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Lexmark CX622h, CX625h, CX921, CX922, CX923, CX924, MX522, MX622h, MX721h, MX722h, MX822, and MX826 with HD
CSEC2017017 		Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
BSI-DSZ-CC-1045-V2-2023
name Lexmark CX622h, CX625h, CX921, CX922, CX923, CX924, MX522, MX622h, MX721h, MX722h, MX822, and MX826 with HD Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
category Multi-Function Devices Other Devices and Systems
scheme SE DE
status archived active
not_valid_after 19.06.2024 03.03.2028
not_valid_before 19.06.2019 03.03.2023
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certificate%20Lexmark%20MFP%20wHD%202017%20CCRA.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certification%20Report%20Lexmark%202017%20MFD%20wHD.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Lexmark%20HD%20Security%20Target%20111.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045V2b_pdf.pdf
manufacturer Lexmark International, Inc. Qualcomm Technologies Inc.
manufacturer_web https://www.lexmark.com/ https://www.qualcomm.com
security_level EAL3, ALC_FLR.3 ALC_DVS.2, EAL4+, AVA_VAN.5
dgst 44e6981b1653ed8b ac18c15a88b4b1bd
heuristics/cert_id CSEC2017017 BSI-DSZ-CC-1045-V2-2023
heuristics/cert_lab [] BSI
heuristics/cpe_matches cpe:2.3:h:lexmark:mx522:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:mx822:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:cx924:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:cx923:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:cx921:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:mx826:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:cx622:-:*:*:*:*:*:*:*, cpe:2.3:h:lexmark:cx922:-:*:*:*:*:*:*:* {}
heuristics/extracted_sars ASE_INT.1, AVA_VAN.2, ALC_CMC.3, ALC_CMS.3, ASE_ECD.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ADV_TDS.2, ALC_DEL.1, ALC_LCD.1, ALC_FLR.3, AGD_OPE.1, AGD_PRE.1, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ATE_DPT.1, ASE_REQ.2, ALC_DVS.1, ATE_IND.2, ADV_FSP.3, ASE_CCL.1 ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_DVS.2, ALC_CMC.4
heuristics/extracted_versions - 1.1.2
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1045-2019
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-1045-2019
heuristics/scheme_data
  • category: System on a chip (SOC)
  • cert_id: BSI-DSZ-CC-1045-V2-2023
  • certification_date: 03.03.2023
  • enhanced:
    • applicant: Qualcomm Technologies Inc. 5775 Morehouse drive San Diego, CA 92121 USA
    • assurance_level: EAL4+; ALC_DVS.2, AVA_VAN.5
    • cert_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2c_pdf.pdf?__blob=publicationFile&v=2
    • certification_date: 03.03.2023
    • description: The TOE is the “Qualcomm Secure Processor Unit SPU230 embedded in the SDM855 host SoC combined with a DDR in a PoP (Package on Package) configuration and its corresponding Software and associated documentation. The hardware is a hard macro (sub-unit of a System-on-Chip which is already synthesized, placed and routed, delivered as GDS file) and the special packaging. The TOE is integrated into the SDM855 SoC by the SoC integrator (Qualcomm). The firmware and software comprise the operating system of the Secure Processor Unit and the software API providing cryptographic services to SPU applications. The SPU applications can be developed by the SPU application developer using the software API. The TOE can be used for multiple applications that require a high level of security. Examples are as follows: User authentication and password storage, Content protection, Payment, Subscriber Identity Module (SIM), Storage and management of digital identities, Secure key storage, Root of trust, Storage of sensitive user data.
    • entries: [frozendict({'id': 'BSI-DSZ-CC-1045-V2-2023 (Ausstellungsdatum / Certification Date 03.03.2023, gültig bis / valid until 02.03.2028) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target Zertifikat / Certificate', 'description': 'has been extended by additional cryptographic functions.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})]
    • evaluation_facility: T-Systems International GmbH atsec information security GmbH
    • expiration_date: 02.03.2028
    • product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
    • report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2a_pdf.pdf?__blob=publicationFile&v=2
    • target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1000/1045V2b_pdf.pdf?__blob=publicationFile&v=2
  • product: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/System_on_a_Chip_SOC/1045.html
  • vendor: Qualcomm Technologies Inc.
heuristics/protection_profiles {} cf0f01bcd7be3e9c
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename Certificate Lexmark MFP wHD 2017 CCRA.pdf 1045V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • SE:
    • CSEC2017017: 1
  • DE:
    • BSI-DSZ-CC-1045-V2-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL3+: 1
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.3: 1
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
  • Combitech:
    • Combitech AB: 1
  • EWA:
    • EWA-Canada: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /CreationDate: D:20190619093135+02'00'
  • /Creator: RICOH MP C4504ex
  • /ModDate: D:20190619110000+02'00'
  • /Producer: RICOH MP C4504ex
  • pdf_file_size_bytes: 971223
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Subject: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
  • /Title: Certification Report BSI-DSZ-CC-1045-V2-2023
  • pdf_file_size_bytes: 289421
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename Certification Report Lexmark 2017 MFD wHD.pdf 1045V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1045-V2-2023
    • cert_item: Qualcomm Secure Processing Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • SE:
    • CSEC2017017: 1
  • DE:
    • BSI-DSZ-CC-1045-2019: 3
    • BSI-DSZ-CC-1045-V2-2023: 17
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 3: 1
    • EAL2: 1
    • EAL3: 1
    • EAL3+: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.3: 1
    • ADV_TDS.2: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.3: 1
    • ALC_CMS.3: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_FLR.3: 5
    • ALC_LCD.1: 1
  • APE:
    • APE_ECD: 1
    • APE_OBJ: 1
    • APE_REQ: 1
    • APE_SPD: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_claims
  • A:
    • A.ACCESS: 1
    • A.ADMIN: 2
    • A.IPSEC: 1
    • A.USER: 1
    • A.VIPER: 1
  • T:
    • T.CONF: 2
    • T.DOC: 2
    • T.FUNC: 1
    • T.PROT: 1
  • O:
    • O.C: 4
  • R:
    • R.O: 4
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 38
pdf_data/report_keywords/eval_facility
  • Combitech:
    • Combitech AB: 5
  • EWA:
    • EWA-Canada: 3
  • DeutscheTelekom:
    • Deutsche Telekom Security: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • CMAC: 2
      • HMAC: 1
      • HMAC-SHA-384: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
      • SHA1: 1
    • SHA2:
      • SHA-256: 6
      • SHA-384: 2
      • SHA-512: 2
pdf_data/report_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • NIST P-192: 2
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 2
    • P-224: 2
    • P-256: 2
    • P-384: 2
    • P-521: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • malfunction: 1
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • ISO:
    • ISO/IEC 17025: 2
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS 180-4: 2
    • FIPS 186-4: 3
    • FIPS 197: 5
    • FIPS 198-1: 1
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS#1: 3
  • RFC:
    • RFC3447: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 04th April 2019 (confidential document) [16] Configuration list for the TOE: Configuration List for the hardware platform, Qualcomm: 1
    • Application Programming Interface API, Qualcomm Technologies Inc., Rev. 4.6, August 26th, 2020 (confidential document) [12] Guidance documentation for the TOE: Secure Processor Unit (SPU) Anti-Replay Island (ARI: 1
    • Configuration list for the TOE: rom_v2_binaries.txt, 23.10.2018 (confidential document) [20] Configuration list for the TOE: Configuration list of the documentation for the hardware: 1
    • Inc., version 3,1; 11th April 2019 (SPU_3_1_config_list.txt (confidential document) [17] Configuration list for the TOE: Configuration list including the functional and verification: 1
    • Qualcomm Technologies Inc., Rev. AC, May 6th, 2021 (confidential document) [14] Configuration list for the TOE: Configuration List user guidance: 1
    • Revision J, Date: 14.01.2022, Qualcomm SPU230 Core Security Target, Qualcomm Technologies, Inc., (confidential document) [7] Evaluation Technical Report, Version 2.1, Date: 26.01.2023, Evaluation Technical Report -: 1
    • TOE_SW_Test_config_list_CC2_PHASE2.txt(confidential document) [23] Configuration list for the TOE: MCP Software configuration list: config_list_spu_100.txt: 1
    • Unit SPU230 in SDM855 SoC with MCP version spss.a1.1.2_00100, Deutsche Telekom Security GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • for SM8150, Qualcomm Technologies Inc., Revision B, November, 2018 (confidential document) [13] Guidance documentation for the TOE: Qualcomm Secure Processing Unit, Enablement, 80-PF777-965: 1
    • list of the documentation for the software development process: ALC_CMC_Doc_config_list-5.2.pdf (confidential document) [25] Configuration list for the TOE: Site Security Documentation Configuration List: 1
    • of the hardware plat-form: TOE_HW_test_config_list.txt (confidential document) [18] Configuration list for the TOE: pbl_v2_config_list.txt, 22.03.2019 (confidential document: 1
    • process TOE_SW_HW_process_config_list-10.1.pdf (confidential document) [21] Configuration list for the TOE: Configuration list software specifications: 1
    • txt (confidential document) 25 / 29 Certification Report BSI-DSZ-CC-1045-V2-2023 C. Excerpts from the Criteria For the: 1
    • txt (confidential document) [22] Configuration list for the TOE: Configuration list functional and verification tests of: 1
    • v13.pdf, 09th December 2021 (confidential document) [15] Configuration list for the TOE: Configuration List hardware spec, TOE_HW_spec_config_list-4.0: 1
pdf_data/report_metadata
  • /Author: Imre Juhasz
  • /CreationDate: D:20190619091437+02'00'
  • /Creator: Microsoft® Word 2016
  • /ModDate: D:20190619115718+02'00'
  • /Producer: Microsoft® Word 2016
  • /Subject: 17FMV8490-21:1
  • /Title: Certification Report - Lexmark MFP wHD 2017
  • pdf_file_size_bytes: 423770
  • pdf_hyperlinks: http://www.fmv.se/Global/Dokument/Verksamhet/CSEC/Scheme_Note_15.pdf
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 23
pdf_data/st_filename Lexmark HD Security Target 111.pdf 1045V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL3: 4
    • EAL3 augmented: 3
    • EAL3+: 2
    • EAL5+: 1
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.3: 1
    • ADV_TDS.2: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.3: 1
    • ALC_CMS.3: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_FLR.3: 6
    • ALC_LCD.1: 1
  • APE:
    • APE_ECD: 1
    • APE_OBJ: 1
    • APE_REQ: 1
    • APE_SPD: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_ARP.1: 1
    • FAU_GEN: 1
    • FAU_GEN.1: 12
    • FAU_GEN.1.1: 1
    • FAU_GEN.1.2: 1
    • FAU_GEN.2: 7
    • FAU_GEN.2.1: 1
  • FCS:
    • FCS_CKM.1: 23
    • FCS_CKM.1.1: 2
    • FCS_CKM.2: 1
    • FCS_CKM.4: 14
    • FCS_CKM.4.1: 1
    • FCS_COP.1: 13
    • FCS_COP.1.1: 1
  • FDP:
    • FDP_ACC.1: 21
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 24
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC: 1
    • FDP_IFC.1: 1
    • FDP_IFF: 1
    • FDP_ITC.1: 2
    • FDP_ITC.2: 2
    • FDP_RIP.1: 7
    • FDP_RIP.1.1: 1
  • FIA:
    • FIA_AFL.1: 8
    • FIA_AFL.1.1: 1
    • FIA_AFL.1.2: 1
    • FIA_ATD.1: 9
    • FIA_ATD.1.1: 1
    • FIA_UAU.1: 13
    • FIA_UAU.1.1: 1
    • FIA_UAU.1.2: 1
    • FIA_UAU.7: 8
    • FIA_UAU.7.1: 1
    • FIA_UID.1: 21
    • FIA_UID.1.1: 1
    • FIA_UID.1.2: 1
    • FIA_USB.1: 8
    • FIA_USB.1.1: 1
    • FIA_USB.1.2: 1
    • FIA_USB.1.3: 1
  • FMT:
    • FMT_MSA.1: 15
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 15
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_MTD: 1
    • FMT_MTD.1: 14
    • FMT_MTD.1.1: 1
    • FMT_SMF.1: 18
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 22
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FDI_EXP: 3
    • FPT_FDI_EXP.1: 13
    • FPT_FDI_EXP.1.1: 2
    • FPT_STM.1: 10
    • FPT_STM.1.1: 1
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FTA:
    • FTA_SSL.3: 10
    • FTA_SSL.3.1: 1
  • FTP:
    • FTP_ITC.1: 13
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 62
    • FCS_CKM.1: 16
    • FCS_CKM.2: 3
    • FCS_CKM.4: 16
    • FCS_COP: 49
    • FCS_COP.1: 12
    • FCS_ITC.1: 13
    • FCS_ITC.2: 13
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 3
    • FDP_SDA.1: 12
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 3
    • FDP_SDR.1: 12
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
pdf_data/st_keywords/cc_claims
  • A:
    • A.ACCESS: 3
    • A.ADMIN: 6
    • A.IPSEC: 4
    • A.TYPE: 1
    • A.USER: 3
    • A.VIPER: 3
  • D:
    • D.CONF: 8
    • D.DOC: 7
    • D.FUNC: 6
    • D.PROT: 3
  • O:
    • O.AUDIT: 5
    • O.CONF: 10
    • O.DOC: 10
    • O.FUNC: 5
    • O.INTERFACE: 5
    • O.MANAGE: 6
    • O.PROT: 3
    • O.SOFTWARE: 5
    • O.TIME_STAMP: 6
    • O.USER: 9
  • OE:
    • OE.ADMIN: 6
    • OE.AUDIT: 3
    • OE.AUDIT_ACCESS: 3
    • OE.AUDIT_STORAGE: 3
    • OE.INTERFACE: 2
    • OE.IPSEC: 4
    • OE.PHYSICAL: 3
    • OE.TIME_STAMP: 4
    • OE.USER: 11
    • OE.VIPER: 3
  • OSP:
    • OSP: 1
  • T:
    • T.CONF: 6
    • T.DOC: 6
    • T.FUNC: 3
    • T.PROT: 3
    • T.TYPE: 1
  • O:
    • O.AES: 3
    • O.CMAC: 4
    • O.ECDH: 4
    • O.ECDSA: 4
    • O.HMAC: 4
    • O.KDF: 4
    • O.RND: 1
    • O.RSA_ENC: 4
    • O.RSA_SIGN: 4
    • O.SHA: 3
    • O.TDES: 3
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-: 1
    • T.CONFID-APPLI-DATA: 4
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-: 1
    • T.INTEG-APPLI-CODE: 2
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 4
  • Qualcomm:
    • Qualcomm: 22
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • TDES: 1
  • constructions:
    • MAC:
      • HMAC: 2
  • AES_competition:
    • AES:
      • AES: 32
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 25
      • Triple-DES: 3
  • constructions:
    • MAC:
      • CMAC: 16
      • HMAC: 25
      • HMAC-SHA-384: 1
pdf_data/st_keywords/asymmetric_crypto
  • FF:
    • DH:
      • DH: 3
      • Diffie-Hellman: 3
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 11
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 2
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 4
    • SHA2:
      • SHA-256: 4
      • SHA-384: 3
  • SHA:
    • SHA1:
      • SHA-1: 10
      • SHA1: 1
    • SHA2:
      • SHA-256: 15
      • SHA-384: 8
      • SHA-512: 8
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/crypto_protocol
  • IKE:
    • IKE: 9
  • IPsec:
    • IPsec: 3
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 3
  • RNG:
    • RBG: 2
  • TRNG:
    • TRNG: 5
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 17
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CBC:
    • CBC: 4
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-192: 5
    • NIST P-224: 2
    • NIST P-256: 2
    • NIST P-384: 2
    • NIST P-521: 2
    • P-192: 13
    • P-224: 16
    • P-256: 12
    • P-384: 14
    • P-521: 16
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • malfunction: 1
  • FI:
    • DFA: 4
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channel: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • IBM:
    • SE: 1
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • FIPS:
    • FIPS 140-2: 1
    • FIPS 180-4: 1
    • FIPS 186-4: 1
    • FIPS 197: 1
    • FIPS 198-1: 1
  • ISO:
    • ISO/IEC 10116: 1
    • ISO/IEC 18033-3: 1
  • NIST:
    • NIST SP 800-56B: 1
    • NIST SP 800-90A: 2
    • SP 800-56B: 1
    • SP 800-90A: 1
  • RFC:
    • RFC 3164: 1
    • RFC2409: 1
  • X509:
    • X.509: 2
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 4
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 4
    • FIPS PUB 186-4: 5
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 3
    • FIPS186-4: 2
    • FIPS198-1: 1
    • FIPS46-3: 1
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-56A: 1
    • NIST SP 800-67: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 7
  • RFC:
    • RFC3447: 3
    • RFC5639: 3
pdf_data/st_metadata
  • /Author: QTI
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /Subject: 80-NU430-6 Rev.H
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 824155
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 61
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