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Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03
JISEC-CC-CRP-C0036 		Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
BSI-DSZ-CC-0719-V2-2016
name Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03 Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme JP DE
not_valid_after 07.10.2013 12.08.2021
not_valid_before 09.09.2005 12.08.2016
report_link https://www.commoncriteriaportal.org/files/epfiles/c0036_ecvr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0719V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/files/epfiles/ https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0719V2b_pdf.pdf
manufacturer Canon Inc. Samsung Electronics Co., Ltd.
manufacturer_web https://www.samsung.com
security_level EAL3 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst fd7107359fa94ec9 2c5ab136ccfdeb16
heuristics/cert_id JISEC-CC-CRP-C0036 BSI-DSZ-CC-0719-V2-2016
heuristics/cert_lab [] BSI
heuristics/extracted_sars {} ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, APE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_FLR.3, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, APE_REQ.2, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, APE_CCL.1, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, APE_INT.1, APE_SPD.1, ATE_IND.2, APE_OBJ.2, ASE_CCL.1, ADV_SPM.1
heuristics/extracted_versions 2.03 1.0
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0719-2011
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0547-2009
heuristics/scheme_data
  • cert_id: JISEC-CC-CRP-C0036
  • certification_date: 01.01.2006
  • claim: EAL3
  • enhanced:
    • assurance_level: EAL3
    • cert_link: https://www.ipa.go.jp/en/security/c0036_eimg.pdf
    • description: PRODUCT DESCRIPTION This product is a software program to be installed for use on the Canon iR4570/iR3570/iR2870/iR2270 -series multifunction products (hereafter referred to collectively as the “multifunction product”). The multifunction product is a digital copier that offers the combined functionality of Copy, Send (Universal Send), Fax Reception, Mail Box, Print, Remote UI (a Web browser interface for operating the multifunction product), plus many others. When the Copy, Send (Universal Send), Fax Reception (fax/I-fax reception) or Print function is used, temporary image data is created on the hard drive of the multifunction product. Also, when the Mail Box function is used (for document storage) or the Fax Reception function is used (for “in-memory reception” of faxes/I-faxes or forwarding of faxes/I-faxes), image data is stored in the receiving inbox that is on the multifunction product. Furthermore, when the Remote UI function is used, image data is exchanged over the network between the Web browser on the user's PC and the multifunction product. By installing this product, security enhancements are added to the multifunction product, helping counter the threat of disclosure of temporary image data created on the hard drive, permanent image data stored in the inboxes, and image data that is transmitted over the Remote UI communication path.
    • evaluation_facility: Electronic Commerce Security Technology Laboratory Inc. Evaluation Center
    • product: Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2
    • product_type: IT Product ( data protection function in digital MFD )
    • report_link: https://www.ipa.go.jp/en/security/c0036_erpt.pdf
    • target_link: https://www.ipa.go.jp/en/security/c0036_est.pdf
    • toe_version: Version 2.03
    • vendor: Canon Inc.
  • expiration_date: 01.10.2013
  • supplier: Canon Inc.
  • toe_japan_name: Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03
  • toe_overseas_link: https://www.ipa.go.jp/en/security/jisec/software/certified-cert/c0036_it5070.html
  • toe_overseas_name: Canon iR4570/iR3570/iR2870/iR2270 Series iR Security Kit-B2 Version 2.03
heuristics/protection_profiles {} f6d23054061d72ba
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/report_filename c0036_ecvr.pdf 0719V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5 SOGIS Recognition Agreement
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0719-V2-2016
    • cert_item: Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
pdf_data/report_keywords/cc_cert_id
  • JP:
    • Certification No. C0036: 1
  • DE:
    • BSI-DSZ-CC-0719-2011: 3
    • BSI-DSZ-CC-0719-V2-2016: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL3: 1
  • EAL:
    • EAL 1: 7
    • EAL 2: 4
    • EAL 3: 4
    • EAL 4: 9
    • EAL 5: 12
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 4
    • EAL 7: 4
    • EAL5: 2
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 3
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 28
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 4
  • DES:
    • 3DES:
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 4
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 5
    • ECDH:
      • ECDH: 2
    • ECDSA:
      • ECDSA: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA2:
      • SHA224: 1
      • SHA256: 1
      • SHA384: 1
      • SHA512: 1
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
pdf_data/report_keywords/randomness
  • TRNG:
    • TRNG: 8
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 1
pdf_data/report_keywords/ecc_curve
  • NIST:
    • P-192: 4
    • P-224: 6
    • P-256: 6
    • P-384: 6
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 2
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS20: 2
    • AIS31: 2
  • FIPS:
    • FIPS PUB 180-3: 1
    • FIPS PUB 186-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC14888-: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [9: 1
    • Evaluation Technical Report For Composite Evaluation (ETR COMP), TÜV Informationstechnik GmbH (confidential document) [11] Security Application Note S3CT9KA_K7_K3_PC_PA_P7_P3_AC_AA_A7, Version 1.6, 2016-05-03: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • optional Secure RSA and ECC Library including specific IC Dedicated Software, Samsung Electronics (confidential document) [7] Evaluation Technical Report, Version 6, 2016-07-27, Evaluation Ttechnical Report Summary (ETR: 1
pdf_data/report_metadata
  • /CreationDate: D:20060123172731+09'00'
  • /ModDate: D:20060123172731+09'00'
  • /Producer: Acrobat Distiller 6.0.1 (Windows)
  • /Title: untitled
  • pdf_file_size_bytes: 14795
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/st_filename 0719V2b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 5
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 4
    • FCS_CKM.1: 21
    • FCS_CKM.2: 2
    • FCS_CKM.4: 11
    • FCS_COP: 19
    • FCS_COP.1: 23
    • FCS_RNG: 11
    • FCS_RNG.1: 19
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 2
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 10
    • FDP_ITC.2: 10
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 3
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 14
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 9
  • constructions:
    • MAC:
      • HMAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 27
    • ECDH:
      • ECDH: 16
    • ECDSA:
      • ECDSA: 15
  • FF:
    • DH:
      • Diffie-Hellman: 2
    • DSA:
      • DSA: 2
  • RSA:
    • RSA-CRT: 1
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 2
    • SHA2:
      • SHA-224: 2
      • SHA-256: 2
      • SHA-384: 2
      • SHA-512: 2
      • SHA224: 6
      • SHA256: 6
      • SHA384: 6
      • SHA512: 2
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
    • RNG: 1
  • TRNG:
    • DTRNG: 2
    • TRNG: 16
pdf_data/st_keywords/cipher_mode
  • ECB:
    • ECB: 3
pdf_data/st_keywords/ecc_curve
  • Brainpool:
    • brainpoolP192r1: 4
    • brainpoolP192t1: 4
    • brainpoolP224r1: 4
    • brainpoolP224t1: 4
    • brainpoolP256r1: 4
    • brainpoolP256t1: 4
    • brainpoolP320r1: 4
    • brainpoolP320t1: 4
    • brainpoolP384r1: 4
    • brainpoolP384t1: 4
    • brainpoolP512r1: 4
    • brainpoolP512t1: 4
  • NIST:
    • P-192: 8
    • P-224: 8
    • P-256: 8
    • P-384: 8
    • secp192k1: 4
    • secp192r1: 4
    • secp224k1: 4
    • secp224r1: 4
    • secp256k1: 4
    • secp256r1: 4
    • secp384r1: 4
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 1
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 24
    • fault injection: 2
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 12
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 10
    • physical probing: 9
    • side channel: 2
    • side-channel: 4
    • timing attack: 5
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 31: 2
    • AIS20: 3
    • AIS31: 2
  • CC:
    • CCMB-2009-07-001: 3
    • CCMB-2009-07-002: 3
    • CCMB-2009-07-003: 3
    • CCMB-2009-07-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS PUB 180-3: 6
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company:
  • /CreationDate: D:20160725163316+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /Keywords:
  • /ModDate: D:20160725163322+09'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20160725073301
  • /Subject:
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1168031
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 66
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/convert_ok False True
state/st/download_ok False True
state/st/extract_ok False True
state/st/pdf_hash Different Different
state/st/txt_hash Different Different