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ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration (Version 4.0.1.52) (ANSSI-CC-2023/12-R01)
ANSSI-CC-2023/12-R01 		Samsung TEEgris on Exynos 2200 (Version 5.0.0.0) (ANSSI-CC-2023/71)
ANSSI-CC-2023/71
name ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration (Version 4.0.1.52) (ANSSI-CC-2023/12-R01) Samsung TEEgris on Exynos 2200 (Version 5.0.0.0) (ANSSI-CC-2023/71)
category ICs, Smart Cards and Smart Card-Related Devices and Systems Trusted Computing
not_valid_after 09.02.2029 01.02.2029
not_valid_before 09.02.2024 01.02.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat-2023_12-R01fr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certificat-CC-2023_71fr.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2023_12-R01fr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2023_71fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-Cible-CC-2023_12-R01en.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-CC-2023_71en.pdf
manufacturer NXP Semiconductors Germany GmbH Samsung Electronics Co., Ltd.
manufacturer_web https://www.nxp.com https://www.samsung.com
security_level AVA_VAN.5, ALC_DVS.2, EAL5+ EAL2+
dgst 6ee673a8fd9cbf07 01cb0a033c2b1c55
heuristics/cert_id ANSSI-CC-2023/12-R01 ANSSI-CC-2023/71
heuristics/cpe_matches {} cpe:2.3:h:samsung:exynos_2200:-:*:*:*:*:*:*:*
heuristics/extracted_sars ASE_CCL.1, ALC_DEL.1, ADV_FSP.5, ALC_CMC.4, ALC_CMS.5, ALC_DVS.2, AVA_VAN.5, ATE_FUN.1, ATE_IND.2, ALC_TAT.2, ASE_TSS.1, ADV_ARC.1, ASE_SPD.1, ASE_REQ.2, ADV_INT.2, ADV_IMP.1, ADV_TDS.4, ATE_COV.2, AGD_OPE.1, ASE_ECD.1, ASE_INT.1, AGD_PRE.1, ALC_LCD.1, ATE_DPT.3, ASE_OBJ.2 ADV_TDS.1, AVA_VAN.2, ALC_CMC.2, ASE_INT.1, AGD_OPE.1, ASE_CCL.1, AGD_PRE.1, ADV_ARC.1, ALC_DEL.1, ATE_COV.1, ADV_FSP.2, ASE_SPD.1, ASE_REQ.2, ASE_ECD.1, ALC_CMS.2, ATE_FUN.1, ASE_OBJ.2, ASE_TSS.1
heuristics/extracted_versions 4.5, 4.0.1.52 5.0.0.0
heuristics/report_references/directly_referencing BSI-DSZ-CC-1149-V2-2023, NSCIB-CC-0313985-CR {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1149-V2-2023, NSCIB-CC-0313985-CR, BSI-DSZ-CC-1149-2022 {}
heuristics/scheme_data
  • cert_id: ANSSI-CC-2023/12-R01
  • description: Le produit évalué est « ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration, Version 4.0.1.52 » développé par NXP SEMICONDUCTORS. Ce produit offre des services d’authentification et de signature électronique (SSCD).
  • developer: NXP SEMICONDUCTORS
  • enhanced:
    • augmented: ALC_DVS.2, AVA_VAN.5
    • category: Cartes à puce
    • cc_version: Critères Communs version 3.1r5
    • cert_id: ANSSI-CC-2023/12-R01
    • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/certificat-2023_12-R01fr.pdf
    • certification_date: 2024-02-09
    • developer: NXP SEMICONDUCTORS
    • evaluation_facility: THALES / CNES
    • expiration_date: 2029-02-09
    • level: EAL5+
    • mutual_recognition: CCRA SOG-IS
    • protection_profile: Protection profiles for secure signature creation device Part 2 : Device with key generation, v2.0.1, BSI-CC-PP-0059-2009-MA-02 Part 3 : Device with key import, v1.0.2, BSI-CC-PP-0075-2012-MA-01 Part 4 : Extension for device with key generation and trusted communication with certificate generation application, v1.0.1, BSI-CC-PP-0071-2012-MA-01 Part 5 : Extension for device with key generation and trusted communication with signature creation application, v1.0.1, BSI-CC-PP-0072-2012-MA-01 Part 6 : Extension for device with key import and trusted communication with signature creation application, v1.0.4, BSI-CC-PP-0076-2013-MA-01
    • report_link: https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-CC-2023_12-R01fr.pdf
    • sponsor: NXP SEMICONDUCTORS
    • target_link: https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-Cible-CC-2023_12-R01en.pdf
  • expiration_date: 2029-02-09
  • level: EAL5+
  • product: ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration (Version 4.0.1.52)
  • sponsor: NXP SEMICONDUCTORS
  • url: https://cyber.gouv.fr/produits-certifies/chipdoc-v4-jcop-45-p71-sscd-configuration-version-40152
  • cert_id: ANSSI-CC-2023/71
  • description: Le produit évalué est « Samsung TEEgris on Exynos 2200, Version 5.0.0.0 » développé par Samsung Electronics Ltd., Co.. Ce produit, appelé également Samsung Secure OS, est l’implémentation de Samsung d’un TEE (Trusted Execution Environment), basé sur la technologie ARM Trust Zone.
  • developer: Samsung Electronics Ltd., Co.
  • enhanced:
    • augmented: AVA_VAN_AP.3
    • category: Divers
    • cc_version: Critères Communs version 3.1r5
    • cert_id: ANSSI-CC-2023/71
    • cert_link: https://cyber.gouv.fr/sites/default/files/document_type/Certificat-CC-2023_71fr.pdf
    • certification_date: 2024-02-01
    • developer: Samsung Electronics Ltd., Co.
    • evaluation_facility: THALES / CNES
    • expiration_date: 2029-02-01
    • level: EAL2+
    • mutual_recognition: CCRA SOG-IS
    • protection_profile: GlobalPlatform Technology TEE Protection Profile, réf. GPD_SPE_021 version 1.3, ANSSI-CC-PP-2014/01-M02
    • report_link: https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-CC-2023_71fr.pdf
    • sponsor: Samsung Electronics Ltd., Co.
    • target_link: https://cyber.gouv.fr/sites/default/files/document_type/ANSSI-cible-CC-2023_71en.pdf
  • expiration_date: 2029-02-01
  • level: EAL2+
  • product: Samsung TEEgris on Exynos 2200 Version 5.0.0.0
  • sponsor: Samsung Electronics Ltd., Co.
  • url: https://cyber.gouv.fr/produits-certifies/samsung-teegris-exynos-2200-version-5000
heuristics/st_references/directly_referencing BSI-DSZ-CC-1149-V2-2023 {}
heuristics/st_references/indirectly_referencing BSI-DSZ-CC-1149-V2-2023 {}
protection_profiles
pdf_data/cert_filename certificat-2023_12-R01fr.pdf Certificat-CC-2023_71fr.pdf
pdf_data/cert_keywords/cc_cert_id
  • FR:
    • ANSSI-CC-2023/12-R01: 2
  • FR:
    • ANSSI-CC-2023/71: 2
    • ANSSI-CC-PP-2014/01-M02: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0059-2009-MA-02: 1
    • BSI-CC-PP-0071-2012-MA-01: 1
    • BSI-CC-PP-0072-2012-MA-01: 1
    • BSI-CC-PP-0075-2012-MA01: 1
    • BSI-CC-PP-0076-2013-MA-01: 1
  • ANSSI:
    • ANSSI-CC-PP-2014/01-M02: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL2: 1
    • EAL5: 1
  • EAL:
    • EAL2: 2
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP: 2
  • Samsung:
    • Samsung: 1
pdf_data/cert_keywords/eval_facility
  • Thales:
    • THALES/CNES: 1
pdf_data/cert_keywords/tee_name
  • other:
    • TEE: 1
    • TEEgris: 1
pdf_data/cert_keywords/os_name
  • JCOP:
    • JCOP 4: 1
pdf_data/cert_metadata
  • /CreationDate: D:20240214225528+01'00'
  • /Creator: Acrobat PDFMaker 23 pour Word
  • /Keywords:
  • /ModDate: D:20240214231041+01'00'
  • /Producer: Adobe PDF Library 23.1.175
  • pdf_file_size_bytes: 165401
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
  • /CreationDate: D:20240215120518+01'00'
  • /Creator: Acrobat PDFMaker 23 pour Word
  • /Keywords:
  • /ModDate: D:20240215120555+01'00'
  • /Producer: Adobe PDF Library 23.1.175
  • pdf_file_size_bytes: 154878
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename ANSSI-CC-2023_12-R01fr.pdf ANSSI-CC-2023_71fr.pdf
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1149-V2-2023: 1
  • FR:
    • ANSSI-CC-2023/12-R01: 2
  • NL:
    • NSCIB-CC-0313985-1MA2: 1
    • NSCIB-CC-0313985-CR: 1
  • FR:
    • ANSSI-CC-2023/71: 2
    • ANSSI-CC-PP-2014/01-M02: 2
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0059-2009-MA-02: 2
    • BSI-CC-PP-0071-2012-MA-01: 2
    • BSI-CC-PP-0072-2012-MA-01: 2
    • BSI-CC-PP-0075-2012-MA-01: 2
    • BSI-CC-PP-0076-2013-MA-01: 2
  • other:
    • PP-SSCD-Part2: 2
    • PP-SSCD-Part3: 2
    • PP-SSCD-Part4: 2
    • PP-SSCD-Part5: 2
    • PP-SSCD-Part6: 2
  • ANSSI:
    • ANSSI-CC-PP-2014/01-M02: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL2: 2
    • EAL5: 1
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
  • EAL:
    • EAL2: 3
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 5
    • NXP Semiconductors: 1
  • Samsung:
    • Samsung: 19
pdf_data/report_keywords/eval_facility
  • CESTI:
    • CESTI: 1
pdf_data/report_keywords/tee_name
  • ARM:
    • TrustZone: 1
  • other:
    • TEE: 10
    • TEEgris: 12
pdf_data/report_keywords/os_name
  • JCOP:
    • JCOP 4: 7
pdf_data/report_metadata
pdf_data/st_filename ANSSI-Cible-CC-2023_12-R01en.pdf ANSSI-cible-CC-2023_71en.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1149-V2-2023: 2
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0055: 1
    • BSI-CC-PP-0056-V2-2012-MA-02: 1
    • BSI-CC-PP-0059-2009-MA-02: 1
    • BSI-CC-PP-0068-: 1
    • BSI-CC-PP-0071-2012-MA-01: 1
    • BSI-CC-PP-0072-2012-MA-01: 1
    • BSI-CC-PP-0075-2012-MA-01: 1
    • BSI-CC-PP-0076-2013-MA-01: 1
    • BSI-CC-PP-0086: 1
    • BSI-CC-PP-0087-V2-MA-01: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 8
    • EAL5 augmented: 4
  • EAL:
    • EAL 2: 6
    • EAL 2 augmented: 2
    • EAL 2+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 5
    • ADV_FSP.4: 1
    • ADV_FSP.5: 6
    • ADV_IMP.1: 5
    • ADV_INT.2: 2
    • ADV_TDS.3: 1
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 4
    • AGD_PRE.1: 5
  • ALC:
    • ALC_CMC.4: 2
    • ALC_CMS.5: 1
    • ALC_DEL.1: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 6
    • ALC_LCD.1: 3
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 2
    • ASE_ECD.1: 1
    • ASE_INT.1: 4
    • ASE_OBJ.2: 3
    • ASE_REQ.2: 4
    • ASE_SPD.1: 1
    • ASE_TSS.1: 2
  • ATE:
    • ATE_COV.2: 4
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 3
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC.1: 7
    • ADV_FSP.1: 3
    • ADV_FSP.2: 15
    • ADV_TDS.1: 10
  • AGD:
    • AGD_OPE.1: 10
    • AGD_PRE.1: 9
  • ALC:
    • ALC_CMC.2: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_DEL.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 4
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 5
    • ATE_FUN.1: 4
  • AVA:
    • AVA_VAN.2: 7
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 5
    • FAU_SAS.1: 11
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 52
    • FCS_CKM.1: 3
    • FCS_CKM.4: 2
    • FCS_COP: 58
    • FCS_COP.1: 2
    • FCS_RND: 5
    • FCS_RND.1: 17
    • FCS_RND.1.1: 2
  • FDP:
    • FDP_ACC: 22
    • FDP_ACC.1: 5
    • FDP_ACF: 22
    • FDP_ACF.1: 22
    • FDP_DAU: 3
    • FDP_DAU.2: 2
    • FDP_ITC: 2
    • FDP_ITC.1: 3
    • FDP_RIP: 28
    • FDP_RIP.1: 4
    • FDP_SDC: 10
    • FDP_SDC.1: 6
    • FDP_SDC.1.1: 1
    • FDP_SDI: 5
    • FDP_SDI.2: 4
    • FDP_UCT: 11
    • FDP_UCT.1: 2
    • FDP_UIT: 9
    • FDP_UIT.1: 4
  • FIA:
    • FIA_AFL: 34
    • FIA_AFL.1: 5
    • FIA_API: 24
    • FIA_API.1: 3
    • FIA_SOS.2: 1
    • FIA_UAU: 96
    • FIA_UAU.1: 14
    • FIA_UAU.1.1: 1
    • FIA_UAU.4: 2
    • FIA_UAU.5: 2
    • FIA_UAU.6: 1
    • FIA_UID: 39
    • FIA_UID.1: 6
  • FMT:
    • FMT_LIM: 4
    • FMT_LIM.1: 12
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 11
    • FMT_LIM.2.1: 2
    • FMT_MOF: 7
    • FMT_MOF.1: 3
    • FMT_MSA: 18
    • FMT_MSA.1: 4
    • FMT_MSA.2: 1
    • FMT_MSA.3: 9
    • FMT_MSA.4: 2
    • FMT_MTD: 98
    • FMT_MTD.1: 6
    • FMT_MTD.3: 9
    • FMT_MTD.3.1: 1
    • FMT_SMF: 22
    • FMT_SMF.1: 3
    • FMT_SMR: 20
    • FMT_SMR.1: 4
  • FPT:
    • FPT_EMS: 12
    • FPT_EMS.1: 5
    • FPT_FLS: 11
    • FPT_FLS.1: 4
    • FPT_FLS.1.1: 1
    • FPT_LIM: 1
    • FPT_LIM.1: 1
    • FPT_LIM.2: 1
    • FPT_PHP: 7
    • FPT_PHP.1: 2
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
    • FPT_TST: 8
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FTP:
    • FTP_ITC: 30
    • FTP_ITC.1: 6
  • FAU:
    • FAU_ARP.1: 12
    • FAU_ARP.1.1: 1
    • FAU_GEN.1: 4
    • FAU_SAA.1: 2
    • FAU_SAR.1: 5
    • FAU_SAR.1.1: 1
    • FAU_SAR.1.2: 1
    • FAU_STG.1: 5
    • FAU_STG.1.1: 1
    • FAU_STG.1.2: 1
  • FCS:
    • FCS_CKM: 48
    • FCS_CKM.1: 17
    • FCS_CKM.2: 2
    • FCS_CKM.4: 23
    • FCS_COP: 68
    • FCS_COP.1: 14
    • FCS_RNG: 3
    • FCS_RNG.1: 10
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 40
    • FDP_ACC.1: 15
    • FDP_ACF: 35
    • FDP_ACF.1: 21
    • FDP_IFC: 13
    • FDP_IFC.1: 8
    • FDP_IFC.2: 2
    • FDP_IFF: 11
    • FDP_IFF.1: 8
    • FDP_ITC.1: 15
    • FDP_ITC.2: 15
    • FDP_ITT: 11
    • FDP_ITT.1: 4
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_ROL: 7
    • FDP_ROL.1: 2
    • FDP_SDI: 6
    • FDP_SDI.2: 15
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_TRP: 1
  • FIA:
    • FIA_ATD: 7
    • FIA_ATD.1: 10
    • FIA_ATD.1.1: 1
    • FIA_UAU: 12
    • FIA_UAU.2: 1
    • FIA_UAU.6: 2
    • FIA_UID: 8
    • FIA_UID.1: 3
    • FIA_UID.2: 8
    • FIA_UID.2.1: 1
    • FIA_USB: 6
    • FIA_USB.1: 9
    • FIA_USB.1.1: 1
    • FIA_USB.1.2: 1
    • FIA_USB.1.3: 1
  • FMT:
    • FMT_MSA: 55
    • FMT_MSA.1: 7
    • FMT_MSA.2: 1
    • FMT_MSA.3: 15
    • FMT_MTD: 5
    • FMT_MTD.1: 1
    • FMT_SMF: 5
    • FMT_SMF.1: 21
    • FMT_SMF.1.1: 1
    • FMT_SMR: 6
    • FMT_SMR.1: 24
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS: 12
    • FPT_FLS.1: 18
    • FPT_FLS.1.1: 1
    • FPT_INI: 4
    • FPT_INI.1: 14
    • FPT_INI.1.1: 2
    • FPT_INI.1.2: 2
    • FPT_INI.1.3: 2
    • FPT_INI.1.4: 1
    • FPT_ITT: 6
    • FPT_ITT.1: 2
    • FPT_STM: 10
    • FPT_STM.1: 2
    • FPT_TEE.1: 6
    • FPT_TEE.1.1: 1
    • FPT_TEE.1.2: 1
  • FTP:
    • FTP_TPR: 1
    • FTP_TRP: 7
    • FTP_TRP.1: 3
pdf_data/st_keywords/cc_claims
  • A:
    • A.NO_RESIDUAL_DATA: 3
    • A.PROTECTION_AFTER_: 1
    • A.PROTECTION_AFTER_DELIVERY: 2
    • A.ROLLBACK: 1
    • A.TA_DEVELOPMENT: 4
    • A.TA_DEVELOPMENT_TUI: 3
    • A.TA_MANAGEMENT: 5
  • O:
    • O.CAPTURE: 2
    • O.CA_TA_IDENTIFICATION: 11
    • O.DATA_ACCESS: 11
    • O.DEBUG: 12
    • O.FUNCTION_ACCESS: 4
    • O.INITIALISATION: 10
    • O.INITIALIZATION: 1
    • O.INSTANCE_TIME: 11
    • O.KEYS_USAGE: 4
    • O.OPERATION: 8
    • O.PERIPHERAL_INITIALISATION: 3
    • O.PREVENT_RESIDUAL_DATA: 3
    • O.PROTECTED_COMMUNICATION_CHANNEL: 12
    • O.RNG: 12
    • O.ROLLBACK_PROTECTION: 5
    • O.RUNTIME_CONFIDENTIALITY: 10
    • O.RUNTIME_INTEGRITY: 21
    • O.SAFE_RELEASE: 11
    • O.TA_AUTHENTICITY: 7
    • O.TA_ISOLATION: 15
    • O.TA_PERSISTENT_TIME: 12
    • O.TEE_DATA_PROTECTION: 11
    • O.TEE_ID: 11
    • O.TEE_ISOLATION: 14
    • O.TRUSTED_STORAGE: 9
  • OE:
    • OE.DISABLED_DEBUG: 1
    • OE.INTEGRATION_CONFIGURATION: 7
    • OE.NO_RESIDUAL_DATA: 2
    • OE.PROTECTION_AFTER_DELIVERY: 7
    • OE.ROLLBACK: 1
    • OE.SECRETS: 2
    • OE.TA_DEVELOPMENT: 6
    • OE.TA_DEVELOPMENT_TUI: 5
    • OE.TA_MANAGEMENT: 3
  • OP:
    • OP.ACTIVATE: 1
    • OP.AUTHENTICATE: 2
    • OP.DEBUG: 7
    • OP.EXTRACT_KEY: 4
    • OP.LOAD: 3
    • OP.STORE: 4
    • OP.USE_KEY: 4
  • OSP:
    • OSP.INTEGRATION_: 1
    • OSP.INTEGRATION_CONFIGURATION: 2
    • OSP.SECRETS: 3
  • T:
    • T.ABUSE_DEBUG: 3
    • T.ABUSE_FUNCT: 3
    • T.CLONE: 3
    • T.CORRUPT_RUNTIME_: 1
    • T.CORRUPT_RUNTIME_DATA: 2
    • T.CORRUPT_SETUP: 5
    • T.EXTRACT_DATA: 3
    • T.EXTRACT_EXCHANGED_: 1
    • T.EXTRACT_EXCHANGED_DATA: 2
    • T.FLASH_DUMP: 3
    • T.IMPERSONATION: 3
    • T.INJECT_DATA: 3
    • T.INJECT_EXCHANGED_: 1
    • T.INJECT_EXCHANGED_DATA: 2
    • T.MODIFY_DATA: 3
    • T.MODIFY_EXCHANGED_: 1
    • T.MODIFY_EXCHANGED_DATA: 2
    • T.MODIFY_FIRMWARE: 3
    • T.PERIPHERAL_ACCESS: 3
    • T.PERTURBATION: 3
    • T.RAM: 3
    • T.RESIDUAL: 3
    • T.RNG: 3
    • T.ROGUE_CODE_: 1
    • T.ROGUE_CODE_EXECUTION: 2
    • T.ROLLBACK: 3
    • T.SHARED_FUNCTION_: 1
    • T.SHARED_FUNCTION_ACCESS: 2
    • T.SPY: 3
    • T.STORAGE_CORRUPTION: 3
    • T.TA_PERSISTENT_TIME_: 1
    • T.TA_PERSISTENT_TIME_ROLLBACK: 2
    • T.TEE_FIRMWARE_: 1
    • T.TEE_FIRMWARE_DOWNGRADE: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 122
    • NXP Semiconductors: 38
  • Samsung:
    • Samsung: 140
  • Thales:
    • Thales: 7
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 25
  • DES:
    • 3DES:
      • TDES: 8
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • CMAC: 6
      • KMAC: 2
  • AES_competition:
    • AES:
      • AES: 11
  • DES:
    • 3DES:
      • 3DES: 7
    • DES:
      • DES: 7
  • constructions:
    • MAC:
      • CMAC: 3
      • HMAC: 5
      • HMAC-SHA-224: 1
      • HMAC-SHA-384: 1
      • HMAC-SHA-512: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
    • ECDH:
      • ECDH: 2
    • ECDSA:
      • ECDSA: 3
  • FF:
    • DH:
      • DH: 7
      • Diffie-Hellman: 3
  • RSA:
    • RSA-PSS: 1
  • ECC:
    • ECDH:
      • ECDH: 5
    • ECDSA:
      • ECDSA: 13
    • EdDSA:
      • EdDSA: 1
  • FF:
    • DH:
      • DH: 5
      • Diffie-Hellman: 2
    • DSA:
      • DSA: 4
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 3
    • SHA2:
      • SHA-224: 4
      • SHA-256: 5
      • SHA-384: 4
      • SHA-512: 5
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 1
    • SHA2:
      • SHA-224: 1
      • SHA-256: 2
      • SHA-384: 1
      • SHA-512: 1
      • SHA224: 1
      • SHA256: 2
      • SHA384: 1
      • SHA512: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 5
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 2
pdf_data/st_keywords/crypto_protocol
  • PACE:
    • PACE: 190
  • IPsec:
    • IPsec: 2
  • TLS:
    • SSL:
      • SSL: 1
    • TLS:
      • TLS: 1
  • VPN:
    • VPN: 2
pdf_data/st_keywords/randomness
  • RNG:
    • RNG: 1
  • PRNG:
    • DRBG: 5
  • RNG:
    • RNG: 29
  • TRNG:
    • TRNG: 5
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 3
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 4
    • Physical Tampering: 3
    • malfunction: 9
    • physical tampering: 5
  • SCA:
    • physical probing: 4
  • SCA:
    • side-channels: 1
  • other:
    • cold boot: 1
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-03110: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • TrustZone: 2
  • IBM:
    • SE: 2
  • other:
    • TEE: 594
    • TEEgris: 126
pdf_data/st_keywords/os_name
  • JCOP:
    • JCOP 4: 117
pdf_data/st_keywords/ic_data_group
  • EF:
    • EF.ChipSecurity: 1
    • EF.DG1: 3
    • EF.DG14: 2
    • EF.DG16: 3
    • EF.DG3: 6
    • EF.DG4: 6
    • EF.SOD: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 180-4: 1
    • FIPS 186-4: 2
    • FIPS 197: 5
    • FIPS 46-3: 4
    • FIPS PUB 46-3: 1
    • FIPS180-4: 1
  • ICAO:
    • ICAO: 32
    • ICAO-SAC: 1
  • ISO:
    • ISO/IEC 14888-3: 1
  • PKCS:
    • PKCS#1: 3
    • PKCS#3: 1
  • SCP:
    • SCP03: 10
  • FIPS:
    • FIPS 140-2: 1
    • FIPS 180-4: 1
    • FIPS 186-2: 1
    • FIPS 186-4: 2
    • FIPS 197: 1
    • FIPS 46-3: 1
    • FIPS 81: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC 1423: 1
    • RFC 2119: 3
    • RFC 2202: 1
    • RFC 4231: 1
    • RFC 7748: 1
    • RFC 8032: 1
pdf_data/st_keywords/javacard_api_const
  • curves:
    • ED25519: 4
    • X25519: 4
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • and this assumption applies only for Phase 7 - End usage. Note that the operational environment is out of scope of the evaluation. A.TA_MANAGEMENT A well-defined TA identification and TA signature policy exist: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: NXP B.V.
  • /CreationDate: D:20231010235706+02'00'
  • /Creator: DITA Open Toolkit 3.3.1
  • /Keywords: Common Criteria, Security Target Lite, ChipDoc v4, SSCD
  • /Producer: Apache FOP Version 2.3
  • /Subject: ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 929958
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 103
  • /Author: rosep
  • /CreationDate: D:20240108141421+01'00'
  • /ModDate: D:20240108141421+01'00'
  • /Producer: Microsoft: Print To PDF
  • /Title: Microsoft Word - Samsung_TEEgris_5.0_Security_Target_v2.10_20230809_clean.docx
  • pdf_file_size_bytes: 1813549
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 98
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