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Microcontrôleurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0
Certificate details
| Status | archived |
|---|---|
| Valid from | 14.08.2014 |
| Valid until | 01.09.2019 |
| Scheme | 🇫🇷 FR |
| Manufacturer | Samsung Electronics Co., Ltd. |
| Category | ICs, Smart Cards and Smart Card-Related Devices and Systems |
| Security level | EAL5+, AVA_VAN.5, ALC_DVS.2 |
| Protection profiles |
Certificate
certificate could not be downloaded, no link is available.
Certification report
Extracted keywords
Symmetric Algorithms
DESRandomness
DTRNGVendor
SamsungSecurity level
EAL 5, EAL4, EAL7, EAL 1, EAL 3, EAL 7, ITSEC E6 ElevéSecurity Assurance Requirements (SAR)
ADV_ARC, ADV_FSP, ADV_IMP, ADV_INT, ADV_SPM, ADV_TDS, AGD_OPE, AGD_PRE, ALC_DVS.2, ALC_FLR, ALC_CMC, ALC_CMS, ALC_DEL, ALC_DVS, ALC_LCD, ALC_TAT, ATE_COV, ATE_DPT, ATE_FUN, ATE_IND, AVA_VAN.5, AVA_VAN, ASE_CCL, ASE_ECD, ASE_INT, ASE_OBJ, ASE_REQ, ASE_SPD, ASE_TSSProtection profiles
BSI-PP-0035-2007Certificates
ANSSI-CC-2014/57, ANSSI-CC-2013/02, ANSSI-CC-2014/37Evaluation facilities
CESTI, CEA - LETIFrontpage
| Certified item | ### Microcontrôleurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0 Référence/version du produit |
|---|---|
| Certification lab | ## ANSSI-CC-2014/57 Revision 1.0 ### EAL 5 augmenté ALC_DVS.2, AVA_VAN.5 ### Samsung Electronics Co., Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud ### Samsung Electronics Co., Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Corée du Sud ## CEA - LETI 17 rue des martyrs, 38054 Grenoble Cedex 9, France |
| Developer | Commanditaire |
Cross-references
Outgoing- ANSSI-CC-2013/02 - archived - Microcontrôleurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0
- ANSSI-CC-2014/37 - archived - Microcontrôleurs SAMSUNG S3FT9MD et S3FT9MC Revision 0
Security target
Extracted keywords
Symmetric Algorithms
DES, TDES, 3DES, Triple-DES, TDEAAsymmetric Algorithms
ECCRandomness
DTRNG, TRNG, RND, RNGBlock cipher modes
ECBVendor
SamsungSecurity level
EAL5, EAL 4, EAL5+, EAL 5, EAL5 augmented, EAL 4 augmented, EAL 5 augmentedClaims
O.RNG, O.RND, O.MEM_ACCESS, T.RNDSecurity Assurance Requirements (SAR)
ADV_ARV, ADV_FSP, ADV_IMP, ADV_VAN, ADV_ARC.1, ADV_FSP.5, ADV_IMP.1, ADV_INT.2, ADV_TDS.4, ADV_FSP.4, ADV_TDS.3, AGD_OPE, AGD_PRE, AGD_OPE.1, AGD_PRE.1, ALC_DVS.2, ALC_DEL, ALC_DVS, ALC_CMS, ALC_CMC, ALC_CMC.4, ALC_CMS.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.2, ALC_DVS.1, ALC_CMS.4, ATE_COV, ATE_COV.2, ATE_DPT.3, ATE_FUN.1, ATE_IND.2, ATE_DPT.1, AVA_VAN.5, AVA_VAN, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1, ASE_TSS.1Security Functional Requirements (SFR)
FAU_SAS, FAU_GEN, FAU_SAS.1, FAU_SAS.1.1, FAU_GEN.1, FCS_RNG, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP.1, FCS_COP, FCS_CKM.1, FCS_CKM.4, FDP_ACF, FDP_ITT.1, FDP_ITT.1.1, FDP_ACC.1, FDP_IFC.1, FDP_IFC.1.1, FDP_IFF.1, FDP_ACF.1, FDP_ACC.1.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_ITC.1, FDP_ITC.2, FDP_SDI.1, FDP_ACC, FDP_IFC, FDP_ITT, FMT_LIM, FMT_LIM.1, FMT_LIM.2, FMT_LIM.1.1, FMT_LIM.2.1, FMT_MSA.3, FMT_MSA.1, FMT_SMF.1, FMT_MSA.3.1, FMT_MSA.3.2, FMT_SMR.1, FMT_MSA.1.1, FMT_SMF.1.1, FMT_MSA, FMT_SMF, FPT_FLS.1, FPT_FLS.1.1, FPT_PHP.3, FPT_PHP.3.1, FPT_PHP, FPT_ITT.1, FPT_ITT.1.1, FPT_FLS, FPT_ITT, FRU_FLT.2, FRU_FLT.1, FRU_FLT.2.1, FRU_FLTProtection profiles
BSI-PP-0035Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, Physical probing, side-channel, DPA, timing attacks, physical tampering, Malfunction, malfunction, reverse engineeringAutomated analysis
Automated inference - use with caution
All attributes shown in this section (e.g., links between certificates, products, vendors, and known CVEs) are generated by automated heuristics and have not been reviewed by humans. These methods can produce false positives or false negatives and should not be treated as definitive without independent verification. This applies equally to the Cross-references section below. If you want to know more about how this data is computed and how reliable it is, see our documentation on automated analysis. If you believe any information here is inaccurate or harmful, please submit feedback.Certificate ID
ANSSI-CC-2014/57Extracted SARs
ADV_ARC.1, ADV_FSP.5, ADV_IMP.1, ADV_INT.2, ADV_TDS.4, AGD_OPE.1, AGD_PRE.1, ALC_CMC.4, ALC_CMS.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_TAT.2, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1, ASE_TSS.1, ATE_COV.2, ATE_DPT.3, ATE_FUN.1, ATE_IND.2, AVA_VAN.5Similar certificates
| Name | Certificate ID | Actions |
|---|---|---|
| Microcontrôleurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0 | ANSSI-CC-2013/02 | Compare |
Cross-references
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The certificate was first processed.
{
"_type": "sec_certs.sample.cc.CCCertificate",
"category": "ICs, Smart Cards and Smart Card-Related Devices and Systems",
"cert_link": null,
"dgst": "812de92eeb1a4daa",
"heuristics": {
"_type": "sec_certs.sample.cc_eucc_common.Heuristics",
"annotated_references": null,
"cert_id": "ANSSI-CC-2014/57",
"cert_lab": [
"##"
],
"cpe_matches": null,
"direct_transitive_cves": null,
"eal": "EAL5+",
"extracted_sars": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_FSP",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_TSS",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DVS",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_FUN",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_TAT",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_INT",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMS",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_SPD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_IND",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_CCL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_ECD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_REQ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_PRE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_INT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_IMP",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_ARC",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_COV",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_OPE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMC",
"level": 4
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AVA_VAN",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_LCD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_OBJ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_TDS",
"level": 4
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DEL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_DPT",
"level": 3
}
]
},
"extracted_versions": {
"_type": "Set",
"elements": [
"1.0"
]
},
"indirect_transitive_cves": null,
"next_certificates": null,
"prev_certificates": null,
"protection_profiles": {
"_type": "Set",
"elements": [
"f6d23054061d72ba"
]
},
"related_cves": null,
"report_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": null,
"directly_referencing": {
"_type": "Set",
"elements": [
"ANSSI-CC-2014/37",
"ANSSI-CC-2013/02"
]
},
"indirectly_referenced_by": null,
"indirectly_referencing": {
"_type": "Set",
"elements": [
"ANSSI-CC-2014/37",
"ANSSI-CC-2013/02"
]
}
},
"scheme_data": null,
"st_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": null,
"directly_referencing": null,
"indirectly_referenced_by": null,
"indirectly_referencing": null
},
"verified_cpe_matches": null
},
"maintenance_updates": {
"_type": "Set",
"elements": []
},
"manufacturer": "Samsung Electronics Co., Ltd.",
"manufacturer_web": "https://www.samsung.com",
"name": "Microcontr\u00f4leurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0",
"not_valid_after": "2019-09-01",
"not_valid_before": "2014-08-14",
"pdf_data": {
"_type": "sec_certs.sample.cc_eucc_common.PdfData",
"cert_filename": null,
"cert_frontpage": null,
"cert_keywords": null,
"cert_metadata": null,
"report_filename": "ANSSI-CC-2014_57_rapport de certification.pdf",
"report_frontpage": {
"FR": {
"cc_security_level": "",
"cc_version": "### Crit\u00e8res Communs version 3.1 r\u00e9vision 4",
"cert_id": "",
"cert_item": "### Microcontr\u00f4leurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0 R\u00e9f\u00e9rence/version du produit",
"cert_item_version": "",
"cert_lab": "## ANSSI-CC-2014/57 Revision 1.0 ### EAL 5 augment\u00e9 ALC_DVS.2, AVA_VAN.5 ### Samsung Electronics Co., Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Cor\u00e9e du Sud ### Samsung Electronics Co., Ltd. 17 Floor, B-Tower, 1-1, Samsungjeonja-ro Hwaseong-si, Gyeonggi-do 445-330, Cor\u00e9e du Sud ## CEA - LETI 17 rue des martyrs, 38054 Grenoble Cedex 9, France",
"developer": "Commanditaire",
"match_rules": [
"R\u00e9f\u00e9rence du rapport de certification(.+)Nom du produit(.+)()Conformit\u00e9 \u00e0 un profil de protection(.+)Crit\u00e8res d\u0027\u00e9valuation et version(.+)Niveau d\u0027\u00e9valuation(.+)D\u00e9veloppeur (.+)Centre d\u0027\u00e9valuation(.+)Accords de reconnaissance applicables"
],
"ref_protection_profiles": "### [PP0035] : Security IC platform Protection Profile Version 1.0"
}
},
"report_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {
"FR": {
"ANSSI-CC-2013/02": 4,
"ANSSI-CC-2014/37": 2,
"ANSSI-CC-2014/57": 17
}
},
"cc_claims": {},
"cc_protection_profile_id": {
"BSI": {
"BSI-PP-0035-2007": 1
}
},
"cc_sar": {
"ADV": {
"ADV_ARC": 1,
"ADV_FSP": 1,
"ADV_IMP": 1,
"ADV_INT": 1,
"ADV_SPM": 1,
"ADV_TDS": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_PRE": 1
},
"ALC": {
"ALC_CMC": 2,
"ALC_CMS": 1,
"ALC_DEL": 1,
"ALC_DVS": 1,
"ALC_DVS.2": 2,
"ALC_FLR": 1,
"ALC_LCD": 1,
"ALC_TAT": 1
},
"ASE": {
"ASE_CCL": 1,
"ASE_ECD": 1,
"ASE_INT": 1,
"ASE_OBJ": 1,
"ASE_REQ": 1,
"ASE_SPD": 1,
"ASE_TSS": 1
},
"ATE": {
"ATE_COV": 1,
"ATE_DPT": 1,
"ATE_FUN": 1,
"ATE_IND": 1
},
"AVA": {
"AVA_VAN": 2,
"AVA_VAN.5": 3
}
},
"cc_security_level": {
"EAL": {
"EAL 1": 1,
"EAL 3": 1,
"EAL 5": 3,
"EAL 7": 1,
"EAL4": 2,
"EAL7": 1
},
"ITSEC": {
"ITSEC E6 Elev\u00e9": 1
}
},
"cc_sfr": {},
"certification_process": {},
"cipher_mode": {},
"cplc_data": {},
"crypto_engine": {},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {
"CEA-LETI": {
"CEA - LETI": 1
},
"CESTI": {
"CESTI": 2
}
},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {
"TRNG": {
"DTRNG": 11
}
},
"side_channel_analysis": {},
"standard_id": {
"BSI": {
"AIS 31": 3,
"AIS31": 1
},
"CC": {
"CCMB-2012-09-001": 1,
"CCMB-2012-09-002": 1,
"CCMB-2012-09-003": 1,
"CCMB-2012-09-004": 1
}
},
"symmetric_crypto": {
"DES": {
"DES": {
"DES": 3
}
}
},
"technical_report_id": {},
"tee_name": {},
"tls_cipher_suite": {},
"vendor": {
"Samsung": {
"Samsung": 14
}
},
"vulnerability": {}
},
"report_metadata": {
"/Author": "gimenez-j",
"/CreationDate": "D:20140819143902+02\u002700\u0027",
"/Creator": "Microsoft\u00ae Word 2010",
"/Keywords": "ANSSI-CC-CER-F-07.009",
"/ModDate": "D:20140819143902+02\u002700\u0027",
"/Producer": "Microsoft\u00ae Word 2010",
"/Subject": "Microcontr\u00f4leurs SAMSUNG S3FT9FD, S3FT9FC et S3FT9FB Revision 1.0",
"/Title": "ANSSI-CC-2014/57",
"pdf_file_size_bytes": 640722,
"pdf_hyperlinks": {
"_type": "Set",
"elements": [
"http://www.ssi.gouv.fr/",
"mailto:[email protected]"
]
},
"pdf_is_encrypted": false,
"pdf_number_of_pages": 18
},
"st_filename": "ANSSI_cible2014_57en.pdf",
"st_frontpage": null,
"st_keywords": {
"asymmetric_crypto": {
"ECC": {
"ECC": {
"ECC": 3
}
}
},
"cc_cert_id": {},
"cc_claims": {
"O": {
"O.MEM_ACCESS": 1,
"O.RND": 5,
"O.RNG": 1
},
"T": {
"T.RND": 4
}
},
"cc_protection_profile_id": {
"BSI": {
"BSI-PP-0035": 5
}
},
"cc_sar": {
"ADV": {
"ADV_ARC.1": 7,
"ADV_ARV": 1,
"ADV_FSP": 2,
"ADV_FSP.4": 2,
"ADV_FSP.5": 3,
"ADV_IMP": 1,
"ADV_IMP.1": 2,
"ADV_INT.2": 1,
"ADV_TDS.3": 1,
"ADV_TDS.4": 1,
"ADV_VAN": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_OPE.1": 2,
"AGD_PRE": 1,
"AGD_PRE.1": 2
},
"ALC": {
"ALC_CMC": 1,
"ALC_CMC.4": 1,
"ALC_CMS": 2,
"ALC_CMS.4": 1,
"ALC_CMS.5": 3,
"ALC_DEL": 1,
"ALC_DEL.1": 1,
"ALC_DVS": 1,
"ALC_DVS.1": 1,
"ALC_DVS.2": 8,
"ALC_LCD.1": 1,
"ALC_TAT.2": 1
},
"ASE": {
"ASE_CCL.1": 1,
"ASE_ECD.1": 1,
"ASE_INT.1": 1,
"ASE_OBJ.2": 1,
"ASE_REQ.2": 1,
"ASE_SPD.1": 1,
"ASE_TSS.1": 1
},
"ATE": {
"ATE_COV": 1,
"ATE_COV.2": 1,
"ATE_DPT.1": 1,
"ATE_DPT.3": 1,
"ATE_FUN.1": 1,
"ATE_IND.2": 1
},
"AVA": {
"AVA_VAN": 1,
"AVA_VAN.5": 13
}
},
"cc_security_level": {
"EAL": {
"EAL 4": 1,
"EAL 4 augmented": 1,
"EAL 5": 2,
"EAL 5 augmented": 2,
"EAL5": 6,
"EAL5 augmented": 1,
"EAL5+": 1
}
},
"cc_sfr": {
"FAU": {
"FAU_GEN": 2,
"FAU_GEN.1": 1,
"FAU_SAS": 8,
"FAU_SAS.1": 12,
"FAU_SAS.1.1": 2
},
"FCS": {
"FCS_CKM.1": 6,
"FCS_CKM.4": 3,
"FCS_COP": 6,
"FCS_COP.1": 7,
"FCS_RNG": 6,
"FCS_RNG.1": 14,
"FCS_RNG.1.1": 2,
"FCS_RNG.1.2": 2
},
"FDP": {
"FDP_ACC": 1,
"FDP_ACC.1": 14,
"FDP_ACC.1.1": 1,
"FDP_ACF": 2,
"FDP_ACF.1": 10,
"FDP_ACF.1.1": 1,
"FDP_ACF.1.2": 1,
"FDP_ACF.1.3": 1,
"FDP_ACF.1.4": 1,
"FDP_IFC": 1,
"FDP_IFC.1": 18,
"FDP_IFC.1.1": 1,
"FDP_IFF.1": 3,
"FDP_ITC.1": 2,
"FDP_ITC.2": 2,
"FDP_ITT": 1,
"FDP_ITT.1": 17,
"FDP_ITT.1.1": 1,
"FDP_SDI.1": 1
},
"FMT": {
"FMT_LIM": 8,
"FMT_LIM.1": 24,
"FMT_LIM.1.1": 2,
"FMT_LIM.2": 28,
"FMT_LIM.2.1": 2,
"FMT_MSA": 2,
"FMT_MSA.1": 12,
"FMT_MSA.1.1": 1,
"FMT_MSA.3": 13,
"FMT_MSA.3.1": 1,
"FMT_MSA.3.2": 1,
"FMT_SMF": 1,
"FMT_SMF.1": 9,
"FMT_SMF.1.1": 1,
"FMT_SMR.1": 6
},
"FPT": {
"FPT_FLS": 1,
"FPT_FLS.1": 21,
"FPT_FLS.1.1": 1,
"FPT_ITT": 1,
"FPT_ITT.1": 15,
"FPT_ITT.1.1": 1,
"FPT_PHP": 3,
"FPT_PHP.3": 20,
"FPT_PHP.3.1": 1
},
"FRU": {
"FRU_FLT": 1,
"FRU_FLT.1": 1,
"FRU_FLT.2": 17,
"FRU_FLT.2.1": 1
}
},
"certification_process": {},
"cipher_mode": {
"ECB": {
"ECB": 2
}
},
"cplc_data": {},
"crypto_engine": {},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {
"RNG": {
"RND": 9,
"RNG": 1
},
"TRNG": {
"DTRNG": 19,
"TRNG": 1
}
},
"side_channel_analysis": {
"FI": {
"Malfunction": 29,
"malfunction": 11,
"physical tampering": 2
},
"SCA": {
"DPA": 1,
"Leak-Inherent": 21,
"Physical Probing": 6,
"Physical probing": 2,
"physical probing": 9,
"side-channel": 3,
"timing attacks": 1
},
"other": {
"reverse engineering": 5
}
},
"standard_id": {
"BSI": {
"AIS 31": 2,
"AIS31": 3,
"BSI-AIS31": 3
},
"CC": {
"CCMB-2009-07-001": 1,
"CCMB-2009-07-002": 1,
"CCMB-2009-07-003": 1,
"CCMB-2009-07-004": 1,
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}
},
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}
},
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},
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"/Classification": "Public",
"/Company": "",
"/CreationDate": "D:20131122161101+09\u002700\u0027",
"/Creator": " Word\uc6a9 Acrobat PDFMaker 10.1",
"/Datum": "23-10-2003",
"/Dokument": "Security Target",
"/EEPROM": "8 kBytes",
"/Jahr": "2003",
"/Keywords": "",
"/ModDate": "D:20131122161117+09\u002700\u0027",
"/PP_Augmentations": "Smartcard Integrated Circuit Platform Augmentations V0.98",
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"/Producer": "Adobe PDF Library 10.0",
"/Protection Profile": "Smartcard IC Platform Protection Profile",
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"/SourceModified": "D:20131122071022",
"/Subject": "",
"/Technologie": "0,22 \u00b5m",
"/Title": "Security Target",
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"/m-Nummer": "m1474/m1495",
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},
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}
},
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]
},
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"scheme": "FR",
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]
},
"st_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI_cible2014_57en.pdf",
"state": {
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},
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}