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ECOSYS M3860idnf, ECOSYS M3860idnfG(KYOCERA), P-6038ifMFP(TA Triumph-Adler/UTAX), with HDD
None 		NXP Smart Card Controller P60D080PVC and its major configurations P60D052PVC, P60D040PVC, P60C080PVC, P60C052PVC and P60C040PVC
BSI-DSZ-CC-0837-2013
name ECOSYS M3860idnf, ECOSYS M3860idnfG(KYOCERA), P-6038ifMFP(TA Triumph-Adler/UTAX), with HDD NXP Smart Card Controller P60D080PVC and its major configurations P60D052PVC, P60D040PVC, P60C080PVC, P60C052PVC and P60C040PVC
category Multi-Function Devices ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme SE DE
status active archived
not_valid_after 26.05.2025 01.09.2019
not_valid_before 26.05.2020 24.06.2013
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Kyocera%20ECOSYS%20with%20HDD%20-%20Certifikat%20CCRA_signerat.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Kyocera%20ECOSYS%20with%20HDD%20-%20Certification%20Report.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0837a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Kyocera%20ECOSYS%20with%20HDD%20-%20ST%20v.%20104.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0837b_pdf.pdf
manufacturer KYOCERA Document Solutions Inc. NXP Semiconductors Germany GmbH Business Line Identification
manufacturer_web https://www.kyoceradocumentsolutions.com/ https://www.nxp.com
security_level EAL2+, ALC_FLR.2 EAL6+, ALC_FLR.1
dgst 52f7856d28ac37d9 6e6d45dbf30497f8
heuristics/cert_id BSI-DSZ-CC-0837-2013
heuristics/cert_lab [] BSI
heuristics/extracted_sars ALC_FLR.2 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, APE_ECD.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, APE_REQ.2, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, APE_CCL.1, ADV_IMP.2, ALC_CMC.5, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, APE_INT.1, APE_SPD.1, ATE_IND.2, APE_OBJ.2, ASE_CCL.1, ATE_COV.3, ADV_SPM.1
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-0893-2014, BSI-DSZ-CC-0892-2014, ANSSI-CC-2014/86, NSCIB-CC-12-36243-CR, BSI-DSZ-CC-0861-2014
heuristics/report_references/indirectly_referenced_by {} ANSSI-CC-2015/37, ANSSI-CC-2016/04, NSCIB-CC-12-36243-CR2, ANSSI-CC-2016/03, BSI-DSZ-CC-0892-2014, ANSSI-CC-2015/03, ANSSI-CC-2015/41, ANSSI-CC-2015/44, ANSSI-CC-2015/39, ANSSI-CC-2015/02, ANSSI-CC-2015/30, ANSSI-CC-2014/86, BSI-DSZ-CC-0892-V2-2015, ANSSI-CC-2015/74, NSCIB-CC-12-36243-CR, ANSSI-CC-2015/01, ANSSI-CC-2015/04, ANSSI-CC-2015/75, ANSSI-CC-2015/38, ANSSI-CC-2016/63, BSI-DSZ-CC-0861-2014, BSI-DSZ-CC-0893-2014, ANSSI-CC-2015/40, ANSSI-CC-2015/08, ANSSI-CC-2015/15
heuristics/st_references/directly_referenced_by {} ANSSI-CC-2015/08
heuristics/st_references/indirectly_referenced_by {} ANSSI-CC-2015/08
heuristics/protection_profiles {} f6d23054061d72ba
maintenance_updates
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/report_filename 0837a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cert_id: BSI-DSZ-CC-0837-2013
    • cert_item: NXP Smart Card Controller P60D080PVC and its major configurations P60D052PVC, P60D040PVC, P60C080PVC, P60C052PVC and P60C040PVC
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0837: 1
    • BSI-DSZ-CC-0837-2013: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 4: 3
    • EAL 5: 3
    • EAL 6: 4
    • EAL 6 augmented: 3
    • EAL1: 7
    • EAL2: 3
    • EAL3: 4
    • EAL4: 7
    • EAL5: 7
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 2
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 1
    • ADV_INT.3: 2
    • ADV_SPM: 1
    • ADV_SPM.1: 2
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_TDS.5: 2
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 1
    • ALC_CMC.5: 3
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 3
    • ALC_FLR: 1
    • ALC_FLR.1: 6
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 1
    • ALC_TAT.3: 3
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 3
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 2
    • ATE_COV.3: 2
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 3
    • ATE_DPT.4: 1
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_FUN.2: 2
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 2
pdf_data/report_keywords/cc_sfr
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 21
    • NXP Semiconductors: 31
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 4
  • DES:
    • 3DES:
      • Triple-DES: 3
    • DES:
      • DES: 2
pdf_data/report_keywords/asymmetric_crypto
pdf_data/report_keywords/pq_crypto
pdf_data/report_keywords/hash_function
pdf_data/report_keywords/crypto_scheme
pdf_data/report_keywords/crypto_protocol
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
pdf_data/report_keywords/ecc_curve
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 12
pdf_data/report_keywords/tls_cipher_suite
pdf_data/report_keywords/crypto_library
pdf_data/report_keywords/vulnerability
pdf_data/report_keywords/side_channel_analysis
  • SCA:
    • physical probing: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/device_model
pdf_data/report_keywords/tee_name
pdf_data/report_keywords/os_name
pdf_data/report_keywords/cplc_data
pdf_data/report_keywords/ic_data_group
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
pdf_data/report_keywords/javacard_version
pdf_data/report_keywords/javacard_api_const
pdf_data/report_keywords/javacard_packages
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 3.0, 2012-10-18 (confidential document) [16] Product Data Sheet Addendum, SmartMX2 family, Post Delivery Configuration, NXP Semiconductors: 1
    • Evaluation Technical Report, BSI-DSZ-CC-0837, Version 4, 2013-03-27, TÜV Informationstechnik GmbH (confidential document) [10] ETR for composite evaluation according to AIS 36 for the Product NXP Secure Smart Card: 1
    • P60x080/052/040PVC, Version 5, 2013-04-23, [9] TÜV Informationstechnik GmbH (confidential document) [11] NXP Secure Smart Card Controller P60x080/052/040PVC, Configuration List, NXP Semiconductors: 1
    • Rev. 1.0, 2012-11-22 (confidential document) [15] Wafer and delivery specification, SmartMX2 family P60x040/052/080 VC, NXP Semiconductors, Rev: 1
    • Rev. 3.1, 2012-12-12 (confidential document) [17] Product Data Sheet Addendum, SmartMX2 family, Chip Health Mode, NXP Semiconductors, Rev. 3.0: 1
    • Rev. 3.3, 2012-12-11 (confidential document) [19] Order Entry Form, P60D080, NXP Semiconductors, Version 0.2, 2012-05-07 [20] Order Entry Form: 1
    • Unit Identification, Rev 01.00, 2012-12-11 (confidential document) 9 specifically • AIS 20, Version 2, Funktionalitätsklassen und Evaluationsmethodologie für: 1
    • Unit Identification, Rev. 3.1, 2012-02-02 (confidential document) [14] Guidance and Operation Manual, NXP Secure Smart Card Controller P60x040/052/080VC, NXP: 1
    • Version 1.0, 2012-12-13, NXP Secure Smart Card Controller P60x080/052/040PVC, NXP Semiconductors (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [8: 1
    • confidential document) [18] Product Data Sheet Addendum, SmartMX2 family, Firmware Interface Specification, Firmware, NXP: 1
    • family P60x040/052/080 VC, NXP Semiconductors, Business Unit Identification, Rev. 3.0, 2012-10-31 (confidential document) [13] Instruction set for the SmartMX2 family, Secure smart card controller, NXP Semiconductors: 1
pdf_data/report_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20130702103841+02'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, smart card, security controller, chip platform, NXP P60"
  • /ModDate: D:20130702105453+02'00'
  • /Producer: LibreOffice 3.6
  • /Subject: IT security
  • /Title: Certification Report BSI-DSZ-CC-0837-2013
  • pdf_file_size_bytes: 1090954
  • pdf_hyperlinks: https://www.bsi.bund.de/zertifizierung, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 38
pdf_data/st_filename 0837b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0837: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 6: 2
    • EAL4: 3
    • EAL4 augmented: 1
    • EAL4+: 1
    • EAL6: 36
    • EAL6 augmented: 3
    • EAL6+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.4: 3
    • ADV_FSP.5: 11
    • ADV_IMP: 1
    • ADV_IMP.2: 4
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 4
    • ALC_CMC.4: 3
    • ALC_CMC.5: 4
    • ALC_CMS: 4
    • ALC_CMS.4: 3
    • ALC_CMS.5: 5
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 2
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 5
    • FCS_CKM.4: 3
    • FCS_COP.1: 23
    • FCS_COP.1.1: 2
    • FCS_RNG.1: 9
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 36
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 32
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_FLS.1: 1
    • FDP_IFC.1: 11
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
    • FDP_ITT.1: 14
    • FDP_SDI.1: 1
    • FDP_SDI.2: 7
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 25
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 20
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 19
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 7
    • FPT_ITT.1: 13
    • FPT_PHP.3: 7
  • FRU:
    • FRU_FLT.2: 7
  • FTP:
    • FTP_ITT.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.CUST_RECONFIG: 5
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.HW_AES: 7
    • O.INTEGRITY_CHK: 7
    • O.MEM_ACCESS: 9
    • O.RND: 3
    • O.SFR_ACCESS: 9
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 108
    • NXP Semiconductors: 33
  • Philips:
    • Philips: 1
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 33
  • DES:
    • 3DES:
      • TDEA: 3
      • TDES: 1
      • Triple-DEA: 1
      • Triple-DES: 9
    • DES:
      • DEA: 2
      • DES: 16
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function
pdf_data/st_keywords/crypto_scheme
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 14
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
pdf_data/st_keywords/ecc_curve
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 18
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 13
    • fault injection: 3
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 13
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • timing attacks: 2
pdf_data/st_keywords/technical_report_id
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2009-07-001: 1
    • CCMB-2009-07-002: 2
    • CCMB-2009-07-003: 2
    • CCMB-2009-07-004: 2
  • FIPS:
    • FIPS PUB 197: 3
    • FIPS PUB 46: 1
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 14443: 20
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 22
    • ISO/IEC 7816-3: 1
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata
  • /Author: NXP Semiconductors
  • /CreationDate: D:20121219105730
  • /Creator: Microsoft® Office Word 2007
  • /Keywords: CC Security Evaluation, Security Target, Functional Requirements, Security Functionality, Assurance Level EAL6+, P60D144PVA, P60D080PVA
  • /ModDate: D:20121219120949+01'00'
  • /Producer: Microsoft® Office Word 2007
  • /Subject: P60x080/052/040PVC
  • /Title: Security Target
  • pdf_file_size_bytes: 1374099
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 82
state/report/convert_ok False True
state/report/download_ok False True
state/report/extract_ok False True
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/convert_ok False True
state/st/download_ok False True
state/st/extract_ok False True
state/st/pdf_hash Different Different
state/st/txt_hash Different Different