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FM1280 V05
SERTIT-109 		Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019
name FM1280 V05 Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
category ICs, Smart Cards and Smart Card-Related Devices and Systems Other Devices and Systems
scheme NO DE
not_valid_after 02.07.2023 07.05.2024
not_valid_before 02.07.2018 08.05.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SERTIT-109%20C%20v%202.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SERTIT-109%20Certification%20Report%20Fudan%20EAL5plus%20v2.0_rev.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/FM1280%20EAL5plus%20ST%20lite%20v2.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf
manufacturer Shanghai Fudan Microelectronics Group Co., Ltd. Qualcomm Technologies Inc.
manufacturer_web https://eng.fmsh.com https://www.qualcomm.com
security_level ALC_DVS.2, EAL5+, AVA_VAN.5 ALC_DVS.2, AVA_VAN.5, EAL4+
dgst 29eab60d2793d1a1 2e8cbf6ce18d4c6f
heuristics/cert_id SERTIT-109 BSI-DSZ-CC-1045-2019
heuristics/cert_lab [] BSI
heuristics/extracted_sars AVA_VAN.5, ADV_ARC.1, ATE_COV.2, ADV_FSP.5, ASE_TSS.1, AGD_OPE.1, ATE_DPT.3, ADV_IMP.1, ADV_TDS.4, ASE_REQ.2, ALC_DVS.2, AGD_PRE.1, ASE_CCL.1, ATE_IND.2, ASE_ECD.1, ALC_DEL.1, ASE_OBJ.2, ASE_INT.1, ADV_INT.2, ALC_TAT.2, ASE_SPD.1, ATE_FUN.1, ALC_CMS.5, ALC_CMC.4, ALC_LCD.1 ALC_LCD.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_TAT.1, ALC_CMC.4, ALC_DVS.2
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-1045-V2-2023
heuristics/report_references/indirectly_referenced_by {} BSI-DSZ-CC-1045-V2-2023
heuristics/scheme_data
  • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
  • certification_date: 02.07.2018
  • developer: Shanghai Fudan Microelectronics Group Co., Ltd.
  • enhanced:
    • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
    • cert_id: SERTIT-109
    • certification_date: 02.07.2018
    • description: The TOE is a Dual Interface Smart Card Chip with IC Dedicated Software. It provides TDES, RSA, AES, ECC,True Random Number Generator and other security features. It can be widely and easily applied in various security fields such as banking and financial market, social security card, transport card, small-amount payment and security identification, etc. The TOE supports the following communication interfaces: - ISO/IEC 14443 TYPE A contactless interface - ISO/IEC 7816 contact interface - GPIO - SPI - I2C - UART
    • developer: Shanghai Fudan Microelectronics Group Co., Ltd.
    • documents: frozendict({'cert': [frozendict({'href': 'https://sertit.no/getfile.php/135331-1607953855/SERTIT/Sertifikater/2018/109/SERTIT-109%20C%20v%202.0.pdf'})], 'target': [frozendict({'href': 'https://sertit.no/getfile.php/135325-1607953847/SERTIT/Sertifikater/2018/109/FM1280%20EAL5%2B%20ST%20lite.pdf'})], 'report': [frozendict({'href': 'https://sertit.no/getfile.php/135328-1607953852/SERTIT/Sertifikater/2018/109/SERTIT-109%20Certification%20Report%20Fudan%20EAL5%2B%20v2.0_rev.pdf'})], 'maintenance': [frozendict({'href': 'https://sertit.no/getfile.php/135322-1607953843/SERTIT/Sertifikater/2018/109/SERTIT-109%20MR%20Maintenance%20Report%20v1.0-.pdf'})]})
    • evaluation_facility: Brightsight B.V.
    • expiration_date: 02.07.2023
    • level: EAL 5, ALC_DVS.2, ATE_DPT.2, AVA_VAN.5
    • mutual_recognition: CCRA, SOG-IS
    • product: V05
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, BSI-CC-PP-0084-2014
    • sponsor: Shanghai Fudan Microelectronics Group Co., Ltd.
  • product: FM1280
  • url: https://sertit.no/certified-products/product-archive/fm1280
maintenance_updates
pdf_data/cert_filename SERTIT-109 C v 2.0.pdf 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • NO:
    • SERTIT-109: 2
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • pdf_file_size_bytes: 2830569
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename SERTIT-109 Certification Report Fudan EAL5plus v2.0_rev.pdf 1045a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • NO:
    • SERTIT-109: 20
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 23
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 22
    • EAL 5 augmented: 1
    • EAL1: 1
    • EAL4: 1
    • EAL5: 1
    • EAL5+: 1
    • EAL7: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 5
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_COP.1: 8
    • FCS_RNG.1: 4
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACF.1: 1
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
    • FDP_SDC.1: 4
    • FDP_SDI.2: 3
  • FMT:
    • FMT_LIM.1: 2
    • FMT_LIM.2: 2
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • BrightSight:
    • Brightsight: 2
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • TDES: 5
    • DES:
      • DES: 3
  • AES_competition:
    • AES:
      • AES: 3
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
  • SCA:
    • DPA: 1
    • SPA: 1
  • other:
    • JIL: 2
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 15408: 8
    • ISO/IEC 7816: 2
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author: Ulrich Isachsen
  • /CreationDate: D:20190319130354+01'00'
  • /Creator: Microsoft® Word 2013
  • /Keywords: ugradert
  • /ModDate: D:20190319130354+01'00'
  • /Producer: Microsoft® Word 2013
  • /Title: tittel
  • pdf_file_size_bytes: 423796
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 20
pdf_data/st_filename FM1280 EAL5plus ST lite v2.0.pdf 1045b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0084-2014: 1
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 2
    • EAL5 augmented: 2
    • EAL5+: 1
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 9
    • FCS_CKM.4: 9
    • FCS_COP.1: 28
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 6
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC.1: 8
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 7
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 4
    • FDP_ITC.1: 13
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDC.1: 7
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 2
    • FMT_MSA.3: 3
  • FPT:
    • FPT_FLS.1: 6
    • FPT_ITT.1: 6
    • FPT_PHP.3: 5
  • FRU:
    • FRU_FLT.2: 6
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 5
    • O.ECC: 5
    • O.MEM_ACCCESS: 1
    • O.MEM_ACCESS: 4
    • O.RND: 3
    • O.RSA: 5
    • O.TDES: 6
  • T:
    • T.RND: 2
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 29
  • DES:
    • 3DES:
      • 3DES: 1
      • TDEA: 1
      • TDES: 16
      • Triple-DES: 7
    • DES:
      • DES: 13
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 30
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 4
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 8
  • TRNG:
    • TRNG: 1
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 5
  • ECB:
    • ECB: 5
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 5
    • fault injection: 1
    • malfunction: 4
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • FIPS:
    • FIPS 197: 3
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 7816: 4
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-67: 1
  • PKCS:
    • PKCS#1: 3
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
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  • /Author: FMSH
  • /CreationDate: D:20180606084137+08'00'
  • /Creator: Microsoft® Word 2010
  • /ModDate: D:20180606084137+08'00'
  • /Producer: Microsoft® Word 2010
  • pdf_file_size_bytes: 677458
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 31
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: mailto:[email protected], https://createpoint.qti.qualcomm.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
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