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Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
2019-48-INF-3811 		NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
BSI-DSZ-CC-1072-V3-2019
name Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
scheme ES DE
status active archived
not_valid_after 07.06.2027 03.12.2024
not_valid_before 07.06.2022 03.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48_Certificado.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20INF-3811.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3b_pdf.pdf
manufacturer Winbond Electonics Corporation NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity
manufacturer_web https://www.winbond.com/ https://www.nxp.com
security_level ALC_DVS.2, EAL5+, AVA_VAN.5 ALC_FLR.1, EAL6+, ASE_TSS.2
dgst 51a1149f945dea23 5fb51bc20f02913c
heuristics/cert_id 2019-48-INF-3811 BSI-DSZ-CC-1072-V3-2019
heuristics/cert_lab [] BSI
heuristics/extracted_sars ADV_ARC.1, AVA_VAN.5, ATE_COV.2, ADV_FSP.5, ASE_TSS.1, AGD_OPE.1, ADV_IMP.1, ATE_DPT.3, ADV_TDS.4, ASE_REQ.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ASE_ECD.1, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ADV_INT.2, ALC_TAT.2, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_CMC.4, ALC_LCD.1 ADV_IMP.2, AVA_VAN.5, ADV_ARC.1, ADV_FSP.5, ALC_CMC.5, ADV_TDS.5, AGD_OPE.1, ATE_DPT.3, ATE_COV.3, ASE_TSS.2, ASE_REQ.2, ADV_SPM.1, ATE_FUN.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ATE_IND.2, ASE_ECD.1, ADV_INT.3, ALC_DEL.1, ASE_OBJ.2, ALC_FLR.1, ASE_INT.1, ALC_TAT.3, ASE_SPD.1, ALC_CMS.5, ALC_LCD.1
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-1072-V4-2021
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1072-V2-2019
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-23-66030-CR, BSI-DSZ-CC-1072-V4-2021, BSI-DSZ-CC-1072-V5-2022
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-1072-2018, BSI-DSZ-CC-0955-2016, BSI-DSZ-CC-1072-V2-2019, BSI-DSZ-CC-0955-V2-2016
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 07.06.2022
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1478
    • certification_date: 07.06.2022
    • description: The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1479
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1477
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/826-winbond-spiflash-trustme-secure-flash-memory-w75f40wbyjeg-version-a
heuristics/protection_profiles {} cf0f01bcd7be3e9c
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename 2019-48_Certificado.pdf 1072V3c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1072-V3-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
  • ASE:
    • ASE_TSS.2: 1
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP: 1
    • NXP Semiconductors: 1
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880365
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20191205125022+01'00'
  • /Creator: Writer
  • /Keywords: NXP, Secure Smart Card Controller, P6021y VB*, NXP Semiconductors Germany GmbH
  • /ModDate: D:20200108095848+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated SoftwarefromNXP Semiconductors Germany GmbH
  • /Title: Certificate BSI-DSZ-CC-1072-V3-2019
  • pdf_file_size_bytes: 296536
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 2019-48 INF-3811.pdf 1072V3a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2, ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1072-V3-2019
    • cert_item: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • ES:
    • 2019-48-INF-3811- v1: 1
  • DE:
    • BSI-DSZ-CC-1072-V2-2019: 2
    • BSI-DSZ-CC-1072-V3-2019: 19
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 4
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 7
  • R:
    • R.O: 7
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 27
    • NXP Semiconductors: 28
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 5
  • TUV:
    • TÜV Informationstechnik: 8
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 9
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 1
      • Triple-DES: 4
    • DES:
      • DES: 3
  • constructions:
    • MAC:
      • CBC-MAC: 1
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 4
  • TRNG:
    • TRNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 5
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 8
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
  • FI:
    • physical tampering: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • FIPS:
    • FIPS197: 3
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • Card Controller P6021y VB Evaluation Reference List, Version 2.5, 2019-11-20, NXP Semiconductors (confidential document) [19] NXP Secure Smart Card Controller P6021y VB Configuration List, Version 1.5, 2019-08-09, NXP: 1
    • Corp, Hsinchu, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [23] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Production), Systems on: 1
    • Corporation, Hsinchu, Version 1, 2019-09-02, TÜV Informationstechnik GmbH (confidential document) [21] SITE TECHNICAL AUDIT REPORT (STAR), Production (Data Prep, Mask Temp Storage), Photronics: 1
    • Evaluation (ETR COMP) for the P6021y VB, version 3, 2019-11-21, TÜV Informationstechnik GmbH (confidential document) [11] SmartMX2 family P6021y VB Secure high-performance smart card controller, Objective data sheet: 1
    • GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Manufacturing Co. Pte. Ltd., Singapore, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) 25 / 31 Certification Report BSI-DSZ-CC-1072-V3-2019 C. Excerpts from the Criteria For the: 1
    • Smart Card Controller P6021y VB – Security Target, Version 1.11, 2019-08-23, NXP Semiconductors (confidential document) [7] Evaluation Technical Report BSI-DSZ-CC-1072-V3-2019, Version 2, 2019-11-21, TÜV: 1
    • Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [22] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Mask Production), Photronics DNP: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) [20] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Bumbing), Chipbond: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 964023
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename 2019-48 ST_lite.pdf 1072V3b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1072: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084: 1
  • BSI:
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
    • EAL4+: 2
    • EAL6: 44
    • EAL6 augmented: 5
    • EAL6+: 11
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 5
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 3
    • ADV_FSP.4: 3
    • ADV_FSP.5: 11
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 3
    • ALC_CMC.4: 3
    • ALC_CMC.5: 4
    • ALC_CMS: 3
    • ALC_CMS.4: 3
    • ALC_CMS.5: 5
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 6
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 3
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 2
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 24
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 17
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 46
    • FCS_CKM.4.1: 3
    • FCS_COP.1: 45
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 8
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 37
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 34
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 10
    • FDP_ITC.1: 14
    • FDP_ITC.2: 16
    • FDP_ITT.1: 6
    • FDP_ROL.1: 1
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI.1: 5
    • FDP_SDI.2: 36
    • FDP_SDI.2.1: 5
    • FDP_SDI.2.2: 5
  • FIA:
    • FIA_UAU.2: 2
    • FIA_UAU.5: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 28
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 24
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 22
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 8
    • FPT_RPL.1: 2
    • FPT_TDC.1: 2
  • FRU:
    • FRU_FLT.2: 8
  • FTP:
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 7
    • O.CUST_RECONF_PLAIN: 6
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.MEM_ACCESS: 10
    • O.PUF: 6
    • O.RND: 3
    • O.SFR_: 1
    • O.SFR_ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 204
    • NXP Semiconductors: 35
    • NXP Semiconductors N.V: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 82
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 45
      • Triple-DES: 19
    • DES:
      • DEA: 1
      • DES: 8
  • constructions:
    • MAC:
      • CBC-MAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
  • MAC:
    • MAC: 8
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 14
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • ECB:
    • ECB: 6
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 10
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
    • Malfunction: 17
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 17
    • Physical Probing: 2
    • physical probing: 5
  • FI:
    • Malfunction: 10
    • fault injection: 2
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 11
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • timing attacks: 2
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 197: 3
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 14443: 20
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 24
    • ISO/IEC 9797-1: 1
  • NIST:
    • NIST SP 800-38A: 3
    • NIST SP 800-67: 4
pdf_data/st_metadata
  • /Author: NXP B.V.
  • /CreationDate: D:20190823113338+01'00'
  • /Creator: DITA Open Toolkit
  • /Keywords: CC Security Evaluation, Security Target Lite, Functional Requirements, Security Functionality, Assurance Level 5+/6+, P6021y VB, P6021P VB, P6021M VB, P6021D VB, P6021J VB
  • /Producer: Apache FOP Version 1.1
  • /Subject: NXP Secure Smart Card Controller P6021y VB
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 727760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 97
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