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Renesas AE45X1-C (HD65145X1)smartcard integrated circuit version 02
BSI-DSZ-CC-0351-2006 		Samsung S3CC9FB microcontroller
ANSSI-CC-2004/08
name Renesas AE45X1-C (HD65145X1)smartcard integrated circuit version 02 Samsung S3CC9FB microcontroller
scheme DE FR
not_valid_before 13.09.2006 11.05.2004
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0351a.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2004_08.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0351b.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2004_08.pdf
manufacturer Renesas Technology Corporation Samsung Electronics Co., Ltd.
manufacturer_web https://am.renesas.com/ https://www.samsung.com
security_level EAL4 ALC_DVS.2, ADV_IMP.2, EAL4+, AVA_VLA.4
dgst c9d17408c8fe84e3 cb87424f533f753c
heuristics/cert_id BSI-DSZ-CC-0351-2006 ANSSI-CC-2004/08
heuristics/cert_lab BSI []
heuristics/extracted_sars ASE_OBJ.1, ATE_COV.2, AGD_USR.1, ASE_REQ.1, ASE_TSS.1, ADV_HLD.2, AVA_VLA.2, ATE_DPT.1, ADV_FSP.2, ADV_IMP.1, ALC_DVS.1, ADV_SPM.1, ALC_TAT.1, ASE_DES.1, ASE_ENV.1, ATE_IND.2, ASE_PPC.1, AGD_ADM.1, ASE_SRE.1, ASE_INT.1, ATE_FUN.1, ADV_RCR.1, AVA_MSU.2, ALC_LCD.1, AVA_SOF.1, ADV_LLD.1 ADV_IMP.2, ASE_OBJ.1, ATE_COV.2, AGD_USR.1, ASE_REQ.1, ASE_TSS.1, ADV_HLD.2, ATE_DPT.1, ADV_FSP.2, AVA_VLA.4, ADV_SPM.1, ALC_TAT.1, ASE_DES.1, ALC_DVS.2, ASE_ENV.1, ATE_IND.2, ASE_PPC.1, AGD_ADM.1, ASE_SRE.1, ASE_INT.1, ATE_FUN.1, ADV_RCR.1, AVA_MSU.2, ALC_LCD.1, AVA_SOF.1, ADV_LLD.1
heuristics/extracted_versions 02 -
heuristics/report_references/directly_referenced_by NSCIB-CC-09-10991-CR {}
heuristics/report_references/directly_referencing BSI-DSZ-CC-0212-2004 ANSSI-CC-2002/25
heuristics/report_references/indirectly_referenced_by NSCIB-CC-09-10991-CR {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0212-2004 ANSSI-CC-2002/25
heuristics/st_references/directly_referenced_by NSCIB-CC-09-10991-CR {}
heuristics/st_references/indirectly_referenced_by NSCIB-CC-09-10991-CR {}
pdf_data/report_filename 0351a.pdf 2004_08.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cert_id: BSI-DSZ-CC-0351-2006
    • cert_item: Renesas AE45X1-C (HD65145X1) smartcard integrated circuit version 02
    • cert_lab: BSI
    • developer: Renesas Technology Corp
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
  • FR:
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0212-2004: 2
    • BSI-DSZ-CC-0351: 3
    • BSI-DSZ-CC-0351-2006: 20
  • FR:
    • Rapport de certification 2002/25: 1
    • Rapport de certification 2004/08: 13
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0002-2001: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 4: 1
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 11
    • EAL5: 6
    • EAL6: 3
    • EAL7: 4
  • EAL:
    • EAL1: 1
    • EAL3: 1
    • EAL4: 1
    • EAL4+: 1
    • EAL41: 1
    • EAL5: 1
    • EAL7: 2
  • ITSEC:
    • ITSEC E6 et: 1
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 2
    • ACM_CAP: 2
    • ACM_CAP.4: 2
    • ACM_SCP: 2
    • ACM_SCP.2: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_HLD: 2
    • ADV_HLD.2: 1
    • ADV_IMP: 2
    • ADV_IMP.1: 1
    • ADV_INT: 2
    • ADV_LLD: 2
    • ADV_LLD.1: 1
    • ADV_RCR: 2
    • ADV_RCR.1: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 1
    • AGD_USR: 2
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 2
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.1: 2
    • ALC_TAT: 2
    • ALC_TAT.1: 2
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_COV.2: 1
    • ATE_DPT: 2
    • ATE_DPT.1: 1
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_IND: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 2
    • AVA_MSU.2: 1
    • AVA_SOF: 3
    • AVA_SOF.1: 1
    • AVA_VLA: 3
    • AVA_VLA.2: 2
    • AVA_VLA.3: 1
    • AVA_VLA.4: 1
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 2
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_DEL.2: 2
    • ADO_IGS: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 1
    • ADV_RCR.1: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 1
    • AGD_ADM.1: 1
    • AGD_USR: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 3
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_COP.1: 1
    • FCS_RND.1: 1
  • FDP:
    • FDP_ACC.1: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
  • FMT:
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_SEP.1: 1
  • FRU:
    • FRU_FLT.2: 1
  • FAU:
    • FAU_SAA.1: 2
  • FCS:
    • FCS_CKM.1: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 2
    • FDP_IFF.1: 2
    • FDP_SDI.1: 2
  • FIA:
    • FIA_ATD.1: 2
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 2
  • FPT:
    • FPT_PHP.2: 2
    • FPT_PHP.3: 2
    • FPT_TST.1: 2
pdf_data/report_keywords/vendor
  • Infineon:
    • Infineon Technologies AG: 1
  • Philips:
    • Philips: 1
  • Samsung:
    • Samsung: 10
pdf_data/report_keywords/eval_facility
  • Serma:
    • SERMA: 3
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 6
  • DES:
    • DES:
      • DES: 4
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 7
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • Malfunction: 1
    • physical tampering: 1
  • SCA:
    • Physical Probing: 1
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 1
    • AIS 26: 1
    • AIS 31: 1
    • AIS 34: 1
  • FIPS:
    • FIPS PUB 140-2: 1
    • FIPS PUB 46-3: 1
  • ISO:
    • ISO/IEC 15408:2005: 3
    • ISO/IEC15408: 2005: 1
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • AE45X1-B), HD65145X1 (AE45X1-C) Hardware Manual, Renesas Technology Corp., 11 June,2004, (confidential document) [11] AE45X1 User Guidance Manual Rev. 7.20, Renesas 16-bit Smart Card Microcomputer AE-4 Series: 1
    • AE45X1-B), HD65145X1 (AE45X1-C), HD65145X1 (AE45X1-CB)l, Renesas Technology Corp., 18 April, 2004, (confidential document) [12] Renesas Single-Chip Microcomputer AE-4 Series, AE45X1-B/C (HD65145C1), Current Control: 1
    • Rev. 1.0, 17 June 2004, (confidential document) [13] Option List for Smart Card Microcomputer (for HD65145X1C [AE45X1C, CB]), (AE45X1C-V1.5R: 1
    • Technology Corp, February 6, 2006, (confidential document) [15] Federal Information Processing Standards Publication, Security Requirements for Cryptographic: 1
    • Version 9.0, 11 July 2006, AE45X1-C (HD65145X1) Version 02, Renesas Technology Corp. (confidential document) B-16 BSI-DSZ-CC-0351-2006 Certification Report [7] Security Target BSI-DSZ-CC-0351, Version 3.0: 1
    • document) [8] Evaluation Technical Report, 1.0, 13 July, 2006, AE45X1-C (HD65145X1) Version 02 (confidential document) [9] Smartcard IC Platform Protection Profile, Version 1.0, July, 2001, BSI registration ID: 1
pdf_data/report_metadata
  • /Author: BSI
  • /Company: BSI, Postfach 200363, 53133 Bonn
  • /CreationDate: D:20060927102809+02'00'
  • /Creator: Acrobat PDFMaker 7.0.7 für Word
  • /Keywords: "Common Criteria, Certification, Zertifizierung, Renesas, smartcard"
  • /ModDate: D:20060928112506+02'00'
  • /Producer: Acrobat Distiller 7.0.5 (Windows)
  • /SourceModified: D:20060927082642
  • /Subject: Certification Report BSI-DSZ-CC-0351-2006
  • /Title: Certification Report BSI-DSZ-CC-0351-2006
  • pdf_file_size_bytes: 283987
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 40
  • /Author: DCSSI
  • /CreationDate: D:20040517150918+02'00'
  • /Creator: Acrobat PDFMaker 5.0 pour Word
  • /ModDate: D:20040517150925+03'00'
  • /Producer: Acrobat Distiller 5.0 (Windows)
  • /Subject: Micro-circuit SAMSUNG S3CC9FB
  • /Title: Rapport de certification 2004/08
  • pdf_file_size_bytes: 657323
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 26
pdf_data/st_filename 0351b.pdf cible2004_08.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP- 0002: 2
    • BSI-PP-0002: 72
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 5
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL4: 2
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADO:
    • ADO_DEL: 1
    • ADO_IGS: 1
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 1
    • ADV_IMP: 1
    • ADV_LLD: 1
    • ADV_RCR: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 4
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • AVA:
    • AVA_MSU: 1
    • AVA_SOF: 5
    • AVA_VLA: 1
    • AVA_VLA.2: 1
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 2
    • ACM_SCP: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_IGS: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 1
    • ADV_LLD: 2
    • ADV_RCR: 2
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 1
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_TAT: 2
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 1
  • AVA:
    • AVA_MSU: 2
    • AVA_SOF: 2
    • AVA_VLA: 2
    • AVA_VLA.4: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN.1: 1
    • FAU_SAS.1: 9
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 11
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 1
    • FCS_CKM.4: 11
    • FCS_CKM.4.1: 1
    • FCS_COP: 1
    • FCS_COP.1: 19
    • FCS_COP.1.1: 2
    • FCS_RND: 1
    • FCS_RND.1: 9
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC.1: 29
    • FDP_ACC.1.1: 3
    • FDP_ACF.1: 27
    • FDP_ACF.1.1: 4
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 17
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 1
    • FDP_ITC.1: 12
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 10
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 10
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 10
    • FMT_LIM.2.1: 1
    • FMT_MSA.1: 2
    • FMT_MSA.2: 14
    • FMT_MSA.2.1: 1
    • FMT_MSA.3: 9
    • FMT_SMR.1: 1
  • FPT:
    • FPT_AMT.1: 1
    • FPT_FLS.1: 31
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 9
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 12
    • FPT_PHP.3.1: 1
    • FPT_SEP.1: 12
    • FPT_SEP.1.1: 1
    • FPT_SEP.1.2: 1
  • FRU:
    • FRU_FLT.1: 1
    • FRU_FLT.2: 16
  • FAU:
    • FAU_SAA.1: 1
  • FCS:
    • FCS_CKM.1: 2
    • FCS_CKM.4: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 1
    • FDP_ACF.1: 2
    • FDP_IFC.1: 1
    • FDP_IFF.1: 2
    • FDP_SDI.1: 1
  • FIA:
    • FIA_ATD.1: 1
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 1
  • FPT:
    • FPT_PHP.2: 1
    • FPT_PHP.3: 1
    • FPT_TST.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 4
  • T:
    • T.RND: 4
  • A:
    • A.DEV_ORG: 1
    • A.DLV: 1
    • A.DLV_AUDIT: 1
    • A.DLV_PROTECT: 1
    • A.DLV_RESP: 1
    • A.KEY_DEST: 2
    • A.SOFT_ARCHI: 1
    • A.USE_DIAG: 1
    • A.USE_PROD: 1
    • A.USE_SYS: 1
    • A.USE_TEST: 1
  • O:
    • O.CLON: 1
    • O.CRYPTO: 2
    • O.DESIGN_ACS: 1
    • O.DEV_DIS: 1
    • O.DEV_TOOLS: 1
    • O.DIS_MECHANISM: 1
    • O.DIS_MEMORY: 1
    • O.DLV_AUDIT: 1
    • O.DLV_PROTECT: 1
    • O.DLV_RESP: 1
    • O.DSOFT_ACS: 1
    • O.FLAW: 1
    • O.IC_DLV: 1
    • O.KEY_DEST: 2
    • O.MASK_FAB: 1
    • O.MECH_ACS: 1
    • O.MOD_MEMORY: 1
    • O.OPERATE: 1
    • O.SOFT_ACS: 1
    • O.SOFT_DLV: 1
    • O.SOFT_MECH: 1
    • O.TAMPER: 1
    • O.TEST_OPERATE: 1
    • O.TOE_PRT: 1
    • O.USE_DIAG: 1
    • O.USE_SYS: 1
  • T:
    • T.CLON: 2
    • T.DIS_DEL: 2
    • T.DIS_DESIGN: 2
    • T.DIS_DSOFT: 2
    • T.DIS_INFO: 1
    • T.DIS_PHOTOMAS: 1
    • T.DIS_PHOTOMASK: 1
    • T.DIS_SOFT: 1
    • T.DIS_TEST: 1
    • T.DIS_TOOLS: 1
    • T.MOD_DEL: 2
    • T.MOD_DESIGN: 1
    • T.MOD_DSOFT: 1
    • T.MOD_PHOTOMA: 1
    • T.MOD_SOFT: 2
    • T.T_DEL: 2
    • T.T_PHOTOMASK: 2
    • T.T_PRODUCT: 2
    • T.T_SAMPLE: 2
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
  • Samsung:
    • Samsung: 1
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 47
  • DES:
    • DES:
      • DES: 6
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 8
    • RNG: 11
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 4
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 2
    • Malfunction: 14
    • malfunction: 5
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 15
    • Physical Probing: 2
    • Physical probing: 1
    • physical probing: 4
  • FI:
    • physical tampering: 6
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 31: 1
    • AIS31: 5
  • FIPS:
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC7816-3: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation: 1
    • a smart card embedded software and an IC dedicated software (Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation. The TOE submitted to the: 1
    • out of scope: 1
pdf_data/st_metadata
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  • /ModDate: D:20060831184508+09'00'
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  • pdf_file_size_bytes: 929922
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 64
  • /CreationDate: D:20040716152549Z
  • /ModDate: D:20041001095815+03'00'
  • /Producer: Acrobat Distiller 4.0 for Windows
  • pdf_file_size_bytes: 219561
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 31
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