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Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
2019-48-INF-3811 		Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h design step S11 and M11 with optional HSL v2.62.7626, optional SCL version v2.04.003, UMSLC lib v01.00.0234 with specific IC-dedicated firmware identifier 80.304.01.0 and user guidance
BSI-DSZ-CC-1102-2019
name Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h design step S11 and M11 with optional HSL v2.62.7626, optional SCL version v2.04.003, UMSLC lib v01.00.0234 with specific IC-dedicated firmware identifier 80.304.01.0 and user guidance
scheme ES DE
status active archived
not_valid_after 07.06.2027 15.02.2024
not_valid_before 07.06.2022 15.02.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48_Certificado.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20INF-3811.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102b_pdf.pdf
manufacturer Winbond Electonics Corporation Infineon Technologies AG
manufacturer_web https://www.winbond.com/ https://www.infineon.com/
dgst 51a1149f945dea23 e5f1a79ba3e3483f
heuristics/cert_id 2019-48-INF-3811 BSI-DSZ-CC-1102-2019
heuristics/cert_lab [] BSI
heuristics/extracted_sars ADV_ARC.1, AVA_VAN.5, ATE_COV.2, ADV_FSP.5, ASE_TSS.1, AGD_OPE.1, ADV_IMP.1, ATE_DPT.3, ADV_TDS.4, ASE_REQ.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ASE_ECD.1, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ADV_INT.2, ALC_TAT.2, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_CMC.4, ALC_LCD.1 AVA_VAN.5, ADV_ARC.1, ATE_COV.2, ADV_FSP.5, ASE_TSS.1, AGD_OPE.1, ATE_DPT.3, ADV_IMP.1, ADV_TDS.4, ASE_REQ.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ATE_IND.2, ASE_ECD.1, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ADV_INT.2, ALC_TAT.2, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_CMC.4, ALC_LCD.1
heuristics/extracted_versions - 01.00.0234, 2.04.003, 2.62.7626, 80.304.01.0
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-1102-V2-2025
heuristics/report_references/indirectly_referenced_by {} BSI-DSZ-CC-1102-V2-2025
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 07.06.2022
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1478
    • certification_date: 07.06.2022
    • description: The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1479
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1477
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/826-winbond-spiflash-trustme-secure-flash-memory-w75f40wbyjeg-version-a
heuristics/protection_profiles {} cf0f01bcd7be3e9c
maintenance_updates
  • maintenance_date: 19.06.2020
  • maintenance_report_link: https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102ma1a_pdf.pdf
  • maintenance_st_link: None
  • maintenance_title: Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h design step S11 and M11 with optional HSL v2.62.7626, optional SCL version v2.04.003, UMSLC lib v01.00.0234 with specific IC-dedicated firmware identifier 80.304.01.0 and user guidance
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename 2019-48_Certificado.pdf 1102c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1102-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
  • Infineon:
    • Infineon Technologies: 1
    • Infineon Technologies AG: 1
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880365
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20190221105324+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Security IC, Smart Card, PP-0084, Infineon Technologies AG, IFX
  • /ModDate: D:20190221105535+01'00'
  • /Producer: LibreOffice 5.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1102-2019
  • pdf_file_size_bytes: 417558
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 2019-48 INF-3811.pdf 1102a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1102-2019
    • cert_item: Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h design step S11 and M11 with optional HSL v2.62.7626, optional SCL version v2.04.003, UMSLC lib v01.00.0234 with specific IC- dedicated firmware identifier 80.304.01.0 and user guidance
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • ES:
    • 2019-48-INF-3811- v1: 1
  • DE:
    • BSI-DSZ-CC-1102-2019: 18
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 8
    • EAL 5 augmented: 3
    • EAL5+: 1
    • EAL6: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • GD:
    • G&D: 2
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 3
    • Infineon Technologies: 8
    • Infineon Technologies AG: 17
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 5
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
      • Triple-DES: 2
  • constructions:
    • MAC:
      • CMAC: 3
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CFB:
    • CFB: 4
  • CTR:
    • CTR: 4
  • ECB:
    • ECB: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
  • FI:
    • DFA: 1
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 20: 1
    • AIS 23: 1
    • AIS 24: 1
    • AIS 25: 1
    • AIS 26: 1
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • FIPS:
    • FIPS197: 2
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • NIST:
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 3
    • NIST SP 800-67: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h S11 and M11 Security Target”, Infineon Technologies AG (confidential document) [7] Evaluation Technical Report, Version, v3, 2019-02-04, “EVALUATION TECHNICAL REPORT SUMMARY: 1
    • SUMMARY)”, TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • “EVALUATION TECHNICAL REPORT FOR COMPOSITE EVALUATION (ETR COMP)”, TÜV Informationstechnik GmbH (confidential document) [11] Configuration list for the TOE, Version 1.1, 2018-10-12, “Configuration Management Scope: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 964023
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename 2019-48 ST_lite.pdf 1102b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084: 1
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
  • EAL:
    • EAL 5: 3
    • EAL 5 augmented: 3
    • EAL5: 5
    • EAL5 augmented: 1
    • EAL5+: 3
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 5
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 4
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL: 5
    • ASE_CCL.1: 1
    • ASE_ECD: 4
    • ASE_ECD.1: 1
    • ASE_INT: 12
    • ASE_INT.1: 1
    • ASE_OBJ: 4
    • ASE_OBJ.2: 1
    • ASE_REQ: 20
    • ASE_REQ.2: 1
    • ASE_SPD: 4
    • ASE_SPD.1: 1
    • ASE_TSS: 5
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 10
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 24
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 4
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 6
    • FCS_CKM.1: 8
    • FCS_CKM.4: 9
    • FCS_COP: 8
    • FCS_COP.1: 8
    • FCS_RNG: 4
    • FCS_RNG.1: 8
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 9
    • FDP_ACC.1: 19
    • FDP_ACC.1.1: 1
    • FDP_ACF: 11
    • FDP_ACF.1: 18
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 7
    • FDP_ITC.1: 8
    • FDP_ITC.2: 8
    • FDP_ITT.1: 3
    • FDP_SDC: 2
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 1
    • FDP_SDI.2: 5
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 7
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 7
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_API: 2
    • FIA_API.1: 7
    • FIA_API.1.1: 1
  • FMT:
    • FMT_LIM: 15
    • FMT_LIM.1: 7
    • FMT_LIM.2: 5
    • FMT_MSA.1: 12
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 16
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 9
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 5
    • FPT_ITT.1: 3
    • FPT_PHP.3: 3
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 29
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 4
  • FTP:
    • FTP_ITC.1: 12
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 1
    • O.RND: 1
    • O.TDES: 1
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 3
    • Infineon Technologies: 7
    • Infineon Technologies AG: 10
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 15
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 10
      • Triple-DES: 2
    • DES:
      • DES: 4
  • constructions:
    • MAC:
      • CMAC: 4
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/st_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 2
  • SHA:
    • SHA1:
      • SHA-1: 2
    • SHA2:
      • SHA-256: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • PRNG: 1
  • RNG:
    • RND: 2
    • RNG: 9
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CFB:
    • CFB: 3
  • CTR:
    • CTR: 3
  • ECB:
    • ECB: 3
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
    • Malfunction: 17
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 17
    • Physical Probing: 2
    • physical probing: 5
  • FI:
    • DFA: 2
    • Malfunction: 5
  • SCA:
    • DPA: 2
    • Leak-Inherent: 5
    • Physical Probing: 2
    • SPA: 1
    • side channel: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
  • BSI:
    • AIS31: 3
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • ISO:
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9798-2: 1
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-38B: 1
    • NIST SP 800-67: 1
pdf_data/st_metadata
  • /Author: Infineon Technologies AG
  • /CreationDate: D:20190124153143+01'00'
  • /Creator: Microsoft Word - IFX_CCI_001Fh_SecurityTargetLite.docx
  • /Keywords: security controller, EAL 5+,
  • /ModDate: D:20190124153143+01'00'
  • /Producer: Nuance PDF Create 8
  • /Title: Microsoft Word - IFX_CCI_001Fh_SecurityTargetLite.docx
  • pdf_file_size_bytes: 457925
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 52
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