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Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03
JISEC-CC-CRP-C0036 		S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
BSI-DSZ-CC-0882-V2-2019
name Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03 S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme JP DE
not_valid_after 07.10.2013 11.12.2024
not_valid_before 09.09.2005 11.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/files/epfiles/c0036_ecvr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/files/epfiles/ https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882V2b_pdf.pdf
manufacturer Canon Inc. Samsung Electronics Co., Ltd.
manufacturer_web https://www.samsung.com
security_level EAL3 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst fd7107359fa94ec9 f97de67112a8125c
heuristics/cert_id JISEC-CC-CRP-C0036 BSI-DSZ-CC-0882-V2-2019
heuristics/cert_lab [] BSI
heuristics/extracted_sars {} ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions 2.03 0, 32
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0882-2013
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0720-2011, BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0547-2009, BSI-DSZ-CC-0882-2013, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0801-2012
heuristics/scheme_data
  • cert_id: JISEC-CC-CRP-C0036
  • certification_date: 01.01.2006
  • claim: EAL3
  • enhanced:
    • assurance_level: EAL3
    • cert_link: https://www.ipa.go.jp/en/security/c0036_eimg.pdf
    • description: PRODUCT DESCRIPTION This product is a software program to be installed for use on the Canon iR4570/iR3570/iR2870/iR2270 -series multifunction products (hereafter referred to collectively as the “multifunction product”). The multifunction product is a digital copier that offers the combined functionality of Copy, Send (Universal Send), Fax Reception, Mail Box, Print, Remote UI (a Web browser interface for operating the multifunction product), plus many others. When the Copy, Send (Universal Send), Fax Reception (fax/I-fax reception) or Print function is used, temporary image data is created on the hard drive of the multifunction product. Also, when the Mail Box function is used (for document storage) or the Fax Reception function is used (for “in-memory reception” of faxes/I-faxes or forwarding of faxes/I-faxes), image data is stored in the receiving inbox that is on the multifunction product. Furthermore, when the Remote UI function is used, image data is exchanged over the network between the Web browser on the user's PC and the multifunction product. By installing this product, security enhancements are added to the multifunction product, helping counter the threat of disclosure of temporary image data created on the hard drive, permanent image data stored in the inboxes, and image data that is transmitted over the Remote UI communication path.
    • evaluation_facility: Electronic Commerce Security Technology Laboratory Inc. Evaluation Center
    • product: Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2
    • product_type: IT Product ( data protection function in digital MFD )
    • report_link: https://www.ipa.go.jp/en/security/c0036_erpt.pdf
    • target_link: https://www.ipa.go.jp/en/security/c0036_est.pdf
    • toe_version: Version 2.03
    • vendor: Canon Inc.
  • expiration_date: 01.10.2013
  • supplier: Canon Inc.
  • toe_japan_name: Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03
  • toe_overseas_link: https://www.ipa.go.jp/en/security/jisec/software/certified-cert/c0036_it5070.html
  • toe_overseas_name: Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03
heuristics/protection_profiles {} f6d23054061d72ba
maintenance_updates
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename 0882V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0882-V2-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Samsung:
    • Samsung: 1
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20191216114820+01'00'
  • /Creator: Writer
  • /Keywords: S3CS9AB, 32-Bit, RISC, Microcontroller, Smart Cards, Samsung
  • /ModDate: D:20191216143837+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated SoftwarefromSamsung Electronics
  • /Title: Certification Report BSI-DSZ-CC-0882-V2-2019
  • pdf_file_size_bytes: 289486
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename c0036_ecvr.pdf 0882V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0882-V2-2019
    • cert_item: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
pdf_data/report_keywords/cc_cert_id
  • JP:
    • Certification No. C0036: 1
  • DE:
    • BSI-DSZ-CC-0882-2013: 3
    • BSI-DSZ-CC-0882-V2-2019: 15
  • NL:
    • CC-0882-2013: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0035-2007: 1
    • BSI-CC-PP-0035-2007: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL3: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 1
    • EAL5: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 20
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 4
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 9
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 3
  • OFB:
    • OFB: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 47: 1
    • AIS31: 3
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 16] SITE TECHNICAL AUDIT REPORT (STAR), PKL Co., Ltd., Cheonan, Version 4, 02- 12-2019, TÜViT (confidential document) [17] SITE TECHNICAL AUDIT REPORT (STAR), Toppan Photomasks Korea Ltd., Korea Icheon, Version 1: 1
    • IC Dedicated Software, BSI-DSZ-CC-0882-V2-2019, Version 2.2, 14-10- 2019, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [8: 1
    • Report Summary (ETR Summary), BSI-DSZ-CC-0882-V2, S3CS9AB Revision 0, Version 3, 02-12-2019, TÜViT (confidential document) [9] Security Target Lite of S3CS9AB 32-Bit RISC Microcontroller for Smart Cards with specific IC: 1
    • TÜViT (confidential document) 21 / 25 Certification Report BSI-DSZ-CC-0882-V2-2019 C. Excerpts from the Criteria For the: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • evaluation according to AIS 36 for the Product S3CS9AB Revision 0, Version 3, 02-12-2019, TÜViT (confidential document) [11] SC100 Reference Manual, Version 0.0, 15-07-2013, Samsung Electronics [12] S3CS9AB 32-Bit CMOS: 1
pdf_data/report_metadata
  • /CreationDate: D:20060123172731+09'00'
  • /ModDate: D:20060123172731+09'00'
  • /Producer: Acrobat Distiller 6.0.1 (Windows)
  • /Title: untitled
  • pdf_file_size_bytes: 14795
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/st_filename 0882V2b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 4
    • FCS_COP: 8
    • FCS_COP.1: 9
    • FCS_RNG: 6
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 2
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
pdf_data/st_keywords/asymmetric_crypto
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function
pdf_data/st_keywords/crypto_scheme
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
  • TRNG:
    • DTRNG: 19
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 4
  • OFB:
    • OFB: 2
pdf_data/st_keywords/ecc_curve
pdf_data/st_keywords/crypto_engine
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 24
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 31: 2
    • AIS31: 1
    • BSI-AIS31: 3
  • CC:
    • CCMB-2017-04-001: 3
    • CCMB-2017-04-002: 3
    • CCMB-2017-04-003: 3
    • CCMB-2017-04-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata
  • /Author: Junghyun KIM
  • /CreationDate: D:20191210200347+09'00'
  • /Creator: Microsoft® Word 2016
  • /Keywords: Security Lite Target of S3CS9AB
  • /ModDate: D:20191210200715+09'00'
  • /Producer: Microsoft® Word 2016
  • /Subject: Security Lite Target of S3CS9AB
  • /Title: Security Lite Target
  • pdf_file_size_bytes: 785729
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 57
state/cert/convert_ok False True
state/cert/download_ok False True
state/cert/extract_ok False True
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/convert_ok False True
state/st/download_ok False True
state/st/extract_ok False True
state/st/pdf_hash Different Different
state/st/txt_hash Different Different