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EMC® VNX OE for Block v5.31 with Unisphere™ v7.0 running on VNX Series Hardware Model VNX5100™ and EMC® VNX OE for File v7.0 and VNX OE for Block v5.31 with Unisphere™ v7.0 running on VNX Series Hardware Models VNX5300™, VNX5500™, VNX5700™, and VNX7500™
383-4-172 		Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023
name EMC® VNX OE for Block v5.31 with Unisphere™ v7.0 running on VNX Series Hardware Model VNX5100™ and EMC® VNX OE for File v7.0 and VNX OE for Block v5.31 with Unisphere™ v7.0 running on VNX Series Hardware Models VNX5300™, VNX5500™, VNX5700™, and VNX7500™ Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
scheme CA DE
status archived active
not_valid_after 15.05.2017 03.03.2028
not_valid_before 30.05.2011 03.03.2023
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/emc-vnx-v531-cert-eng.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/emc-vnx-v531-sec-eng.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf
manufacturer EMC Corporation Qualcomm Technologies Inc.
manufacturer_web https://www.emc.com/ https://www.qualcomm.com
security_level EAL3+, ALC_FLR.2 ALC_DVS.2, EAL4+, AVA_VAN.5
dgst 5c135ac1bf057d70 ac18c15a88b4b1bd
heuristics/cert_id 383-4-172 BSI-DSZ-CC-1045-V2-2023
heuristics/cert_lab CANADA BSI
heuristics/extracted_sars ASE_INT.1, AVA_VAN.2, ALC_CMC.3, ALC_CMS.3, ASE_ECD.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ADV_TDS.2, ALC_DEL.1, ALC_LCD.1, AGD_OPE.1, AGD_PRE.1, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ATE_DPT.1, ALC_FLR.2, ASE_REQ.2, ALC_DVS.1, ATE_IND.2, ADV_FSP.3, ASE_CCL.1 ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_DVS.2, ALC_CMC.4
heuristics/extracted_versions 7.0, 5.31 1.1.2
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1045-2019
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-1045-2019
heuristics/scheme_data
  • category: System on a chip (SOC)
  • cert_id: BSI-DSZ-CC-1045-V2-2023
  • certification_date: 03.03.2023
  • enhanced:
    • applicant: Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA
    • assurance_level: EAL4+; ALC_DVS.2, AVA_VAN.5
    • cert_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2
    • certification_date: 03.03.2023
    • description: The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.
    • entries: [frozendict({'id': 'BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target Zertifikat / Certificate', 'description': 'has been extended by additional cryptographic functions.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})]
    • evaluation_facility: T-Systems International GmbH atsec information security GmbH
    • expiration_date: 02.03.2028
    • product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
    • report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2
    • target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2
  • product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html
  • vendor: Qualcomm Technologies Inc.
heuristics/protection_profiles {} cf0f01bcd7be3e9c
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename 1045V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename emc-vnx-v531-cert-eng.pdf 1045V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • CA:
    • cert_id: 383-4-172-CR
    • cert_lab: CANADA
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • CA:
pdf_data/report_keywords/cc_cert_id
  • CA:
    • 383-4-172: 1
    • 383-4-172-CR: 1
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 3: 4
    • EAL 3+: 3
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_FLR.2: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 4
  • R:
    • R.O: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
pdf_data/report_keywords/eval_facility
  • EWA:
    • EWA-Canada: 3
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • ISO:
    • ISO/IEC 17025:2005: 1
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
  • /AM_ACPP_Date: [dd month yyyy]
  • /AM_ACPP_Doc#: [AM_AMCPP_Doc#]
  • /AM_ACPP_Title: Assurance Continuity Program Plan (ACPP)
  • /AM_ACPP_Version: [AM_AMCPP_Version]
  • /AM_IAR_Date: [dd month yyyy]
  • /AM_IAR_Doc#: [AM_IAR_Doc#]
  • /AM_IAR_Title: Assurance Maintenace Impact Analysis Report
  • /AM_IAR_Version: [AM_IAR_Version]
  • /AM_ST Date: [dd month yyyy]
  • /AM_ST Title: [AM_ST Title]
  • /AM_ST Version: [AM_ST Version]
  • /AM_TOE: [AM_TOE]
  • /AM_TOE Short: [AM_TOE Short]
  • /AM_TOE Version: [AM_TOE Version]
  • /Author: sjackson
  • /CC Version: 3.1R3
  • /CC date: July 2009
  • /CEM Version: 3.1R3
  • /CEM date: July 2009
  • /CR_Date: TBD
  • /CR_Version: 1.0
  • /Client City: Hopkinton
  • /Client Country: USA
  • /Client Full Name: EMC Corporation
  • /Client Postal Code: 01748
  • /Client Short Name: EMC
  • /Client State: MA
  • /Client Street: 171 South Street
  • /Comments: PCR Template Version 0.1-EWA-C (for CC 3.1)
  • /Company: Hewlett-Packard
  • /CreationDate: D:20110708105045-04'00'
  • /Creator: Acrobat PDFMaker 10.0 for Word
  • /Developer Long Name: EMC Corporation
  • /Developer Short Name: EMC
  • /EAL Level: 3+
  • /EAL Level Base: 3
  • /EAL Level Text: 3 augmented
  • /EAL Long: EAL 3 Augmented
  • /EAL Short: EAL 3+
  • /ER Document Date: 15 September 2010
  • /ER Version: Version 1.0
  • /ETPlan_Doc#: 1683-000-D003
  • /ETPlan_Title: Evaluation Test Plan
  • /ETPlan_Version: 1.0
  • /ETPlan_date: 7 April 2011
  • /ETProcRes_Date: 7 April 2011
  • /ETProcRes_Doc#: 1683-000-D004
  • /ETProcRes_Title: Evaluation Test Procedures and Test results
  • /ETProcRes_Version: 1.0
  • /ETProc_Date: 7 April 2011
  • /ETProc_Doc#: 1683-000-D004
  • /ETProc_Title: Evaluation Test Procedures and Test results
  • /ETProc_Version: 1.0
  • /ETReport_Date: 30 May 2011
  • /ETReport_Doc#: 1683-000-D002
  • /ETReport_Title: Evaluation Technical Report
  • /ETReport_TitleShort: ETR
  • /ETReport_Version: 1.2
  • /EWP_Date: 12 November 2010
  • /EWP_Doc#: 1683-000-D001
  • /EWP_Title: Evaluation Work Plan
  • /EWP_Version: 1.0
  • /Eval number: 383-4-172
  • /Eval_End_Date: 1 July 2011
  • /Eval_Start_Date: 2 August 2010
  • /Keywords:
  • /LeadEvaluator: Greg Lague
  • /LeadEvaluatorInitials: GL
  • /ModDate: D:20110708105130-04'00'
  • /Producer: Acrobat Distiller 10.0.0 (Windows)
  • /ProjectManager: M. Gauvreau
  • /ProjectManagerInitials: MG
  • /ProjectNumber: 1683
  • /ST_Date: 27 May 2011
  • /ST_Title: EMC® VNX OE for Block v5.31 with Unisphere™ running on VNX Series Hardware Model VNX5100™ and EMC® VNX OE (VNX for File v7.0 and VNX for Block v5.31) with Unisphere™ running on VNX Series Hardware Models VNX5300™, VNX5500™, VNX5700™, and VNX7500™
  • /ST_Version: 0.8
  • /SVC_Date: 9 December 2009
  • /SVC_Doc#: 1683-000-D007
  • /SVC_Title: Site Visit Checklist
  • /SVC_Version: 0.1
  • /SVR_Date: 7 April 2011
  • /SVR_Doc#: 1683-000-D006
  • /SVR_Title: Site Visit Report
  • /SVR_Version: 1.0
  • /SV_City: Hopkinton, MA
  • /Security Classification: EWA-Canada & EMC Proprietary
  • /SourceModified: D:20110708141631
  • /Sponsor: EMC
  • /Sponsor City: Hopkinton
  • /Sponsor Country: USA
  • /Sponsor Postal Code: 01748
  • /Sponsor State: MA
  • /Sponsor Street: 171 South Street
  • /Subject:
  • /TOE: EMC® VNX OE for Block v5.31 with Unisphere™ running on VNX Series Hardware Model VNX5100™ and EMC® VNX OE (VNX for File v7.0 and VNX for Block v5.31) with Unisphere™ running on VNX Series Hardware Models VNX5300™, VNX5500™, VNX5700™, and VNX7500™
  • /TOE Short: EMC® VNX OE
  • /TOE Short with version: EMC® VNX OE
  • /TOE Short-NoTM: EMC® VNX OE
  • /TOE Version: Block v5.31 and File v7.0
  • /TOE with version: EMC® VNX OE for Block v5.31 and File v7.0 with Unisphere™ running on VNX Series Hardware
  • /TOE-NoTM: EMC VNX OE for Block v5.31 and File v7.0 with Unisphere running on VNX Series Hardware
  • /Title: EAL X+ Evaluation of [Developer Long Name]
  • pdf_file_size_bytes: 89946
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 12
pdf_data/st_filename emc-vnx-v531-sec-eng.pdf 1045V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL3: 1
    • EAL3 augmented: 1
    • EAL3+: 4
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.3: 1
    • ADV_TDS.2: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.3: 1
    • ALC_CMS.3: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_FLR.2: 4
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 7
    • FAU_GEN.1.1: 1
    • FAU_GEN.1.2: 1
    • FAU_SAR.1: 6
    • FAU_SAR.1.1: 1
    • FAU_SAR.1.2: 1
  • FDP:
    • FDP_ACC: 20
    • FDP_ACC.1: 2
    • FDP_ACF: 17
    • FDP_ACF.1: 8
    • FDP_SDI.1: 1
    • FDP_SDI.2: 7
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FIA:
    • FIA_ATD.1: 6
    • FIA_ATD.1.1: 1
    • FIA_UAU.1: 1
    • FIA_UAU.2: 7
    • FIA_UAU.2.1: 1
    • FIA_UID.1: 8
    • FIA_UID.2: 9
    • FIA_UID.2.1: 1
  • FMT:
    • FMT_MSA: 32
    • FMT_MSA.1: 2
    • FMT_MSA.3: 4
    • FMT_MTD: 18
    • FMT_MTD.1: 3
    • FMT_SMF.1: 16
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 20
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_STM.1: 3
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
pdf_data/st_keywords/cc_claims
  • A:
    • A.MANAGE: 2
    • A.NOEVIL: 2
    • A.PHYSICAL: 2
    • A.PROTECT: 2
    • A.TIMESTAMP: 2
  • O:
    • O.ADMIN: 23
    • O.AUDIT: 4
    • O.AUDIT_REVIEW: 4
    • O.BYPASS: 7
    • O.PROTECT: 16
  • OE:
    • OE.PROPER_NAME_ASSIGNME: 2
    • OE.PROPER_NAME_ASSIGNMEN: 1
    • OE.SECURE_COMMUNICATIO: 6
    • OE.SECURE_COMMUNICATION: 1
    • OE.SECURE_SERVERS: 7
    • OE.TIME: 3
  • T:
    • T.DATA_CORRUPTION: 2
    • T.IMPROPER_CONFIG: 2
    • T.IMPROPER_SERVER: 2
    • T.MEDIATE_ACCESS: 2
    • T.UNAUTH: 2
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Microsoft:
    • Microsoft: 4
  • Qualcomm:
    • Qualcomm: 22
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/crypto_protocol
  • SSH:
    • SSH: 4
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
pdf_data/st_metadata
  • /Author: Greg Milliken
  • /CreationDate: D:20110527131502Z
  • /Creator: Microsoft® Office Word 2007
  • /ModDate: D:20110621111006-04'00'
  • /Producer: Microsoft® Office Word 2007
  • /Subject: EMC® VNX OE for Block v5.31 with Unisphere™ v7.0 running on VNX Series Hardware Model VNX5100™ and EMC® VNX OE for File v7.0 and VNX OE for Block v5.31 with Unisphere™ v7.0 running on VNX Series Hardware Models VNX5300™, VNX5500™, VNX5700™, and VNX7500™
  • /Title: Security Target
  • pdf_file_size_bytes: 887892
  • pdf_hyperlinks: mailto:[email protected], http://www.corsec.com/, http://www.emc.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 49
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
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