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Samsung S3CC9P9 microcontroller
ANSSI-CC-2004/06 		Infineon Technologies AG Smartcard ICs SLE88CNFX6600PM/P, SLE88CNFX6602PM/P, SLE88CNFX5400PM/P, SLE88CNF6600PM/P, SLE88CNF6602PM/P, SLE88CNF5400PM/P, SLE88CFX6600P, SLE88CFX6602P, SLE88CFX5400P, SLE88CF6600P, SLE88CF6602P, SLE88CF5400P all with PSL 3.22.11
BSI-DSZ-CC-0706-2011
name Samsung S3CC9P9 microcontroller Infineon Technologies AG Smartcard ICs SLE88CNFX6600PM/P, SLE88CNFX6602PM/P, SLE88CNFX5400PM/P, SLE88CNF6600PM/P, SLE88CNF6602PM/P, SLE88CNF5400PM/P, SLE88CFX6600P, SLE88CFX6602P, SLE88CFX5400P, SLE88CF6600P, SLE88CF6602P, SLE88CF5400P all with PSL 3.22.11
scheme FR DE
not_valid_before 11.05.2004 29.06.2011
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2004_06.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0706a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2004_06.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0706b_pdf.pdf
manufacturer Samsung Electronics Co., Ltd. Infineon Technologies AG
manufacturer_web https://www.samsung.com https://www.infineon.com/
security_level ALC_DVS.2, ADV_IMP.2, EAL4+, AVA_VLA.4 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 473ea605d6a40ef5 c379736b67eb7df8
heuristics/cert_id ANSSI-CC-2004/06 BSI-DSZ-CC-0706-2011
heuristics/cert_lab [] BSI
heuristics/extracted_sars ALC_DVS.2, ALC_TAT.1, ADV_IMP.2, ATE_DPT.1, ADV_DVS.2, ASE_REQ.1, ATE_COV.2, ADV_LLD.1, ASE_DES.1, AVA_SOF.1, AVA_MSU.2, ADV_RCR.1, ADV_HLD.2, ATE_IND.2, ASE_TSS.1, ASE_INT.1, AGD_USR.1, ALC_LCD.1, ADV_SPM.1, ADV_FSP.1, ASE_ENV.1, ASE_OBJ.1, ASE_SRE.1, ASE_PPC.1, AGD_ADM.1, ATE_FUN.1, AVA_VLA.4 ALC_FLR.3, ADV_ARC.1, AGD_OPE.1, APE_CCL.1, ALC_DVS.2, ATE_DPT.3, ALC_CMS.5, ASE_OBJ.2, APE_OBJ.2, ASE_REQ.2, ALC_DEL.1, ADV_FSP.5, APE_INT.1, ATE_COV.2, ASE_SPD.1, AVA_VAN.5, ATE_IND.2, ASE_TSS.1, ADV_INT.2, ASE_INT.1, AGD_PRE.1, ALC_LCD.1, ADV_SPM.1, APE_REQ.2, APE_ECD.1, ASE_CCL.1, ASE_ECD.1, ADV_TDS.4, ALC_CMC.4, ATE_FUN.1, ADV_IMP.1, ALC_TAT.2, APE_SPD.1
heuristics/extracted_versions - 3.22.11
heuristics/report_references/directly_referencing ANSSI-CC-2002/25 {}
heuristics/report_references/indirectly_referencing ANSSI-CC-2002/25 {}
heuristics/protection_profiles {} f6d23054061d72ba
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/report_filename 2004_06.pdf 0706a_pdf.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
  • FR:
  • DE:
    • cert_id: BSI-DSZ-CC-0706-2011
    • cert_item: Infineon Technologies AG Smartcard ICs SLE88CNFX6600PM/P, SLE88CNFX6602PM/P, SLE88CNFX5400PM/P, SLE88CNF6600PM/P, SLE88CNF6602PM/P, SLE88CNF5400PM/P, SLE88CFX6600P, SLE88CFX6602P, SLE88CFX5400P, SLE88CF6600P, SLE88CF6602P, SLE88CF5400P all with PSL 3.22.11
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • FR:
    • Rapport de certification 2002/25: 1
    • Rapport de certification 2004/06: 13
  • DE:
    • BSI-DSZ-CC-0706-2011: 21
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0035-2007: 1
    • BSI-CC-PP-0035-2007: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL1: 1
    • EAL3: 1
    • EAL4: 1
    • EAL4+: 1
    • EAL41: 1
    • EAL5: 1
    • EAL7: 2
  • ITSEC:
    • ITSEC E6 et: 1
  • EAL:
    • EAL 4: 2
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL1: 7
    • EAL2: 3
    • EAL3: 4
    • EAL4: 7
    • EAL5: 7
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 2
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_DEL.2: 2
    • ADO_IGS: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 1
    • ADV_RCR.1: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 1
    • AGD_ADM.1: 1
    • AGD_USR: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 3
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAA.1: 2
  • FCS:
    • FCS_CKM.1: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 2
    • FDP_IFF.1: 2
    • FDP_SDI.1: 2
  • FIA:
    • FIA_ATD.1: 2
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 2
  • FPT:
    • FPT_PHP.2: 2
    • FPT_PHP.3: 2
    • FPT_TST.1: 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 10
  • Infineon:
    • Infineon: 4
    • Infineon Technologies: 6
    • Infineon Technologies AG: 26
pdf_data/report_keywords/eval_facility
  • Serma:
    • SERMA: 3
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 4
  • AES_competition:
    • AES:
      • AES: 3
  • DES:
    • 3DES:
      • 3DES: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 2
  • SHA:
    • SHA1:
      • SHA1: 1
pdf_data/report_keywords/crypto_protocol
  • PGP:
    • PGP: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 3
  • TRNG:
    • TRNG: 2
pdf_data/report_keywords/side_channel_analysis
  • SCA:
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 36: 3
    • AIS 37: 2
    • AIS 38: 1
  • FIPS:
    • FIPS PUB 180-3: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 0035-2007 [8] Evaluation Technical Report, Version 1.02, 09.06.2011, T-Systems GEI GmbH, (confidential document) [9] ETR for composite evaluation according to AIS 36 for the Product Infineon Smart Card IC: 1
    • Version 1.02, 09.06.2011, T-Systems GEI GmbH (confidential document) [10] SLE88CNFX Family Hardware Reference User’s Manual, Edition 19-12-2009, Infineon Technologies: 1
pdf_data/report_metadata
  • /Author: DCSSI
  • /CreationDate: D:20040517150819+02'00'
  • /Creator: Acrobat PDFMaker 5.0 pour Word
  • /ModDate: D:20040517150839+03'00'
  • /Producer: Acrobat Distiller 5.0 (Windows)
  • /Subject: Micro-circuit SAMSUNG S3CC9P9
  • /Title: Rapport de certification 2004/06
  • pdf_file_size_bytes: 656869
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 26
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20110712132349+02'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, SLE88, Infineon"
  • /ModDate: D:20110712133038+02'00'
  • /Producer: OpenOffice.org 3.2
  • /Subject: Common Criteria Certification
  • /Title: Certification Report BSI-DSZ-CC-0706-2011
  • pdf_file_size_bytes: 932246
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 38
pdf_data/st_filename cible2004_06.pdf 0706b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 2
    • EAL 4 augmented: 1
    • EAL4: 12
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 3
    • EAL 5 augmented: 3
    • EAL5: 5
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 3
    • ACM_SCP: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_IGS: 3
  • ADV:
    • ADV_DVS.2: 1
    • ADV_FSP: 3
    • ADV_FSP.1: 1
    • ADV_HLD: 2
    • ADV_HLD.2: 1
    • ADV_IMP: 2
    • ADV_IMP.1: 2
    • ADV_IMP.2: 5
    • ADV_LLD: 2
    • ADV_LLD.1: 2
    • ADV_RCR: 3
    • ADV_RCR.1: 1
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 3
    • AGD_ADM.1: 1
    • AGD_USR: 3
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_TAT: 2
    • ALC_TAT.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_MSU: 2
    • AVA_SOF: 2
    • AVA_VLA: 2
    • AVA_VLA.4: 6
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 9
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL: 2
    • ASE_CCL.1: 1
    • ASE_ECD: 2
    • ASE_ECD.1: 1
    • ASE_INT: 2
    • ASE_INT.1: 1
    • ASE_OBJ: 2
    • ASE_OBJ.2: 1
    • ASE_REQ: 2
    • ASE_REQ.2: 1
    • ASE_SPD: 2
    • ASE_SPD.1: 1
    • ASE_TSS: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 11
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_GEN.1: 2
    • FAU_SAA.1: 7
  • FCS:
    • FCS_CKM.1: 8
    • FCS_CKM.4: 7
    • FCS_COP.1: 8
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACC.2: 5
    • FDP_ACF.1: 6
    • FDP_IFC.1: 6
    • FDP_IFF.1: 6
    • FDP_ITC.1: 3
    • FDP_SDI.1: 5
  • FIA:
    • FIA_ATD.1: 7
    • FIA_UAU.2: 8
    • FIA_UID.1: 1
    • FIA_UID.2: 8
  • FMT:
    • FMT_MOF.1: 7
    • FMT_MSA.1: 6
    • FMT_MSA.2: 3
    • FMT_MSA.3: 7
    • FMT_SMR.1: 7
  • FPR:
    • FPR_UNO: 1
    • FPR_UNO.1: 4
  • FPT:
    • FPT_AMT.1: 2
    • FPT_PHP.2: 5
    • FPT_PHP.3: 5
    • FPT_TST.1: 8
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 4
    • FAU_SAS.1: 10
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 1
    • FCS_CKM.1: 18
    • FCS_CKM.2: 1
    • FCS_CKM.4: 13
    • FCS_COP: 28
    • FCS_COP.1: 16
    • FCS_RNG: 4
    • FCS_RNG.1: 10
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC.1: 17
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 15
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 8
    • FDP_ITC.1: 14
    • FDP_ITC.2: 14
    • FDP_ITT.1: 6
    • FDP_SDI.1: 1
    • FDP_SDI.2: 13
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_CKM.4: 1
    • FMT_LIM: 3
    • FMT_LIM.1: 8
    • FMT_LIM.2: 8
    • FMT_MSA.1: 15
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 16
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 12
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 9
    • FPT_ITT.1: 6
    • FPT_PHP.3: 8
    • FPT_TST: 7
    • FPT_TST.1: 8
    • FPT_TST.2: 29
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 9
pdf_data/st_keywords/cc_claims
  • A:
    • A.DEV_ORG: 2
    • A.DLV: 1
    • A.DLV_AUDIT: 2
    • A.DLV_PROTECT: 2
    • A.DLV_RESP: 2
    • A.KEY_DEST: 3
    • A.SOFT_ARCHI: 2
    • A.USE_DIAG: 2
    • A.USE_PROD: 2
    • A.USE_SYS: 2
    • A.USE_TEST: 2
  • O:
    • O.CLON: 3
    • O.CRYPTO: 3
    • O.DESIGN: 1
    • O.DESIGN_ACS: 2
    • O.DEV_DIS: 4
    • O.DEV_TOOLS: 3
    • O.DIS_: 3
    • O.DIS_ME: 1
    • O.DIS_MECHANISM: 4
    • O.DIS_MEMORY: 3
    • O.DLV_AUDIT: 1
    • O.DLV_PROTECT: 2
    • O.DLV_RESP: 2
    • O.DSOFT: 1
    • O.DSOFT_ACS: 2
    • O.FLAW: 3
    • O.IC_DLV: 2
    • O.KEY_: 1
    • O.KEY_DEST: 3
    • O.MASK: 1
    • O.MASK_FAB: 2
    • O.MECH: 1
    • O.MECH_ACS: 2
    • O.MOD_: 2
    • O.MOD_MEMORY: 5
    • O.OPER: 1
    • O.OPERATE: 7
    • O.SOFT: 1
    • O.SOFT_ACS: 2
    • O.SOFT_DLV: 2
    • O.SOFT_MECH: 1
    • O.TA: 1
    • O.TAMPER: 3
    • O.TEST_OPERATE: 2
    • O.TI: 1
    • O.TI_ACS: 1
    • O.TOE_PRT: 3
    • O.USE_DIAG: 1
    • O.USE_SYS: 2
  • T:
    • T.CLON: 12
    • T.DIS_DEL: 5
    • T.DIS_DESIGN: 10
    • T.DIS_DSOFT: 8
    • T.DIS_INFO: 4
    • T.DIS_PHOTOMASK: 6
    • T.DIS_SOFT: 7
    • T.DIS_TEST: 5
    • T.DIS_TOOLS: 5
    • T.MOD_DEL: 5
    • T.MOD_DESIGN: 10
    • T.MOD_DSOFT: 9
    • T.MOD_PHOTOMASK: 5
    • T.MOD_SOFT: 10
    • T.T_DEL: 6
    • T.T_PHOTOMASK: 6
    • T.T_PRODUCT: 7
    • T.T_SAMPLE: 8
  • O:
    • O.RND: 1
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 6
  • Infineon:
    • Infineon: 3
    • Infineon Technologies: 2
    • Infineon Technologies AG: 5
  • NXP:
    • NXP: 1
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 13
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • 3DES: 8
      • Triple-DES: 2
    • DES:
      • DES: 23
  • constructions:
    • MAC:
      • HMAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 8
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
  • MD:
    • MD5:
      • MD5: 5
  • SHA:
    • SHA1:
      • SHA-1: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • PRNG: 2
  • RNG:
    • RND: 2
    • RNG: 8
  • TRNG:
    • TRNG: 5
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • ECB:
    • ECB: 4
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Physical Tampering: 1
    • physical tampering: 5
  • other:
    • reverse engineering: 1
  • FI:
    • DFA: 1
    • Malfunction: 8
    • malfunction: 1
  • SCA:
    • DPA: 5
    • Leak-Inherent: 7
    • Physical Probing: 2
    • SPA: 1
    • side-channel: 4
  • other:
    • reverse engineering: 2
pdf_data/st_keywords/standard_id
  • FIPS:
    • FIPS 186: 1
    • FIPS 46-2: 2
  • BSI:
    • AIS31: 5
  • CC:
    • CCMB-2009-07-001: 2
    • CCMB-2009-07-002: 2
    • CCMB-2009-07-003: 2
  • FIPS:
    • FIPS PUB 180-3: 3
  • ISO:
    • ISO/IEC 3309: 2
    • ISO/IEC 7816-3: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation: 1
    • a smart card embedded software and an IC dedicated software (Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation. 10 To allow the: 1
    • out of scope: 1
pdf_data/st_metadata
  • /CreationDate: D:20040221110009
  • /Creator: AdobePS5.dll Version 5.0.1
  • /ModDate: D:20040221110011+09'00'
  • /Producer: Acrobat Distiller 4.0 for Windows
  • /Title: Microsoft Word - ST C9P9 v1.2_FEB 21_.doc
  • pdf_file_size_bytes: 651062
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 58
  • /Author: Jürgen Noller
  • /CreationDate: D:20110617092354
  • /Creator: SLE88CNFX6600PM_SecTar.doc - Microsoft Word
  • /Keywords: Dresden, NFC, high end Security Controller, robust, high attack potential, EAL5, high, not practical, Infineon, CCv3.1, PP0035, TRGN
  • /Producer: Acrobat PDFWriter 5.0 für Windows NT
  • /Subject: Security Target SLE88CNFX6600PM / M8864
  • /Title: CC EAL5 Certification Security Target
  • pdf_file_size_bytes: 339184
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 59
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