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Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
2019-48-INF-3811 		S3FV9VH 32-Bit RISC Microcontroller for Smart Cards, Revision 0 including specific IC Dedicated Software
BSI-DSZ-CC-1026-2017
name Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A S3FV9VH 32-Bit RISC Microcontroller for Smart Cards, Revision 0 including specific IC Dedicated Software
scheme ES DE
status active archived
not_valid_after 07.06.2027 08.12.2022
not_valid_before 07.06.2022 08.12.2017
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48_Certificado.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20INF-3811.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1026a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1026b_pdf.pdf
manufacturer Winbond Electonics Corporation Samsung Electronics Co., Ltd.
manufacturer_web https://www.winbond.com/ https://www.samsung.com
security_level ALC_DVS.2, EAL5+, AVA_VAN.5 EAL6+, ASE_TSS.2
dgst 51a1149f945dea23 fbbd023618bad95b
heuristics/cert_id 2019-48-INF-3811 BSI-DSZ-CC-1026-2017
heuristics/cert_lab [] BSI
heuristics/extracted_sars ADV_ARC.1, AVA_VAN.5, ATE_COV.2, ADV_FSP.5, ASE_TSS.1, AGD_OPE.1, ADV_IMP.1, ATE_DPT.3, ADV_TDS.4, ASE_REQ.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ASE_ECD.1, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ADV_INT.2, ALC_TAT.2, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_CMC.4, ALC_LCD.1 ADV_IMP.2, AVA_VAN.5, ADV_ARC.1, ADV_FSP.5, ALC_CMC.5, ADV_TDS.5, AGD_OPE.1, ATE_DPT.3, ATE_COV.3, ASE_TSS.2, ASE_REQ.2, ADV_SPM.1, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ATE_IND.2, ASE_ECD.1, ADV_INT.3, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ALC_TAT.3, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_LCD.1
heuristics/extracted_versions - 32, 0
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 07.06.2022
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1478
    • certification_date: 07.06.2022
    • description: The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1479
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1477
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/826-winbond-spiflash-trustme-secure-flash-memory-w75f40wbyjeg-version-a
heuristics/protection_profiles {} cf0f01bcd7be3e9c
maintenance_updates
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename 2019-48_Certificado.pdf
pdf_data/cert_keywords/cc_cert_id
pdf_data/cert_keywords/cc_protection_profile_id
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880365
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 2019-48 INF-3811.pdf 1026a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1026-2017
    • cert_item: S3FV9VH 32-Bit RISC Microcontroller for Smart Cards, Revision 0 including specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • ES:
    • 2019-48-INF-3811- v1: 1
  • DE:
    • BSI-DSZ-CC-1026-2017: 18
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 4
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 21
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 5
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CBC-MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • TRNG:
    • DTRNG: 7
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 4
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
  • FI:
    • physical tampering: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 4
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 4
  • FIPS:
    • FIPS197: 3
  • ICAO:
    • ICAO: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 9797-1: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • ETR COMP) for the S3FV9VH Revision 0, version 2, 2017-09-29, TÜV Informationstechnik GmbH. (confidential document) [11] S3FV9VH HW DTRNG FRO M and DTRNG FRO M Library Application Note, Version 1.2, 2016-10-07: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for Smart Card with specific IC Dedicated Software, Version 2.0, 2017-08-31, Samsung Electronics (confidential document) [7] Evaluation Technical Report, Version 2, 2017-09-29, Evaluation Technical Report Summary (ETR: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 964023
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename 2019-48 ST_lite.pdf 1026b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084: 1
  • BSI:
    • BSI-CC-PP- 0084-2014: 2
    • BSI-CC-PP-0084: 1
    • BSI-PP-0084: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL6: 30
    • EAL6 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 5
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 5
    • ADV_FSP: 2
    • ADV_FSP.4: 2
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.2: 1
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 7
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • APE:
    • APE_ECD: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 2
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 11
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 7
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 24
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 28
    • FCS_CKM.1: 8
    • FCS_CKM.4: 4
    • FCS_COP: 24
    • FCS_COP.1: 5
    • FCS_RNG: 14
    • FCS_RNG.1: 7
  • FDP:
    • FDP_ACC: 27
    • FDP_ACC.1: 3
    • FDP_ACF: 28
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 15
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 8
    • FDP_ITC.2: 8
    • FDP_ITT: 1
    • FDP_ITT.1: 18
    • FDP_ITT.1.1: 1
    • FDP_MSA.1: 1
    • FDP_SDC: 6
    • FDP_SDC.1: 15
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.1: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FIA:
    • FIA_API: 7
    • FIA_API.1: 12
    • FIA_API.1.1: 2
  • FMT:
    • FMT_LIM: 26
    • FMT_LIM.1: 29
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 33
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 14
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 17
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 11
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 16
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 21
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 5
    • O.RND: 6
    • O.TDES: 6
  • T:
    • T.RND: 6
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 12
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 36
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 16
      • Triple-DES: 10
    • DES:
      • DES: 8
  • constructions:
    • MAC:
      • CBC-MAC: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 12
    • RNG: 8
  • TRNG:
    • DTRNG: 18
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • ECB:
    • ECB: 14
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
    • Malfunction: 17
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 17
    • Physical Probing: 2
    • physical probing: 5
  • FI:
    • Malfunction: 26
    • malfunction: 11
    • physical tampering: 3
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 1
    • timing attacks: 1
  • other:
    • JIL: 1
    • reverse engineering: 3
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
  • BSI:
    • AIS31: 3
  • CC:
    • CCMB-2012-09-001: 3
    • CCMB-2012-09-002: 3
    • CCMB-2012-09-003: 3
    • CCMB-2012-09-004: 3
  • FIPS:
    • FIPS197: 2
  • ICAO:
    • ICAO: 1
  • ISO:
    • ISO/IEC 9797-1: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • operational environment and SFRs related to the TOE authentication are regarded as not applicable (out of scope of the intended use-case), as the authentication functionality is no longer available. Composite: 4
    • out of scope: 4
pdf_data/st_metadata
  • /Author: Sunggeun Park
  • /CreationDate: D:20171208161554+09'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: ST Lite; S3FV9VH
  • /ModDate: D:20171208162325+09'00'
  • /Producer: Microsoft® Word 2010
  • /Subject: Security Target Lite Samsung S3FV9VH 32-bit RISC Microcontroller for Smart Card with ST Lite Samsung S3FV9VH 32-bit RISC Microcontroller for Smart Card with specific IC Dedicated Software
  • /Title: Security Target Lite Samsung S3FV9VH 32-bit RISC Microcontroller for Smart Card with specific IC Dedicated Software
  • pdf_file_size_bytes: 1016457
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 72
state/cert/convert_ok True False
state/cert/download_ok True False
state/cert/extract_ok True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different