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Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
2019-48-INF-3811 		S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
BSI-DSZ-CC-0882-2013
name Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
scheme ES DE
status active archived
not_valid_after 07.06.2027 01.09.2019
not_valid_before 07.06.2022 04.12.2013
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48_Certificado.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20INF-3811.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882b_pdf.pdf
manufacturer Winbond Electonics Corporation Samsung Electronics Co., Ltd.
manufacturer_web https://www.winbond.com/ https://www.samsung.com
dgst 51a1149f945dea23 db89c868db0d272f
heuristics/cert_id 2019-48-INF-3811 BSI-DSZ-CC-0882-2013
heuristics/cert_lab [] BSI
heuristics/extracted_sars ASE_REQ.2, ASE_CCL.1, AGD_PRE.1, ALC_LCD.1, ATE_DPT.3, ADV_IMP.1, ALC_TAT.2, ASE_SPD.1, ALC_DVS.2, ADV_INT.2, ADV_ARC.1, ALC_CMS.5, ATE_FUN.1, ADV_FSP.5, ALC_DEL.1, ADV_TDS.4, AGD_OPE.1, ASE_TSS.1, ASE_INT.1, ATE_COV.2, ALC_CMC.4, AVA_VAN.5, ASE_OBJ.2, ASE_ECD.1 ATE_IND.2, ASE_REQ.2, ASE_CCL.1, AGD_PRE.1, ALC_LCD.1, ADV_SPM.1, APE_ECD.1, ATE_DPT.3, ADV_IMP.1, ALC_DVS.2, ALC_TAT.2, ASE_SPD.1, APE_OBJ.2, ADV_INT.2, ADV_ARC.1, ALC_CMS.5, APE_SPD.1, APE_REQ.2, ATE_FUN.1, ADV_FSP.5, ALC_DEL.1, ADV_TDS.4, AGD_OPE.1, ALC_FLR.3, APE_INT.1, ASE_TSS.1, APE_CCL.1, ASE_INT.1, ATE_COV.2, ALC_CMC.4, AVA_VAN.5, ASE_OBJ.2, ASE_ECD.1
heuristics/extracted_versions - 0, 32
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0801-2012
heuristics/report_references/indirectly_referenced_by {} BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0801-2012, BSI-DSZ-CC-0720-2011, BSI-DSZ-CC-0547-2009, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0639-2010
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 07.06.2022
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1478
    • certification_date: 07.06.2022
    • description: The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1479
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1477
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/826-winbond-spiflash-trustme-secure-flash-memory-w75f40wbyjeg-version-a
heuristics/protection_profiles {} f6d23054061d72ba
maintenance_updates
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename 2019-48_Certificado.pdf
pdf_data/cert_keywords/cc_cert_id
pdf_data/cert_keywords/cc_protection_profile_id
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880365
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 2019-48 INF-3811.pdf 0882a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cert_id: BSI-DSZ-CC-0882-2013
    • cert_item: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • ES:
    • 2019-48-INF-3811- v1: 1
  • DE:
    • BSI-DSZ-CC-0801-2012: 3
    • BSI-DSZ-CC-0882: 1
    • BSI-DSZ-CC-0882-2013: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 4: 2
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL1: 7
    • EAL2: 3
    • EAL3: 4
    • EAL4: 7
    • EAL5: 7
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 2
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 24
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 5
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
      • Triple-DES: 2
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 12
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS 46: 1
    • AIS31: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 2013-11-27, TÜViT (confidential document) [11] Project < Kansa > Life Cycle Definition (Class ALC_CMC.4/CMS.5), Version 1.4, 2013-10-21: 1
    • Electronics (confidential document) [12] S3CS9AB 32-Bit CMOS Microcontroller for Smart Card User’s manual, Version 1.00, April 2013: 1
    • Report Summary (ETR Summary), BSI-DSZ-CC-0882, S3CS9AB Revision 0, Version 3, 2013-11-27, TÜViT (confidential document) [10] ETR for composite evaluation according to AIS 36 for the Product S3CS9AB Revision 0, Version: 1
    • Software (Project Kansa), BSI-DSZ-CC-0882-2013, Version 1.9, 2013-10-21, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [8: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 964023
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20140205100058+01'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software, Samsung Electronics"
  • /ModDate: D:20140206085959+01'00'
  • /Producer: LibreOffice 3.6
  • /Subject: Common Criteria Certification
  • /Title: Certification Report BSI-DSZ-CC-0882-2013
  • pdf_file_size_bytes: 996795
  • pdf_hyperlinks: https://www.bsi.bund.de/zertifizierung, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 38
pdf_data/st_filename 2019-48 ST_lite.pdf 0882b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084: 1
  • BSI:
    • BSI-PP-0035: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 5
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 24
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 4
    • FCS_COP: 8
    • FCS_COP.1: 9
    • FCS_RNG: 6
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
  • TRNG:
    • DTRNG: 18
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 3
  • ECB:
    • ECB: 4
  • OFB:
    • OFB: 2
pdf_data/st_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
    • Malfunction: 17
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 17
    • Physical Probing: 2
    • physical probing: 5
  • FI:
    • Malfunction: 24
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
  • BSI:
    • AIS 31: 2
    • AIS31: 1
    • BSI-AIS31: 3
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_metadata
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company: Samsung Electronics
  • /CreationDate: D:20131021190305+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /ModDate: D:20140206090253+01'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20131021100233
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1315207
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 57
state/cert/convert_ok True False
state/cert/download_ok True False
state/cert/extract_ok True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different