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Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
2019-48-INF-3811 		NXP MF0AES(H)x0, NT2H2xy1G and NT2H2xy1S, Release B0
NSCIB-CC-0138361-CR
name Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A NXP MF0AES(H)x0, NT2H2xy1G and NT2H2xy1S, Release B0
scheme ES NL
not_valid_after 07.06.2027 01.02.2027
not_valid_before 07.06.2022 01.02.2022
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48_Certificado.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-certificate%2022-0138361.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20INF-3811.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-0138361-CR-1.0.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-0138361-STLite.pdf
manufacturer Winbond Electonics Corporation NXP Semiconductors
manufacturer_web https://www.winbond.com/ https://www.nxp.com/
security_level EAL5+, AVA_VAN.5, ALC_DVS.2 EAL3+, ASE_TSS.2
dgst 51a1149f945dea23 c5f632afda89c54d
heuristics/cert_id 2019-48-INF-3811 NSCIB-CC-0138361-CR
heuristics/cert_lab []
heuristics/extracted_sars ALC_LCD.1, ASE_CCL.1, AGD_OPE.1, ASE_SPD.1, ASE_OBJ.2, ATE_DPT.3, ATE_COV.2, ALC_CMS.5, ADV_ARC.1, ATE_FUN.1, ADV_IMP.1, ALC_DVS.2, ALC_TAT.2, ASE_INT.1, AVA_VAN.5, ASE_TSS.1, ADV_TDS.4, ALC_CMC.4, ADV_INT.2, ASE_REQ.2, ALC_DEL.1, ADV_FSP.5, AGD_PRE.1, ASE_ECD.1 ALC_DVS.1, ATE_IND.2, ALC_LCD.1, ATE_DPT.1, ALC_CMC.3, ASE_CCL.1, AGD_OPE.1, ASE_SPD.1, AVA_VAN.2, ADV_FSP.3, ASE_OBJ.2, ASE_TSS.2, ATE_COV.2, ALC_CMS.3, ADV_ARC.1, ATE_FUN.1, ADV_TDS.2, ASE_INT.1, ASE_REQ.2, ALC_DEL.1, AGD_PRE.1, ASE_ECD.1
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 07.06.2022
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1478
    • certification_date: 07.06.2022
    • description: The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1479
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1477
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/826-winbond-spiflash-trustme-secure-flash-memory-w75f40wbyjeg-version-a
pdf_data/cert_filename 2019-48_Certificado.pdf NSCIB-certificate 22-0138361.pdf
pdf_data/cert_keywords/cc_cert_id
  • NL:
    • CC-22-0138361: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
  • EAL:
    • EAL3: 1
    • EAL3 augmented: 1
    • EAL4: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
  • ASE:
    • ASE_TSS.2: 1
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
  • R:
    • R.L: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP Semiconductors: 1
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
  • BrightSight:
    • Brightsight: 1
  • SGS:
    • SGS: 1
    • SGS Brightsight: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408-1: 1
    • ISO/IEC 15408-2: 1
    • ISO/IEC 15408-3: 1
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880365
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
  • /CreationDate: D:20220203151928+01'00'
  • /Creator: C458-M
  • /ModDate: D:20220203151146+01'00'
  • /Producer: KONICA MINOLTA bizhub C458
  • /Title: C458-M&S22020315190
  • pdf_file_size_bytes: 79257
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 2019-48 INF-3811.pdf NSCIB-CC-0138361-CR-1.0.pdf
pdf_data/report_frontpage
  • NL:
  • NL:
    • cert_id: NSCIB-CC-0138361-CR
    • cert_item: MF0AES(H)x0, NT2H2xy1G and NT2H2xy1S, Release B0
    • cert_lab: SGS Brightsight B.V.
    • developer: NXP Semiconductors Germany GmbH
pdf_data/report_keywords/cc_cert_id
  • ES:
    • 2019-48-INF-3811- v1: 1
  • NL:
    • NSCIB-CC-0138361-CR: 11
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 3: 1
    • EAL 3 augmented: 1
    • EAL3: 1
    • EAL3 augmented: 1
    • EAL3+: 2
    • EAL4: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ASE:
    • ASE_TSS.2: 2
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP Semiconductors: 3
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 5
  • BrightSight:
    • Brightsight: 2
  • SGS:
    • SGS: 2
    • SGS Brightsight: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 7
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
  • other:
    • JIL: 2
    • JIL-AAPS: 2
    • JIL-AM: 2
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 964023
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename 2019-48 ST_lite.pdf NSCIB-CC-0138361-STLite.pdf
pdf_data/st_keywords/cc_cert_id
  • NL:
    • NSCIB-CC-0138361: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084: 1
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
  • EAL:
    • EAL3: 6
    • EAL3 augmented: 3
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 5
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.3: 1
    • ADV_TDS.2: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.3: 1
    • ALC_CMS.3: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 4
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 2
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 24
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_GEN.1: 5
    • FAU_SAS.1: 8
    • FAU_SAS.1.1: 1
    • FAU_STG.1: 1
    • FAU_STG.2: 10
    • FAU_STG.2.1: 1
    • FAU_STG.2.2: 1
    • FAU_STG.2.3: 1
  • FCS:
    • FCS_CKM.1: 15
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 17
    • FCS_CKM.4.1: 1
    • FCS_COP: 12
    • FCS_COP.1: 3
    • FCS_RNG.1: 2
  • FDP:
    • FDP_ACC.1: 16
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 10
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ETC: 6
    • FDP_ETC.1: 1
    • FDP_ETC.2: 1
    • FDP_ETC.3: 15
    • FDP_ETC.3.1: 2
    • FDP_ETC.3.2: 2
    • FDP_ETC.3.3: 2
    • FDP_IFC.1: 6
    • FDP_ITC.1: 4
    • FDP_ITC.2: 13
    • FDP_ITC.2.1: 1
    • FDP_ITC.2.2: 1
    • FDP_ITC.2.3: 1
    • FDP_ITC.2.4: 1
    • FDP_ITC.2.5: 1
    • FDP_ITT.1: 4
    • FDP_SDC.1: 8
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 8
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FIA:
    • FIA_SOS.2: 10
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 1
    • FIA_UAU.1: 1
    • FIA_UAU.2: 7
    • FIA_UAU.2.1: 1
    • FIA_UAU.3: 7
    • FIA_UAU.3.1: 1
    • FIA_UAU.3.2: 1
    • FIA_UAU.5: 8
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UID.1: 4
    • FIA_UID.2: 10
    • FIA_UID.2.1: 1
  • FMT:
    • FMT_LIM.1: 4
    • FMT_LIM.2: 4
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 7
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_MTD.1: 7
    • FMT_MTD.1.1: 1
    • FMT_SMF.1: 14
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 15
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNL.1: 8
    • FPR_UNL.1.1: 1
  • FPT:
    • FPT_FLS.1: 7
    • FPT_ITT.1: 4
    • FPT_PHP.3: 4
    • FPT_RPL.1: 11
    • FPT_RPL.1.1: 1
    • FPT_RPL.1.2: 1
    • FPT_TDC.1: 12
    • FPT_TDC.1.1: 1
    • FPT_TDC.1.2: 1
  • FRU:
    • FRU_FLT.2: 4
  • FTP:
    • FTP_ITC.1: 1
    • FTP_TRP.1: 14
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 3
pdf_data/st_keywords/cc_claims
  • O:
    • O.MAC: 7
    • O.RND: 2
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 90
    • NXP Semiconductors: 31
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 44
  • constructions:
    • MAC:
      • CMAC: 6
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
  • MAC:
    • MAC: 26
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 4
    • RNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
    • Malfunction: 17
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 17
    • Physical Probing: 2
    • physical probing: 5
  • FI:
    • Malfunction: 3
    • fault injection: 1
    • malfunction: 1
  • SCA:
    • Leak-Inherent: 2
    • Physical Probing: 2
    • side-channel: 1
    • side-channels: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS PUB 197: 2
  • NIST:
    • NIST SP 800-108: 2
    • NIST SP 800-38A: 1
    • NIST SP 800-38B: 1
pdf_data/st_metadata
  • /Author: NXP B.V.
  • /CreationDate: D:20220202080220+01'00'
  • /Creator: DITA Open Toolkit 3.3.1
  • /Keywords: Common Criteria, Security Target Lite, MF0AES(H)x0, NT2H2xy1G and NT2H2xy1S
  • /Producer: Apache FOP Version 2.3
  • /Subject: MF0AES(H)x0, NT2H2xy1G and NT2H2xy1S
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 515463
  • pdf_hyperlinks: mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 56
state/cert/convert_garbage False True
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different