc_data': {}, 'ic_data_group': {}, 'standard_id': {'ISO': {'ISO/IEC 15408': 2, 'ISO/IEC 18045': 2}}, 'javacard_version': {}, 'javacard_api_const': {}, 'javacard_packages': {}, 'certification_process': {}}.
    • The report_filename property was set to 1045V2a_pdf.pdf.
    • The st_filename property was set to 1045V2b_pdf.pdf.
    • The cert_filename property was set to 1045V2c_pdf.pdf.

    The computed heuristics were updated.

    • The cert_lab property was set to ['BSI'].
    • The cert_id property was set to BSI-DSZ-CC-1045-V2-2023.
    • The report_references property was updated, with the {'directly_referencing': {'_type': 'Set', 'elements': ['BSI-DSZ-CC-1045-2019']}, 'indirectly_referencing': {'_type': 'Set', 'elements': ['BSI-DSZ-CC-1045-2019']}} data.
    • The extracted_sars property was updated, with the {'_type': 'Set', 'elements': [{'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_TAT', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_LCD', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMS', 'level': 4}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_DEL', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMC', 'level': 4}]} values added.
  • 17.08.2024 The certificate data changed.
    Certificate changed

    The report_link was updated.

    • The new value is https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf.

    The st_link was updated.

    • The new value is https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf.

    The state of the certificate object was updated.

    • The report property was updated, with the {'download_ok': False, 'convert_ok': False, 'extract_ok': False, 'pdf_hash': None, 'txt_hash': None} data.
    • The cert property was updated, with the {'download_ok': False, 'convert_ok': False, 'extract_ok': False, 'pdf_hash': None, 'txt_hash': None} data.

    The PDF extraction data was updated.

    • The report_metadata property was set to None.
    • The cert_metadata property was set to None.
    • The report_frontpage property was set to None.
    • The report_keywords property was set to None.
    • The cert_keywords property was set to None.
    • The report_filename property was set to None.
    • The cert_filename property was set to None.

    The computed heuristics were updated.

    • The cert_lab property was set to None.
    • The cert_id property was set to None.
    • The report_references property was updated, with the {'directly_referencing': None, 'indirectly_referencing': None} data.
    • The extracted_sars property was updated, with the {'_type': 'Set', 'elements': [{'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_TAT', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_LCD', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMS', 'level': 4}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_DEL', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMC', 'level': 4}]} values discarded.
  • 12.08.2024 The certificate data changed.
    Certificate changed

    The state of the certificate object was updated.

    • The st property was updated, with the {'download_ok': False, 'convert_ok': False, 'extract_ok': False, 'pdf_hash': None, 'txt_hash': None} data.

    The PDF extraction data was updated.

    • The st_metadata property was set to None.
    • The st_keywords property was set to None.
    • The st_filename property was set to None.
  • 23.07.2024 The certificate was first processed.
    New certificate

    A new Common Criteria certificate with the product name Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 was processed.

Raw data

{
  "_type": "sec_certs.sample.cc.CCCertificate",
  "category": "Other Devices and Systems",
  "cert_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf",
  "dgst": "ac18c15a88b4b1bd",
  "heuristics": {
    "_type": "sec_certs.sample.cc.CCCertificate.Heuristics",
    "annotated_references": null,
    "cert_id": "BSI-DSZ-CC-1045-V2-2023",
    "cert_lab": [
      "BSI"
    ],
    "cpe_matches": null,
    "direct_transitive_cves": null,
    "extracted_sars": {
      "_type": "Set",
      "elements": [
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_LCD",
          "level": 1
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_CMS",
          "level": 4
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_DEL",
          "level": 1
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_CMC",
          "level": 4
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_TAT",
          "level": 1
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "AVA_VAN",
          "level": 5
        },
        {
          "_type": "sec_certs.sample.sar.SAR",
          "family": "ALC_DVS",
          "level": 2
        }
      ]
    },
    "extracted_versions": {
      "_type": "Set",
      "elements": [
        "1.1.2"
      ]
    },
    "indirect_transitive_cves": null,
    "related_cves": null,
    "report_references": {
      "_type": "sec_certs.sample.certificate.References",
      "directly_referenced_by": null,
      "directly_referencing": {
        "_type": "Set",
        "elements": [
          "BSI-DSZ-CC-1045-2019"
        ]
      },
      "indirectly_referenced_by": null,
      "indirectly_referencing": {
        "_type": "Set",
        "elements": [
          "BSI-DSZ-CC-1045-2019"
        ]
      }
    },
    "scheme_data": {
      "category": "System on a chip (SOC)",
      "cert_id": "BSI-DSZ-CC-1045-V2-2023",
      "certification_date": "03.03.2023",
      "enhanced": {
        "applicant": "Qualcomm Technologies Inc.\n5775 Morehouse drive \nSan Diego, CA 92121\nUSA",
        "assurance_level": "EAL4+; ALC_DVS.2, AVA_VAN.5",
        "cert_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile\u0026v=2",
        "certification_date": "03.03.2023",
        "description": "The TOE is the \u201cQualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.",
        "entries": [
          {
            "description": "has been extended by additional cryptographic functions.",
            "id": "BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, g\u00fcltig bis / valid until 02.03.2028)\nZertifizierungsreport / Certification Report\nSicherheitsvorgaben / Security Target\nZertifikat / Certificate"
          },
          {
            "description": "Certificate",
            "id": "BSI"
          }
        ],
        "evaluation_facility": "T-Systems International GmbH\natsec information security GmbH",
        "expiration_date": "02.03.2028",
        "product": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
        "protection_profile": "Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014",
        "report_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile\u0026v=2",
        "target_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile\u0026v=2"
      },
      "product": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
      "url": "https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html",
      "vendor": "Qualcomm Technologies Inc."
    },
    "st_references": {
      "_type": "sec_certs.sample.certificate.References",
      "directly_referenced_by": null,
      "directly_referencing": null,
      "indirectly_referenced_by": null,
      "indirectly_referencing": null
    },
    "verified_cpe_matches": null
  },
  "maintenance_updates": {
    "_type": "Set",
    "elements": []
  },
  "manufacturer": "Qualcomm Technologies Inc.",
  "manufacturer_web": "https://www.qualcomm.com",
  "name": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
  "not_valid_after": "2028-03-03",
  "not_valid_before": "2023-03-03",
  "pdf_data": {
    "_type": "sec_certs.sample.cc.CCCertificate.PdfData",
    "cert_filename": "1045V2c_pdf.pdf",
    "cert_frontpage": null,
    "cert_keywords": {
      "asymmetric_crypto": {},
      "cc_cert_id": {
        "DE": {
          "BSI-DSZ-CC-1045-V2-2023": 1
        }
      },
      "cc_claims": {},
      "cc_protection_profile_id": {
        "BSI": {
          "BSI-CC-PP-0084-2014": 1
        }
      },
      "cc_sar": {
        "ALC": {
          "ALC_DVS.2": 1
        },
        "AVA": {
          "AVA_VAN.5": 1
        }
      },
      "cc_security_level": {
        "EAL": {
          "EAL 2": 1,
          "EAL 4": 1,
          "EAL 4 augmented": 1,
          "EAL 5": 1
        }
      },
      "cc_sfr": {},
      "certification_process": {},
      "cipher_mode": {},
      "cplc_data": {},
      "crypto_engine": {},
      "crypto_library": {},
      "crypto_protocol": {},
      "crypto_scheme": {},
      "device_model": {},
      "ecc_curve": {},
      "eval_facility": {},
      "hash_function": {},
      "ic_data_group": {},
      "javacard_api_const": {},
      "javacard_packages": {},
      "javacard_version": {},
      "os_name": {},
      "pq_crypto": {},
      "randomness": {},
      "side_channel_analysis": {},
      "standard_id": {
        "ISO": {
          "ISO/IEC 15408": 2,
          "ISO/IEC 18045": 2
        }
      },
      "symmetric_crypto": {},
      "technical_report_id": {},
      "tee_name": {},
      "tls_cipher_suite": {},
      "vendor": {
        "Qualcomm": {
          "Qualcomm": 2
        }
      },
      "vulnerability": {}
    },
    "cert_metadata": {
      "/Author": "Bundesamt f\u00fcr Sicherheit in der Informationstechnik",
      "/Subject": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
      "/Title": "Certification Report BSI-DSZ-CC-1045-V2-2023",
      "pdf_file_size_bytes": 289421,
      "pdf_hyperlinks": {
        "_type": "Set",
        "elements": []
      },
      "pdf_is_encrypted": false,
      "pdf_number_of_pages": 1
    },
    "report_filename": "1045V2a_pdf.pdf",
    "report_frontpage": {
      "DE": {
        "cc_security_level": "Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2",
        "cc_version": "PP conformant plus product specific extensions Common Criteria Part 2 extended",
        "cert_id": "BSI-DSZ-CC-1045-V2-2023",
        "cert_item": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
        "cert_lab": "BSI",
        "developer": "Qualcomm Technologies Inc",
        "match_rules": [
          "(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)"
        ],
        "ref_protection_profiles": "Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014"
      }
    },
    "report_keywords": {
      "asymmetric_crypto": {
        "ECC": {
          "ECC": {
            "ECC": 4
          },
          "ECDH": {
            "ECDH": 1
          },
          "ECDSA": {
            "ECDSA": 1
          }
        }
      },
      "cc_cert_id": {
        "DE": {
          "BSI-DSZ-CC-1045-2019": 3,
          "BSI-DSZ-CC-1045-V2-2023": 17
        }
      },
      "cc_claims": {
        "O": {
          "O.C": 4
        },
        "R": {
          "R.O": 4
        }
      },
      "cc_protection_profile_id": {
        "BSI": {
          "BSI-CC-PP-0084-2014": 4
        }
      },
      "cc_sar": {
        "ALC": {
          "ALC_CMC.4": 1,
          "ALC_CMS.4": 1,
          "ALC_DEL": 1,
          "ALC_DEL.1": 1,
          "ALC_DVS": 1,
          "ALC_DVS.2": 5,
          "ALC_FLR": 1,
          "ALC_LCD.1": 1,
          "ALC_TAT.1": 1
        },
        "ATE": {
          "ATE_FUN": 1,
          "ATE_IND": 1
        },
        "AVA": {
          "AVA_VAN": 1,
          "AVA_VAN.5": 4
        }
      },
      "cc_security_level": {
        "EAL": {
          "EAL 1": 1,
          "EAL 2": 3,
          "EAL 4": 5,
          "EAL 4 augmented": 3,
          "EAL 5": 4,
          "EAL 5+": 1,
          "EAL 6": 1
        }
      },
      "cc_sfr": {},
      "certification_process": {
        "ConfidentialDocument": {
          "04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm": 1,
          "Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI": 1,
          "Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware": 1,
          "Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification": 1,
          "Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance": 1,
          "Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -": 1,
          "TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt": 1,
          "Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January": 1,
          "being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification": 1,
          "for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965": 1,
          "list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List": 1,
          "of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document": 1,
          "process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications": 1,
          "txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the": 1,
          "txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of": 1,
          "v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0": 1
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