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Infineon smart card IC (Security Controller) IFX_CCI_000011h, 00001Bh, 00001Eh, 000025h, design step G12 with optional libraries CCL V02.00.0005, RSA2048/4096 V2.07.003, EC V2.07.003, Toolbox V2.07.003, HSL V2.01.6198, SCL V2.04.002 and with specific IC dedicated software
BSI-DSZ-CC-1025-2018 		NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
BSI-DSZ-CC-0978-V2-2017
name Infineon smart card IC (Security Controller) IFX_CCI_000011h, 00001Bh, 00001Eh, 000025h, design step G12 with optional libraries CCL V02.00.0005, RSA2048/4096 V2.07.003, EC V2.07.003, Toolbox V2.07.003, HSL V2.01.6198, SCL V2.04.002 and with specific IC dedicated software NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
not_valid_after 10.09.2023 27.09.2022
not_valid_before 10.09.2018 27.09.2017
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1025c_pdf.pdf None
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1025a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1025b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V2b_pdf.pdf
manufacturer Infineon Technologies AG NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity
manufacturer_web https://www.infineon.com/ https://www.nxp.com
security_level EAL6+, ALC_FLR.1 ASE_TSS.2, EAL6+, ALC_FLR.1
dgst f1edac1b03b47a24 5e878dec3caea712
heuristics/cert_id BSI-DSZ-CC-1025-2018 BSI-DSZ-CC-0978-V2-2017
heuristics/extracted_sars ASE_CCL.1, ALC_DEL.1, ADV_FSP.5, ALC_CMS.5, ALC_DVS.2, AVA_VAN.5, ALC_CMC.5, ATE_IND.2, ADV_ARC.1, ADV_IMP.2, ASE_TSS.1, ATE_FUN.2, ASE_SPD.1, ASE_REQ.2, AGD_OPE.1, ATE_COV.3, ALC_TAT.3, ASE_ECD.1, ADV_INT.3, ADV_SPM.1, ASE_INT.1, ADV_CMC.5, ADV_TDS.5, AGD_PRE.1, ALC_LCD.1, ATE_DPT.3, ALC_FLR.1, ASE_OBJ.2 ASE_CCL.1, ALC_DEL.1, ADV_FSP.5, ALC_CMS.5, ALC_DVS.2, AVA_VAN.5, ALC_CMC.5, ATE_IND.2, ADV_ARC.1, ADV_IMP.2, ATE_FUN.2, ASE_SPD.1, ASE_REQ.2, ASE_TSS.2, APE_INT.1, AGD_OPE.1, ATE_COV.3, APE_CCL.1, ALC_TAT.3, APE_REQ.2, APE_ECD.1, ASE_ECD.1, ADV_INT.3, ADV_SPM.1, ASE_INT.1, ADV_TDS.5, APE_OBJ.2, APE_SPD.1, AGD_PRE.1, ALC_LCD.1, ATE_DPT.3, ALC_FLR.1, ASE_OBJ.2
heuristics/extracted_versions 2.04.002, 2.01.6198, 02.00.0005, 2.07.003 -
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1025-V2-2019 BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-0809-V3-2017, BSI-DSZ-CC-0978-V3-2019
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0978-2016
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1025-V5-2023, BSI-DSZ-CC-1025-V4-2021, BSI-DSZ-CC-1025-V2-2019, BSI-DSZ-CC-1025-V3-2020 BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-0809-V3-2017, BSI-DSZ-CC-0978-V3-2019
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0978-2016
heuristics/st_references/directly_referenced_by {} BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-0809-V3-2017
heuristics/st_references/indirectly_referenced_by {} BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-0809-V3-2017
protection_profiles
pdf_data/cert_filename 1025c_pdf.pdf None
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1025-2018: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Infineon:
    • Infineon: 1
    • Infineon Technologies AG: 1
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20180927090415+02'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, SmartCard, EAL, Security Controller, Infineon"
  • /ModDate: D:20180927092157+02'00'
  • /Producer: LibreOffice 5.2
  • /Subject: Infineon smart card IC (Security Controller) IFX_CCI_000011h, 00001Bh, 00001Eh, 000025h, design step G12 with optional libraries CCL V02.00.0005, RSA2048/4096 V2.07.003, EC V2.07.003, Toolbox V2.07.003, HSL V2.01.6198, SCL V2.04.002 and with specific IC dedicated software
  • /Title: Certification Report BSI-DSZ-CC-1025-2018
  • pdf_file_size_bytes: 367795
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1025a_pdf.pdf 0978V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1025-2018
    • cert_item: Infineon smart card IC (Security Controller) IFX_CCI_000011h, 00001Bh, 00001Eh, 000025h, design step G12 with optional libraries CCL V02.00.0005, RSA2048/4096 V2.07.003, EC V2.07.003, Toolbox V2.07.003, HSL V2.01.6198, SCL V2.04.002 and with specific IC dedicated software
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2 and ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0978-V2-2017
    • cert_item: NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1025-2018: 22
  • DE:
    • BSI-DSZ-CC-0978-: 1
    • BSI-DSZ-CC-0978-2016: 2
    • BSI-DSZ-CC-0978-V2-2017: 21
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP- 0035-2007: 1
    • BSI-CC-PP-0035-2007: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 6: 4
    • EAL 6 augmented: 3
    • EAL5+: 1
    • EAL6: 1
  • EAL:
    • EAL 1: 7
    • EAL 2: 6
    • EAL 3: 4
    • EAL 4: 5
    • EAL 5: 9
    • EAL 5+: 1
    • EAL 6: 8
    • EAL 6 augmented: 3
    • EAL 7: 4
    • EAL5: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 1
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 1
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 2
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 4
    • ALC_FLR.1: 6
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 1
    • ALC_TAT.3: 2
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 5
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 1
    • ATE_DPT.4: 1
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 2
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 3
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 1
pdf_data/report_keywords/cc_sfr
  • FCS:
    • FCS_RNG: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 6
  • R:
    • R.O: 6
pdf_data/report_keywords/vendor
  • GD:
    • G&D: 2
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 10
    • Infineon Technologies: 1
    • Infineon Technologies AG: 21
  • NXP:
    • NXP: 35
    • NXP Semiconductors: 53
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 5
  • TUV:
    • TÜV Informationstechnik: 4
    • TÜViT: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 11
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 3
      • Triple-DES: 1
    • DES:
      • DES: 2
  • constructions:
    • MAC:
      • CBC-MAC: 2
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
      • Triple-DES: 5
    • DES:
      • DES: 4
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 3
  • RSA:
    • RSA2048: 1
    • RSA4096: 1
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • RNG:
    • RNG: 3
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CFB:
    • CFB: 2
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 16
pdf_data/report_keywords/side_channel_analysis
  • SCA:
    • physical probing: 1
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 20: 1
    • AIS 23: 1
    • AIS 25: 1
    • AIS 26: 1
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS31: 5
  • FIPS:
    • FIPS PUB 186-4: 1
    • FIPS186-4: 4
    • FIPS197: 2
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 25: 2
  • PKCS:
    • PKCS #1: 1
    • PKCS1: 2
  • RFC:
    • RFC 5639: 1
    • RFC5639: 2
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS31: 1
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • IFX_CCI_000011h IFX_CCI_00001Bh IFX_CCI_00001Eh IFX_CCI_000025h G12”, Infineon Technologies AG (confidential document) [7] Evaluation Technical Report Summary for BSI-DSZ-CC-1025-2018, Version 3, 2018-07-30: 1
    • Standards Compliance Verification”, Version 4, 2018-06-19, TÜV Informationstechnik GmbH (confidential document) [21] Configuration list for the TOE, Version 0.4, 2018-02-12, “Life Cycle Support IFX_CCI_11h: 1
    • TECHNICAL REPORT SUMMARY (ETR SUMMARY)”, TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • optional Software Libraries and Flash Loader according Package 1 and Package 2” (confidential document), Infineon Technologies AG 29 / 34 Certification Report BSI-DSZ-CC-1025-2018 [22] ARMv7-M: 1
    • “EVALUATION TECHNICAL REPORT FOR COMPOSITE EVALUATION (ETR COMP)”, TÜV Informationstechnik (confidential document) [11] 32-bit Security Controller – V07 Security Guidelines, v1.00-1813, 2018-04-27, Infineon: 1
  • OutOfScope:
    • n/a 1976 – 4096 (note: TOE supports larger and smaller key sizes, which are generally out of scope of evaluation in BSI scheme) Yes Table 4: TOE cryptographic functionality – RSA Key Gen For the: 1
    • Modulus length = 1976 – 4096 (note: TOE supports larger and smaller key sizes, which are generally out of scope of evaluation in BSI scheme) yes ECDSA signature generation [X962], [IEEE_P1363], [ISO_14888-3] Key: 1
    • note: TOE supports larger and smaller key sizes, which are generally out of scope of evaluation in BSI scheme: 2
    • out of scope: 2
  • ConfidentialDocument:
    • Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE, NXP Semiconductors, Version 2.62, 14 September 2017 (confidential document) [7] Evaluation Technical Report, NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE: 1
    • Document Number 2250** ,NXP Semiconductors, Version 3.2, 04 February 2013 (confidential document) [18] Product data sheet addendum: SmartMX2 family Chip Health Mode (CHM), NXP Semiconductors: 1
    • Document Number 2333**, NXP Semiconductors, Version 4.2, 24 June 2015 (confidential document) [20] Product data sheet SmartMX2 family P60N144 VA, Secure high-performance smart card controller: 1
    • NXP Semiconductors Document Number 1658**, NXP Semiconductors, Version 5.4, 14 August 2015 (confidential document) [14] Instruction Set for the SmartMX2 family, Secure smart card controller, NXP Semiconductors: 1
    • NXP Semiconductors, Document Number 1569**, NXP Semiconductors, Version 3.7, 21 May 2014 (confidential document) [17] Product data sheet addendum: SmartMX2 family Post Delivery Configuration (PDC), NXP: 1
    • Number 1478**, NXP Semiconductors, Version 3.1, 02 February 2012 (confidential document) [15] Information on Guidance and Operation, NXP Secure Smart Card Controller P60x080/144P VA/VE: 1
    • Number 2244**, NXP Semiconductors, Version 3.1, 01 October 2014 (confidential document) [19] Product data sheet addendum: SmartMX2 family Firmware Interface Specification (FIS), NXP: 1
    • Report Software, BSI-DSZ-CC-0978-V2, TÜV Informationstechnik GmbH, Version 2, 14 September 2017 (confidential document) [11] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Configuration List,NXP: 1
    • Semiconductors, Document Number 2408**, NXP Semiconductors, Version 3.2, 14 August 2014 (confidential document) [21] Product data sheet addendum: SmartMX2 family P60N144 VA/VE, Wafer and delivery specification: 1
    • Semiconductors, Document Number 2414**, NXP Semiconductors, Version 3.2, 06 June 2015 (confidential document) [22] Order Entry Form, P60C144, NXP Semiconductors, Version 3.2, 06 October 2015 [23] Order Entry: 1
    • Semiconductors, NXP Semiconductors, Version 2.8, 07 July 2017 (confidential document) [16] Product data sheet addendum: SmartMX2 family P60D080/144 VA/VE and P60C080/144 VA/VE: 1
    • Software, BSI-DSZ-CC-0978- V2, TÜV Informationstechnik GmbH, Version 2, 14 September 2017 (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [9: 1
    • Version 1.44, 14 September 2017 (confidential document) [13] Product data sheet SmartMX2 family P60x080/144 VA/VE, Secure high- performance smart card: 1
    • Version 2.7, 25 September 2015 (confidential document) [12] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Evaluation Reference List, NXP: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1025b_pdf.pdf 0978V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
  • BSI:
    • BSI-PP-0035: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 6: 1
    • EAL 6 augmented: 1
    • EAL6: 131
    • EAL6 augmented: 128
    • EAL6+: 128
  • EAL:
    • EAL 6: 2
    • EAL4: 3
    • EAL4 augmented: 1
    • EAL4+: 1
    • EAL6: 36
    • EAL6 augmented: 3
    • EAL6+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_IMP.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 6
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 3
    • ALC_CMC.5: 2
    • ALC_CMS: 2
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_DEL: 2
    • ALC_DEL.1: 1
    • ALC_DVS: 3
    • ALC_DVS.1: 2
    • ALC_DVS.2: 4
    • ALC_FLR.1: 11
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL: 9
    • ASE_CCL.1: 1
    • ASE_ECD: 4
    • ASE_ECD.1: 1
    • ASE_INT: 19
    • ASE_INT.1: 1
    • ASE_OBJ: 9
    • ASE_OBJ.2: 1
    • ASE_REQ: 45
    • ASE_REQ.2: 1
    • ASE_SPD: 8
    • ASE_SPD.1: 1
    • ASE_TSS: 16
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 3
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.4: 3
    • ADV_FSP.5: 11
    • ADV_IMP: 1
    • ADV_IMP.2: 4
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 4
    • ALC_CMC.4: 3
    • ALC_CMC.5: 4
    • ALC_CMS: 4
    • ALC_CMS.4: 3
    • ALC_CMS.5: 5
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 2
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS: 3
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 76
    • FCS_CKM.1: 32
    • FCS_CKM.2: 6
    • FCS_CKM.4: 31
    • FCS_COP: 114
    • FCS_COP.1: 25
    • FCS_RNG: 47
    • FCS_RNG.1: 16
  • FDP:
    • FDP_ACC: 17
    • FDP_ACC.1: 27
    • FDP_ACC.1.1: 1
    • FDP_ACF: 17
    • FDP_ACF.1: 23
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_AFC: 1
    • FDP_IFC.1: 16
    • FDP_ITC.1: 26
    • FDP_ITC.2: 26
    • FDP_ITT.1: 14
    • FDP_PHP.3: 1
    • FDP_SDC: 2
    • FDP_SDC.1: 12
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 13
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 16
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 16
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_API: 3
    • FIA_API.1: 13
    • FIA_API.1.1: 1
    • FIA_SOS.2: 2
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 1
  • FMT:
    • FMT_ACF: 1
    • FMT_LIM: 29
    • FMT_LIM.1: 12
    • FMT_LIM.2: 11
    • FMT_MSA.1: 17
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 20
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 15
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 20
    • FPT_ITC.1: 2
    • FPT_ITT.1: 15
    • FPT_PHP.3: 17
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 31
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 9
  • FTP:
    • FTP_ITC.1: 21
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 4
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 5
    • FCS_CKM.4: 3
    • FCS_COP.1: 23
    • FCS_COP.1.1: 2
    • FCS_RNG.1: 9
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 35
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 32
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_FLS.1: 1
    • FDP_IFC.1: 10
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDI.1: 1
    • FDP_SDI.2: 7
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 25
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 20
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 19
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 7
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
  • FRU:
    • FRU_FLT.2: 7
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 4
    • O.RND: 4
    • O.TDES: 4
  • T:
    • T.RND: 1
  • O:
    • O.CUST_RECONFIG: 5
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.HW_AES: 7
    • O.MEM_ACCESS: 9
    • O.RND: 3
    • O.SFR_ACCESS: 9
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 15
    • Infineon Technologies: 21
    • Infineon Technologies AG: 31
  • NXP:
    • NXP: 138
    • NXP Semiconductors: 49
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 50
      • AES-128: 3
  • DES:
    • 3DES:
      • TDEA: 3
      • TDES: 26
      • Triple-DES: 4
      • TripleDES: 2
    • DES:
      • DES: 29
  • constructions:
    • MAC:
      • CBC-MAC: 8
  • AES_competition:
    • AES:
      • AES: 32
  • DES:
    • 3DES:
      • TDEA: 3
      • Triple-DEA: 1
      • Triple-DES: 9
    • DES:
      • DEA: 2
      • DES: 16
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 15
    • ECDH:
      • ECDH: 6
    • ECDSA:
      • ECDSA: 19
  • FF:
    • DH:
      • Diffie-Hellman: 9
    • DSA:
      • DSA: 1
  • RSA:
    • RSA2048: 6
    • RSA4096: 6
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 11
  • SHA:
    • SHA1:
      • SHA1: 11
    • SHA2:
      • SHA256: 11
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
    • Key agreement: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • PRNG: 1
  • RNG:
    • RND: 5
    • RNG: 25
  • TRNG:
    • TRNG: 3
  • RNG:
    • RND: 5
    • RNG: 14
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 14
  • CFB:
    • CFB: 6
  • CTR:
    • CTR: 8
  • ECB:
    • ECB: 16
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 21
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 7
    • Malfunction: 12
    • fault injection: 2
    • malfunction: 1
  • SCA:
    • DPA: 7
    • Leak-Inherent: 12
    • Physical Probing: 2
    • SPA: 6
    • Side-channel: 1
    • Timing Attack: 1
    • physical probing: 1
    • side channel: 11
  • other:
    • reverse engineering: 1
  • FI:
    • Malfunction: 10
    • fault injection: 3
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 13
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • timing attacks: 2
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS20: 1
    • AIS31: 13
    • AIS32: 8
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
  • FIPS:
    • FIPS 140-2: 1
    • FIPS 197: 4
    • FIPS PUB 140-2: 1
  • ISO:
    • ISO/IEC 11770-3: 1
    • ISO/IEC 14443-4: 3
    • ISO/IEC 14888-3: 6
    • ISO/IEC 15946-1: 1
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9797-1: 2
    • ISO/IEC 9798-2: 1
  • NIST:
    • SP 800-108: 1
    • SP 800-38A: 11
    • SP 800-67: 5
  • PKCS:
    • PKCS #1: 2
    • PKCS#1: 8
  • RFC:
    • RFC 5639: 1
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-004: 2
  • FIPS:
    • FIPS PUB 197: 3
    • FIPS PUB 46: 1
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 14443: 16
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 22
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • SFRs related to the TOE authentication are regarded as not applicable, due to the fact that it is out of scope of the intended use-case and the authentication functionality is no longer available. End of note: 1
    • certification. The user operating system and further applications implemented on the TOE are also out of scope of this certification. To summarize, if used with the PCD software the certification view equals to: 1
    • is enabled to communicate via the selected interfaces. The surrounding environment is in both cases out of scope. Note 1: The cryptographic libraries RSA, EC and Toolbox are delivery options. Therefore the TOE: 1
    • out of scope: 3
pdf_data/st_metadata
  • /Alternative descriptive title: Security Target Lite
  • /Author: NXP Semiconductors
  • /CertificationID: BSI-DSZ-CC-0978-V2
  • /Company: NXP Semiconductors GmbH Germany
  • /Copyright date: 2015
  • /CreationDate: D:20170918092651+02'00'
  • /Creator: Acrobat PDFMaker 11 für Word
  • /Descriptive title: Security Target Lite
  • /Division: NXP Semiconductors
  • /Document identifier:
  • /Keywords: CC Security Evaluation, Security Target, Functional Requirements, Security Functionality, Assurance Level EAL6+, P60D144yVA, P60D080yVA, P60D144yVE, P60D080yVE
  • /ModDate: D:20170918092812+02'00'
  • /Modification date: 14 September 2017
  • /Producer: Adobe PDF Library 11.0
  • /Product name title: <not applicable>
  • /Revision: Rev. 2.62
  • /Security status: <Security status>
  • /SourceModified: D:20170918070724
  • /Specification status: Evaluation documentation PUBLIC
  • /Subject: P60x144/080yVA/yVA(Y/B/X)/yVE
  • /Template date: 29 January 2010
  • /Template version: 2.9.0
  • /Title: Security Target Lite
  • /docpath: file:///e|/idsmx21_p60/data/id_smx21_lib/id_smx21/DOCUMENTS/project_docu/Evaluation/Procedure_P60D144/ASE
  • /list_of_authors:
  • /philips_smx_cl_docpath: I:\P5_CryptoLib\SmxCl\docs\99_prj_mgmt\Templates\V2.9.0_R1
  • /relBiblioPath: ..\Bibliography.doc
  • /test_sec_row_naming: manufacturer area
  • /text_cert_body_long: Bundesamt fuer Sicherheit in der Informationstechnik
  • /text_cert_body_short: BSI
  • /text_developer_long: NXP Semiconductors, Business Unit Security & Connectivity
  • /text_developer_short: NXP Semiconductors
  • /text_product_cfgC080: P60C080P
  • /text_product_cfgC144: P60C144P
  • /text_product_cfgD080: P60D080y
  • /text_product_cfgD144: P60D144y
  • /text_product_cfgD144_nameplate: 9050C
  • /text_product_letter: A
  • /text_product_long: NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE
  • /text_product_minor: VA/VE
  • /text_product_short: NXP Secure Smart Card Controller P60x144/080y
  • /text_product_short_pa: P60x144/080yVA/VE
  • /text_product_short_pa_b: P60x144/080yVA(B)
  • /text_product_short_pa_y: P60x144/080yVA(Y)
  • /text_product_short_pe: P60x144/080yVE
  • /text_sponsor_long: NXP Semiconductors, Business Unit Security & Connectivity
  • /text_sponsor_short: NXP
  • pdf_file_size_bytes: 899610
  • pdf_hyperlinks: mailto:[email protected], http://www.nxp.com/
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 87
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