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Samsung S3CC9P9 microcontroller
ANSSI-CC-2004/06 		Renesas AE45X1-C (HD65145X1)smartcard integrated circuit version 02
BSI-DSZ-CC-0351-2006
name Samsung S3CC9P9 microcontroller Renesas AE45X1-C (HD65145X1)smartcard integrated circuit version 02
scheme FR DE
not_valid_before 11.05.2004 13.09.2006
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2004_06.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0351a.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2004_06.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0351b.pdf
manufacturer Samsung Electronics Co., Ltd. Renesas Technology Corporation
manufacturer_web https://www.samsung.com https://am.renesas.com/
security_level EAL4+, ADV_IMP.2, ALC_DVS.2, AVA_VLA.4 EAL4
dgst 473ea605d6a40ef5 c9d17408c8fe84e3
heuristics/cert_id ANSSI-CC-2004/06 BSI-DSZ-CC-0351-2006
heuristics/cert_lab [] BSI
heuristics/extracted_sars ADV_DVS.2, AGD_USR.1, ADV_HLD.2, AVA_MSU.2, ATE_DPT.1, ADV_IMP.2, ALC_LCD.1, ASE_INT.1, ADV_RCR.1, ASE_SRE.1, ADV_FSP.1, ATE_IND.2, ADV_SPM.1, ASE_REQ.1, ASE_TSS.1, ASE_PPC.1, ATE_COV.2, ATE_FUN.1, ALC_DVS.2, AVA_SOF.1, ASE_OBJ.1, ALC_TAT.1, AVA_VLA.4, ADV_LLD.1, ASE_ENV.1, AGD_ADM.1, ASE_DES.1 AGD_USR.1, ADV_HLD.2, ADV_FSP.2, AVA_MSU.2, ATE_DPT.1, ALC_DVS.1, ALC_LCD.1, ADV_IMP.1, ASE_INT.1, ADV_RCR.1, ASE_SRE.1, ATE_IND.2, ADV_SPM.1, ASE_REQ.1, ASE_TSS.1, ASE_PPC.1, ATE_COV.2, ATE_FUN.1, AVA_SOF.1, ASE_OBJ.1, ALC_TAT.1, AVA_VLA.2, ADV_LLD.1, ASE_ENV.1, AGD_ADM.1, ASE_DES.1
heuristics/extracted_versions - 02
heuristics/report_references/directly_referenced_by {} NSCIB-CC-09-10991-CR
heuristics/report_references/directly_referencing ANSSI-CC-2002/25 BSI-DSZ-CC-0212-2004
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-09-10991-CR
heuristics/report_references/indirectly_referencing ANSSI-CC-2002/25 BSI-DSZ-CC-0212-2004
heuristics/st_references/directly_referenced_by {} NSCIB-CC-09-10991-CR
heuristics/st_references/indirectly_referenced_by {} NSCIB-CC-09-10991-CR
pdf_data/report_filename 2004_06.pdf 0351a.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
  • FR:
  • DE:
    • cert_id: BSI-DSZ-CC-0351-2006
    • cert_item: Renesas AE45X1-C (HD65145X1) smartcard integrated circuit version 02
    • cert_lab: BSI
    • developer: Renesas Technology Corp
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • FR:
    • Rapport de certification 2002/25: 1
    • Rapport de certification 2004/06: 13
  • DE:
    • BSI-DSZ-CC-0212-2004: 2
    • BSI-DSZ-CC-0351: 3
    • BSI-DSZ-CC-0351-2006: 20
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0002-2001: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL1: 1
    • EAL3: 1
    • EAL4: 1
    • EAL4+: 1
    • EAL41: 1
    • EAL5: 1
    • EAL7: 2
  • ITSEC:
    • ITSEC E6 et: 1
  • EAL:
    • EAL 1: 1
    • EAL 4: 1
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 11
    • EAL5: 6
    • EAL6: 3
    • EAL7: 4
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 2
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_DEL.2: 2
    • ADO_IGS: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 1
    • ADV_RCR.1: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 1
    • AGD_ADM.1: 1
    • AGD_USR: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 3
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 2
    • ACM_CAP: 2
    • ACM_CAP.4: 2
    • ACM_SCP: 2
    • ACM_SCP.2: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_HLD: 2
    • ADV_HLD.2: 1
    • ADV_IMP: 2
    • ADV_IMP.1: 1
    • ADV_INT: 2
    • ADV_LLD: 2
    • ADV_LLD.1: 1
    • ADV_RCR: 2
    • ADV_RCR.1: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 1
    • AGD_USR: 2
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 2
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.1: 2
    • ALC_TAT: 2
    • ALC_TAT.1: 2
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_COV.2: 1
    • ATE_DPT: 2
    • ATE_DPT.1: 1
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_IND: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 2
    • AVA_MSU.2: 1
    • AVA_SOF: 3
    • AVA_SOF.1: 1
    • AVA_VLA: 3
    • AVA_VLA.2: 2
    • AVA_VLA.3: 1
    • AVA_VLA.4: 1
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAA.1: 2
  • FCS:
    • FCS_CKM.1: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 2
    • FDP_IFF.1: 2
    • FDP_SDI.1: 2
  • FIA:
    • FIA_ATD.1: 2
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 2
  • FPT:
    • FPT_PHP.2: 2
    • FPT_PHP.3: 2
    • FPT_TST.1: 2
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_COP.1: 1
    • FCS_RND.1: 1
  • FDP:
    • FDP_ACC.1: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
  • FMT:
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_SEP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 10
  • Infineon:
    • Infineon Technologies AG: 1
  • Philips:
    • Philips: 1
pdf_data/report_keywords/eval_facility
  • Serma:
    • SERMA: 3
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 4
  • DES:
    • DES:
      • DES: 6
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 7
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • Malfunction: 1
    • physical tampering: 1
  • SCA:
    • Physical Probing: 1
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
  • BSI:
    • AIS 25: 1
    • AIS 26: 1
    • AIS 31: 1
    • AIS 34: 1
  • FIPS:
    • FIPS PUB 140-2: 1
    • FIPS PUB 46-3: 1
  • ISO:
    • ISO/IEC 15408:2005: 3
    • ISO/IEC15408: 2005: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • AE45X1-B), HD65145X1 (AE45X1-C) Hardware Manual, Renesas Technology Corp., 11 June,2004, (confidential document) [11] AE45X1 User Guidance Manual Rev. 7.20, Renesas 16-bit Smart Card Microcomputer AE-4 Series: 1
    • AE45X1-B), HD65145X1 (AE45X1-C), HD65145X1 (AE45X1-CB)l, Renesas Technology Corp., 18 April, 2004, (confidential document) [12] Renesas Single-Chip Microcomputer AE-4 Series, AE45X1-B/C (HD65145C1), Current Control: 1
    • Rev. 1.0, 17 June 2004, (confidential document) [13] Option List for Smart Card Microcomputer (for HD65145X1C [AE45X1C, CB]), (AE45X1C-V1.5R: 1
    • Technology Corp, February 6, 2006, (confidential document) [15] Federal Information Processing Standards Publication, Security Requirements for Cryptographic: 1
    • Version 9.0, 11 July 2006, AE45X1-C (HD65145X1) Version 02, Renesas Technology Corp. (confidential document) B-16 BSI-DSZ-CC-0351-2006 Certification Report [7] Security Target BSI-DSZ-CC-0351, Version 3.0: 1
    • document) [8] Evaluation Technical Report, 1.0, 13 July, 2006, AE45X1-C (HD65145X1) Version 02 (confidential document) [9] Smartcard IC Platform Protection Profile, Version 1.0, July, 2001, BSI registration ID: 1
pdf_data/report_metadata
  • /Author: DCSSI
  • /CreationDate: D:20040517150819+02'00'
  • /Creator: Acrobat PDFMaker 5.0 pour Word
  • /ModDate: D:20040517150839+03'00'
  • /Producer: Acrobat Distiller 5.0 (Windows)
  • /Subject: Micro-circuit SAMSUNG S3CC9P9
  • /Title: Rapport de certification 2004/06
  • pdf_file_size_bytes: 656869
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 26
  • /Author: BSI
  • /Company: BSI, Postfach 200363, 53133 Bonn
  • /CreationDate: D:20060927102809+02'00'
  • /Creator: Acrobat PDFMaker 7.0.7 für Word
  • /Keywords: "Common Criteria, Certification, Zertifizierung, Renesas, smartcard"
  • /ModDate: D:20060928112506+02'00'
  • /Producer: Acrobat Distiller 7.0.5 (Windows)
  • /SourceModified: D:20060927082642
  • /Subject: Certification Report BSI-DSZ-CC-0351-2006
  • /Title: Certification Report BSI-DSZ-CC-0351-2006
  • pdf_file_size_bytes: 283987
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 40
pdf_data/st_filename cible2004_06.pdf 0351b.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP- 0002: 2
    • BSI-PP-0002: 72
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 2
    • EAL 4 augmented: 1
    • EAL4: 12
    • EAL4 augmented: 1
  • EAL:
    • EAL4: 5
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 3
    • ACM_SCP: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_IGS: 3
  • ADV:
    • ADV_DVS.2: 1
    • ADV_FSP: 3
    • ADV_FSP.1: 1
    • ADV_HLD: 2
    • ADV_HLD.2: 1
    • ADV_IMP: 2
    • ADV_IMP.1: 2
    • ADV_IMP.2: 5
    • ADV_LLD: 2
    • ADV_LLD.1: 2
    • ADV_RCR: 3
    • ADV_RCR.1: 1
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 3
    • AGD_ADM.1: 1
    • AGD_USR: 3
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_TAT: 2
    • ALC_TAT.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_MSU: 2
    • AVA_SOF: 2
    • AVA_VLA: 2
    • AVA_VLA.4: 6
  • ADO:
    • ADO_DEL: 1
    • ADO_IGS: 1
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 1
    • ADV_IMP: 1
    • ADV_LLD: 1
    • ADV_RCR: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 4
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • AVA:
    • AVA_MSU: 1
    • AVA_SOF: 5
    • AVA_VLA: 1
    • AVA_VLA.2: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_GEN.1: 2
    • FAU_SAA.1: 7
  • FCS:
    • FCS_CKM.1: 8
    • FCS_CKM.4: 7
    • FCS_COP.1: 8
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACC.2: 5
    • FDP_ACF.1: 6
    • FDP_IFC.1: 6
    • FDP_IFF.1: 6
    • FDP_ITC.1: 3
    • FDP_SDI.1: 5
  • FIA:
    • FIA_ATD.1: 7
    • FIA_UAU.2: 8
    • FIA_UID.1: 1
    • FIA_UID.2: 8
  • FMT:
    • FMT_MOF.1: 7
    • FMT_MSA.1: 6
    • FMT_MSA.2: 3
    • FMT_MSA.3: 7
    • FMT_SMR.1: 7
  • FPR:
    • FPR_UNO: 1
    • FPR_UNO.1: 4
  • FPT:
    • FPT_AMT.1: 2
    • FPT_PHP.2: 5
    • FPT_PHP.3: 5
    • FPT_TST.1: 8
  • FAU:
    • FAU_GEN.1: 1
    • FAU_SAS.1: 9
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 11
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 1
    • FCS_CKM.4: 11
    • FCS_CKM.4.1: 1
    • FCS_COP: 1
    • FCS_COP.1: 19
    • FCS_COP.1.1: 2
    • FCS_RND: 1
    • FCS_RND.1: 9
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC.1: 29
    • FDP_ACC.1.1: 3
    • FDP_ACF.1: 27
    • FDP_ACF.1.1: 4
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 17
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 1
    • FDP_ITC.1: 12
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 10
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 10
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 10
    • FMT_LIM.2.1: 1
    • FMT_MSA.1: 2
    • FMT_MSA.2: 14
    • FMT_MSA.2.1: 1
    • FMT_MSA.3: 9
    • FMT_SMR.1: 1
  • FPT:
    • FPT_AMT.1: 1
    • FPT_FLS.1: 31
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 9
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 12
    • FPT_PHP.3.1: 1
    • FPT_SEP.1: 12
    • FPT_SEP.1.1: 1
    • FPT_SEP.1.2: 1
  • FRU:
    • FRU_FLT.1: 1
    • FRU_FLT.2: 16
pdf_data/st_keywords/cc_claims
  • A:
    • A.DEV_ORG: 2
    • A.DLV: 1
    • A.DLV_AUDIT: 2
    • A.DLV_PROTECT: 2
    • A.DLV_RESP: 2
    • A.KEY_DEST: 3
    • A.SOFT_ARCHI: 2
    • A.USE_DIAG: 2
    • A.USE_PROD: 2
    • A.USE_SYS: 2
    • A.USE_TEST: 2
  • O:
    • O.CLON: 3
    • O.CRYPTO: 3
    • O.DESIGN: 1
    • O.DESIGN_ACS: 2
    • O.DEV_DIS: 4
    • O.DEV_TOOLS: 3
    • O.DIS_: 3
    • O.DIS_ME: 1
    • O.DIS_MECHANISM: 4
    • O.DIS_MEMORY: 3
    • O.DLV_AUDIT: 1
    • O.DLV_PROTECT: 2
    • O.DLV_RESP: 2
    • O.DSOFT: 1
    • O.DSOFT_ACS: 2
    • O.FLAW: 3
    • O.IC_DLV: 2
    • O.KEY_: 1
    • O.KEY_DEST: 3
    • O.MASK: 1
    • O.MASK_FAB: 2
    • O.MECH: 1
    • O.MECH_ACS: 2
    • O.MOD_: 2
    • O.MOD_MEMORY: 5
    • O.OPER: 1
    • O.OPERATE: 7
    • O.SOFT: 1
    • O.SOFT_ACS: 2
    • O.SOFT_DLV: 2
    • O.SOFT_MECH: 1
    • O.TA: 1
    • O.TAMPER: 3
    • O.TEST_OPERATE: 2
    • O.TI: 1
    • O.TI_ACS: 1
    • O.TOE_PRT: 3
    • O.USE_DIAG: 1
    • O.USE_SYS: 2
  • T:
    • T.CLON: 12
    • T.DIS_DEL: 5
    • T.DIS_DESIGN: 10
    • T.DIS_DSOFT: 8
    • T.DIS_INFO: 4
    • T.DIS_PHOTOMASK: 6
    • T.DIS_SOFT: 7
    • T.DIS_TEST: 5
    • T.DIS_TOOLS: 5
    • T.MOD_DEL: 5
    • T.MOD_DESIGN: 10
    • T.MOD_DSOFT: 9
    • T.MOD_PHOTOMASK: 5
    • T.MOD_SOFT: 10
    • T.T_DEL: 6
    • T.T_PHOTOMASK: 6
    • T.T_PRODUCT: 7
    • T.T_SAMPLE: 8
  • O:
    • O.RND: 4
  • T:
    • T.RND: 4
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 6
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 13
  • DES:
    • DES:
      • DES: 47
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 8
    • RNG: 11
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 4
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Physical Tampering: 1
    • physical tampering: 5
  • other:
    • reverse engineering: 1
  • FI:
    • DFA: 2
    • Malfunction: 14
    • malfunction: 5
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 15
    • Physical Probing: 2
    • Physical probing: 1
    • physical probing: 4
pdf_data/st_keywords/standard_id
  • FIPS:
    • FIPS 186: 1
    • FIPS 46-2: 2
  • BSI:
    • AIS 31: 1
    • AIS31: 5
  • FIPS:
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC7816-3: 1
pdf_data/st_keywords/certification_process
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    • out of scope: 1
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