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ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52) ( ANSSI-CC-2023/10-R01 )
ANSSI-CC-2023/10-R01 		ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration(Version 4.0.1.52)
ANSSI-CC-2023/10
name ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52) ( ANSSI-CC-2023/10-R01 ) ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration(Version 4.0.1.52)
not_valid_after 09.02.2029 01.03.2028
not_valid_before 09.02.2024 01.03.2023
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-2023_10-R01fr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-2023_10cdv4bac.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2023_10-R01fr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2023_10_bac.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-Cible-CC-2023_10-R01en.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-cc-2023_10en.pdf
manufacturer NXP Semiconductors Germany GmbH NXP Semiconductors
manufacturer_web https://www.nxp.com https://www.nxp.com/
dgst ce4fe00bb1d91a41 03abb3f744f8ea2c
heuristics/cert_id ANSSI-CC-2023/10-R01 ANSSI-CC-2023/10
heuristics/report_references/directly_referencing BSI-DSZ-CC-1149-V2-2023, NSCIB-CC-0313985-CR NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1149-V2-2023, NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022 NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022
heuristics/scheme_data
  • cert_id: ANSSI-CC-2023/10-R01
  • description: Le produit évalué est « ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration, Version 4.0.1.52 » développé par NXP SEMICONDUCTORS. Il s’agit de documents électroniques, qui permettent différents types d’usage basés sur l’identité électronique.
  • developer: NXP SEMICONDUCTORS
  • enhanced:
    • augmented: ADV_FSP.5, ADV_INT.2, ADV_TDS.4, ALC_CMS.5, ALC_DVS.2, ALC_TAT.2, ATE_DPT.3
    • category: Cartes à puce
    • cc_version: Critères Communs version 3.1r5
    • cert_id: ANSSI-CC-2023/10-R01
    • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/certificat-2023_10-R01fr.pdf
    • certification_date: 2024-02-09
    • developer: NXP SEMICONDUCTORS
    • evaluation_facility: THALES / CNES
    • expiration_date: 2029-02-09
    • level: EAL4+
    • mutual_recognition: CCRA SOG-IS
    • protection_profile: Machine Readable Travel Document with « ICAO Application », Basic Access Control, version 1.10, certifié BSI-CC-PP-0055-2009
    • report_link: https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-CC-2023_10-R01fr.pdf
    • sponsor: NXP SEMICONDUCTORS
    • target_link: https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-Cible-CC-2023_10-R01en.pdf
  • expiration_date: 2029-02-09
  • level: EAL4+
  • product: ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration (Version 4.0.1.52)
  • sponsor: NXP SEMICONDUCTORS
  • url: https://cyber.gouv.fr/produits-certifies/chipdoc-v4-jcop-45-p71-icao-bac-configuration-version-40152
  • cert_id: ANSSI-CC-2023/10
  • description: Le produit évalué est « ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration, Version 4.0.1.52 » développé par NXP SEMICONDUCTORS. Il s’agit de documents électroniques, qui permettent différents types d’usage basés sur l’identité électronique.    
  • developer: NXP SEMICONDUCTORS
  • enhanced:
    • augmented: (ADV_FSP.5, ADV_INT.2, ADV_TDS.4, ALC_CMS.5, ALC_DVS.2, ALC_TAT.2, ATE_DPT.3)
    • category: Cartes à puce
    • cc_version: Critères Communs version 3.1r5
    • cert_id: ANSSI-CC-2023/10
    • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/Certificat-2023_10%28CDv4BAC%29.pdf
    • certification_date: 2023-03-01
    • developer: NXP SEMICONDUCTORS
    • evaluation_facility: THALES / CNES
    • expiration_date: 2028-02-29
    • level: EAL4+
    • mutual_recognition: CCRA SOG-IS
    • protection_profile: Machine Readable Travel Document with « ICAO Application », Basic Access Control, version 1.10 Certifié BSI-CC-PP-0055-2009
    • sponsor: NXP SEMICONDUCTORS
  • expiration_date: 2028-02-29
  • level: EAL4+
  • product: ChipDoc v4 on JCOP 4.5 P71 in ICAO BAC configuration(Version 4.0.1.52)
  • sponsor: NXP SEMICONDUCTORS
  • url: https://cyber.gouv.fr/produits-certifies/chipdoc-v4-jcop-45-p71-icao-bac-configurationversion-40152
heuristics/st_references/directly_referencing BSI-DSZ-CC-1149-V2-2023 NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022
heuristics/st_references/indirectly_referencing BSI-DSZ-CC-1149-V2-2023 NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022
pdf_data/cert_filename certificat-2023_10-R01fr.pdf certificat-2023_10cdv4bac.pdf
pdf_data/cert_keywords/cc_cert_id
  • FR:
    • ANSSI-CC-2023/10-R01: 2
  • FR:
    • ANSSI-CC-2023/10: 2
pdf_data/cert_metadata
  • /CreationDate: D:20240214223000+01'00'
  • /Creator: Acrobat PDFMaker 23 pour Word
  • /Keywords:
  • /ModDate: D:20240214231043+01'00'
  • /Producer: Adobe PDF Library 23.1.175
  • pdf_file_size_bytes: 166046
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename ANSSI-CC-2023_10-R01fr.pdf anssi-cc-2023_10_bac.pdf
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1149-V2-2023: 1
  • FR:
    • ANSSI-CC-2023/10-R01: 2
  • NL:
    • NSCIB-CC-0313985-1MA2: 1
    • NSCIB-CC-0313985-CR: 1
  • DE:
    • BSI-DSZ-CC-1149-2022: 1
  • FR:
    • ANSSI-CC-2023/10: 2
  • NL:
    • NSCIB-CC-0313985-CR: 1
    • NSCIB-CC-0313985-MA: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 5
    • NXP Semiconductors: 1
  • NXP:
    • NXP: 8
    • NXP Semiconductors: 1
pdf_data/report_keywords/eval_facility
  • CESTI:
    • CESTI: 1
  • CESTI:
    • CESTI: 1
  • Thales:
    • THALES/CNES: 2
pdf_data/report_metadata
pdf_data/st_filename ANSSI-Cible-CC-2023_10-R01en.pdf anssi-cible-cc-2023_10en.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1149-V2-2023: 1
  • DE:
    • BSI-DSZ-CC-1149-2022: 2
  • NL:
    • CC-0313985: 1
    • CC-22-0313985: 1
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 88
    • NXP Semiconductors: 30
  • NXP:
    • NXP: 87
    • NXP Semiconductors: 30
pdf_data/st_metadata
  • /Author: David Herrgesell
  • /CreationDate: D:20231011002739+02'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20231011002739+02'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • /Title: CDv4_2_210374_STLite_CDv4_ICAO_BAC
  • pdf_file_size_bytes: 1219524
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 77
state/cert/extract_ok True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/extract_ok True False
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/extract_ok True False
state/st/pdf_hash Different Different
state/st/txt_hash Different Different