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NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
BSI-DSZ-CC-1072-V5-2022 		NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
BSI-DSZ-CC-1072-V3-2019
status active archived
not_valid_after 12.12.2027 03.12.2024
not_valid_before 12.12.2022 03.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V5c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V5a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V4b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3b_pdf.pdf
manufacturer NXP Semiconductors Germany GmbH NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity
dgst 472cd3e990562b05 5fb51bc20f02913c
heuristics/cert_id BSI-DSZ-CC-1072-V5-2022 BSI-DSZ-CC-1072-V3-2019
heuristics/report_references/directly_referenced_by NSCIB-CC-23-66030-CR BSI-DSZ-CC-1072-V4-2021
heuristics/report_references/directly_referencing BSI-DSZ-CC-1072-V4-2021 BSI-DSZ-CC-1072-V2-2019
heuristics/report_references/indirectly_referenced_by NSCIB-CC-23-66030-CR BSI-DSZ-CC-1072-V4-2021, BSI-DSZ-CC-1072-V5-2022, NSCIB-CC-23-66030-CR
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-1072-V3-2019, BSI-DSZ-CC-1072-2018, BSI-DSZ-CC-0955-2016, BSI-DSZ-CC-0955-V2-2016, BSI-DSZ-CC-1072-V2-2019, BSI-DSZ-CC-1072-V4-2021 BSI-DSZ-CC-0955-V2-2016, BSI-DSZ-CC-1072-2018, BSI-DSZ-CC-1072-V2-2019, BSI-DSZ-CC-0955-2016
maintenance_updates
pdf_data/cert_filename 1072V5c_pdf.pdf 1072V3c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1072-V5-2022: 1
  • DE:
    • BSI-DSZ-CC-1072-V3-2019: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Keywords: "Common Criteria, Certification, Zertifizierung, P6021y VB*, NXP"
  • /Subject: Common Criteria, Certification, Zertifizierung, P6021y VB*, NXP
  • /Title: Certificate BSI-DSZ-CC-1072-V5-2022
  • pdf_file_size_bytes: 230121
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20191205125022+01'00'
  • /Creator: Writer
  • /Keywords: NXP, Secure Smart Card Controller, P6021y VB*, NXP Semiconductors Germany GmbH
  • /ModDate: D:20200108095848+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated SoftwarefromNXP Semiconductors Germany GmbH
  • /Title: Certificate BSI-DSZ-CC-1072-V3-2019
  • pdf_file_size_bytes: 296536
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1072V5a_pdf.pdf 1072V3a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2 and ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1072-V5-2022
    • cert_item: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2, ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1072-V3-2019
    • cert_item: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1072-V4-2021: 2
    • BSI-DSZ-CC-1072-V5-2022: 19
  • DE:
    • BSI-DSZ-CC-1072-V2-2019: 2
    • BSI-DSZ-CC-1072-V3-2019: 19
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
  • O:
    • O.C: 7
  • R:
    • R.O: 7
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 39
    • NXP Semiconductors: 30
  • NXP:
    • NXP: 27
    • NXP Semiconductors: 28
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
  • TUV:
    • TÜV Informationstechnik: 8
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • SCA:
    • physical probing: 1
  • other:
    • JIL: 4
  • FI:
    • physical tampering: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • Card Controller P6021y VB Evaluation Reference List, Version 2.7, 2021-05-04, NXP Semiconductors (confidential document) [19] NXP Secure Smart Card Controller P6021y VB Configuration List, Version 1.5, 2019-08-09, NXP: 1
    • Evaluation (ETR COMP) for the P6021y VB, version 2, 2022-11-25, TÜV Informationstechnik GmbH (confidential document) [11] SmartMX2 family P6021y VB Secure high-performance smart card controller, Objective data sheet: 1
    • GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Smart Card Controller P6021y VB – Security Target, Version 1.11, 2019-08-23, NXP Semiconductors (confidential document) [7] Evaluation Technical Report BSI-DSZ-CC-1072-V5-2022, Version 2, 2022-11-25, TÜV: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) 25 / 30 Certification Report BSI-DSZ-CC-1072-V5-2022 C. Excerpts from the Criteria For the: 1
  • ConfidentialDocument:
    • Card Controller P6021y VB Evaluation Reference List, Version 2.5, 2019-11-20, NXP Semiconductors (confidential document) [19] NXP Secure Smart Card Controller P6021y VB Configuration List, Version 1.5, 2019-08-09, NXP: 1
    • Corp, Hsinchu, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [23] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Production), Systems on: 1
    • Corporation, Hsinchu, Version 1, 2019-09-02, TÜV Informationstechnik GmbH (confidential document) [21] SITE TECHNICAL AUDIT REPORT (STAR), Production (Data Prep, Mask Temp Storage), Photronics: 1
    • Evaluation (ETR COMP) for the P6021y VB, version 3, 2019-11-21, TÜV Informationstechnik GmbH (confidential document) [11] SmartMX2 family P6021y VB Secure high-performance smart card controller, Objective data sheet: 1
    • GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Manufacturing Co. Pte. Ltd., Singapore, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) 25 / 31 Certification Report BSI-DSZ-CC-1072-V3-2019 C. Excerpts from the Criteria For the: 1
    • Smart Card Controller P6021y VB – Security Target, Version 1.11, 2019-08-23, NXP Semiconductors (confidential document) [7] Evaluation Technical Report BSI-DSZ-CC-1072-V3-2019, Version 2, 2019-11-21, TÜV: 1
    • Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [22] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Mask Production), Photronics DNP: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) [20] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Bumbing), Chipbond: 1
pdf_data/report_metadata
pdf_data/st_filename 1072V4b_pdf.pdf 1072V3b_pdf.pdf
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