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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		PR/SM for IBM z16 and IBM LinuxONE 4 Systems Driver Level 51C with Bundle Level 19B (D51C/B19B)
BSI-DSZ-CC-1222-2024
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC PR/SM for IBM z16 and IBM LinuxONE 4 Systems Driver Level 51C with Bundle Level 19B (D51C/B19B)
status archived active
not_valid_after 07.05.2024 10.03.2029
not_valid_before 08.05.2019 11.03.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1222c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1222a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1222b_pdf.pdf
manufacturer Qualcomm Technologies Inc. IBM Corporation
manufacturer_web https://www.qualcomm.com https://www.ibm.com
security_level EAL4+, AVA_VAN.5, ALC_DVS.2 ALC_TAT.3, AVA_VAN.5, EAL5+, ALC_FLR.3, ATE_FUN.2
dgst 2e8cbf6ce18d4c6f 3f9c694a84d34fd9
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-1222-2024
heuristics/extracted_sars ALC_LCD.1, ALC_TAT.1, ALC_DVS.2, AVA_VAN.5, ALC_CMS.4, ALC_CMC.4, ALC_DEL.1 ALC_FLR.3, ASE_CCL.1, ASE_OBJ.2, ATE_DPT.3, AVA_VAN.5, ASE_INT.1, ALC_CMC.4, ASE_REQ.2, ADV_INT.2, ATE_FUN.2, AGD_PRE.1, ATE_IND.2, ASE_ECD.1, ALC_TAT.3, ADV_IMP.1, ADV_TDS.4, ALC_LCD.1, ASE_SPD.1, ATE_COV.2, ALC_DVS.1, ALC_CMS.5, AGD_OPE.1, ADV_FSP.5, ALC_DEL.1, ASE_TSS.1, ADV_ARC.1
heuristics/extracted_versions - 4
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1186-2023
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0846-2013, BSI-DSZ-CC-0793-2012, BSI-DSZ-CC-1109-2019, BSI-DSZ-CC-1160-2021, BSI-DSZ-CC-1186-2023, BSI-DSZ-CC-0900-2014, BSI-DSZ-CC-1133-2020, BSI-DSZ-CC-0953-2015, BSI-DSZ-CC-1005-2016, BSI-DSZ-CC-0715-2011, BSI-DSZ-CC-1048-2018
heuristics/scheme_data
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf 1222c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • DE:
    • BSI-DSZ-CC-1222-2024: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 5: 1
    • EAL 5 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.3: 1
    • ALC_TAT.3: 1
  • ATE:
    • ATE_FUN.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Keywords: "Common Criteria, Certification, Zertifizierung, PR/SM for IBM z16 and IBM LinuxONE 4 Systems, Driver Level 51C with Bundle Level 19B (D51C/B19B), BSI-DSZ-CC-1222-2024"
  • /Subject: Common Criteria, Certification, Zertifizierung, PR/SM for IBM z16 and IBM LinuxONE 4 Systems, Driver Level 51C with Bundle Level 19B (D51C/B19B), BSI-DSZ-CC-1222-2024
  • /Title: Certificate BSI-DSZ-CC-1222-2024
  • pdf_file_size_bytes: 339351
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 1222a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_FLR.3, ALC_TAT.3, ATE_FUN.2, AVA_VAN.5 valid until: 10 March 2029
    • cc_version: Product specific Security Target Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1222-2024
    • cert_item: PR/SM for IBM z16 and IBM LinuxONE 4 Systems Driver Level 51C with Bundle Level 19B (D51C/B19B
    • cert_lab: BSI
    • developer: IBM Corporation
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: None
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-1186: 1
    • BSI-DSZ-CC-1186-2023: 3
    • BSI-DSZ-CC-1222-2024: 15
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 4
    • EAL 5: 4
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_FSP.5: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • ALC:
    • ALC_CMS.5: 1
    • ALC_FLR: 3
    • ALC_FLR.3: 4
    • ALC_TAT.3: 5
  • ATE:
    • ATE_DPT.3: 1
    • ATE_FUN.2: 5
  • AVA:
    • AVA_VAN.5: 5
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • atsec:
    • atsec: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_protocol
  • TLS:
    • TLS:
      • TLS 1.3: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 16
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 32: 1
    • AIS 34: 1
    • AIS 38: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • Report, Version 4, 2024-01-25, Final Evaluation Technical Report, atsec information security GmbH (confidential document) [8] IBM zSystems and LinuxONE Processor Resource/Systems Manager Planning, Version SB10-7178-01: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • OutOfScope:
    • out of scope: 1
    • the security test suite FTP06 must be included in the driver regression testing, which however is out of scope for this evaluation The combination of the above ensures that changes to the driver, including: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf 1222b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1222: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL5: 4
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP.5: 2
    • ADV_IMP.1: 2
    • ADV_INT.2: 2
    • ADV_TDS.4: 2
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 2
    • ALC_CMS.5: 2
    • ALC_DEL.1: 2
    • ALC_DVS.1: 2
    • ALC_FLR.3: 4
    • ALC_LCD.1: 2
    • ALC_TAT.3: 4
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 2
    • ATE_DPT.3: 2
    • ATE_FUN.2: 4
    • ATE_IND.2: 2
  • AVA:
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN.1: 10
    • FAU_GEN.1.1: 2
    • FAU_GEN.1.2: 1
    • FAU_GEN.2: 6
    • FAU_GEN.2.1: 1
    • FAU_SAR.1: 9
    • FAU_SAR.1.1: 1
    • FAU_SAR.1.2: 1
    • FAU_SAR.2: 6
    • FAU_SAR.2.1: 1
    • FAU_SAR.3: 7
    • FAU_SAR.3.1: 1
    • FAU_STG.1: 7
    • FAU_STG.1.1: 1
    • FAU_STG.1.2: 1
    • FAU_STG.4: 7
    • FAU_STG.4.1: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 3
    • FDP_ACC.1.1: 2
    • FDP_ACC.2: 25
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 43
    • FDP_ACF.1: 14
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 17
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 9
    • FDP_IFF.1.1: 1
    • FDP_IFF.1.2: 1
    • FDP_IFF.1.3: 1
    • FDP_IFF.1.4: 1
    • FDP_IFF.1.5: 1
    • FDP_RIP.2: 8
    • FDP_RIP.2.1: 1
  • FIA:
    • FIA_ATD.1: 10
    • FIA_ATD.1.1: 1
    • FIA_UID.2: 10
    • FIA_UID.2.1: 1
  • FMT:
    • FMT_MSA: 27
    • FMT_MSA.1: 14
    • FMT_MSA.3: 13
    • FMT_MSA.3.1: 4
    • FMT_MSA.3.2: 4
    • FMT_MTD.1: 9
    • FMT_MTD.1.1: 1
    • FMT_SMF.1: 12
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 14
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNO.1: 13
    • FPR_UNO.1.1: 1
  • FPT:
    • FPT_ITT.1: 8
    • FPT_ITT.1.1: 1
    • FPT_STM.1: 9
    • FPT_STM.1.1: 1
    • FPT_TRC.1: 6
    • FPT_TRC.1.1: 1
    • FPT_TRC.1.2: 1
    • FPT_TST.1: 8
    • FPT_TST.1.1: 2
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FRU:
    • FRU_RSA.1: 7
    • FRU_RSA.1.1: 1
  • FTA:
    • FTA_TSE.1: 10
    • FTA_TSE.1.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • OE:
    • OE.SIE: 3
  • T:
    • T.LPAR_XCTL: 5
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
pdf_data/st_keywords/eval_facility
  • atsec:
    • atsec: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
  • IBM:
    • SE: 26
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
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