This page was not yet optimized for use on mobile devices.
Comparing certificates Experimental feature
You are comparing two certificates. By default, only different attributes are shown. Use the button below to show/hide all attributes.
S3FV9RR/S3FV9RQ/S3FV9RP/S3FV9RK (S3FV9RR_20240407) (ANSSI-CC-2023/32-R01) ANSSI-CC-2023/32-R01 |
ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52) ( ANSSI-CC-2023/10-R01 ) ANSSI-CC-2023/10-R01 |
|
---|---|---|
name | S3FV9RR/S3FV9RQ/S3FV9RP/S3FV9RK (S3FV9RR_20240407) (ANSSI-CC-2023/32-R01) | ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52) ( ANSSI-CC-2023/10-R01 ) |
not_valid_before | 2024-08-24 | 2024-02-09 |
not_valid_after | 2029-08-24 | 2029-02-09 |
st_link | https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Cible-ANSSI-CC-2023_32-R01en.pdf | https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-Cible-CC-2023_10-R01en.pdf |
manufacturer | Samsung Electronics Co., Ltd. | NXP Semiconductors Germany GmbH |
manufacturer_web | https://www.samsung.com | https://www.nxp.com |
security_level | ASE_TSS.2, EAL6+ | ADV_INT.2, ATE_DPT.3, ALC_CMS.5, ADV_TDS.4, ALC_TAT.2, ALC_DVS.2, EAL4+, ADV_FSP.5 |
report_link | https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2023_32-R01fr.pdf | https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2023_10-R01fr.pdf |
cert_link | https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-CC-2023_32-R01fr.pdf | https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-2023_10-R01fr.pdf |
protection_profiles | frozendict({'_type': 'sec_certs.sample.protection_profile.ProtectionProfile', 'pp_name': 'Security IC Platform Protection Profile with Augmentation Packages', 'pp_eal': 'EAL4+', 'pp_link': 'https://www.commoncriteriaportal.org/files/ppfiles/pp0084b_pdf.pdf', 'pp_ids': frozenset({'BAROC_SC_PP_V1.0', 'SECURITY_IC_AUGP_V1.0', 'JAVA_OC'})}) | frozendict({'_type': 'sec_certs.sample.protection_profile.ProtectionProfile', 'pp_name': "Protection Profile for Machine Readable Travel Document with 'ICAO Application', Basic Acce...", 'pp_eal': None, 'pp_link': 'https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0055b.pdf', 'pp_ids': None}) |
state/cert/pdf_hash | c5f2ad25514334799ea12a98b44c3209b03d32e2e06661eac7c9d8c8b082f504 | 418552077d64e332c9ed893921c4b6722bd7d4b773ad61be49257de27b8064f2 |
state/cert/txt_hash | e68063364976565982742adebca5ed7fd3f0f3d4c55bb771197fad8e2e9974ec | 180fb79f4caef0818f16b21d84e23dfaa8c03e48edd8450852cad3e4d6a587e3 |
state/report/pdf_hash | 4bcc48745e3595cd46d92ca59573882557aa6eea7c9a16f930742d420aa70c10 | 8bd07e310b469ba234a33e36da9369fcf998bfc25179812643b724f77447adb2 |
state/report/txt_hash | 2e938ec9402a113c52828688ba49d4a0d78c4909e85f104b868df138dfa74c9d | e82a678149e5a43d5dd29166f25fb5bcf4fd827b595e4f0ae4007a3692e672b3 |
state/st/pdf_hash | 306cfe205c784903487737da959d6bb9c2bd750e2e8cbf0cdaeda036cd4ab8d6 | 8f5cb8f3ca6c33d47d5e4ca1efe8489d158e94f96f371ee95c89bc9a7d9cec4a |
state/st/txt_hash | 58c4f12629488fb58ba65b4dafc4ae553d0d48d6ae6db49367b312c79cfb90ff | 7307e38d8fca95690b25396c9073011743c9d9b0921a3f1cb903969f5ea551da |
heuristics/cert_id | ANSSI-CC-2023/32-R01 | ANSSI-CC-2023/10-R01 |
heuristics/extracted_versions | 2023, 32 | 4.5, 4.0.1.52 |
heuristics/report_references/directly_referencing | None | NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-V2-2023 |
heuristics/report_references/indirectly_referencing | None | NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022, BSI-DSZ-CC-1149-V2-2023 |
heuristics/scheme_data/cert_id | ANSSI-CC-2023/32-R01 | ANSSI-CC-2023/10-R01 |
heuristics/scheme_data/description | Le produit évalué est « S3FV9RR/S3FV9RQ/S3FV9RP/S3FV9RK, S3FV9RR_20240407 » développé par SAMSUNG ELECTRONICS CO. LTD. Le microcontrôleur seul n’est pas un produit utilisable en tant que tel. Il est destiné à héberger une ou plusieurs applications. Il peut être inséré dans un support plastique pour constituer une carte à puce. Les usages possibles de cette carte sont multiples (documents d’identi | Le produit évalué est « ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration, Version 4.0.1.52 » développé par NXP SEMICONDUCTORS. Il s’agit de documents électroniques, qui permettent différents types d’usage basés sur l’identité électronique. |
heuristics/scheme_data/developer | SAMSUNG ELECTRONICS CO. LTD. | NXP SEMICONDUCTORS |
heuristics/scheme_data/enhanced/augmented | ASE_TSS.2 | ADV_FSP.5, ADV_INT.2, ADV_TDS.4, ALC_CMS.5, ALC_DVS.2, ALC_TAT.2, ATE_DPT.3 |
heuristics/scheme_data/enhanced/category | Micro-circuits | Cartes à puce |
heuristics/scheme_data/enhanced/cert_id | ANSSI-CC-2023/32-R01 | ANSSI-CC-2023/10-R01 |
heuristics/scheme_data/enhanced/cert_link | https://cyber.gouv.fr/sites/default/files/document_type/certificat-CC-2023_32-R01fr.pdf | https://cyber.gouv.fr/sites/default/files/document_type/certificat-2023_10-R01fr.pdf |
heuristics/scheme_data/enhanced/certification_date | 24/08/2024 | 09/02/2024 |
heuristics/scheme_data/enhanced/developer | SAMSUNG ELECTRONICS CO. LTD. | NXP SEMICONDUCTORS |
heuristics/scheme_data/enhanced/evaluation_facility | CEA - LETI | THALES / CNES |
heuristics/scheme_data/enhanced/expiration_date | 24/08/2029 | 09/02/2029 |
heuristics/scheme_data/enhanced/level | EAL6+ | EAL4+ |
heuristics/scheme_data/enhanced/protection_profile | Security IC Platform Protection Profile with Augmentation Packages, version 1.0 certifié BSI-CC-PP-0084-2014 le 19 février 2014 avec conformité aux packages : “Authentication of the security IC”, “TDES”, “AES”, “Hash Functions” “Loader dedicated for usage in Secured Environment only” “Loader dedicated for usage by authorized users only” | Machine Readable Travel Document with « ICAO Application », Basic Access Control, version 1.10, certifié BSI-CC-PP-0055-2009 |
heuristics/scheme_data/enhanced/report_link | https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-CC-2023_32-R01fr.pdf | https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-CC-2023_10-R01fr.pdf |
heuristics/scheme_data/enhanced/sponsor | SAMSUNG ELECTRONICS CO. LTD. | NXP SEMICONDUCTORS |
heuristics/scheme_data/enhanced/target_link | https://cyber.gouv.fr/sites/default/files/document_type/Cible-ANSSI-CC-2023_32-R01en.pdf | https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-Cible-CC-2023_10-R01en.pdf |
heuristics/scheme_data/expiration_date | 24 Août 2029 | 9 Février 2029 |
heuristics/scheme_data/level | EAL6+ | EAL4+ |
heuristics/scheme_data/product | S3FV9RR/S3FV9RQ/S3FV9RP/S3FV9RK (S3FV9RR_20240407) | ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52) |
heuristics/scheme_data/sponsor | SAMSUNG ELECTRONICS CO. LTD. | NXP SEMICONDUCTORS |
heuristics/scheme_data/url | https://cyber.gouv.fr/produits-certifies/s3fv9rrs3fv9rqs3fv9rps3fv9rk-s3fv9rr20240407 | https://cyber.gouv.fr/produits-certifies/chipdoc-v4-jcop-45-p71-icao-bac-configuration-version-40152 |
heuristics/st_references/directly_referencing | None | BSI-DSZ-CC-1149-V2-2023 |
heuristics/st_references/indirectly_referencing | None | BSI-DSZ-CC-1149-V2-2023 |
pdf_data/cert_filename | certificat-CC-2023_32-R01fr.pdf | certificat-2023_10-R01fr.pdf |
pdf_data/cert_keywords/cc_cert_id/FR |
|
|
pdf_data/cert_keywords/cc_protection_profile_id/BSI |
|
|
pdf_data/cert_keywords/cc_sar |
|
|
pdf_data/cert_keywords/cc_security_level/EAL |
|
|
pdf_data/cert_keywords/eval_facility |
|
|
pdf_data/cert_keywords/os_name | |
|
pdf_data/cert_keywords/standard_id | |
|
pdf_data/cert_keywords/vendor | |
|
pdf_data/cert_metadata//CreationDate | D:20240828105449+02'00' | D:20240214223000+01'00' |
pdf_data/cert_metadata//ModDate | D:20240828111801+02'00' | D:20240214231043+01'00' |
pdf_data/cert_metadata/pdf_file_size_bytes | 169375 | 166046 |
pdf_data/report_filename | ANSSI-CC-2023_32-R01fr.pdf | ANSSI-CC-2023_10-R01fr.pdf |
pdf_data/report_keywords/asymmetric_crypto |
|
|
pdf_data/report_keywords/cc_cert_id |
|
|
pdf_data/report_keywords/cc_cert_id/FR |
|
|
pdf_data/report_keywords/cc_protection_profile_id/BSI |
|
|
pdf_data/report_keywords/cc_sar |
|
|
pdf_data/report_keywords/cc_sar/ALC |
|
|
pdf_data/report_keywords/cc_security_level/EAL |
|
|
pdf_data/report_keywords/eval_facility |
|
|
pdf_data/report_keywords/eval_facility/CESTI/CESTI | 3 | 1 |
pdf_data/report_keywords/ic_data_group | |
|
pdf_data/report_keywords/os_name | |
|
pdf_data/report_keywords/randomness |
|
|
pdf_data/report_keywords/standard_id |
|
|
pdf_data/report_keywords/symmetric_crypto |
|
|
pdf_data/report_keywords/symmetric_crypto/DES |
|
|
pdf_data/report_keywords/vendor |
|
|
pdf_data/report_metadata//CreationDate | D:20240828111636+02'00' | D:20240214222629+01'00' |
pdf_data/report_metadata//ModDate | D:20240828111753+02'00' | D:20240214231044+01'00' |
pdf_data/report_metadata/pdf_file_size_bytes | 358634 | 377021 |
pdf_data/report_metadata/pdf_number_of_pages | 14 | 13 |
pdf_data/st_filename | Cible-ANSSI-CC-2023_32-R01en.pdf | ANSSI-Cible-CC-2023_10-R01en.pdf |
pdf_data/st_keywords/asymmetric_crypto |
|
|
pdf_data/st_keywords/asymmetric_crypto/ECC |
|
|
pdf_data/st_keywords/asymmetric_crypto/ECC/ECC/ECC | 29 | 7 |
pdf_data/st_keywords/asymmetric_crypto/ECC/ECDSA/ECDSA | 20 | 3 |
pdf_data/st_keywords/cc_cert_id | |
|
pdf_data/st_keywords/cc_claims |
|
|
pdf_data/st_keywords/cc_protection_profile_id/BSI |
|
|
pdf_data/st_keywords/cc_sar |
|
|
pdf_data/st_keywords/cc_sar/ADV |
|
|
pdf_data/st_keywords/cc_sar/ADV/ADV_ARC.1 | 5 | 6 |
pdf_data/st_keywords/cc_sar/ADV/ADV_FSP.5 | 3 | 11 |
pdf_data/st_keywords/cc_sar/AGD |
|
|
pdf_data/st_keywords/cc_sar/AGD/AGD_OPE.1 | 1 | 4 |
pdf_data/st_keywords/cc_sar/AGD/AGD_PRE.1 | 1 | 4 |
pdf_data/st_keywords/cc_sar/ALC |
|
|
pdf_data/st_keywords/cc_sar/ALC/ALC_CMS.5 | 3 | 5 |
pdf_data/st_keywords/cc_sar/ALC/ALC_DEL.1 | 1 | 2 |
pdf_data/st_keywords/cc_sar/ALC/ALC_DVS.2 | 1 | 8 |
pdf_data/st_keywords/cc_sar/ALC/ALC_LCD.1 | 1 | 3 |
pdf_data/st_keywords/cc_sar/ASE |
|
|
pdf_data/st_keywords/cc_sar/ASE/ASE_CCL.1 | 1 | 2 |
pdf_data/st_keywords/cc_sar/ASE/ASE_INT.1 | 2 | 4 |
pdf_data/st_keywords/cc_sar/ASE/ASE_OBJ.2 | 1 | 3 |
pdf_data/st_keywords/cc_sar/ASE/ASE_REQ.2 | 1 | 4 |
pdf_data/st_keywords/cc_sar/ATE |
|
|
pdf_data/st_keywords/cc_sar/ATE/ATE_DPT.3 | 1 | 5 |
pdf_data/st_keywords/cc_sar/AVA |
|
|
pdf_data/st_keywords/cc_security_level/EAL |
|
|
pdf_data/st_keywords/cc_security_level/EAL/EAL 4 | 1 | 3 |
pdf_data/st_keywords/cc_security_level/EAL/EAL 4 augmented | 1 | 3 |
pdf_data/st_keywords/cc_sfr |
|
|
pdf_data/st_keywords/cc_sfr/FAU |
|
|
pdf_data/st_keywords/cc_sfr/FAU/FAU_GEN | 2 | 1 |
pdf_data/st_keywords/cc_sfr/FAU/FAU_SAS | 8 | 7 |
pdf_data/st_keywords/cc_sfr/FCS |
|
|
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM | 62 | 12 |
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM.1 | 54 | 15 |
pdf_data/st_keywords/cc_sfr/FCS/FCS_CKM.4 | 35 | 12 |
pdf_data/st_keywords/cc_sfr/FCS/FCS_COP | 79 | 40 |
pdf_data/st_keywords/cc_sfr/FCS/FCS_COP.1 | 28 | 8 |
pdf_data/st_keywords/cc_sfr/FDP |
|
|
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACC.1 | 20 | 7 |
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF | 14 | 1 |
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1 | 18 | 9 |
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1.2 | 1 | 2 |
pdf_data/st_keywords/cc_sfr/FDP/FDP_ACF.1.4 | 1 | 2 |
pdf_data/st_keywords/cc_sfr/FDP/FDP_UCT.1 | 9 | 11 |
pdf_data/st_keywords/cc_sfr/FDP/FDP_UIT.1 | 9 | 10 |
pdf_data/st_keywords/cc_sfr/FIA |
|
|
pdf_data/st_keywords/cc_sfr/FIA/FIA_API | 6 | 8 |
pdf_data/st_keywords/cc_sfr/FMT |
|
|
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM | 22 | 8 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM.1 | 28 | 18 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM.1.1 | 2 | 3 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM.2 | 32 | 17 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_LIM.2.1 | 2 | 4 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_MSA.1 | 12 | 1 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_MSA.3 | 16 | 1 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_SMF.1 | 9 | 11 |
pdf_data/st_keywords/cc_sfr/FMT/FMT_SMR.1 | 6 | 13 |
pdf_data/st_keywords/cc_sfr/FPT |
|
|
pdf_data/st_keywords/cc_sfr/FPT/FPT_FLS.1 | 22 | 7 |
pdf_data/st_keywords/cc_sfr/FPT/FPT_PHP.3 | 20 | 7 |
pdf_data/st_keywords/cc_sfr/FTP |
|
|
pdf_data/st_keywords/cc_sfr/FTP/FTP_ITC.1 | 13 | 1 |
pdf_data/st_keywords/cc_sfr/FTP/FTP_TRP.1 | 4 | 1 |
pdf_data/st_keywords/cipher_mode |
|
|
pdf_data/st_keywords/cipher_mode/CBC/CBC | 1 | 3 |
pdf_data/st_keywords/cplc_data |
|
|
pdf_data/st_keywords/crypto_library | |
|
pdf_data/st_keywords/crypto_protocol |
|
|
pdf_data/st_keywords/crypto_scheme |
|
|
pdf_data/st_keywords/ecc_curve |
|
|
pdf_data/st_keywords/hash_function/SHA/SHA1 |
|
|
pdf_data/st_keywords/hash_function/SHA/SHA1/SHA-1 | 1 | 2 |
pdf_data/st_keywords/hash_function/SHA/SHA2 |
|
|
pdf_data/st_keywords/hash_function/SHA/SHA2/SHA-224 | 3 | 1 |
pdf_data/st_keywords/hash_function/SHA/SHA2/SHA-256 | 3 | 1 |
pdf_data/st_keywords/ic_data_group | |
|
pdf_data/st_keywords/javacard_api_const |
|
|
pdf_data/st_keywords/os_name | |
|
pdf_data/st_keywords/randomness |
|
|
pdf_data/st_keywords/randomness/RNG |
|
|
pdf_data/st_keywords/randomness/RNG/RND | 11 | 1 |
pdf_data/st_keywords/side_channel_analysis/FI |
|
|
pdf_data/st_keywords/side_channel_analysis/FI/Malfunction | 26 | 3 |
pdf_data/st_keywords/side_channel_analysis/FI/malfunction | 11 | 7 |
pdf_data/st_keywords/side_channel_analysis/FI/physical tampering | 3 | 1 |
pdf_data/st_keywords/side_channel_analysis/SCA |
|
|
pdf_data/st_keywords/side_channel_analysis/SCA/DPA | 8 | 2 |
pdf_data/st_keywords/side_channel_analysis/SCA/SPA | 7 | 1 |
pdf_data/st_keywords/side_channel_analysis/SCA/physical probing | 9 | 4 |
pdf_data/st_keywords/side_channel_analysis/other/reverse engineering | 5 | 1 |
pdf_data/st_keywords/standard_id |
|
|
pdf_data/st_keywords/standard_id/BSI |
|
|
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-001 | 3 | 1 |
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-002 | 3 | 1 |
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-003 | 3 | 1 |
pdf_data/st_keywords/standard_id/CC/CCMB-2017-04-004 | 3 | 1 |
pdf_data/st_keywords/standard_id/FIPS |
|
|
pdf_data/st_keywords/standard_id/RFC |
|
|
pdf_data/st_keywords/symmetric_crypto/AES_competition/AES/AES | 31 | 6 |
pdf_data/st_keywords/symmetric_crypto/DES/3DES |
|
|
pdf_data/st_keywords/symmetric_crypto/DES/3DES/TDES | 17 | 15 |
pdf_data/st_keywords/symmetric_crypto/DES/DES/DES | 10 | 4 |
pdf_data/st_keywords/symmetric_crypto/constructions/MAC |
|
|
pdf_data/st_keywords/vendor |
|
|
pdf_data/st_metadata |
|
|
pdf_data/st_metadata//Author | Windows 사용자 | David Herrgesell |
pdf_data/st_metadata//CreationDate | D:20240524111804+09'00' | D:20231011002739+02'00' |
pdf_data/st_metadata//Creator | Microsoft® Word 2016 | Microsoft® Word for Microsoft 365 |
pdf_data/st_metadata//ModDate | D:20240524111804+09'00' | D:20231011002739+02'00' |
pdf_data/st_metadata//Producer | Microsoft® Word 2016 | Microsoft® Word for Microsoft 365 |
pdf_data/st_metadata/pdf_file_size_bytes | 1613460 | 1219524 |
pdf_data/st_metadata/pdf_hyperlinks | https://tools.ietf.org/html/rfc7748, https://tools.ietf.org/html/rfc8032, mailto:[email protected] | |
pdf_data/st_metadata/pdf_number_of_pages | 122 | 77 |
dgst | d6d36276965c686c | ce4fe00bb1d91a41 |