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bizhub PRO 950 Control Software Image Control Program(Image Control I1):00I1-G00-10 Controller Control Program(IC Controller P):00P1-G00-11
JISEC-CC-CRP-C0212
Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023
name bizhub PRO 950 Control Software Image Control Program(Image Control I1):00I1-G00-10 Controller Control Program(IC Controller P):00P1-G00-11 Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
scheme JP DE
status archived active
not_valid_after 28.04.2014 03.03.2028
not_valid_before 21.04.2009 03.03.2023
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/c0212_erpt.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/c0212_est.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf
manufacturer Konica Minolta Business Technologies, Inc Qualcomm Technologies Inc.
manufacturer_web https://www.konicaminolta.com/ https://www.qualcomm.com
security_level EAL3 ALC_DVS.2, EAL4+, AVA_VAN.5
dgst 48ea19b7c16c1685 ac18c15a88b4b1bd
heuristics/cert_id JISEC-CC-CRP-C0212 BSI-DSZ-CC-1045-V2-2023
heuristics/cert_lab [] BSI
heuristics/extracted_sars ALC_DVS.1, ATE_COV.2, ADV_RCR.1, ADV_FSP.1, ADV_HLD.2, ATE_FUN.1, AGD_USR.1, AVA_VLA.1, ATE_IND.2, AGD_ADM.1, AVA_MSU.1, ATE_DPT.1, AVA_SOF.1 ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_DVS.2, ALC_CMC.4
heuristics/extracted_versions 950, 11, 10 1.1.2
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1045-2019
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-1045-2019
heuristics/scheme_data
  • cert_id: JISEC-CC-CRP-C0212
  • certification_date: 01.04.2009
  • claim: EAL3
  • enhanced:
    • assurance_level: EAL3
    • cc_version: 2.3
    • cert_link: https://www.ipa.go.jp/en/security/c0212_eimg.pdf
    • description: PRODUCT DESCRIPTION Description of TOE This product (bizhub PRO 950 Control Software *1 ), that is installed with digital MFP (bizhub PRO 950 ) manufactured by Konica Minolta Business Technologies, Inc., is a software product for the purpose of reducing the risk for disclosure of document data in bizhub PRO 950. Bizhub PRO 950 Control Software prevents document data in bizhub PRO 950 from disclosing during the use of functions such as copier and printer. It offers the protection function *2 with password lock system against the risk of reading data out illegally from HDD (Hard Disk Drive) which is a medium for storing temporarily document data. *1: shows "bizhub PRO 950 Zentai Seigyo Software" for Japan and "bizhub PRO 950 Control Software" for overseas are the same product with different calling name. *2: HDD has the password so that it cannot be removed and read in another equipment. HDD lock password is set in the HDD lock function. TOE security functions TOE security function is as follows - IA.ADM_ADD; Registration of administrator - IA.ADM_AUTH; Identification and Authentication of administrator - IA.CE_AUTH; Identification and Authentication of CE - IA.PASS; Change of Password - ACL.USR; Rule and Control of user's access - AUD.LOG; Audit Record - AUD.MNG; Management of audit area - MNG.MODE; Configuration of Security Mode - MNG.ADM; Function of Management Support(Administrator) - MNG.HDD; Function of HDD lock password
    • evaluation_facility: Information Technology Security Center Evaluation Department
    • product: Japan : bizhub PRO 950 Zentai Seigyo Software Overseas: bizhub PRO 950 Control Software
    • product_type: IT Product (data protection function in digital MFD)
    • report_link: https://www.ipa.go.jp/en/security/c0212_erpt.pdf
    • target_link: https://www.ipa.go.jp/en/security/c0212_est.pdf
    • toe_version: Image Control Program(Image Control I1):00I1-G00-10 Controller Control Program(IC Control P):00P1-G00-11
    • vendor: Konica Minolta Business Technologies, Inc.
  • expiration_date: 01.04.2014
  • revalidations: [frozendict({'date': '2010-03', 'link': 'https://www.ipa.go.jp/en/security/jisec/software/certified-cert/c0212_it8219_01.html'})]
  • supplier: Konica Minolta Business Technologies, Inc.
  • toe_japan_name: bizhub PRO 950 Zentai Seigyo Software Image Control Program(Image Control I1):00I1-G00-10 Controller Control Program(IC Control P):00P1-G00-11
  • toe_overseas_link: https://www.ipa.go.jp/en/security/jisec/software/certified-cert/c0212_it8219.html
  • toe_overseas_name: bizhub PRO 950 / VarioLink 9522 / ineo 950 control software Image Control Program( Image Control I1):00I1-G00-22 Controller Control Program(IC Control P):00P1-G00-20
  • category: System on a chip (SOC)
  • cert_id: BSI-DSZ-CC-1045-V2-2023
  • certification_date: 03.03.2023
  • enhanced:
    • applicant: Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA
    • assurance_level: EAL4+; ALC_DVS.2, AVA_VAN.5
    • cert_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2
    • certification_date: 03.03.2023
    • description: The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.
    • entries: [frozendict({'id': 'BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target Zertifikat / Certificate', 'description': 'has been extended by additional cryptographic functions.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})]
    • evaluation_facility: T-Systems International GmbH atsec information security GmbH
    • expiration_date: 02.03.2028
    • product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
    • report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2
    • target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2
  • product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html
  • vendor: Qualcomm Technologies Inc.
heuristics/protection_profiles {} cf0f01bcd7be3e9c
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename 1045V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename c0212_erpt.pdf 1045V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • JP:
    • CRP-C0212-01: 1
    • Certification No. C0212: 1
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL3: 3
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_claims
  • OE:
    • OE.WATCH: 1
  • T:
    • T.ACCESS: 1
    • T.HDDACCESS: 1
    • T.IMPADMIN: 1
  • O:
    • O.C: 4
  • R:
    • R.O: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
pdf_data/report_keywords/eval_facility
  • ITSC:
    • Information Technology Security Center: 3
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2005-08-001: 2
    • CCMB-2005-08-002: 2
    • CCMB-2005-08-003: 2
    • CCMB-2005-08-004: 2
  • ISO:
    • ISO/IEC 15408:2005: 1
    • ISO/IEC 18045:2005: 2
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
  • /Author: IPA/JISEC
  • /Company: IPA
  • /CreationDate: D:20090803101046+09'00'
  • /Creator: Word 用 Acrobat PDFMaker 8.1
  • /Manager: IPA
  • /ModDate: D:20090803101109+09'00'
  • /Producer: Acrobat Distiller 8.1.0 (Windows)
  • /SourceModified: D:20090803005803
  • /Title: CRP-e
  • pdf_file_size_bytes: 350221
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 24
pdf_data/st_filename c0212_est.pdf 1045V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL3: 9
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_CAP.3: 2
    • ACM_SCP.1: 2
  • ADO:
    • ADO_DEL.1: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP.1: 2
    • ADV_HLD.2: 2
    • ADV_RCR.1: 2
  • AGD:
    • AGD_ADM.1: 2
    • AGD_USR.1: 2
  • ALC:
    • ALC_DVS.1: 2
  • ATE:
    • ATE_COV.2: 2
    • ATE_DPT.1: 2
    • ATE_FUN.1: 2
    • ATE_IND.2: 2
  • AVA:
    • AVA_MSU.1: 2
    • AVA_SOF.1: 2
    • AVA_VLA.1: 2
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 3
    • FAU_GEN.1: 17
    • FAU_GEN.1.1: 1
    • FAU_GEN.1.2: 1
    • FAU_SAR.1: 13
    • FAU_SAR.1.1: 1
    • FAU_SAR.2: 11
    • FAU_SAR.2.1: 1
    • FAU_STG.1: 13
    • FAU_STG.1.1: 1
    • FAU_STG.1.2: 1
    • FAU_STG.3: 1
    • FAU_STG.4: 10
  • FDP:
    • FDP_ACC.1: 26
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 28
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 1
    • FDP_MTD.1: 16
    • FDP_MTD.1.1: 1
    • FDP_SOS: 1
    • FDP_SOS.1: 20
    • FDP_SOS.1.1: 1
    • FDP_UAU.2: 1
    • FDP_UID.2: 1
  • FIA:
    • FIA_AFL: 1
    • FIA_AFL.1: 13
    • FIA_AFL.1.1: 1
    • FIA_AFL.1.2: 1
    • FIA_SOS: 2
    • FIA_SOS.1: 32
    • FIA_SOS.1.1: 2
    • FIA_UAU: 2
    • FIA_UAU.1: 9
    • FIA_UAU.2: 20
    • FIA_UAU.2.1: 1
    • FIA_UAU.7: 15
    • FIA_UAU.7.1: 1
    • FIA_UID: 1
    • FIA_UID.1: 10
    • FIA_UID.2: 23
  • FMT:
    • FMT_MOF.1: 43
    • FMT_MOF.1.1: 1
    • FMT_MSA.1: 13
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 15
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_MTD.1: 56
    • FMT_MTD.1.1: 5
    • FMT_RVM.1: 1
    • FMT_SMF.1: 24
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 30
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_RVM.1: 39
    • FPT_RVM.1.1: 1
    • FPT_SEP.1: 1
    • FPT_STM.1: 11
    • FPT_STM.1.1: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AUDIT: 9
    • O.CE: 5
    • O.DATAACCESS: 8
    • O.IA: 11
    • O.MANAGE: 7
  • OE:
    • OE.ADMIN: 4
    • OE.CE: 4
    • OE.HDD: 6
    • OE.NET: 4
    • OE.PLACE: 4
    • OE.USR: 4
    • OE.WATCH: 2
  • T:
    • T.ACCESS: 2
    • T.HDDACCESS: 2
    • T.IMPADMIN: 2
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 22
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCIMB-2005-08-001: 2
    • CCIMB-2005-08-002: 1
    • CCIMB-2005-08-003: 1
  • ISO:
    • ISO/IEC 15408: 6
    • ISO/IEC 15408:2005: 1
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
pdf_data/st_metadata
  • /CreationDate: D:20090731103907+09'00'
  • /ModDate: D:20090731103907+09'00'
  • /Producer: Acrobat Distiller 6.0 (Windows)
  • /Title: untitled
  • pdf_file_size_bytes: 382882
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 89
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
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