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Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
2019-48-INF-3811 		Infineon smart card IC (Security Controller) IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022Dh, design step H13 with optional libraries CCL V2.0.0002, RSA2048/4096 V2.07.003 / V2.06.003, EC V2.07.003 / V2.06.003, Toolbox V2.07.003 / V2.06.003, HSL V02.01.6634 / V01.22.4346, MCS V02.02.3389 / V02.03.3446, SCL V2.02.010 and with specific IC dedicated software
BSI-DSZ-CC-0945-V2-2018
name Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A Infineon smart card IC (Security Controller) IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022Dh, design step H13 with optional libraries CCL V2.0.0002, RSA2048/4096 V2.07.003 / V2.06.003, EC V2.07.003 / V2.06.003, Toolbox V2.07.003 / V2.06.003, HSL V02.01.6634 / V01.22.4346, MCS V02.02.3389 / V02.03.3446, SCL V2.02.010 and with specific IC dedicated software
scheme ES DE
status active archived
not_valid_after 07.06.2027 20.04.2023
not_valid_before 07.06.2022 20.04.2018
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48_Certificado.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0945V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20INF-3811.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0945V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2019-48%20ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0945V2b_pdf.pdf
manufacturer Winbond Electonics Corporation Infineon Technologies AG
manufacturer_web https://www.winbond.com/ https://www.infineon.com/
security_level ALC_DVS.2, EAL5+, AVA_VAN.5 ALC_FLR.1, EAL6+
dgst 51a1149f945dea23 495bf1a11037cde1
heuristics/cert_id 2019-48-INF-3811 BSI-DSZ-CC-0945-V2-2018
heuristics/cert_lab [] BSI
heuristics/extracted_sars ADV_ARC.1, AVA_VAN.5, ATE_COV.2, ADV_FSP.5, ASE_TSS.1, AGD_OPE.1, ADV_IMP.1, ATE_DPT.3, ADV_TDS.4, ASE_REQ.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ASE_ECD.1, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ADV_INT.2, ALC_TAT.2, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_CMC.4, ALC_LCD.1 ADV_IMP.2, AVA_VAN.5, ADV_ARC.1, ADV_FSP.5, ALC_CMC.5, ASE_TSS.1, ADV_TDS.5, AGD_OPE.1, ATE_DPT.3, ATE_COV.3, ASE_REQ.2, ADV_SPM.1, ATE_FUN.2, ADV_CMC.5, ALC_DVS.2, AGD_PRE.1, ATE_IND.2, ASE_CCL.1, ASE_ECD.1, ADV_INT.3, ALC_DEL.1, ASE_OBJ.2, ALC_FLR.1, ASE_INT.1, ASE_SPD.1, ALC_TAT.3, ALC_CMS.5, ALC_LCD.1
heuristics/extracted_versions - 2.0.0002, 2.07.003, 2.06.003, 01.22.4346, 02.02.3389, 2.02.010, 02.01.6634, 02.03.3446
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-0945-V3-2018, BSI-DSZ-CC-0976-V2-2018
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0945-2017, BSI-DSZ-CC-0891-V2-2016
heuristics/report_references/indirectly_referenced_by {} ANSSI-CC-2020/58, BSI-DSZ-CC-1076-2020, ANSSI-CC-2022/07, BSI-DSZ-CC-1110-V3-2020, BSI-DSZ-CC-1176-2023, NSCIB-CC-175887-CR3, BSI-DSZ-CC-0976-V4-2021, ANSSI-CC-2022/65, ANSSI-CC-2019/56-R01, ANSSI-CC-2020/64, ANSSI-CC-2019/56, ANSSI-CC-2022/19, ANSSI-CC-2022/68, BSI-DSZ-CC-1110-V4-2021, ANSSI-CC-2022/64, ANSSI-CC-2020/55, BSI-DSZ-CC-1110-V2-2019, ANSSI-CC-2020/88, NSCIB-CC-0075541-CR2, BSI-DSZ-CC-1255-2025, BSI-DSZ-CC-1110-V7-2024, ANSSI-CC-2020/63, NSCIB-CC-0299277-CR, ANSSI-CC-2020/87, NSCIB-CC-0299278-CR, BSI-DSZ-CC-1110-V6-2023, ANSSI-CC-2019/55-R01, ANSSI-CC-2022/67, ANSSI-CC-2020/59, NSCIB-CC-22-0286910-CR, ANSSI-CC-2019/58, ANSSI-CC-2019/57, ANSSI-CC-2022/20, BSI-DSZ-CC-1077-2020, ANSSI-CC-2022/33, ANSSI-CC-2022/08, NSCIB-CC-0286907-CR, BSI-DSZ-CC-0976-V3-2019, BSI-DSZ-CC-1243-2024, BSI-DSZ-CC-1077-V2-2024, ANSSI-CC-2020/56, ANSSI-CC-2020/07, KECS-ISIS-1031-2020, BSI-DSZ-CC-1172-2022, ANSSI-CC-2019/57-R01, ANSSI-CC-2020/08, ANSSI-CC-2020/60, BSI-DSZ-CC-0945-V3-2018, BSI-DSZ-CC-1098-2020, ANSSI-CC-2020/88-R01, ANSSI-CC-2020/87-R01, ANSSI-CC-2020/57, BSI-DSZ-CC-1162-2021, BSI-DSZ-CC-1110-2019, ANSSI-CC-2020/62, ANSSI-CC-2019/55, BSI-DSZ-CC-1110-V5-2022, BSI-DSZ-CC-1162-V3-2024, ANSSI-CC-2020/61, BSI-DSZ-CC-1162-V2-2023, BSI-DSZ-CC-0976-V2-2018, ANSSI-CC-2019/58-R01
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0891-2015, BSI-DSZ-CC-0945-2017, BSI-DSZ-CC-0891-V2-2016, BSI-DSZ-CC-0782-2012
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 07.06.2022
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1478
    • certification_date: 07.06.2022
    • description: The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1479
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1477
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/826-winbond-spiflash-trustme-secure-flash-memory-w75f40wbyjeg-version-a
heuristics/st_references/directly_referenced_by {} NSCIB-CC-200689-CR, NSCIB-CC-200716-CR2, NSCIB-CC-200270-CR, NSCIB-CC-200833-CR, NSCIB-CC-200736-CR, BSI-DSZ-CC-0976-V2-2018
heuristics/st_references/indirectly_referenced_by {} NSCIB-CC-200689-CR, NSCIB-CC-200716-CR2, NSCIB-CC-200270-CR, NSCIB-CC-200833-CR, NSCIB-CC-200736-CR, BSI-DSZ-CC-0976-V2-2018
heuristics/protection_profiles {} cf0f01bcd7be3e9c
maintenance_updates
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename 2019-48_Certificado.pdf 0945V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0945-V2-2018: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
  • Infineon:
    • Infineon: 1
    • Infineon Technologies AG: 1
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 880365
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20180511123101+02'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, 0945-V2, SmartCard, Security IC, Infineon, PP-0084"
  • /ModDate: D:20180524130830+02'00'
  • /Producer: LibreOffice 5.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-0945-V2-2018
  • pdf_file_size_bytes: 347840
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 2019-48 INF-3811.pdf 0945V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0945-V2-2018
    • cert_item: Infineon smart card IC (Security Controller) IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022Dh, design step H13 with optional libraries CCL V2.0.0002, RSA2048/4096 V2.07.003 / V2.06.003, EC V2.07.003 / V2.06.003, Toolbox V2.07.003 / V2.06.003, HSL V02.01.6634 / V01.22.4346, MCS V02.02.3389 / V02.03.3446, SCL V2.02.010 and with specific IC dedicated software
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • ES:
    • 2019-48-INF-3811- v1: 1
  • DE:
    • BSI-DSZ-CC-0891-V2-2016: 1
    • BSI-DSZ-CC-0945-2017: 3
    • BSI-DSZ-CC-0945-V2-2018: 19
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 6: 4
    • EAL 6 augmented: 3
    • EAL5+: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ADV:
    • ADV_ARC: 1
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • GD:
    • G&D: 1
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 21
    • Infineon Technologies AG: 19
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 5
  • TSystems:
    • T-Systems International: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • Triple-DES: 3
    • DES:
      • DES: 2
pdf_data/report_keywords/asymmetric_crypto
  • FF:
    • DH:
      • Diffie-Hellman: 1
    • DSA:
      • DSA: 1
  • RSA:
    • RSA2048: 3
    • RSA4096: 1
pdf_data/report_keywords/crypto_scheme
  • KEX:
    • Key Exchange: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • TRNG:
    • TRNG: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
  • FI:
    • DFA: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 2
    • physical probing: 1
  • other:
    • JIL: 5
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 31: 1
    • AIS 34: 1
    • AIS 35: 1
    • AIS 36: 1
    • AIS1: 1
    • AIS14: 1
    • AIS19: 1
    • AIS20: 2
    • AIS25: 2
    • AIS26: 1
    • AIS31: 3
    • AIS32: 1
    • AIS34: 1
    • AIS35: 1
    • AIS36: 2
    • AIS38: 2
    • AIS39: 2
    • AIS46: 4
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • IFX_CCI_00001Dh, IFX_CCI_000021h, IFX_CCI_000022h design step H13”, Infineon Technologies AG (confidential document) [7] Evaluation Technical Report for the Product BSI-DSZ-CC-0945-V2-2018, 2.02, 04.04.2018: 1
    • Technical Report - Summary”, T-Systems International GmbH, (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Version 2.03, 04.04.2018, ETR for composite evaluation (EFC), T- Systems International GmbH (confidential document) 7 specifically • AIS1, Durchführung der Ortsbesichtigung in der Entwicklungsumgebung des: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 964023
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename 2019-48 ST_lite.pdf 0945V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084: 1
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
  • EAL:
    • EAL 6: 1
    • EAL 6 augmented: 1
    • EAL6: 149
    • EAL6 augmented: 145
    • EAL6+: 145
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 5
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_IMP.2: 2
    • ADV_INT: 1
    • ADV_INT.2: 3
    • ADV_INT.3: 2
    • ADV_SPM: 1
    • ADV_SPM.1: 6
    • ADV_TDS: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 3
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 3
    • ALC_DVS.1: 2
    • ALC_DVS.2: 4
    • ALC_FLR.1: 10
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.2: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL: 8
    • ASE_CCL.1: 1
    • ASE_ECD: 4
    • ASE_ECD.1: 1
    • ASE_INT: 19
    • ASE_INT.1: 1
    • ASE_OBJ: 11
    • ASE_OBJ.2: 1
    • ASE_REQ: 57
    • ASE_REQ.2: 1
    • ASE_SPD: 8
    • ASE_SPD.1: 1
    • ASE_TSS: 21
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 3
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 3
    • ATE_FUN.2: 3
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 24
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
  • FAU:
    • FAU_SAS: 3
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 104
    • FCS_CKM.1: 33
    • FCS_CKM.2: 9
    • FCS_CKM.4: 46
    • FCS_COP: 124
    • FCS_COP.1: 35
    • FCS_RNG: 42
    • FCS_RNG.1: 16
  • FDP:
    • FDP_ACC: 15
    • FDP_ACC.1: 30
    • FDP_ACC.1.1: 1
    • FDP_ACF: 15
    • FDP_ACF.1: 27
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 20
    • FDP_ITC.1: 34
    • FDP_ITC.2: 34
    • FDP_ITT.1: 22
    • FDP_SDC: 1
    • FDP_SDC.1: 10
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 14
    • FDP_SDI.1.1: 2
    • FDP_SDI.2: 16
    • FDP_SDI.2.1: 2
    • FDP_SDI.2.2: 2
    • FDP_UCT.1: 12
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 12
    • FDP_UIT.1.1: 1
  • FIA:
    • FIA_API: 4
    • FIA_API.1: 14
    • FIA_API.1.1: 1
    • FIA_SOS.2: 2
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 1
  • FMT:
    • FMT_LIM: 35
    • FMT_LIM.1: 10
    • FMT_LIM.2: 9
    • FMT_MSA.1: 19
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 3
    • FMT_MSA.3: 23
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 17
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 27
    • FPT_ITC.1: 4
    • FPT_ITT.1: 23
    • FPT_PHP.3: 30
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 31
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 9
  • FTP:
    • FTP_ACF: 1
    • FTP_ITC.1: 14
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 3
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 9
    • O.RND: 4
    • O.TDES: 7
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 14
    • Infineon Technologies: 19
    • Infineon Technologies AG: 15
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 83
      • AES-128: 3
  • DES:
    • 3DES:
      • 3DES: 1
      • TDEA: 4
      • TDES: 50
      • Triple-DES: 3
      • TripleDES: 2
    • DES:
      • DES: 33
  • constructions:
    • MAC:
      • CBC-MAC: 11
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 20
    • ECDH:
      • ECDH: 13
    • ECDSA:
      • ECDSA: 26
  • FF:
    • DH:
      • Diffie-Hellman: 12
    • DSA:
      • DSA: 2
  • RSA:
    • RSA2048: 1
    • RSA4096: 1
pdf_data/st_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 20
  • SHA:
    • SHA1:
      • SHA-1: 21
      • SHA1: 1
    • SHA2:
      • SHA-256: 19
      • SHA256: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
  • KA:
    • Key Agreement: 3
    • Key agreement: 3
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • PRNG: 2
  • RNG:
    • RND: 5
    • RNG: 25
  • TRNG:
    • DTRNG: 1
    • TRNG: 4
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 18
  • CFB:
    • CFB: 10
  • CTR:
    • CTR: 10
  • ECB:
    • ECB: 21
pdf_data/st_keywords/ecc_curve
  • NIST:
    • K-163: 2
    • P-192: 4
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
    • Malfunction: 17
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 17
    • Physical Probing: 2
    • physical probing: 5
  • FI:
    • DFA: 4
    • Malfunction: 12
    • fault induction: 1
    • fault injection: 3
    • malfunction: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 12
    • Physical Probing: 2
    • SPA: 2
    • physical probing: 1
    • side channel: 17
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
  • BSI:
    • AIS 31: 2
    • AIS31: 24
    • AIS32: 10
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
  • FIPS:
    • FIPS 140-2: 2
    • FIPS 197: 3
    • FIPS PUB 186-4: 1
  • ISO:
    • ISO/IEC 11770-3: 1
    • ISO/IEC 14443-4: 3
    • ISO/IEC 14888-3: 1
    • ISO/IEC 18033: 2
    • ISO/IEC 18033-3: 4
    • ISO/IEC 18092: 2
    • ISO/IEC 9797-1: 5
    • ISO/IEC 9798-2: 2
  • NIST:
    • SP 800-38A: 12
    • SP 800-67: 2
  • PKCS:
    • PKCS #1: 4
    • PKCS#1: 1
  • RFC:
    • RFC 5639: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • certification. The user operating system and further applications implemented on the TOE are also out of scope of this certification. To summarize, if used with the PCD software the certification view equals to: 1
    • is enabled to communicate via the selected interfaces. The surrounding environment is in both cases out of scope. The CIPURSE™ CL is delivered as object code and in this way integrated in the user software. The: 1
    • out of scope: 2
pdf_data/st_metadata
  • /Author: Buchmüller
  • /CreationDate: D:20180129133020+01'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: contactless, dual interface, high end Security Controller, integrity guard, robust, dual core, high attack
  • /ModDate: D:20180129133020+01'00'
  • /Producer: Microsoft® Word 2010
  • /Subject: Common Criteria
  • /Title: Security Target IFX_CCI_3h with Options
  • pdf_file_size_bytes: 2270754
  • pdf_hyperlinks: http://www.bsi.bund.de/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 144
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