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Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
BSI-DSZ-CC-0719-V2-2016
Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 with optional Software Libraries RSA2048, RSA4096, EC, Base, SCL, HCL, PSL and with specific IC dedicated software
None
name Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 with optional Software Libraries RSA2048, RSA4096, EC, Base, SCL, HCL, PSL and with specific IC dedicated software
status archived active
not_valid_after 12.08.2021 07.07.2025
not_valid_before 12.08.2016 06.11.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V9c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0719V2a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V9a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0719V2b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V9b_pdf.pdf
manufacturer Samsung Electronics Co., Ltd. Infineon Technologies AG
manufacturer_web https://www.samsung.com https://www.infineon.com/
dgst 2c5ab136ccfdeb16 4e1b46d48008d9c2
heuristics/cert_id BSI-DSZ-CC-0719-V2-2016
heuristics/cert_lab BSI []
heuristics/extracted_sars ASE_SPD.1, APE_INT.1, ALC_DVS.2, AGD_OPE.1, ALC_TAT.2, APE_REQ.2, ATE_FUN.1, ATE_IND.2, ASE_REQ.2, APE_SPD.1, ADV_FSP.5, ALC_CMS.5, ADV_IMP.1, ASE_ECD.1, ALC_FLR.3, ADV_SPM.1, ALC_CMC.4, ADV_TDS.4, ASE_TSS.1, ADV_INT.2, APE_CCL.1, ALC_DEL.1, ALC_LCD.1, ATE_COV.2, AVA_VAN.5, ASE_INT.1, APE_OBJ.2, ASE_CCL.1, AGD_PRE.1, ADV_ARC.1, APE_ECD.1, ATE_DPT.3, ASE_OBJ.2 ALC_DVS.2, AVA_VAN.5
heuristics/extracted_versions 1.0 -
heuristics/prev_certificates BSI-DSZ-CC-0719-2011 {}
heuristics/report_references/directly_referencing BSI-DSZ-CC-0719-2011 {}
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0547-2009 {}
heuristics/scheme_data
  • category: Smart Cards and similar devices
  • cert_id: BSI-DSZ-CC-0827-V9-2024
  • certification_date: 06.11.2024
  • enhanced:
    • applicant: Infineon Technologies AG Am Campeon 1-12 85579 Neubiberg
    • assurance_level: EAL 5+,ALC_DVS.2,AVA_VAN.5
    • certification_date: 06.11.2024
    • description: The Target of Evaluation (TOE) is Infineon smart card IC (Security Controller) M9900 A21 with optional Software Libraries RSA2048 v1.03.006 – RSA4096 v1.03.006 – EC v1.03.006 – Toolbox v1.03.006 – FTL v1.01.0008 and with specific IC dedicated software. The TOE provides a real 32-bit CPU-architecture and is compatible to the ARMv7-M instruction set. The major components of the core system are the 32-bit CPU (Central Processing Unit), the Cache system, the MPU (Memory Protection Unit) and MED (Memory Encryption/Decryption Unit. The TOE consists of the hardware part, the firmware parts and the software parts. The software parts are differentiated into: the cryptographic libraries RSA and EC and the supporting libraries Toolbox, Base and FTL. RSA, EC, Toolbox, and FTL provide certain functionality to the Smartcard Embedded Software. This TOE is intended to be used in smart cards for particularly security relevant applications and for its previous use as developing platform for smart card operating systems. The term Smartcard Embedded Software is used in the following for all operating systems and applications stored and executed on the TOE. The TOE is the platform for the Smartcard Embedded Software.
    • entries: [frozendict({'id': 'BSI-DSZ-CC-0827-V9-2024', 'description': 'In comparison to the TOE forerunner changes were conducted in TOE documentation (guidance), and the certification scope has been reduced.'}), frozendict({'id': 'BSI-DSZ-CC-0827-V8-2020 (Ausstellungsdatum / Certification Date 06.07.2020, gültig bis / valid until 05.07.2025)', 'description': 'Certificate'}), frozendict({'id': 'BSI-DSZ-CC-0827-V7-2018 (Ausstellungsdatum / Certification Date 14.09.2018, gültig bis / valid until 13.09.2023)', 'description': 'Certificate'}), frozendict({'id': 'BSI-DSZ-CC-0827-V6-2017 (Ausstellungsdatum / Certification Date 02.11.2017, gültig bis / valid until 01.11.2022)', 'description': 'forerunner, the changes comprise the addition of new software library versions and change of the respective guidance documentations.'}), frozendict({'id': 'BSI', 'description': 'design step. Furthermore, adjustments and changes in guidance documentations apply.'}), frozendict({'id': 'BSI-DSZ-CC-0827-V4-2016 (Ausstellungsdatum / Certification Date 23.11.2016, gültig bis / valid until 22.11.2021)', 'description': 'The changes, compared to the preceding certification, consist of addition of a new configuration as well as addition of optional software libraries.'}), frozendict({'id': 'BSI-DSZ-CC-0827-V3-2015 (Ausstellungsdatum / Certification Date 03.11.2015, gültig bis / valid until 02.11.2020)', 'description': 'Security Target'}), frozendict({'id': 'BSI-DSZ-CC-0827-V2-2014 (30.04.2014) Zertifizierungsreport / Certification Report Sicherheitsvorgaben / Security Target', 'description': 'in Taiwan.'}), frozendict({'id': 'BSI-DSZ-CC-0827-2013-MA-01 (19.06.2013)', 'description': 'dedicated software'}), frozendict({'id': 'BSI', 'description': 'Security Target'})]
    • evaluation_facility: TÜV Informationstechnik GmbH
    • expiration_date: 06.07.2025
    • product: Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 with optional Software Libraries RSA2048, RSA4096, EC, Base, SCL, HCL, PSL and with specific IC dedicated software
    • protection_profile: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
    • report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte08/0827V9c_pdf.pdf?__blob=publicationFile&v=2
    • target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte08/0827V9b_pdf.pdf?__blob=publicationFile&v=2
  • product: Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 …
  • subcategory: ICs, Cryptolib
  • url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/SmartCards_IC_Cryptolib/0827.html
  • vendor: Infineon Technologies AG
pdf_data/report_filename 0719V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5 SOGIS Recognition Agreement
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0719-V2-2016
    • cert_item: Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0719-2011: 3
    • BSI-DSZ-CC-0719-V2-2016: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 7
    • EAL 2: 4
    • EAL 3: 4
    • EAL 4: 9
    • EAL 5: 12
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 4
    • EAL 7: 4
    • EAL5: 2
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 3
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/cc_sfr
pdf_data/report_keywords/cc_claims
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 28
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 4
  • DES:
    • 3DES:
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 4
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 5
    • ECDH:
      • ECDH: 2
    • ECDSA:
      • ECDSA: 3
pdf_data/report_keywords/pq_crypto
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA2:
      • SHA224: 1
      • SHA256: 1
      • SHA384: 1
      • SHA512: 1
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
pdf_data/report_keywords/crypto_protocol
pdf_data/report_keywords/randomness
  • TRNG:
    • TRNG: 8
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 1
pdf_data/report_keywords/ecc_curve
  • NIST:
    • P-192: 4
    • P-224: 6
    • P-256: 6
    • P-384: 6
pdf_data/report_keywords/crypto_engine
pdf_data/report_keywords/tls_cipher_suite
pdf_data/report_keywords/crypto_library
pdf_data/report_keywords/vulnerability
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/device_model
pdf_data/report_keywords/tee_name
pdf_data/report_keywords/os_name
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/ic_data_group
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 2
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS20: 2
    • AIS31: 2
  • FIPS:
    • FIPS PUB 180-3: 1
    • FIPS PUB 186-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC14888-: 1
pdf_data/report_keywords/javacard_version
pdf_data/report_keywords/javacard_api_const
pdf_data/report_keywords/javacard_packages
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [9: 1
    • Evaluation Technical Report For Composite Evaluation (ETR COMP), TÜV Informationstechnik GmbH (confidential document) [11] Security Application Note S3CT9KA_K7_K3_PC_PA_P7_P3_AC_AA_A7, Version 1.6, 2016-05-03: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • optional Secure RSA and ECC Library including specific IC Dedicated Software, Samsung Electronics (confidential document) [7] Evaluation Technical Report, Version 6, 2016-07-27, Evaluation Ttechnical Report Summary (ETR: 1
pdf_data/report_metadata
pdf_data/st_filename 0719V2b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 5
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 4
    • FCS_CKM.1: 21
    • FCS_CKM.2: 2
    • FCS_CKM.4: 11
    • FCS_COP: 19
    • FCS_COP.1: 23
    • FCS_RNG: 11
    • FCS_RNG.1: 19
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 2
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 10
    • FDP_ITC.2: 10
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 3
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 14
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 9
  • constructions:
    • MAC:
      • HMAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 27
    • ECDH:
      • ECDH: 16
    • ECDSA:
      • ECDSA: 15
  • FF:
    • DH:
      • Diffie-Hellman: 2
    • DSA:
      • DSA: 2
  • RSA:
    • RSA-CRT: 1
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 2
    • SHA2:
      • SHA-224: 2
      • SHA-256: 2
      • SHA-384: 2
      • SHA-512: 2
      • SHA224: 6
      • SHA256: 6
      • SHA384: 6
      • SHA512: 2
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
    • RNG: 1
  • TRNG:
    • DTRNG: 2
    • TRNG: 16
pdf_data/st_keywords/cipher_mode
  • ECB:
    • ECB: 3
pdf_data/st_keywords/ecc_curve
  • Brainpool:
    • brainpoolP192r1: 4
    • brainpoolP192t1: 4
    • brainpoolP224r1: 4
    • brainpoolP224t1: 4
    • brainpoolP256r1: 4
    • brainpoolP256t1: 4
    • brainpoolP320r1: 4
    • brainpoolP320t1: 4
    • brainpoolP384r1: 4
    • brainpoolP384t1: 4
    • brainpoolP512r1: 4
    • brainpoolP512t1: 4
  • NIST:
    • P-192: 8
    • P-224: 8
    • P-256: 8
    • P-384: 8
    • secp192k1: 4
    • secp192r1: 4
    • secp224k1: 4
    • secp224r1: 4
    • secp256k1: 4
    • secp256r1: 4
    • secp384r1: 4
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 1
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 24
    • fault injection: 2
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 12
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 10
    • physical probing: 9
    • side channel: 2
    • side-channel: 4
    • timing attack: 5
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 31: 2
    • AIS20: 3
    • AIS31: 2
  • CC:
    • CCMB-2009-07-001: 3
    • CCMB-2009-07-002: 3
    • CCMB-2009-07-003: 3
    • CCMB-2009-07-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS PUB 180-3: 6
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company:
  • /CreationDate: D:20160725163316+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /Keywords:
  • /ModDate: D:20160725163322+09'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20160725073301
  • /Subject:
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1168031
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 66
state/report/convert_ok True False
state/report/download_ok True False
state/report/extract_ok True False
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state/report/txt_hash Different Different
state/st/convert_ok True False
state/st/download_ok True False
state/st/extract_ok True False
state/st/pdf_hash Different Different
state/st/txt_hash Different Different