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	RISE Konnektor V5.1 BSI-DSZ-CC-1052-V6-2024	Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 BSI-DSZ-CC-1045-V2-2023
name	RISE Konnektor V5.1	Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
category	Other Devices and Systems	Other Devices and Systems
scheme	DE	DE
status	active	active
not_valid_after	23.01.2029	03.03.2028
not_valid_before	24.01.2024	03.03.2023
cert_link	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1052V6c_pdf.pdf	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1052V6a_pdf.pdf	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf
st_link	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1052V6b_pdf.pdf	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf
manufacturer	Research Industrial Systems Engineering (RISE) Forschungs-, Entwicklungs- und Großprojekteberatung GmbH	Qualcomm Technologies Inc.
manufacturer_web	https://www.rise-world.com/	https://www.qualcomm.com
security_level	ADV_FSP.4, EAL3, AVA_VAN.5, ALC_FLR.2, ADV_IMP.1, ALC_TAT.1, ADV_TDS.3	ALC_DVS.2, EAL4+, AVA_VAN.5
dgst	65d148b67bc5288a	ac18c15a88b4b1bd
heuristics/cert_id	BSI-DSZ-CC-1052-V6-2024	BSI-DSZ-CC-1045-V2-2023
heuristics/cert_lab	BSI	BSI
heuristics/cpe_matches	{}	{}
heuristics/verified_cpe_matches	{}	{}
heuristics/related_cves	{}	{}
heuristics/direct_transitive_cves	{}	{}
heuristics/indirect_transitive_cves	{}	{}
heuristics/extracted_sars	AGD_PRE.1, ALC_TAT.1, AVA_VAN.5, ALC_DEL.1, ADV_FSP.4, AGD_OPE.1, ADV_ARC.1, ADV_TDS.3, ATE_DPT.1, ALC_FLR.2, ADV_IMP.1	ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_DVS.2, ALC_CMC.4
heuristics/extracted_versions	5.1	1.1.2
heuristics/prev_certificates	{}	{}
heuristics/next_certificates	{}	{}
heuristics/report_references/directly_referenced_by	{}	{}
heuristics/report_references/directly_referencing	BSI-DSZ-CC-1052-V5-2022	BSI-DSZ-CC-1045-2019
heuristics/report_references/indirectly_referenced_by	{}	{}
heuristics/report_references/indirectly_referencing	BSI-DSZ-CC-1052-V3-2021, BSI-DSZ-CC-1052-2018, BSI-DSZ-CC-1052-V4-2021, BSI-DSZ-CC-1052-V2-2020, BSI-DSZ-CC-1052-V5-2022	BSI-DSZ-CC-1045-2019
heuristics/scheme_data	category: eHealth cert_id: BSI-DSZ-CC-1052-V6-2024 certification_date: 24.01.2024 enhanced: applicant: Research Industrial Systems Engineering (RISE) Forschungs-, Entwicklungs- und Großprojektberatung GmbH Concorde Business Park F 2320 Schwechat Austria assurance_level: EAL3,AVA_VAN.5,ALC_TAT.1,ALC_FLR.2,ADV_TDS.3,ADV_IMP.1,ADV_FSP.4 cert_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1052V6c_pdf.pdf?__blob=publicationFile&v=1 certification_date: 24.01.2024 description: The target of evaluation (TOE) is the network connector (German “Netzkonnektor”) RISE-Konnektor V1.0. The TOE is part of the application connector (German “Anwendungskonnektor”) as an “e-Health Konnektor” in the context of the German health care telematics infrastructure. entries: [frozendict({'id': 'BSI-DSZ-CC-1052-V6-2024-MA-01 (Ausstellungsdatum / Certification Date 14.03.2024) Maintenance Report', 'description': '-Client'}), frozendict({'id': 'BSI-DSZ-CC-1052-V6-2024 (Ausstellungsdatum / Certification Date 24.01.2024, gültig bis / valid until 23.01.2029) Zertifizierungsreport / Certification Report', 'description': 'is part of the Konnektor and it is delivered pre-installed on exactly one hardware-configuration.'}), frozendict({'id': 'BSI-DSZ-CC-1052-V5-2022 (Ausstellungsdatum / Certification Date 14.04.2022, gültig bis / valid until 13.04.2027) Zertifizierungsreport / Certification Report', 'description': 'is part of the Konnektor and it is delivered pre-installed on exactly one hardware-configuration. This version implements the changes from PTV4 to PTV5.'}), frozendict({'id': 'BSI-DSZ-CC-1052-V4-2021 (Ausstellungsdatum / Certification Date 27.08.2021, gültig bis / valid until 26.08.2026) Zertifizierungsreport / Certification Report', 'description': 'is part of the Konnektor and it is delivered pre-installed on exactly one hardware-configuration.'}), frozendict({'id': 'BSI-DSZ-CC-1052-V3-2021 (Ausstellungsdatum / Certification Date 22.02.2021, gültig bis / valid until 21.02.2026) Zertifizierungsreport / Certification Report', 'description': 'The security functionality of the Anwendungskonnektor comprises the signature service, encryption and decryption of documents, a card terminal service and a smart card service. Together with the network connector, the Anwendungskonnektor also enables secure communication between the connector and the client system and between Fachmodulen and Fachdiensten.'}), frozendict({'id': 'BSI-DSZ-CC-1052-V2-2020 (Ausstellungsdatum / Certification Date 24.06.2020, gültig bis / valid until 23.06.2025) Zertifizierungsreport / Certification Report', 'description': ') of the German health care.'}), frozendict({'id': 'BSI-DSZ-CC-1052-2018 (Ausstellungsdatum / Certification Date 08.01.2019, gültig bis / valid until 07.01.2024) Zertifizierungsreport / Certification Report', 'description': 'Certificat'})] evaluation_facility: SRC Security Research & Consulting GmbH expiration_date: 23.01.2029 product: RISE Konnektor V5.1 protection_profile: Common Criteria Schutzprofil (Protection Profile), Schutzprofil 1: Anforderungen an den Netzkonnektor, Version 1.6.6, BSI-CC-PP-0097-V2-2020-MA-01 vom 15.04.2021; report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1052V6a_pdf.pdf?__blob=publicationFile&v=1 target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1052V6b_pdf.pdf?__blob=publicationFile&v=1 product: RISE Konnektor V5.1 subcategory: Software url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/Gesundheitswesen_Software/1052_1052V2_1052V3_1052V4_1052V5_1052V6.html vendor: Research Industrial Systems Engineering (RISE) Forschungs-, Entwicklungs- und Großprojektberatung GmbH	category: System on a chip (SOC) cert_id: BSI-DSZ-CC-1045-V2-2023 certification_date: 03.03.2023 enhanced: applicant: Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA assurance_level: EAL4+; ALC_DVS.2, AVA_VAN.5 cert_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2 certification_date: 03.03.2023 description: The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data. entries: [frozendict({'id': 'BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target Zertifikat / Certificate', 'description': 'has been extended by additional cryptographic functions.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})] evaluation_facility: T-Systems International GmbH atsec information security GmbH expiration_date: 02.03.2028 product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014 report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2 target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2 product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html vendor: Qualcomm Technologies Inc.
heuristics/st_references/directly_referenced_by	{}	{}
heuristics/st_references/directly_referencing	{}	{}
heuristics/st_references/indirectly_referenced_by	{}	{}
heuristics/st_references/indirectly_referencing	{}	{}
heuristics/protection_profiles	19e2d2b1593c97a5	cf0f01bcd7be3e9c
maintenance_updates	maintenance_date: 14.03.2024 maintenance_report_link: https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1052V6MA01a_pdf.pdf maintenance_st_link: https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1052V6MA01b_pdf.pdf maintenance_title: RISE Konnektor V5.2
protection_profiles
protection_profile_links	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0097V2b_pdf.pdf	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename	1052V6c_pdf.pdf	1045V2c_pdf.pdf
pdf_data/cert_frontpage
pdf_data/cert_keywords/cc_cert_id	DE: BSI-DSZ-CC-1052-V6-2024: 1	DE: BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id	BSI: BSI-CC-PP-0097-V2-2020-MA-01: 1	BSI: BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level	EAL: EAL 2: 1 EAL 3: 1 EAL 4: 1 EAL 5: 1	EAL: EAL 2: 1 EAL 4: 1 EAL 4 augmented: 1 EAL 5: 1
pdf_data/cert_keywords/cc_sar	ADV: ADV_FSP.4: 1 ADV_IMP.1: 1 ADV_TDS.3: 1 ALC: ALC_FLR: 1 ALC_FLR.2: 1 ALC_TAT.1: 1 AVA: AVA_VAN.5: 1	ALC: ALC_DVS.2: 1 AVA: AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor		Qualcomm: Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id	ISO: ISO/IEC 15408: 2 ISO/IEC 18045: 2	ISO: ISO/IEC 15408: 2 ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata	/Author: Bundesamt für Sicherheit in der Informationstechnik /Keywords: "Common Criteria, Certification, Zertifizierung, Konnektor" /Subject: Common Criteria, Certification, Zertifizierung, Konnektor /Title: Zertifikat BSI-DSZ-CC-1052-V6-2023 pdf_file_size_bytes: 393917 pdf_hyperlinks: {} pdf_is_encrypted: False pdf_number_of_pages: 1	/Author: Bundesamt für Sicherheit in der Informationstechnik /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 /Title: Certification Report BSI-DSZ-CC-1045-V2-2023 pdf_file_size_bytes: 289421 pdf_hyperlinks: {} pdf_is_encrypted: False pdf_number_of_pages: 1
pdf_data/report_filename	1052V6a_pdf.pdf	1045V2a_pdf.pdf
pdf_data/report_frontpage	DE: cert_id: BSI-DSZ-CC-1052-V6-2024 cert_item: RISE Konnektor, V5.1 cert_lab: BSI developer: Research Industrial Systems Engineering (RISE match_rules: ['(BSI-DSZ-CC-.+?) zu (.+?) der (.*)']	DE: cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2 cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended cert_id: BSI-DSZ-CC-1045-V2-2023 cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100 cert_lab: BSI developer: Qualcomm Technologies Inc match_rules: ['(BSI-DSZ-CC-.+?) (?:for\|For) (.+?) from (.)'] ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014*
pdf_data/report_keywords/cc_cert_id	DE: BSI-DSZ-CC-1052-V5-2022: 2 BSI-DSZ-CC-1052-V6-2024: 19	DE: BSI-DSZ-CC-1045-2019: 3 BSI-DSZ-CC-1045-V2-2023: 17
pdf_data/report_keywords/cc_protection_profile_id	BSI: BSI-CC-PP-0097-V2-2020-: 1 BSI-CC-PP-0097-V2-2020-MA-01: 1 BSI-CC-PP-0097-V2-2021-MA-01: 1	BSI: BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level	EAL: EAL 1: 1 EAL 2: 3 EAL 3: 4 EAL 4: 2 EAL 5: 1 EAL5+: 1 EAL6: 1	EAL: EAL 1: 1 EAL 2: 3 EAL 4: 5 EAL 4 augmented: 3 EAL 5: 4 EAL 5+: 1 EAL 6: 1
pdf_data/report_keywords/cc_sar	ADV: ADV_FSP.4: 4 ADV_IMP.1: 4 ADV_TDS.3: 4 ALC: ALC_FLR: 3 ALC_FLR.2: 4 ALC_TAT.1: 4 AVA: AVA_CCA: 3 AVA_VAN.5: 5	ALC: ALC_CMC.4: 1 ALC_CMS.4: 1 ALC_DEL: 1 ALC_DEL.1: 1 ALC_DVS: 1 ALC_DVS.2: 5 ALC_FLR: 1 ALC_LCD.1: 1 ALC_TAT.1: 1 ATE: ATE_FUN: 1 ATE_IND: 1 AVA: AVA_VAN: 1 AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr	FDP: FDP_UIT: 2
pdf_data/report_keywords/cc_claims	OE: OE.NK: 5	O: O.C: 4 R: R.O: 4
pdf_data/report_keywords/vendor		Qualcomm: Qualcomm: 38
pdf_data/report_keywords/eval_facility	SRC: SRC Security Research & Consulting: 6	DeutscheTelekom: Deutsche Telekom Security: 3 atsec: atsec: 2
pdf_data/report_keywords/symmetric_crypto	AES_competition: AES: AES: 6 AES-: 8 AES-128: 2 constructions: MAC: HMAC: 8 HMAC-SHA-256: 2 HMAC-SHA-384: 1 HMAC-SHA-512: 1	AES_competition: AES: AES: 6 DES: 3DES: TDES: 3 DES: DES: 1 constructions: MAC: CMAC: 2 HMAC: 1 HMAC-SHA-384: 1
pdf_data/report_keywords/asymmetric_crypto	ECC: ECC: ECC: 3 ECDH: ECDH: 3 ECDSA: ECDSA: 3 FF: DH: DH: 8 Diffie-Hellman: 3	ECC: ECC: ECC: 4 ECDH: ECDH: 1 ECDSA: ECDSA: 1
pdf_data/report_keywords/pq_crypto
pdf_data/report_keywords/hash_function	MD: MD5: MD5: 1 SHA: SHA1: SHA-1: 3 SHA2: SHA-2: 1 SHA-256: 6 SHA3: SHA-3: 1	SHA: SHA1: SHA-1: 2 SHA1: 1 SHA2: SHA-256: 6 SHA-384: 2 SHA-512: 2
pdf_data/report_keywords/crypto_scheme	AEAD: AEAD: 1 KEX: Key Exchange: 3
pdf_data/report_keywords/crypto_protocol	IKE: IKE: 2 IKEv2: 9 IPsec: IPsec: 10 TLS: TLS: TLS: 20 TLS 1.2: 2 TLS v1.2: 7 VPN: VPN: 12
pdf_data/report_keywords/randomness		RNG: RNG: 2
pdf_data/report_keywords/cipher_mode	CBC: CBC: 3 GCM: GCM: 4	CBC: CBC: 2 CCM: CCM: 1 CTR: CTR: 1 ECB: ECB: 2
pdf_data/report_keywords/ecc_curve	Brainpool: brainpoolP256r1: 4	NIST: NIST P-192: 2 NIST P-224: 2 NIST P-256: 2 NIST P-384: 2 NIST P-521: 2 P-192: 2 P-224: 2 P-256: 2 P-384: 2 P-521: 2
pdf_data/report_keywords/crypto_engine
pdf_data/report_keywords/tls_cipher_suite
pdf_data/report_keywords/crypto_library
pdf_data/report_keywords/vulnerability
pdf_data/report_keywords/side_channel_analysis	other: JIL: 2	FI: fault injection: 1 SCA: Side-channel: 1 physical probing: 1 other: JIL: 3
pdf_data/report_keywords/technical_report_id	BSI: BSI 7148: 1 BSI TR-02102: 1 BSI TR-03111: 1 BSI TR-03116-1: 1	BSI: BSI 7148: 1 BSI TR-02102: 1
pdf_data/report_keywords/device_model
pdf_data/report_keywords/tee_name
pdf_data/report_keywords/os_name	STARCOS: STARCOS 3: 2
pdf_data/report_keywords/cplc_data
pdf_data/report_keywords/ic_data_group
pdf_data/report_keywords/standard_id	BSI: AIS 1: 1 AIS 14: 1 AIS 19: 1 AIS 20: 2 AIS 23: 1 AIS 31: 1 AIS 32: 1 AIS 34: 1 AIS 38: 1 AIS 46: 1 FIPS: FIPS 180-4: 11 FIPS 186-4: 4 FIPS 197: 4 FIPS 202: 1 FIPS PUB 180-4: 1 ISO: ISO/IEC 15408: 4 ISO/IEC 17065: 2 ISO/IEC 18045: 4 NIST: SP 800-38D: 2 SP 800-56A: 1 SP 800-90A: 1 PKCS: PKCS#1: 4 PKCS#12: 2 RFC: RFC 1321: 1 RFC 2104: 5 RFC 2404: 4 RFC 2898: 2 RFC 3268: 5 RFC 3279: 1 RFC 3526: 4 RFC 3602: 4 RFC 4055: 2 RFC 4301: 4 RFC 4303: 4 RFC 4346: 2 RFC 4492: 4 RFC 4868: 4 RFC 5083: 1 RFC 5084: 1 RFC 5116: 2 RFC 5246: 7 RFC 5280: 2 RFC 5289: 3 RFC 5639: 2 RFC 5652: 1 RFC 5751: 1 RFC 5869: 2 RFC 7027: 4 RFC 7292: 2 RFC 7296: 6 RFC 8017: 8 X509: X.509: 4	BSI: AIS 20: 1 AIS 25: 2 AIS 26: 3 AIS 31: 3 AIS 32: 1 AIS 34: 2 AIS 35: 2 AIS 36: 1 AIS 37: 1 AIS 38: 1 FIPS: FIPS 180-4: 2 FIPS 186-4: 3 FIPS 197: 5 FIPS 198-1: 1 FIPS186-4: 2 FIPS198-1: 1 FIPS46-3: 1 ISO: ISO/IEC 15408: 4 ISO/IEC 17065: 2 ISO/IEC 18045: 4 PKCS: PKCS#1: 3 RFC: RFC3447: 3
pdf_data/report_keywords/javacard_version
pdf_data/report_keywords/javacard_api_const
pdf_data/report_keywords/javacard_packages
pdf_data/report_keywords/certification_process		ConfidentialDocument: 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1 Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1 Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1 Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1 Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1 Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1 TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1 Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1 being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1 for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1 list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1 of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1 process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1 txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1 txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1 v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata	/Author: Bundesamt für Sicherheit in der Informationstechnik /Keywords: "Common Criteria, Certification, Zertifizierung, Konnektor" /Subject: Common Criteria, Certification, Zertifizierung, Konnektor /Title: Zertifizierungsreport BSI-DSZ-CC-1052-V6-2023 pdf_file_size_bytes: 600723 pdf_hyperlinks: https://www.sogis.eu/, https://www.bsi.bund.de/AIS, https://www.commoncriteriaportal.org/, https://www.commoncriteriaportal.org/cc/, https://www.bsi.bund.de/zertifizierung, https://www.bsi.bund.de/zertifizierungsreporte pdf_is_encrypted: False pdf_number_of_pages: 35	/Author: Bundesamt für Sicherheit in der Informationstechnik /Keywords: "BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230" /Subject: BSI, SOG-IS, IT-security, SoC, integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230 /Title: Certification Report BSI-DSZ-CC-1045-V2-2023 pdf_file_size_bytes: 641231 pdf_hyperlinks: http://www.commoncriteriaportal.org/cc/, https://www.sogis.eu/, https://www.bsi.bund.de/AIS, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/zertifizierung, https://www.bsi.bund.de/zertifizierungsreporte, https://www.bsi.bund.de/ pdf_is_encrypted: False pdf_number_of_pages: 29
pdf_data/st_filename	1052V6b_pdf.pdf	1045V2b_pdf.pdf
pdf_data/st_frontpage
pdf_data/st_keywords/cc_cert_id	NL: CC-1052: 1
pdf_data/st_keywords/cc_protection_profile_id	BSI: BSI-CC-PP- 0082-: 1 BSI-CC-PP- 0098-V2: 1 BSI-CC-PP-0097-V2-2020-MA-: 2 BSI-CC-PP-0097-V2-2020-MA-01: 9 BSI-CC-PP-0098-: 1 BSI-CC-PP-0098-V2: 7	BSI: BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level	EAL: EAL3: 14	EAL: EAL4: 1 EAL4 augmented: 1
pdf_data/st_keywords/cc_sar	ADV: ADV_ARC: 2 ADV_ARC.1: 1 ADV_FSP.4: 7 ADV_IMP.1: 9 ADV_TDS.1: 1 ADV_TDS.2: 2 ADV_TDS.3: 7 AGD: AGD_OPE: 1 AGD_OPE.1: 12 AGD_PRE.1: 1 ALC: ALC_DEL.1: 6 ALC_FLR.2: 6 ALC_TAT.1: 8 ATE: ATE_DPT.1: 1 AVA: AVA_VAN: 1 AVA_VAN.5: 10	ALC: ALC_DEL: 1 ALC_DVS: 1 ALC_DVS.2: 1 AVA: AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr	FAU: FAU_GEN: 16 FAU_GEN.1: 5 FAU_GEN.2: 1 FAU_STG: 2 FCS: FCS_CKM: 90 FCS_CKM.1: 14 FCS_CKM.2: 6 FCS_CKM.4: 13 FCS_COP: 77 FCS_COP.1: 12 FDP: FDP_ACC: 11 FDP_ACC.1: 7 FDP_ACF: 8 FDP_ACF.1: 5 FDP_ETC: 9 FDP_ETC.2: 4 FDP_IFC: 20 FDP_IFC.1: 7 FDP_IFF: 21 FDP_IFF.1: 16 FDP_ITC: 9 FDP_ITC.1: 12 FDP_ITC.2: 17 FDP_RIP: 6 FDP_RIP.1: 1 FDP_UIT: 9 FDP_UIT.1: 2 FIA: FIA_UID: 8 FIA_UID.1: 4 FMT: FMT_MOF: 13 FMT_MOF.1: 1 FMT_MSA: 48 FMT_MSA.1: 2 FMT_MSA.3: 6 FMT_MSA.4: 1 FMT_MTD: 8 FMT_MTD.1: 1 FMT_SMF: 18 FMT_SMF.1: 4 FMT_SMR: 23 FMT_SMR.1: 6 FMT_SMR.1.1: 1 FPT: FPT_EMS: 17 FPT_EMS.1: 7 FPT_EMS.1.1: 2 FPT_EMS.1.2: 2 FPT_STM: 11 FPT_STM.1: 2 FPT_TDC: 22 FPT_TDC.1: 6 FPT_TST: 7 FPT_TST.1: 3 FTP: FTP_ITC: 50 FTP_ITC.1: 26 FTP_TRP: 14 FTP_TRP.1: 5	FAU: FAU_GEN: 1 FAU_SAS.1: 4 FAU_SAS.1.1: 1 FCS: FCS_CKM: 62 FCS_CKM.1: 16 FCS_CKM.2: 3 FCS_CKM.4: 16 FCS_COP: 49 FCS_COP.1: 12 FCS_ITC.1: 13 FCS_ITC.2: 13 FCS_RNG.1: 3 FCS_RNG.1.1: 1 FCS_RNG.1.2: 1 FDP: FDP_ACC: 4 FDP_ACC.1: 2 FDP_ACC.2: 3 FDP_ACC.2.1: 1 FDP_ACC.2.2: 1 FDP_ACF: 3 FDP_ACF.1: 4 FDP_ACF.1.1: 1 FDP_ACF.1.2: 1 FDP_ACF.1.3: 1 FDP_ACF.1.4: 1 FDP_ICT.1: 1 FDP_IFC.1: 5 FDP_IFC.1.1: 2 FDP_IFF.1: 1 FDP_ITC.1: 8 FDP_ITC.1.1: 1 FDP_ITC.1.2: 1 FDP_ITC.1.3: 1 FDP_ITT.1: 3 FDP_ITT.1.1: 1 FDP_RIP: 10 FDP_RIP.1: 2 FDP_SDA: 3 FDP_SDA.1: 12 FDP_SDA.1.1: 2 FDP_SDC.1: 11 FDP_SDC.1.1: 2 FDP_SDI: 2 FDP_SDI.2: 18 FDP_SDI.2.1: 3 FDP_SDI.2.2: 3 FDP_SDR: 3 FDP_SDR.1: 12 FDP_SDR.1.1: 2 FMT: FMT_CMT: 2 FMT_CMT.1: 35 FMT_CMT.1.1: 7 FMT_LIM.1: 5 FMT_LIM.1.1: 1 FMT_LIM.2: 5 FMT_LIM.2.1: 1 FMT_MSA: 5 FMT_MSA.1: 2 FMT_MSA.3: 7 FMT_SMR.1: 1 FPT: FPT_FLS.1: 5 FPT_FLS.1.1: 1 FPT_ITT.1: 3 FPT_ITT.1.1: 1 FPT_PHP.3: 3 FPT_PHP.3.1: 1 FRU: FRU_FLT.2: 4 FRU_FLT.2.1: 1
pdf_data/st_keywords/cc_claims	A: A.NK: 56 O: O.AK: 1 O.NK: 196 OE: OE.NK: 164 OSP: OSP.NK: 22 T: T.NK: 142	O: O.AES: 3 O.CMAC: 4 O.ECDH: 4 O.ECDSA: 4 O.HMAC: 4 O.KDF: 4 O.RND: 1 O.RSA_ENC: 4 O.RSA_SIGN: 4 O.SHA: 3 O.TDES: 3 T: T.AUTH-APPLI-DATA: 3 T.AUTH-TSF-DATA: 3 T.CONFID-APPLI-: 1 T.CONFID-APPLI-DATA: 4 T.CONFID-TSF-CODE: 3 T.CONFID-TSF-DATA: 4 T.INTEG-: 1 T.INTEG-APPLI-: 1 T.INTEG-APPLI-CODE: 2 T.INTEG-APPLI-DATA: 5 T.INTEG-TSF-CODE: 3 T.INTEG-TSF-DATA: 3 T.RBP-APPLI-DATA: 3 T.RBP-TSF-DATA: 3 T.RND: 1
pdf_data/st_keywords/vendor		Qualcomm: Qualcomm: 22
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto	AES_competition: AES: AES: 22 AES-128: 3 AES-256: 2 HPC: HPC: 1 constructions: MAC: HMAC: 31 HMAC-SHA-256: 1 HMAC-SHA-384: 1 HMAC-SHA-512: 1	AES_competition: AES: AES: 32 AES-256: 1 DES: 3DES: TDEA: 1 TDES: 25 Triple-DES: 3 constructions: MAC: CMAC: 16 HMAC: 25 HMAC-SHA-384: 1
pdf_data/st_keywords/asymmetric_crypto	ECC: ECC: ECC: 4 ECDSA: ECDSA: 2 FF: DH: Diffie-Hellman: 1	ECC: ECC: ECC: 9 ECDH: ECDH: 11 ECDSA: ECDSA: 11 FF: DH: Diffie-Hellman: 2
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function	SHA: SHA1: SHA-1: 3 SHA2: SHA-2: 2 SHA-256: 6 SHA256: 2	SHA: SHA1: SHA-1: 10 SHA1: 1 SHA2: SHA-256: 15 SHA-384: 8 SHA-512: 8
pdf_data/st_keywords/crypto_scheme	KEX: Key Exchange: 4 MAC: MAC: 1	MAC: MAC: 1
pdf_data/st_keywords/crypto_protocol	IKE: IKE: 25 IKEv2: 8 IPsec: IPsec: 31 TLS: SSL: SSL: 2 TLS: TLS: 143 TLS 1.2: 2 TLS 1.3: 1 VPN: VPN: 58
pdf_data/st_keywords/randomness	RNG: RNG: 13	PRNG: DRBG: 1 RNG: RND: 2 RNG: 17
pdf_data/st_keywords/cipher_mode	CBC: CBC: 2 GCM: GCM: 3	CBC: CBC: 4 CCM: CCM: 4 CTR: CTR: 2 ECB: ECB: 4
pdf_data/st_keywords/ecc_curve	Brainpool: brainpoolP256r1: 2 brainpoolP384r1: 1 NIST: P-256: 2 P-384: 2	NIST: NIST P-192: 5 NIST P-224: 2 NIST P-256: 2 NIST P-384: 2 NIST P-521: 2 P-192: 13 P-224: 16 P-256: 12 P-384: 14 P-521: 16
pdf_data/st_keywords/crypto_engine
pdf_data/st_keywords/tls_cipher_suite	TLS: TLS_DHE_RSA_WITH_AES_128_CBC_SHA: 2 TLS_DHE_RSA_WITH_AES_256_CBC_SHA: 2 TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256: 3 TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384: 3 TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA: 2 TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256: 2 TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256: 2 TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA: 2 TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA384: 2 TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384: 2
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis	SCA: side channel: 1	FI: DFA: 4 Malfunction: 3 fault injection: 2 malfunction: 3 SCA: Leak-Inherent: 3 Physical Probing: 2 Side-channel: 1 physical probing: 4 side channel: 4 side channels: 1 side-channel: 2 other: cold boot: 4
pdf_data/st_keywords/technical_report_id	BSI: BSI 4: 1 BSI TR-03116-1: 3 BSI TR-03144: 1
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name		ARM: ARM TrustZone: 1
pdf_data/st_keywords/os_name	STARCOS: STARCOS 3: 2
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id	CC: CCMB-2017-04-002: 1 CCMB-2017-04-003: 1 CCMB-2017-04-004: 1 FIPS: FIPS 180-4: 1 FIPS 197: 2 FIPS PUB 180-4: 4 PKCS: PKCS #12: 1 PKCS#12: 2 RFC: RFC 1323: 1 RFC 2104: 3 RFC 2131: 2 RFC 2132: 2 RFC 2401: 1 RFC 2402: 1 RFC 2404: 2 RFC 2406: 2 RFC 2460: 1 RFC 2560: 1 RFC 2663: 1 RFC 3268: 1 RFC 3279: 1 RFC 3526: 1 RFC 3602: 3 RFC 3947: 1 RFC 4035: 1 RFC 4055: 2 RFC 4301: 5 RFC 4302: 2 RFC 4303: 6 RFC 4330: 1 RFC 4346: 1 RFC 4868: 2 RFC 5246: 4 RFC 5280: 1 RFC 5289: 2 RFC 5639: 1 RFC 5905: 1 RFC 7296: 8 RFC 791: 1 RFC 793: 1 RFC 8017: 3 RFC 8422: 2 RFC 8446: 1 RFC 958: 1 RFC-5639: 1 RFC-7027: 1 X509: X.509: 14	CC: CCMB-2017-04-001: 1 CCMB-2017-04-002: 1 CCMB-2017-04-003: 1 FIPS: FIPS 180-4: 3 FIPS 186-4: 4 FIPS 197: 5 FIPS 198-1: 2 FIPS PUB 180-4: 4 FIPS PUB 186-4: 5 FIPS PUB 197: 3 FIPS PUB 198-1: 3 FIPS186-4: 2 FIPS198-1: 1 FIPS46-3: 1 NIST: NIST SP 800-108: 3 NIST SP 800-38A: 3 NIST SP 800-38B: 2 NIST SP 800-38C: 1 NIST SP 800-56A: 1 NIST SP 800-67: 1 NIST SP 800-90A: 1 PKCS: PKCS#1: 7 RFC: RFC3447: 3 RFC5639: 3
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata	/Author: RISE /Subject: RISE-Konnektor /Title: RISE-Konnektor pdf_file_size_bytes: 1443373 pdf_hyperlinks: https://www.dimdi.de/, https://www.rfc-editor.org/rfc/rfc8017.txt, https://www.rfc-editor.org/rfc/rfc4868.txt, http://tools.ietf.org/html/rfc4302, https://www.ietf.org/rfc/rfc5996.txt, http://tools.ietf.org/html/rfc4301, http://www.ietf.org/rfc/rfc5280.txt, http://tools.ietf.org/html/rfc2663, http://tools.ietf.org/html/rfc4330, https://www.rfc-editor.org/rfc/rfc2404.txt, http://tools.ietf.org/html/rfc2402, https://www.rfc-editor.org/rfc/rfc3526.txt, https://www.rfc-editor.org/rfc/rfc3602.txt, https://www.ietf.org/rfc/rfc2131.txt, http://csrc.nist.gov/publications/fips/fips197/fips-197.pdf, http://tools.ietf.org/html/rfc791, http://www.eecis.udel.edu/~mills/ntp/html/release.html, http://www.dimdi.de/, https://www.ietf.org/rfc/rfc4303.txt, https://www.gematik.de/, http://tools.ietf.org/html/rfc4303, http://tools.ietf.org/html/rfc958, https://www.ietf.org/rfc/rfc5905.txt, https://www.ietf.org/rfc/rfc2406.txt, http://www.ietf.org/rfc/rfc5639.txt, http://tools.ietf.org/html/rfc2460, https://www.ietf.org/rfc/rfc2132.txt, http://tools.ietf.org/html/rfc2406, http://tools.ietf.org/html/, http://tools.ietf.org/html/rfc1323, http://www.bundesnetzagentur.de/, https://www.ietf.org/rfc/rfc4035.txt, http://www.gematik.de/, http://tools.ietf.org/html/rfc2401, https://www.bmg.bund.de/, https://www.rfc-editor.org/rfc/rfc4055.txt, https://www.ietf.org/rfc/rfc7296.txt, http://tools.ietf.org/html/rfc793 pdf_is_encrypted: False pdf_number_of_pages: 156	/Author: QTI /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230 /Subject: 80-NU430-6 Rev.H /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite pdf_file_size_bytes: 824155 pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/ pdf_is_encrypted: False pdf_number_of_pages: 61
state/cert/convert_garbage	False	False
state/cert/convert_ok	True	True
state/cert/download_ok	True	True
state/cert/extract_ok	True	True
state/cert/pdf_hash	Different	Different
state/cert/txt_hash	Different	Different
state/report/convert_garbage	False	False
state/report/convert_ok	True	True
state/report/download_ok	True	True
state/report/extract_ok	True	True
state/report/pdf_hash	Different	Different
state/report/txt_hash	Different	Different
state/st/convert_garbage	False	False
state/st/convert_ok	True	True
state/st/download_ok	True	True
state/st/extract_ok	True	True
state/st/pdf_hash	Different	Different
state/st/txt_hash	Different	Different