Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
CSV information ?
Status | active |
---|---|
Valid from | 03.03.2023 |
Valid until | 03.03.2028 |
Scheme | 🇩🇪 DE |
Manufacturer | Qualcomm Technologies Inc. |
Category | Other Devices and Systems |
Security level | AVA_VAN.5, EAL4+, ALC_DVS.2 |
Protection profiles |
Heuristics summary ?
Certificate ?
Extracted keywords
Vendor
QualcommSecurity level
EAL 4, EAL 5, EAL 2, EAL 4 augmentedSecurity Assurance Requirements (SAR)
ALC_DVS.2, AVA_VAN.5Protection profiles
BSI-CC-PP-0084-2014Certificates
BSI-DSZ-CC-1045-V2-2023Standards
ISO/IEC 15408, ISO/IEC 18045File metadata
Title | Certification Report BSI-DSZ-CC-1045-V2-2023 |
---|---|
Subject | Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 |
Author | Bundesamt für Sicherheit in der Informationstechnik |
Pages | 1 |
Certification report ?
Extracted keywords
Symmetric Algorithms
AES, DES, TDES, HMAC, HMAC-SHA-384, CMACAsymmetric Algorithms
ECDH, ECDSA, ECCHash functions
SHA1, SHA-1, SHA-256, SHA-512, SHA-384Randomness
RNGElliptic Curves
P-192, P-224, P-256, P-384, P-521, NIST P-192, NIST P-224, NIST P-256, NIST P-384, NIST P-521Block cipher modes
ECB, CBC, CTR, CCMVendor
QualcommSecurity level
EAL 4, EAL 5, EAL 2, EAL 1, EAL 5+, EAL 6, EAL 4 augmentedClaims
O.C, R.OSecurity Assurance Requirements (SAR)
ALC_DVS.2, ALC_FLR, ALC_DEL, ALC_DVS, ALC_CMC.4, ALC_CMS.4, ALC_DEL.1, ALC_LCD.1, ALC_TAT.1, ATE_FUN, ATE_IND, AVA_VAN.5, AVA_VANProtection profiles
BSI-CC-PP-0084-2014Certificates
BSI-DSZ-CC-1045-V2-2023, BSI-DSZ-CC-1045-2019Evaluation facilities
atsec, Deutsche Telekom SecuritySide-channel analysis
physical probing, Side-channel, fault injection, JILCertification process
being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification, Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -, Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January, Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI, for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965, Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance, v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0, 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm, Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification, of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document, Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware, process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications, txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of, TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt, list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List, txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For theStandards
FIPS 186-4, FIPS 197, FIPS 180-4, FIPS46-3, FIPS198-1, FIPS 198-1, FIPS186-4, PKCS#1, AIS 31, AIS 26, AIS 34, AIS 25, AIS 37, AIS 36, AIS 35, AIS 20, AIS 32, AIS 38, RFC3447, ISO/IEC 15408, ISO/IEC 18045, ISO/IEC 17065Technical reports
BSI TR-02102, BSI 7148File metadata
Title | Certification Report BSI-DSZ-CC-1045-V2-2023 |
---|---|
Subject | BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230 |
Keywords | "BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230" |
Author | Bundesamt für Sicherheit in der Informationstechnik |
Pages | 29 |
Frontpage
Certificate ID | BSI-DSZ-CC-1045-V2-2023 |
---|---|
Certified item | Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 |
Certification lab | BSI |
Developer | Qualcomm Technologies Inc |
References
Outgoing- BSI-DSZ-CC-1045-2019 - archived - Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
Security target ?
Extracted keywords
Symmetric Algorithms
AES, AES-256, TDES, Triple-DES, TDEA, HMAC, HMAC-SHA-384, CMACAsymmetric Algorithms
ECDH, ECDSA, ECC, Diffie-HellmanHash functions
SHA-1, SHA1, SHA-256, SHA-384, SHA-512Schemes
MACRandomness
DRBG, RND, RNGElliptic Curves
P-192, P-224, P-256, P-384, P-521, NIST P-192, NIST P-224, NIST P-256, NIST P-384, NIST P-521Block cipher modes
ECB, CBC, CTR, CCMTrusted Execution Environments
ARM TrustZoneVendor
QualcommSecurity level
EAL4, EAL4 augmentedClaims
O.RND, O.AES, O.TDES, O.SHA, O.RSA_SIGN, O.RSA_ENC, O.ECDSA, O.ECDH, O.HMAC, O.CMAC, O.KDF, T.RND, T.CONFID-TSF-CODE, T.CONFID-APPLI-, T.CONFID-TSF-DATA, T.INTEG-APPLI-, T.INTEG-TSF-CODE, T.INTEG-APPLI-DATA, T.INTEG-TSF-DATA, T.AUTH-TSF-DATA, T.AUTH-APPLI-DATA, T.RBP-TSF-DATA, T.RBP-APPLI-DATA, T.CONFID-APPLI-DATA, T.INTEG-APPLI-CODE, T.INTEG-Security Assurance Requirements (SAR)
ALC_DEL, ALC_DVS, ALC_DVS.2, AVA_VAN.5Security Functional Requirements (SFR)
FAU_SAS.1, FAU_GEN, FAU_SAS.1.1, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP, FCS_COP.1, FCS_CKM, FCS_CKM.4, FCS_CKM.1, FCS_CKM.2, FCS_ITC.1, FCS_ITC.2, FDP_SDA, FDP_SDA.1, FDP_SDR, FDP_SDR.1, FDP_SDC.1, FDP_SDI, FDP_SDA.1.1, FDP_SDR.1.1, FDP_SDC.1.1, FDP_SDI.2, FDP_SDI.2.1, FDP_SDI.2.2, FDP_ITT.1, FDP_ITT.1.1, FDP_IFC.1, FDP_IFC.1.1, FDP_IFF.1, FDP_ITC.1, FDP_ITC.1.1, FDP_ITC.1.2, FDP_ITC.1.3, FDP_ACC.2, FDP_ACC.2.1, FDP_ACC.2.2, FDP_ACF.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_RIP, FDP_RIP.1, FDP_ACC, FDP_ACF, FDP_ACC.1, FDP_ICT.1, FMT_CMT, FMT_CMT.1, FMT_LIM.1, FMT_LIM.2, FMT_CMT.1.1, FMT_LIM.1.1, FMT_LIM.2.1, FMT_MSA.3, FMT_MSA, FMT_MSA.1, FMT_SMR.1, FPT_FLS.1, FPT_FLS.1.1, FPT_PHP.3, FPT_PHP.3.1, FPT_ITT.1, FPT_ITT.1.1, FRU_FLT.2, FRU_FLT.2.1Protection profiles
BSI-CC-PP-0084-2014Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, side channels, Side-channel, side channel, side-channel, Malfunction, malfunction, DFA, fault injection, cold bootStandards
FIPS PUB 198-1, FIPS PUB 180-4, FIPS PUB 197, FIPS 198-1, FIPS 180-4, FIPS PUB 186-4, FIPS 186-4, FIPS 197, FIPS46-3, FIPS198-1, FIPS186-4, NIST SP 800-108, NIST SP 800-67, NIST SP 800-38A, NIST SP 800-38C, NIST SP 800-38B, NIST SP 800-56A, NIST SP 800-90A, PKCS#1, RFC5639, RFC3447, CCMB-2017-04-001, CCMB-2017-04-002, CCMB-2017-04-003File metadata
Title | Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite |
---|---|
Subject | 80-NU430-6 Rev.H |
Keywords | integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230 |
Author | QTI |
Pages | 61 |
Heuristics ?
Extracted SARs
ALC_TAT.1, ALC_LCD.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_CMC.4, ALC_DVS.2Similar certificates
Scheme data ?
Cert Id | BSI-DSZ-CC-1045-V2-2023 | |
---|---|---|
Product | Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 | |
Vendor | Qualcomm Technologies Inc. | |
Certification Date | 03.03.2023 | |
Category | System on a chip (SOC) | |
Url | https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html | |
Enhanced | ||
Product | Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 | |
Applicant | Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA | |
Evaluation Facility | T-Systems International GmbH atsec information security GmbH | |
Assurance Level | EAL4+; ALC_DVS.2, AVA_VAN.5 | |
Protection Profile | Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014 | |
Certification Date | 03.03.2023 | |
Expiration Date | 02.03.2028 | |
Entries | [frozendict({'id': 'BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028)\nZertifizierungsreport / Certification Report\nSicherheitsvorgaben / Security Target\nZertifikat / Certificate', 'description': 'has been extended by additional cryptographic functions.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})] | |
Report Link | https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2 | |
Target Link | https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2 | |
Cert Link | https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2 | |
Description | The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data. |
References ?
Updates ?
-
17.10.2024 The certificate data changed.
Certificate changed
The Protection Profiles of the certificate were updated.
- The new value is
{'_type': 'Set', 'elements': [{'_type': 'sec_certs.sample.protection_profile.ProtectionProfile', 'pp_name': 'Security IC Platform Protection Profile with Augmentation Packages', 'pp_eal': 'EAL4+', 'pp_link': 'https://www.commoncriteriaportal.org/files/ppfiles/pp0084b_pdf.pdf', 'pp_ids': {'_type': 'Set', 'elements': ['JAVA_OC', 'SECURITY_IC_AUGP_V1.0', 'BAROC_SC_PP_V1.0']}}]}
.
- The new value is
-
22.08.2024 The certificate data changed.
Certificate changed
The state of the certificate object was updated.
- The report property was updated, with the
{'download_ok': True, 'convert_ok': True, 'extract_ok': True, 'pdf_hash': 'fe539cd32abddd009a309e4fb1ab93e7eb67868d6f74745b9b0aaf252b7e139b', 'txt_hash': '7e6cd0fb84c1747d2ec5944d35e3b0255d314af2b19a2de2eb3931871b67d801'}
data. - The st property was updated, with the
{'download_ok': True, 'convert_ok': True, 'extract_ok': True, 'pdf_hash': '973569ccf4bb09961a356874a2380d56f7789bc2ee757e7957425967a09b1079', 'txt_hash': '36a03aa8ef2a12b2ccb22b7b2df7732658d8919d738b29e77c6a9885e9f53d9d'}
data. - The cert property was updated, with the
{'download_ok': True, 'convert_ok': True, 'extract_ok': True, 'pdf_hash': '515909c4e8f0a63a6f66236bd8202a91d6abdda5f9e1008e2e9b766172002c57', 'txt_hash': 'b6968a9484f792a95df13d19cad6cbc60607cd6985e5626d808bbe2e1b67b6e9'}
data.
The PDF extraction data was updated.
- The report_metadata property was set to
{'pdf_file_size_bytes': 641231, 'pdf_is_encrypted': False, 'pdf_number_of_pages': 29, '/Author': 'Bundesamt für Sicherheit in der Informationstechnik', '/Keywords': '"BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230"', '/Subject': 'BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230', '/Title': 'Certification Report BSI-DSZ-CC-1045-V2-2023', 'pdf_hyperlinks': {'_type': 'Set', 'elements': ['http://www.commoncriteriaportal.org/cc/', 'https://www.bsi.bund.de/AIS', 'http://www.commoncriteriaportal.org/', 'https://www.bsi.bund.de/zertifizierungsreporte', 'https://www.sogis.eu/', 'https://www.bsi.bund.de/', 'https://www.bsi.bund.de/zertifizierung']}}
. - The st_metadata property was set to
{'pdf_file_size_bytes': 824155, 'pdf_is_encrypted': False, 'pdf_number_of_pages': 61, '/Author': 'QTI', '/Keywords': 'integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230', '/Subject': '80-NU430-6 Rev.H', '/Title': 'Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite', 'pdf_hyperlinks': {'_type': 'Set', 'elements': ['https://createpoint.qti.qualcomm.com/', 'mailto:[email protected]']}}
. - The cert_metadata property was set to
{'pdf_file_size_bytes': 289421, 'pdf_is_encrypted': False, 'pdf_number_of_pages': 1, '/Author': 'Bundesamt für Sicherheit in der Informationstechnik', '/Subject': 'Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100', '/Title': 'Certification Report BSI-DSZ-CC-1045-V2-2023', 'pdf_hyperlinks': {'_type': 'Set', 'elements': []}}
. - The report_frontpage property was set to
{'DE': {'match_rules': ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)'], 'cert_id': 'BSI-DSZ-CC-1045-V2-2023', 'cert_item': 'Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100', 'developer': 'Qualcomm Technologies Inc', 'cert_lab': 'BSI', 'ref_protection_profiles': 'Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014', 'cc_version': 'PP conformant plus product specific extensions Common Criteria Part 2 extended', 'cc_security_level': 'Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2'}}
. - The report_keywords property was set to
{'cc_cert_id': {'DE': {'BSI-DSZ-CC-1045-V2-2023': 17, 'BSI-DSZ-CC-1045-2019': 3}}, 'cc_protection_profile_id': {'BSI': {'BSI-CC-PP-0084-2014': 4}}, 'cc_security_level': {'EAL': {'EAL 4': 5, 'EAL 5': 4, 'EAL 2': 3, 'EAL 1': 1, 'EAL 5+': 1, 'EAL 6': 1, 'EAL 4 augmented': 3}}, 'cc_sar': {'ALC': {'ALC_DVS.2': 5, 'ALC_FLR': 1, 'ALC_DEL': 1, 'ALC_DVS': 1, 'ALC_CMC.4': 1, 'ALC_CMS.4': 1, 'ALC_DEL.1': 1, 'ALC_LCD.1': 1, 'ALC_TAT.1': 1}, 'ATE': {'ATE_FUN': 1, 'ATE_IND': 1}, 'AVA': {'AVA_VAN.5': 4, 'AVA_VAN': 1}}, 'cc_sfr': {}, 'cc_claims': {'O': {'O.C': 4}, 'R': {'R.O': 4}}, 'vendor': {'Qualcomm': {'Qualcomm': 38}}, 'eval_facility': {'atsec': {'atsec': 2}, 'DeutscheTelekom': {'Deutsche Telekom Security': 3}}, 'symmetric_crypto': {'AES_competition': {'AES': {'AES': 6}}, 'DES': {'DES': {'DES': 1}, '3DES': {'TDES': 3}}, 'constructions': {'MAC': {'HMAC': 1, 'HMAC-SHA-384': 1, 'CMAC': 2}}}, 'asymmetric_crypto': {'ECC': {'ECDH': {'ECDH': 1}, 'ECDSA': {'ECDSA': 1}, 'ECC': {'ECC': 4}}}, 'pq_crypto': {}, 'hash_function': {'SHA': {'SHA1': {'SHA1': 1, 'SHA-1': 2}, 'SHA2': {'SHA-256': 6, 'SHA-512': 2, 'SHA-384': 2}}}, 'crypto_scheme': {}, 'crypto_protocol': {}, 'randomness': {'RNG': {'RNG': 2}}, 'cipher_mode': {'ECB': {'ECB': 2}, 'CBC': {'CBC': 2}, 'CTR': {'CTR': 1}, 'CCM': {'CCM': 1}}, 'ecc_curve': {'NIST': {'P-192': 2, 'P-224': 2, 'P-256': 2, 'P-384': 2, 'P-521': 2, 'NIST P-192': 2, 'NIST P-224': 2, 'NIST P-256': 2, 'NIST P-384': 2, 'NIST P-521': 2}}, 'crypto_engine': {}, 'tls_cipher_suite': {}, 'crypto_library': {}, 'vulnerability': {}, 'side_channel_analysis': {'SCA': {'physical probing': 1, 'Side-channel': 1}, 'FI': {'fault injection': 1}, 'other': {'JIL': 3}}, 'technical_report_id': {'BSI': {'BSI TR-02102': 1, 'BSI 7148': 1}}, 'device_model': {}, 'tee_name': {}, 'os_name': {}, 'cplc_data': {}, 'ic_data_group': {}, 'standard_id': {'FIPS': {'FIPS 186-4': 3, 'FIPS 197': 5, 'FIPS 180-4': 2, 'FIPS46-3': 1, 'FIPS198-1': 1, 'FIPS 198-1': 1, 'FIPS186-4': 2}, 'PKCS': {'PKCS#1': 3}, 'BSI': {'AIS 31': 3, 'AIS 26': 3, 'AIS 34': 2, 'AIS 25': 2, 'AIS 37': 1, 'AIS 36': 1, 'AIS 35': 2, 'AIS 20': 1, 'AIS 32': 1, 'AIS 38': 1}, 'RFC': {'RFC3447': 3}, 'ISO': {'ISO/IEC 15408': 4, 'ISO/IEC 18045': 4, 'ISO/IEC 17065': 2}}, 'javacard_version': {}, 'javacard_api_const': {}, 'javacard_packages': {}, 'certification_process': {'ConfidentialDocument': {'being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification': 1, 'Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -': 1, 'Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January': 1, 'Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI': 1, 'for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965': 1, 'Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance': 1, 'v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0': 1, '04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm': 1, 'Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification': 1, 'of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document': 1, 'Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware': 1, 'process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications': 1, 'txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of': 1, 'TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt': 1, 'list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List': 1, 'txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the': 1}}}
. - The st_keywords property was set to
{'cc_cert_id': {}, 'cc_protection_profile_id': {'BSI': {'BSI-CC-PP-0084-2014': 3}}, 'cc_security_level': {'EAL': {'EAL4': 1, 'EAL4 augmented': 1}}, 'cc_sar': {'ALC': {'ALC_DEL': 1, 'ALC_DVS': 1, 'ALC_DVS.2': 1}, 'AVA': {'AVA_VAN.5': 1}}, 'cc_sfr': {'FAU': {'FAU_SAS.1': 4, 'FAU_GEN': 1, 'FAU_SAS.1.1': 1}, 'FCS': {'FCS_RNG.1': 3, 'FCS_RNG.1.1': 1, 'FCS_RNG.1.2': 1, 'FCS_COP': 49, 'FCS_COP.1': 12, 'FCS_CKM': 62, 'FCS_CKM.4': 16, 'FCS_CKM.1': 16, 'FCS_CKM.2': 3, 'FCS_ITC.1': 13, 'FCS_ITC.2': 13}, 'FDP': {'FDP_SDA': 3, 'FDP_SDA.1': 12, 'FDP_SDR': 3, 'FDP_SDR.1': 12, 'FDP_SDC.1': 11, 'FDP_SDI': 2, 'FDP_SDA.1.1': 2, 'FDP_SDR.1.1': 2, 'FDP_SDC.1.1': 2, 'FDP_SDI.2': 18, 'FDP_SDI.2.1': 3, 'FDP_SDI.2.2': 3, 'FDP_ITT.1': 3, 'FDP_ITT.1.1': 1, 'FDP_IFC.1': 5, 'FDP_IFC.1.1': 2, 'FDP_IFF.1': 1, 'FDP_ITC.1': 8, 'FDP_ITC.1.1': 1, 'FDP_ITC.1.2': 1, 'FDP_ITC.1.3': 1, 'FDP_ACC.2': 3, 'FDP_ACC.2.1': 1, 'FDP_ACC.2.2': 1, 'FDP_ACF.1': 4, 'FDP_ACF.1.1': 1, 'FDP_ACF.1.2': 1, 'FDP_ACF.1.3': 1, 'FDP_ACF.1.4': 1, 'FDP_RIP': 10, 'FDP_RIP.1': 2, 'FDP_ACC': 4, 'FDP_ACF': 3, 'FDP_ACC.1': 2, 'FDP_ICT.1': 1}, 'FMT': {'FMT_CMT': 2, 'FMT_CMT.1': 35, 'FMT_LIM.1': 5, 'FMT_LIM.2': 5, 'FMT_CMT.1.1': 7, 'FMT_LIM.1.1': 1, 'FMT_LIM.2.1': 1, 'FMT_MSA.3': 7, 'FMT_MSA': 5, 'FMT_MSA.1': 2, 'FMT_SMR.1': 1}, 'FPT': {'FPT_FLS.1': 5, 'FPT_FLS.1.1': 1, 'FPT_PHP.3': 3, 'FPT_PHP.3.1': 1, 'FPT_ITT.1': 3, 'FPT_ITT.1.1': 1}, 'FRU': {'FRU_FLT.2': 4, 'FRU_FLT.2.1': 1}}, 'cc_claims': {'O': {'O.RND': 1, 'O.AES': 3, 'O.TDES': 3, 'O.SHA': 3, 'O.RSA_SIGN': 4, 'O.RSA_ENC': 4, 'O.ECDSA': 4, 'O.ECDH': 4, 'O.HMAC': 4, 'O.CMAC': 4, 'O.KDF': 4}, 'T': {'T.RND': 1, 'T.CONFID-TSF-CODE': 3, 'T.CONFID-APPLI-': 1, 'T.CONFID-TSF-DATA': 4, 'T.INTEG-APPLI-': 1, 'T.INTEG-TSF-CODE': 3, 'T.INTEG-APPLI-DATA': 5, 'T.INTEG-TSF-DATA': 3, 'T.AUTH-TSF-DATA': 3, 'T.AUTH-APPLI-DATA': 3, 'T.RBP-TSF-DATA': 3, 'T.RBP-APPLI-DATA': 3, 'T.CONFID-APPLI-DATA': 4, 'T.INTEG-APPLI-CODE': 2, 'T.INTEG-': 1}}, 'vendor': {'Qualcomm': {'Qualcomm': 22}}, 'eval_facility': {}, 'symmetric_crypto': {'AES_competition': {'AES': {'AES': 32, 'AES-256': 1}}, 'DES': {'3DES': {'TDES': 25, 'Triple-DES': 3, 'TDEA': 1}}, 'constructions': {'MAC': {'HMAC': 25, 'HMAC-SHA-384': 1, 'CMAC': 16}}}, 'asymmetric_crypto': {'ECC': {'ECDH': {'ECDH': 11}, 'ECDSA': {'ECDSA': 11}, 'ECC': {'ECC': 9}}, 'FF': {'DH': {'Diffie-Hellman': 2}}}, 'pq_crypto': {}, 'hash_function': {'SHA': {'SHA1': {'SHA-1': 10, 'SHA1': 1}, 'SHA2': {'SHA-256': 15, 'SHA-384': 8, 'SHA-512': 8}}}, 'crypto_scheme': {'MAC': {'MAC': 1}}, 'crypto_protocol': {}, 'randomness': {'PRNG': {'DRBG': 1}, 'RNG': {'RND': 2, 'RNG': 17}}, 'cipher_mode': {'ECB': {'ECB': 4}, 'CBC': {'CBC': 4}, 'CTR': {'CTR': 2}, 'CCM': {'CCM': 4}}, 'ecc_curve': {'NIST': {'P-192': 13, 'P-224': 16, 'P-256': 12, 'P-384': 14, 'P-521': 16, 'NIST P-192': 5, 'NIST P-224': 2, 'NIST P-256': 2, 'NIST P-384': 2, 'NIST P-521': 2}}, 'crypto_engine': {}, 'tls_cipher_suite': {}, 'crypto_library': {}, 'vulnerability': {}, 'side_channel_analysis': {'SCA': {'Leak-Inherent': 3, 'Physical Probing': 2, 'physical probing': 4, 'side channels': 1, 'Side-channel': 1, 'side channel': 4, 'side-channel': 2}, 'FI': {'Malfunction': 3, 'malfunction': 3, 'DFA': 4, 'fault injection': 2}, 'other': {'cold boot': 4}}, 'technical_report_id': {}, 'device_model': {}, 'tee_name': {'ARM': {'ARM TrustZone': 1}}, 'os_name': {}, 'cplc_data': {}, 'ic_data_group': {}, 'standard_id': {'FIPS': {'FIPS PUB 198-1': 3, 'FIPS PUB 180-4': 4, 'FIPS PUB 197': 3, 'FIPS 198-1': 2, 'FIPS 180-4': 3, 'FIPS PUB 186-4': 5, 'FIPS 186-4': 4, 'FIPS 197': 5, 'FIPS46-3': 1, 'FIPS198-1': 1, 'FIPS186-4': 2}, 'NIST': {'NIST SP 800-108': 3, 'NIST SP 800-67': 1, 'NIST SP 800-38A': 3, 'NIST SP 800-38C': 1, 'NIST SP 800-38B': 2, 'NIST SP 800-56A': 1, 'NIST SP 800-90A': 1}, 'PKCS': {'PKCS#1': 7}, 'RFC': {'RFC5639': 3, 'RFC3447': 3}, 'CC': {'CCMB-2017-04-001': 1, 'CCMB-2017-04-002': 1, 'CCMB-2017-04-003': 1}}, 'javacard_version': {}, 'javacard_api_const': {}, 'javacard_packages': {}, 'certification_process': {}}
. - The cert_keywords property was set to
{'cc_cert_id': {'DE': {'BSI-DSZ-CC-1045-V2-2023': 1}}, 'cc_protection_profile_id': {'BSI': {'BSI-CC-PP-0084-2014': 1}}, 'cc_security_level': {'EAL': {'EAL 4': 1, 'EAL 5': 1, 'EAL 2': 1, 'EAL 4 augmented': 1}}, 'cc_sar': {'ALC': {'ALC_DVS.2': 1}, 'AVA': {'AVA_VAN.5': 1}}, 'cc_sfr': {}, 'cc_claims': {}, 'vendor': {'Qualcomm': {'Qualcomm': 2}}, 'eval_facility': {}, 'symmetric_crypto': {}, 'asymmetric_crypto': {}, 'pq_crypto': {}, 'hash_function': {}, 'crypto_scheme': {}, 'crypto_protocol': {}, 'randomness': {}, 'cipher_mode': {}, 'ecc_curve': {}, 'crypto_engine': {}, 'tls_cipher_suite': {}, 'crypto_library': {}, 'vulnerability': {}, 'side_channel_analysis': {}, 'technical_report_id': {}, 'device_model': {}, 'tee_name': {}, 'os_name': {}, 'cplc_data': {}, 'ic_data_group': {}, 'standard_id': {'ISO': {'ISO/IEC 15408': 2, 'ISO/IEC 18045': 2}}, 'javacard_version': {}, 'javacard_api_const': {}, 'javacard_packages': {}, 'certification_process': {}}
. - The report_filename property was set to
1045V2a_pdf.pdf
. - The st_filename property was set to
1045V2b_pdf.pdf
. - The cert_filename property was set to
1045V2c_pdf.pdf
.
The computed heuristics were updated.
- The cert_lab property was set to
['BSI']
. - The cert_id property was set to
BSI-DSZ-CC-1045-V2-2023
. - The report_references property was updated, with the
{'directly_referencing': {'_type': 'Set', 'elements': ['BSI-DSZ-CC-1045-2019']}, 'indirectly_referencing': {'_type': 'Set', 'elements': ['BSI-DSZ-CC-1045-2019']}}
data. - The extracted_sars property was updated, with the
{'_type': 'Set', 'elements': [{'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_TAT', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_LCD', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMS', 'level': 4}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_DEL', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMC', 'level': 4}]}
values added.
- The report property was updated, with the
-
17.08.2024 The certificate data changed.
Certificate changed
The report_link was updated.
- The new value is
https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf
.
The st_link was updated.
- The new value is
https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf
.
The state of the certificate object was updated.
- The report property was updated, with the
{'download_ok': False, 'convert_ok': False, 'extract_ok': False, 'pdf_hash': None, 'txt_hash': None}
data. - The cert property was updated, with the
{'download_ok': False, 'convert_ok': False, 'extract_ok': False, 'pdf_hash': None, 'txt_hash': None}
data.
The PDF extraction data was updated.
- The report_metadata property was set to
None
. - The cert_metadata property was set to
None
. - The report_frontpage property was set to
None
. - The report_keywords property was set to
None
. - The cert_keywords property was set to
None
. - The report_filename property was set to
None
. - The cert_filename property was set to
None
.
The computed heuristics were updated.
- The cert_lab property was set to
None
. - The cert_id property was set to
None
. - The report_references property was updated, with the
{'directly_referencing': None, 'indirectly_referencing': None}
data. - The extracted_sars property was updated, with the
{'_type': 'Set', 'elements': [{'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_TAT', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_LCD', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMS', 'level': 4}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_DEL', 'level': 1}, {'_type': 'sec_certs.sample.sar.SAR', 'family': 'ALC_CMC', 'level': 4}]}
values discarded.
- The new value is
-
12.08.2024 The certificate data changed.
Certificate changed
The state of the certificate object was updated.
- The st property was updated, with the
{'download_ok': False, 'convert_ok': False, 'extract_ok': False, 'pdf_hash': None, 'txt_hash': None}
data.
The PDF extraction data was updated.
- The st_metadata property was set to
None
. - The st_keywords property was set to
None
. - The st_filename property was set to
None
.
- The st property was updated, with the
-
23.07.2024 The certificate was first processed.
New certificate
A new Common Criteria certificate with the product name Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 was processed.
Raw data
{
"_type": "sec_certs.sample.cc.CCCertificate",
"category": "Other Devices and Systems",
"cert_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf",
"dgst": "ac18c15a88b4b1bd",
"heuristics": {
"_type": "sec_certs.sample.cc.CCCertificate.Heuristics",
"annotated_references": null,
"cert_id": "BSI-DSZ-CC-1045-V2-2023",
"cert_lab": [
"BSI"
],
"cpe_matches": null,
"direct_transitive_cves": null,
"extracted_sars": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_LCD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMS",
"level": 4
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DEL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMC",
"level": 4
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_TAT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AVA_VAN",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DVS",
"level": 2
}
]
},
"extracted_versions": {
"_type": "Set",
"elements": [
"1.1.2"
]
},
"indirect_transitive_cves": null,
"related_cves": null,
"report_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": null,
"directly_referencing": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-1045-2019"
]
},
"indirectly_referenced_by": null,
"indirectly_referencing": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-1045-2019"
]
}
},
"scheme_data": {
"category": "System on a chip (SOC)",
"cert_id": "BSI-DSZ-CC-1045-V2-2023",
"certification_date": "03.03.2023",
"enhanced": {
"applicant": "Qualcomm Technologies Inc.\n5775 Morehouse drive \nSan Diego, CA 92121\nUSA",
"assurance_level": "EAL4+; ALC_DVS.2, AVA_VAN.5",
"cert_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile\u0026v=2",
"certification_date": "03.03.2023",
"description": "The TOE is the \u201cQualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.",
"entries": [
{
"description": "has been extended by additional cryptographic functions.",
"id": "BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, g\u00fcltig bis / valid until 02.03.2028)\nZertifizierungsreport / Certification Report\nSicherheitsvorgaben / Security Target\nZertifikat / Certificate"
},
{
"description": "Certificate",
"id": "BSI"
}
],
"evaluation_facility": "T-Systems International GmbH\natsec information security GmbH",
"expiration_date": "02.03.2028",
"product": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
"protection_profile": "Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014",
"report_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile\u0026v=2",
"target_link": "https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile\u0026v=2"
},
"product": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
"url": "https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html",
"vendor": "Qualcomm Technologies Inc."
},
"st_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": null,
"directly_referencing": null,
"indirectly_referenced_by": null,
"indirectly_referencing": null
},
"verified_cpe_matches": null
},
"maintenance_updates": {
"_type": "Set",
"elements": []
},
"manufacturer": "Qualcomm Technologies Inc.",
"manufacturer_web": "https://www.qualcomm.com",
"name": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
"not_valid_after": "2028-03-03",
"not_valid_before": "2023-03-03",
"pdf_data": {
"_type": "sec_certs.sample.cc.CCCertificate.PdfData",
"cert_filename": "1045V2c_pdf.pdf",
"cert_frontpage": null,
"cert_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {
"DE": {
"BSI-DSZ-CC-1045-V2-2023": 1
}
},
"cc_claims": {},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP-0084-2014": 1
}
},
"cc_sar": {
"ALC": {
"ALC_DVS.2": 1
},
"AVA": {
"AVA_VAN.5": 1
}
},
"cc_security_level": {
"EAL": {
"EAL 2": 1,
"EAL 4": 1,
"EAL 4 augmented": 1,
"EAL 5": 1
}
},
"cc_sfr": {},
"certification_process": {},
"cipher_mode": {},
"cplc_data": {},
"crypto_engine": {},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {},
"side_channel_analysis": {},
"standard_id": {
"ISO": {
"ISO/IEC 15408": 2,
"ISO/IEC 18045": 2
}
},
"symmetric_crypto": {},
"technical_report_id": {},
"tee_name": {},
"tls_cipher_suite": {},
"vendor": {
"Qualcomm": {
"Qualcomm": 2
}
},
"vulnerability": {}
},
"cert_metadata": {
"/Author": "Bundesamt f\u00fcr Sicherheit in der Informationstechnik",
"/Subject": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
"/Title": "Certification Report BSI-DSZ-CC-1045-V2-2023",
"pdf_file_size_bytes": 289421,
"pdf_hyperlinks": {
"_type": "Set",
"elements": []
},
"pdf_is_encrypted": false,
"pdf_number_of_pages": 1
},
"report_filename": "1045V2a_pdf.pdf",
"report_frontpage": {
"DE": {
"cc_security_level": "Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2",
"cc_version": "PP conformant plus product specific extensions Common Criteria Part 2 extended",
"cert_id": "BSI-DSZ-CC-1045-V2-2023",
"cert_item": "Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100",
"cert_lab": "BSI",
"developer": "Qualcomm Technologies Inc",
"match_rules": [
"(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)"
],
"ref_protection_profiles": "Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014"
}
},
"report_keywords": {
"asymmetric_crypto": {
"ECC": {
"ECC": {
"ECC": 4
},
"ECDH": {
"ECDH": 1
},
"ECDSA": {
"ECDSA": 1
}
}
},
"cc_cert_id": {
"DE": {
"BSI-DSZ-CC-1045-2019": 3,
"BSI-DSZ-CC-1045-V2-2023": 17
}
},
"cc_claims": {
"O": {
"O.C": 4
},
"R": {
"R.O": 4
}
},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP-0084-2014": 4
}
},
"cc_sar": {
"ALC": {
"ALC_CMC.4": 1,
"ALC_CMS.4": 1,
"ALC_DEL": 1,
"ALC_DEL.1": 1,
"ALC_DVS": 1,
"ALC_DVS.2": 5,
"ALC_FLR": 1,
"ALC_LCD.1": 1,
"ALC_TAT.1": 1
},
"ATE": {
"ATE_FUN": 1,
"ATE_IND": 1
},
"AVA": {
"AVA_VAN": 1,
"AVA_VAN.5": 4
}
},
"cc_security_level": {
"EAL": {
"EAL 1": 1,
"EAL 2": 3,
"EAL 4": 5,
"EAL 4 augmented": 3,
"EAL 5": 4,
"EAL 5+": 1,
"EAL 6": 1
}
},
"cc_sfr": {},
"certification_process": {
"ConfidentialDocument": {
"04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm": 1,
"Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI": 1,
"Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware": 1,
"Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification": 1,
"Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance": 1,
"Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -": 1,
"TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt": 1,
"Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January": 1,
"being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification": 1,
"for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965": 1,
"list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List": 1,
"of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document": 1,
"process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications": 1,
"txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the": 1,
"txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of": 1,
"v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0": 1
}
},
"cipher_mode": {
"CBC": {
"CBC": 2
},
"CCM": {
"CCM": 1
},
"CTR": {
"CTR": 1
},
"ECB": {
"ECB": 2
}
},
"cplc_data": {},
"crypto_engine": {},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {
"NIST": {
"NIST P-192": 2,
"NIST P-224": 2,
"NIST P-256": 2,
"NIST P-384": 2,
"NIST P-521": 2,
"P-192": 2,
"P-224": 2,
"P-256": 2,
"P-384": 2,
"P-521": 2
}
},
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