Comparing certificates Experimental feature

You are comparing two certificates. By default, only differing attributes are shown. Use the button below to show/hide all attributes.

Showing only differing attributes.
NXP Secure Smart Card Controller P6022y VB* including IC Dedicated Software
BSI-DSZ-CC-1059-V5-2022 		NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
BSI-DSZ-CC-1072-V3-2019
name NXP Secure Smart Card Controller P6022y VB* including IC Dedicated Software NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
status active archived
not_valid_after 12.12.2027 03.12.2024
not_valid_before 12.12.2022 03.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1059V5c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1059V5a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1059V5b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3b_pdf.pdf
manufacturer NXP Semiconductors Germany GmbH NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity
dgst 8cc4b54348148bbe 5fb51bc20f02913c
heuristics/cert_id BSI-DSZ-CC-1059-V5-2022 BSI-DSZ-CC-1072-V3-2019
heuristics/prev_certificates BSI-DSZ-CC-1059-2018, BSI-DSZ-CC-1059-V2-2019, BSI-DSZ-CC-1059-V3-2019, BSI-DSZ-CC-1059-V4-2021 BSI-DSZ-CC-1072-2018, BSI-DSZ-CC-1072-V2-2019
heuristics/next_certificates {} BSI-DSZ-CC-1072-V4-2021, BSI-DSZ-CC-1072-V5-2022
heuristics/report_references/directly_referenced_by ANSSI-CC-2020/26-R01, ANSSI-CC-2020/51-R01, ANSSI-CC-2020/52-R01, NSCIB-CC-2200035-01-CR, NSCIB-CC-23-67206-CR, ANSSI-CC-2020/53-R01, ANSSI-CC-2020/50-R01 BSI-DSZ-CC-1072-V4-2021
heuristics/report_references/directly_referencing BSI-DSZ-CC-1059-V4-2021 BSI-DSZ-CC-1072-V2-2019
heuristics/report_references/indirectly_referenced_by ANSSI-CC-2020/26-R01, ANSSI-CC-2020/51-R01, ANSSI-CC-2020/52-R01, NSCIB-CC-2200035-01-CR, NSCIB-CC-23-67206-CR, ANSSI-CC-2020/53-R01, ANSSI-CC-2023/38, ANSSI-CC-2020/50-R01 NSCIB-CC-23-66030-CR, BSI-DSZ-CC-1072-V4-2021, BSI-DSZ-CC-1072-V5-2022
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0973-2016, BSI-DSZ-CC-1059-2018, BSI-DSZ-CC-1059-V2-2019, BSI-DSZ-CC-0973-V2-2016, BSI-DSZ-CC-1059-V4-2021, BSI-DSZ-CC-1059-V3-2019 BSI-DSZ-CC-1072-V2-2019, BSI-DSZ-CC-0955-V2-2016, BSI-DSZ-CC-0955-2016, BSI-DSZ-CC-1072-2018
heuristics/st_references/directly_referenced_by ANSSI-CC-2020/26-R01, ANSSI-CC-2023/38 {}
heuristics/st_references/indirectly_referenced_by ANSSI-CC-2020/26-R01, ANSSI-CC-2023/38 {}
pdf_data/cert_filename 1059V5c_pdf.pdf 1072V3c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1059-V5-2022: 1
  • DE:
    • BSI-DSZ-CC-1072-V3-2019: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Keywords: "Common Criteria, Certification, Zertifizierung, NXP Secure Smart Card Controller P6022y VB* including IC Dedicated Software, NXP Semiconductors Germany GmbH"
  • /Subject: Common Criteria, Certification, Zertifizierung, NXP Secure Smart Card Controller P6022y VB* including IC Dedicated Software, NXP Semiconductors Germany GmbH
  • /Title: Certificate BSI-DSZ-CC-1059-V5-2022
  • pdf_file_size_bytes: 230975
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20191205125022+01'00'
  • /Creator: Writer
  • /Keywords: NXP, Secure Smart Card Controller, P6021y VB*, NXP Semiconductors Germany GmbH
  • /ModDate: D:20200108095848+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated SoftwarefromNXP Semiconductors Germany GmbH
  • /Title: Certificate BSI-DSZ-CC-1072-V3-2019
  • pdf_file_size_bytes: 296536
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1059V5a_pdf.pdf 1072V3a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2, ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1059-V5-2022
    • cert_item: NXP Secure Smart Card Controller P6022y VB* including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2, ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1072-V3-2019
    • cert_item: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1059-V4-2021: 2
    • BSI-DSZ-CC-1059-V5-2022: 19
  • DE:
    • BSI-DSZ-CC-1072-V2-2019: 2
    • BSI-DSZ-CC-1072-V3-2019: 19
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
  • O:
    • O.C: 7
  • R:
    • R.O: 7
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 40
    • NXP Semiconductors: 30
  • NXP:
    • NXP: 27
    • NXP Semiconductors: 28
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 5
  • TUV:
    • TÜV Informationstechnik: 8
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 12
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 1
      • Triple-DES: 5
    • DES:
      • DES: 2
  • AES_competition:
    • AES:
      • AES: 9
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 1
      • Triple-DES: 4
    • DES:
      • DES: 3
  • constructions:
    • MAC:
      • CBC-MAC: 1
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 3
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 3
  • TRNG:
    • TRNG: 2
  • RNG:
    • RNG: 4
  • TRNG:
    • TRNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 7
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 5
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 10
  • SmartMX:
    • SmartMX2: 8
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • SCA:
    • physical probing: 1
  • other:
    • JIL: 4
  • FI:
    • physical tampering: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • FIPS:
    • FIPS197: 4
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
  • BSI:
    • AIS 1: 1
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • FIPS:
    • FIPS197: 3
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 2018-11-27, NXP Semiconductors (confidential document) 7 specifically • AIS 1, Version 14, Durchführung der Ortsbesichtigung in der Entwicklungsumgebung: 1
    • 3.7, 2017-05-15, NXP Semiconductors (confidential document) [16] Objective Data Sheet Addendum - SmartMX2 P602xy VB Family Firmware Interface Specification: 1
    • COMP) for the P6022y VB, BSI-DSZ-CC-1059-V5, version 1, 2022-10-24, TÜV Informationstechnik GmbH (confidential document) [11] Product Data Sheet - SmartMX2 family P6022y VB, Secure high-performance smart card controller: 1
    • GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • NXP Semiconductors (confidential document) [13] Information on Guidance and Operation, NXP Secure Smart Card Controller P6022y VB, Version 1: 1
    • NXP Semiconductors (confidential document) [20] Site Technical Audit Report (STAR), Firma C. Weber, Leiterplattenverarbeitung, Version 1: 1
    • P6022y VB Configuration List - Hardware IC, Version 1.6, 2019-08-09, NXP Semiconductors (confidential document) [19] NXP Secure Smart Card Controller P6022y VB Evaluation Reference List, Version 2.8, 2021-05-04: 1
    • Smart Card Controller P6022y VB – Security Target, Version 2.8, 2021-03-09, NXP Semiconductors (confidential document) [7] Evaluation Technical Report BSI-DSZ-CC-1059-V5-2022, Version 1, 2022-10-24, TÜV: 1
    • SmartMX2 P6022y VB, Wafer and delivery specification, Version 3.3, 2019-07-12, NXP Semiconductors (confidential document) [15] Product data sheet addendum - SmartMX2 P602xy VB family, Firmware Interface Specification: 1
    • Version 1.1, 2016-05-23, NXP Semiconductors (confidential document) [17] Order Entry Form, Version 2.1, 2019-11-18, NXP Semiconductors [18] NXP Secure Smart Card: 1
    • Version 3.6, 2019-08-22, NXP Semiconductors (confidential document) [12] Instruction Set for the SmartMX2 family, Secure smart card controller, Version 3.1: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • Card Controller P6021y VB Evaluation Reference List, Version 2.5, 2019-11-20, NXP Semiconductors (confidential document) [19] NXP Secure Smart Card Controller P6021y VB Configuration List, Version 1.5, 2019-08-09, NXP: 1
    • Corp, Hsinchu, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [23] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Production), Systems on: 1
    • Corporation, Hsinchu, Version 1, 2019-09-02, TÜV Informationstechnik GmbH (confidential document) [21] SITE TECHNICAL AUDIT REPORT (STAR), Production (Data Prep, Mask Temp Storage), Photronics: 1
    • Evaluation (ETR COMP) for the P6021y VB, version 3, 2019-11-21, TÜV Informationstechnik GmbH (confidential document) [11] SmartMX2 family P6021y VB Secure high-performance smart card controller, Objective data sheet: 1
    • GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Manufacturing Co. Pte. Ltd., Singapore, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) 25 / 31 Certification Report BSI-DSZ-CC-1072-V3-2019 C. Excerpts from the Criteria For the: 1
    • Smart Card Controller P6021y VB – Security Target, Version 1.11, 2019-08-23, NXP Semiconductors (confidential document) [7] Evaluation Technical Report BSI-DSZ-CC-1072-V3-2019, Version 2, 2019-11-21, TÜV: 1
    • Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [22] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Mask Production), Photronics DNP: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) [20] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Bumbing), Chipbond: 1
pdf_data/report_metadata
pdf_data/st_filename 1059V5b_pdf.pdf 1072V3b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1059: 1
  • DE:
    • BSI-DSZ-CC-1072: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 17
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 44
    • FCS_CKM.4.1: 3
    • FCS_COP.1: 42
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 8
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 35
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 32
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 10
    • FDP_ITC.1: 14
    • FDP_ITC.2: 14
    • FDP_ITT.1: 6
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI.1: 5
    • FDP_SDI.2: 36
    • FDP_SDI.2.1: 5
    • FDP_SDI.2.2: 5
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 26
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 22
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 20
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 5
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 8
  • FRU:
    • FRU_FLT.2: 8
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 17
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 46
    • FCS_CKM.4.1: 3
    • FCS_COP.1: 45
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 8
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 37
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 34
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 10
    • FDP_ITC.1: 14
    • FDP_ITC.2: 16
    • FDP_ITT.1: 6
    • FDP_ROL.1: 1
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI.1: 5
    • FDP_SDI.2: 36
    • FDP_SDI.2.1: 5
    • FDP_SDI.2.2: 5
  • FIA:
    • FIA_UAU.2: 2
    • FIA_UAU.5: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 28
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 24
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 22
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 8
    • FPT_RPL.1: 2
    • FPT_TDC.1: 2
  • FRU:
    • FRU_FLT.2: 8
  • FTP:
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 7
    • O.CUST_RECONF_PLAIN: 6
    • O.E: 1
    • O.EEPROM_INTEGRITY: 4
    • O.F: 1
    • O.FM_FW: 8
    • O.MEM_ACCESS: 10
    • O.PUF: 6
    • O.RND: 3
    • O.SFR_: 1
    • O.SFR_ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
  • O:
    • O.AES: 7
    • O.CUST_RECONF_PLAIN: 6
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.MEM_ACCESS: 10
    • O.PUF: 6
    • O.RND: 3
    • O.SFR_: 1
    • O.SFR_ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 204
    • NXP Semiconductors: 140
    • NXP Semiconductors N.V: 1
  • NXP:
    • NXP: 204
    • NXP Semiconductors: 35
    • NXP Semiconductors N.V: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 81
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 45
      • Triple-DES: 19
    • DES:
      • DEA: 1
      • DES: 8
  • constructions:
    • MAC:
      • CBC-MAC: 1
  • AES_competition:
    • AES:
      • AES: 82
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 45
      • Triple-DES: 19
    • DES:
      • DEA: 1
      • DES: 8
  • constructions:
    • MAC:
      • CBC-MAC: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 4
  • MAC:
    • MAC: 8
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 13
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 10
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 197: 3
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 14443: 20
    • ISO/IEC 7816: 28
    • ISO/IEC 9797-1: 1
  • NIST:
    • NIST SP 800-38A: 3
    • NIST SP 800-67: 4
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 197: 3
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 14443: 20
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 24
    • ISO/IEC 9797-1: 1
  • NIST:
    • NIST SP 800-38A: 3
    • NIST SP 800-67: 4
pdf_data/st_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Keywords: CC, Security Target, P6022P VB, P6022X VB, P6022M VB, P6022D VB, P6022J VB
  • /Subject: NXP Secure Smart Card Controller P6022y VB
  • /Title: Security Target
  • pdf_file_size_bytes: 1313917
  • pdf_hyperlinks: http://www.nxp.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 99
  • /Author: NXP B.V.
  • /CreationDate: D:20190823113338+01'00'
  • /Creator: DITA Open Toolkit
  • /Keywords: CC Security Evaluation, Security Target Lite, Functional Requirements, Security Functionality, Assurance Level 5+/6+, P6021y VB, P6021P VB, P6021M VB, P6021D VB, P6021J VB
  • /Producer: Apache FOP Version 1.1
  • /Subject: NXP Secure Smart Card Controller P6021y VB
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 727760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 97
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different