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Samsung S3CC9FB microcontroller
ANSSI-CC-2004/08 		SLS 32TLC00xS(M) CIPURSE™4move v1.0.2
BSI-DSZ-CC-0990-V2-2017
name Samsung S3CC9FB microcontroller SLS 32TLC00xS(M) CIPURSE™4move v1.0.2
scheme FR DE
not_valid_after 01.09.2019 22.11.2022
not_valid_before 11.05.2004 22.11.2017
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2004_08.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0990V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2004_08.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0990V2b_pdf.pdf
manufacturer Samsung Electronics Co., Ltd. Infineon Technologies AG
manufacturer_web https://www.samsung.com https://www.infineon.com/
security_level EAL4+, AVA_VLA.4, ADV_IMP.2, ALC_DVS.2 EAL5+, AVA_VAN.5, ALC_DVS.2
dgst cb87424f533f753c 39381be2d49e4778
heuristics/cert_id ANSSI-CC-2004/08 BSI-DSZ-CC-0990-V2-2017
heuristics/cert_lab [] BSI
heuristics/extracted_sars AVA_MSU.2, ATE_FUN.1, ADV_RCR.1, ASE_INT.1, ADV_LLD.1, ADV_IMP.2, ASE_ENV.1, ATE_IND.2, ATE_DPT.1, AGD_USR.1, ASE_REQ.1, ASE_SRE.1, ALC_LCD.1, ALC_DVS.2, AVA_VLA.4, ADV_HLD.2, ATE_COV.2, ASE_PPC.1, ASE_DES.1, ALC_TAT.1, ADV_FSP.2, AGD_ADM.1, AVA_SOF.1, ASE_OBJ.1, ASE_TSS.1, ADV_SPM.1 ASE_CCL.1, ATE_FUN.1, ASE_OBJ.2, ATE_DPT.3, AVA_VAN.5, ASE_INT.1, ALC_CMC.4, ASE_REQ.2, ADV_INT.2, ASE_COMP.1, AGD_PRE.1, ATE_IND.2, ASE_ECD.1, ADV_IMP.1, ADV_TDS.4, ALC_LCD.1, ALC_DVS.2, ASE_SPD.1, ATE_COV.2, ALC_CMS.5, AGD_OPE.1, ADV_FSP.5, ALC_DEL.1, ASE_TSS.1, ADV_ARC.1, ALC_TAT.2
heuristics/extracted_versions - 1.0.2
heuristics/report_references/directly_referencing ANSSI-CC-2002/25 BSI-DSZ-CC-0963-V2-2017, BSI-DSZ-CC-0990-2016
heuristics/report_references/indirectly_referencing ANSSI-CC-2002/25 BSI-DSZ-CC-0963-V2-2017, BSI-DSZ-CC-0854-2013, BSI-DSZ-CC-0990-2016, BSI-DSZ-CC-0814-2012, BSI-DSZ-CC-0963-2015, BSI-DSZ-CC-0786-2012, BSI-DSZ-CC-0944-2014
pdf_data/report_filename 2004_08.pdf 0990V2a_pdf.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5
    • cc_version: Product specific Security Target Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-0990-V2-2017
    • cert_item: SLS 32TLC00xS(M) CIPURSE™ 4move, V1.0.2
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: None
pdf_data/report_keywords/cc_cert_id
  • FR:
    • Rapport de certification 2002/25: 1
    • Rapport de certification 2004/08: 13
  • DE:
    • BSI-DSZ-CC-0963-V2-2017: 2
    • BSI-DSZ-CC-0990-2016: 4
    • BSI-DSZ-CC-0990-V2-2017: 14
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL1: 1
    • EAL3: 1
    • EAL4: 1
    • EAL4+: 1
    • EAL41: 1
    • EAL5: 1
    • EAL7: 2
  • ITSEC:
    • ITSEC E6 et: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 8
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 1
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 2
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_DEL.2: 2
    • ADO_IGS: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 1
    • ADV_RCR.1: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 1
    • AGD_ADM.1: 1
    • AGD_USR: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 3
  • ADV:
    • ADV_ARC: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAA.1: 2
  • FCS:
    • FCS_CKM.1: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 2
    • FDP_IFF.1: 2
    • FDP_SDI.1: 2
  • FIA:
    • FIA_ATD.1: 2
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 2
  • FPT:
    • FPT_PHP.2: 2
    • FPT_PHP.3: 2
    • FPT_TST.1: 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 10
  • Infineon:
    • Infineon: 3
    • Infineon Technologies: 2
    • Infineon Technologies AG: 12
pdf_data/report_keywords/eval_facility
  • Serma:
    • SERMA: 3
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 4
  • AES_competition:
    • AES:
      • AES: 1
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
  • BSI:
    • AIS 25: 3
    • AIS 26: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS 46: 1
  • ISO:
    • ISO/IEC 14443-3: 1
    • ISO/IEC 14443-4: 1
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816-4: 1
    • ISO/IEC 9798-2: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • Report, Version 5, 2017-11-09, Evaluation Technical Report Summary, TÜV Informationstechnik GmbH, (confidential document) [8] Configuration list for the TOE (confidential documents) a) Configuration item list, Version 1: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • to AIS 36 for the Product M7791 B12 and G11, Version 1, 2017-01-24, TÜV Informationstechnik GmbH (confidential document) [12] Certification Report BSI-DSZ-CC-0990-2016, SLS 32TLC00xS(M) CIPURSE™ 4move v1.00.00, Infineon: 1
pdf_data/report_metadata
  • /Author: DCSSI
  • /CreationDate: D:20040517150918+02'00'
  • /Creator: Acrobat PDFMaker 5.0 pour Word
  • /ModDate: D:20040517150925+03'00'
  • /Producer: Acrobat Distiller 5.0 (Windows)
  • /Subject: Micro-circuit SAMSUNG S3CC9FB
  • /Title: Rapport de certification 2004/08
  • pdf_file_size_bytes: 657323
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 26
pdf_data/st_filename cible2004_08.pdf 0990V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL4: 2
    • EAL4 augmented: 1
  • EAL:
    • EAL5: 40
    • EAL5 augmented: 38
    • EAL5+: 37
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 2
    • ACM_SCP: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_IGS: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 1
    • ADV_LLD: 2
    • ADV_RCR: 2
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 1
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_TAT: 2
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 1
  • AVA:
    • AVA_MSU: 2
    • AVA_SOF: 2
    • AVA_VLA: 2
    • AVA_VLA.4: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 4
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL: 3
    • ASE_CCL.1: 1
    • ASE_COMP.1: 1
    • ASE_ECD: 3
    • ASE_ECD.1: 1
    • ASE_INT: 10
    • ASE_INT.1: 1
    • ASE_OBJ: 4
    • ASE_OBJ.2: 1
    • ASE_REQ: 14
    • ASE_REQ.2: 1
    • ASE_SPD: 5
    • ASE_SPD.1: 1
    • ASE_TSS: 4
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAA.1: 1
  • FCS:
    • FCS_CKM.1: 2
    • FCS_CKM.4: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 1
    • FDP_ACF.1: 2
    • FDP_IFC.1: 1
    • FDP_IFF.1: 2
    • FDP_SDI.1: 1
  • FIA:
    • FIA_ATD.1: 1
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 1
  • FPT:
    • FPT_PHP.2: 1
    • FPT_PHP.3: 1
    • FPT_TST.1: 2
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_CKM: 5
    • FCS_CKM.1: 12
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 13
    • FCS_CKM.4.1: 1
    • FCS_COP: 11
    • FCS_COP.1: 3
    • FCS_RNG.1: 1
  • FDP:
    • FDP_ACC: 10
    • FDP_ACC.1: 6
    • FDP_ACF: 8
    • FDP_ACF.1: 7
    • FDP_IFC.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT.1: 1
    • FDP_SDC.1: 1
    • FDP_SDI.2: 1
  • FIA:
    • FIA_UAU: 4
    • FIA_UAU.1: 1
    • FIA_UAU.2: 7
    • FIA_UAU.2.1: 1
    • FIA_UAU.3: 6
    • FIA_UAU.3.1: 1
    • FIA_UAU.3.2: 1
    • FIA_UAU.5: 7
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UID.1: 4
    • FIA_UID.2: 9
    • FIA_UID.2.1: 1
  • FMT:
    • FMT_LIM: 4
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
    • FMT_MAS: 1
    • FMT_MSA: 16
    • FMT_MSA.1: 4
    • FMT_MSA.3: 5
    • FMT_SMF: 9
    • FMT_SMF.1: 4
    • FMT_SMR: 2
    • FMT_SMR.1: 12
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNL: 1
    • FPR_UNL.1: 7
    • FPR_UNL.1.1: 1
  • FPT:
    • FPT_FLS: 9
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_RPL: 2
    • FPT_RPL.1: 8
    • FPT_RPL.1.1: 1
    • FPT_RPL.1.2: 1
    • FPT_TST.2: 1
  • FRU:
    • FRU_FLT.2: 1
  • FTP:
    • FTP_TRP: 3
    • FTP_TRP.1: 7
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
pdf_data/st_keywords/cc_claims
  • A:
    • A.DEV_ORG: 1
    • A.DLV: 1
    • A.DLV_AUDIT: 1
    • A.DLV_PROTECT: 1
    • A.DLV_RESP: 1
    • A.KEY_DEST: 2
    • A.SOFT_ARCHI: 1
    • A.USE_DIAG: 1
    • A.USE_PROD: 1
    • A.USE_SYS: 1
    • A.USE_TEST: 1
  • O:
    • O.CLON: 1
    • O.CRYPTO: 2
    • O.DESIGN_ACS: 1
    • O.DEV_DIS: 1
    • O.DEV_TOOLS: 1
    • O.DIS_MECHANISM: 1
    • O.DIS_MEMORY: 1
    • O.DLV_AUDIT: 1
    • O.DLV_PROTECT: 1
    • O.DLV_RESP: 1
    • O.DSOFT_ACS: 1
    • O.FLAW: 1
    • O.IC_DLV: 1
    • O.KEY_DEST: 2
    • O.MASK_FAB: 1
    • O.MECH_ACS: 1
    • O.MOD_MEMORY: 1
    • O.OPERATE: 1
    • O.SOFT_ACS: 1
    • O.SOFT_DLV: 1
    • O.SOFT_MECH: 1
    • O.TAMPER: 1
    • O.TEST_OPERATE: 1
    • O.TOE_PRT: 1
    • O.USE_DIAG: 1
    • O.USE_SYS: 1
  • T:
    • T.CLON: 2
    • T.DIS_DEL: 2
    • T.DIS_DESIGN: 2
    • T.DIS_DSOFT: 2
    • T.DIS_INFO: 1
    • T.DIS_PHOTOMAS: 1
    • T.DIS_PHOTOMASK: 1
    • T.DIS_SOFT: 1
    • T.DIS_TEST: 1
    • T.DIS_TOOLS: 1
    • T.MOD_DEL: 2
    • T.MOD_DESIGN: 1
    • T.MOD_DSOFT: 1
    • T.MOD_PHOTOMA: 1
    • T.MOD_SOFT: 2
    • T.T_DEL: 2
    • T.T_PHOTOMASK: 2
    • T.T_PRODUCT: 2
    • T.T_SAMPLE: 2
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 1
  • Infineon:
    • Infineon: 1
    • Infineon Technologies: 6
    • Infineon Technologies AG: 6
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 6
  • AES_competition:
    • AES:
      • AES: 22
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 4
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • physical tampering: 6
  • other:
    • reverse engineering: 1
  • FI:
    • DFA: 3
  • SCA:
    • DPA: 3
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 14443-3: 4
    • ISO/IEC 14443-4: 6
    • ISO/IEC 7816: 2
    • ISO/IEC 7816-4: 8
    • ISO/IEC 7816-9: 2
    • ISO/IEC 9798: 2
    • ISO/IEC 9798-2: 4
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation: 1
    • a smart card embedded software and an IC dedicated software (Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation. The TOE submitted to the: 1
    • out of scope: 1
pdf_data/st_metadata
  • /CreationDate: D:20040716152549Z
  • /ModDate: D:20041001095815+03'00'
  • /Producer: Acrobat Distiller 4.0 for Windows
  • pdf_file_size_bytes: 219561
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 31
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