Comparing certificates Experimental feature

You are comparing two certificates. By default, only differing attributes are shown. Use the button below to show/hide all attributes.

Showing only differing attributes.
THD88/M2064 Secure Microcontroller With Crypto Library
SERTIT-074 		Samsung SP of S3B512C revision 3
2021-23-INF-4038
name THD88/M2064 Secure Microcontroller With Crypto Library Samsung SP of S3B512C revision 3
scheme NO ES
status archived active
not_valid_after 09.12.2020 08.04.2028
not_valid_before 09.12.2015 08.04.2023
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/20160806_S74_C_v2.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-23_Certificado.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/20160608_S-074_CR_v.2.0_Tongfang.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-23%20INF-4038.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/[08450][THD88][ST%20Lite][V1.1]%20THD88-M2064%20EAL4+%20ST_Lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-23%20ST_Lite.pdf
manufacturer Beijing Tongfang Microelectronics Co., Ltd. Samsung Electronics Co., Ltd.
manufacturer_web https://www.tsinghuaic.com/ https://www.samsung.com
security_level ALC_FLR.2, ATE_DPT.2, EAL4+, AVA_VAN.5 EAL2
dgst f336e1fd6f8d5222 95f760528ffedd31
heuristics/cert_id SERTIT-074 2021-23-INF-4038
heuristics/extracted_sars ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, ASE_SPD.1, ATE_DPT.2, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, AGD_OPE.1, AGD_PRE.1, ALC_CMS.4, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.3, ALC_FLR.2, ASE_REQ.2, ADV_FSP.4, ATE_IND.2, ASE_CCL.1 ASE_INT.1, AVA_VAN.2, ADV_FSP.2, ASE_ECD.1, ASE_TSS.1, ASE_SPD.1, ALC_DEL.1, AGD_OPE.1, AGD_PRE.1, ALC_CMS.2, ADV_TDS.1, ATE_FUN.1, ATE_COV.1, ADV_ARC.1, ASE_OBJ.2, ASE_REQ.2, ALC_CMC.2, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions - 3
heuristics/scheme_data
  • category: Biometric Devices
  • certification_date: 08.04.2023
  • enhanced:
    • category: Biometric Devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1701
    • certification_date: 08.04.2023
    • description: The SP of S3B512C single-chip CMOS micro-controller is designed and packaged specifically for "Biometric Smart Card" applications. The Cortex-M33 CPU architecture of the SP of S3B512C microcontrollerfollows the Harvard style, that is, it has separate program memory and data memory. Both instruction and data can be fetched simultaneously without causing a stall, using separate paths for memory access. The main security features of the SP of S3B512C integrated circuit are: Secure fingerprint image capture and feature extraction provided by TOE SP firmware, integrity protected. Access control of Users to Flash memory positions where SP firmware is executed. TOE Unique Identification Countermeasures to avoid attackers reproduction of fingerprint data. An AES hardware block supporting AES encryption and decryption with 128-bit, 192-bit and 256-bit keys in ECB mode. The AES block supports encryption of fingerprint features to be sent to SE of S3B512C. Note SE (Secure Element) is not TOE.
    • evaluation_facility: Applus Laboratories
    • level: EAL2
    • manufacturer: Samsung Electronics Co., Ltd
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1702
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1700
    • type: Product
  • manufacturer: Samsung Electronics Co., Ltd
  • product: Samsung SP of S3B512C revision 3
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/974-samsung-sp-of-s3b512c-revision-3
pdf_data/cert_filename 20160806_S74_C_v2.pdf 2021-23_Certificado.pdf
pdf_data/cert_keywords/cc_cert_id
  • NO:
    • SERTIT-074: 2
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 2
    • EAL 4 augmented: 1
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL2: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • ATE:
    • ATE_DPT.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 2
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
  • T:
    • T.I: 1
pdf_data/cert_keywords/vendor
  • Samsung:
    • Samsung: 3
pdf_data/cert_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_metadata
  • /CreationDate: D:20170222114542Z00'00'
  • /ModDate: D:20170222114542Z00'00'
  • /Producer: Mac OS X 10.12.3 Quartz PDFContext
  • pdf_file_size_bytes: 731810
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 913137
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 20160608_S-074_CR_v.2.0_Tongfang.pdf 2021-23 INF-4038.pdf
pdf_data/report_keywords/cc_cert_id
  • NO:
    • SERTIT-074: 15
  • ES:
    • 2021-23-INF-4038- v1: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 16
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 3
    • EAL 4 augmented: 1
    • EAL 4+: 14
    • EAL1: 1
    • EAL4: 1
    • EAL7: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 8
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.2: 4
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC.1: 1
    • ADV_TDS.1: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.2: 1
    • ALC_DEL.1: 1
    • ALC_FLR: 2
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_SPD.1: 1
  • ATE:
    • ATE_COV.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 3
  • FCS:
    • FCS_COP.1: 3
    • FCS_RNG.1: 2
  • FDP:
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
    • FDP_SDC.1: 3
    • FDP_SDI.2: 2
  • FMT:
    • FMT_LIM.1: 2
    • FMT_LIM.2: 2
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 14
pdf_data/report_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
  • Applus:
    • Applus Laboratories: 4
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • 3DES:
      • TDES: 1
    • DES:
      • DES: 3
  • AES_competition:
    • AES:
      • AES: 7
pdf_data/report_keywords/crypto_protocol
  • PGP:
    • PGP: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
  • SCA:
    • DPA: 1
    • SPA: 1
  • other:
    • JIL: 2
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 5
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 15408: 2
    • ISO/IEC 7816: 2
pdf_data/report_metadata
  • /Author: Ulrich Isachsen
  • /CreationDate: D:20170222114910Z00'00'
  • /Creator: Microsoft® Word 2010
  • /ModDate: D:20170222114910Z00'00'
  • /Producer: Mac OS X 10.12.3 Quartz PDFContext
  • /Title: tittel
  • pdf_file_size_bytes: 650500
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 16
pdf_data/st_filename [08450][THD88][ST Lite][V1.1] THD88-M2064 EAL4 ST_Lite.pdf 2021-23 ST_Lite.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0084-2014: 1
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 2
    • EAL4 augmented: 2
    • EAL4+: 1
  • EAL:
    • EAL2: 5
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 3
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.2: 3
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP.2: 1
    • ADV_TDS.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.2: 1
    • ALC_CMS.2: 1
    • ALC_DEL.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.2: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 5
    • FCS_CKM.4: 5
    • FCS_COP.1: 14
    • FCS_COP.1.1: 2
    • FCS_RNG: 1
    • FCS_RNG.1: 6
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_IFC.1: 4
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 2
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 2
  • FPT:
    • FPT_FLS.1: 7
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 7
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 9
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 1
    • FCS_CKM.1: 4
    • FCS_CKM.4: 7
    • FCS_CKM.4.1: 1
    • FCS_COP: 1
    • FCS_COP.1: 6
    • FCS_COP.1.1: 1
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 15
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 7
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 10
    • FDP_ITC: 2
    • FDP_ITC.1: 10
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 6
    • FDP_ITT.1.1: 1
    • FDP_RIP: 1
    • FDP_RIP.1: 1
    • FDP_RIP.2: 6
    • FDP_RIP.2.1: 1
    • FDP_SDI: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT: 1
    • FDP_UCT.1: 6
    • FDP_UCT.1.1: 1
    • FDP_UIT: 1
    • FDP_UIT.1: 6
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 11
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 3
    • FMT_SMR.1: 6
  • FPT:
    • FPT_ITT: 1
    • FPT_ITT.1: 6
    • FPT_ITT.1.1: 1
  • FTP:
    • FTP_ITC.1: 4
    • FTP_TRP: 1
    • FTP_TRP.1: 10
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 3
    • O.RSA: 4
    • O.TDES: 6
  • T:
    • T.RND: 2
  • O:
    • O.AES: 10
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 20
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 16
      • Triple-DES: 4
    • DES:
      • DES: 7
  • AES_competition:
    • AES:
      • AES: 36
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 2
pdf_data/st_keywords/crypto_protocol
  • PGP:
    • PGP: 1
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 6
  • TRNG:
    • TRNG: 2
  • RNG:
    • RNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 2
  • ECB:
    • ECB: 3
pdf_data/st_keywords/crypto_library
  • Generic:
    • Crypto Library 1.2: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 7
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 3
pdf_data/st_keywords/tee_name
  • IBM:
    • SE: 70
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 7816: 4
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-67: 1
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_metadata
  • /Author: Jan Blonk
  • /CreationDate: D:20151211143810+01'00'
  • /Creator: Microsoft® Word 2013
  • /ModDate: D:20151211143810+01'00'
  • /Producer: Microsoft® Word 2013
  • /Title: THD88 Dual Interface Smart Card Chip
  • pdf_file_size_bytes: 796693
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 26
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 1418253
  • pdf_hyperlinks: mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 51
state/cert/convert_garbage True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different