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M/Chip Select v2.0.5.2 Application
ANSSI-CC-2001/22
Samsung S3CC9P9 microcontroller
ANSSI-CC-2004/06
name M/Chip Select v2.0.5.2 Application Samsung S3CC9P9 microcontroller
not_valid_before 01.01.2001 11.05.2004
report_link https://www.commoncriteriaportal.org/files/epfiles/2001_22.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2004_06.pdf
st_link https://www.commoncriteriaportal.org/files/epfiles/ https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2004_06.pdf
manufacturer Mondex International Ltd Samsung Electronics Co., Ltd.
manufacturer_web https://www.samsung.com
security_level AVA_VLA.2, EAL1+ ADV_IMP.2, EAL4+, ALC_DVS.2, AVA_VLA.4
dgst cb2462180d97ed8c 473ea605d6a40ef5
heuristics/cert_id ANSSI-CC-2001/22 ANSSI-CC-2004/06
heuristics/extracted_sars ASE_ENV.1, ADV_RCR.1, ADV_FSP.1, AVA_VLA.2, ASE_INT.1, ASE_SRE.1, ASE_TSS.1, ASE_OBJ.1, AGD_USR.1, ATE_IND.1, AGD_ADM.1, ASE_REQ.1, ASE_PPC.1, ASE_DES.1 ASE_ENV.1, ADV_RCR.1, ASE_INT.1, ADV_HLD.2, AGD_USR.1, ALC_DVS.2, ASE_REQ.1, ASE_PPC.1, ASE_DES.1, AVA_SOF.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, AVA_MSU.2, AGD_ADM.1, ALC_LCD.1, ADV_DVS.2, ATE_FUN.1, ADV_IMP.2, ATE_DPT.1, ADV_FSP.1, AVA_VLA.4, ASE_SRE.1, ASE_OBJ.1, ATE_IND.2, ADV_LLD.1, ADV_SPM.1
heuristics/extracted_versions 2.0.5.2 -
heuristics/report_references/directly_referencing {} ANSSI-CC-2002/25
heuristics/report_references/indirectly_referencing {} ANSSI-CC-2002/25
protection_profile_links {} {}
pdf_data/report_filename 2001_22.pdf 2004_06.pdf
pdf_data/report_keywords/cc_cert_id
  • FR:
    • Rapport de certification 2001/22: 3
  • FR:
    • Rapport de certification 2002/25: 1
    • Rapport de certification 2004/06: 13
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL1: 4
  • EAL:
    • EAL1: 1
    • EAL3: 1
    • EAL4: 1
    • EAL4+: 1
    • EAL41: 1
    • EAL5: 1
    • EAL7: 2
  • ITSEC:
    • ITSEC E6 et: 1
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_CAP.1: 1
  • ADO:
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP.1: 1
    • ADV_RCR.1: 1
  • AGD:
    • AGD_ADM.1: 1
    • AGD_USR.1: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VLA.2: 5
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 2
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 1
    • ADO_DEL.2: 2
    • ADO_IGS: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT: 1
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 1
    • ADV_RCR.1: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 1
    • AGD_ADM.1: 1
    • AGD_USR: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 1
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 3
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAA.1: 2
  • FCS:
    • FCS_CKM.1: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 2
    • FDP_ACF.1: 2
    • FDP_IFC.1: 2
    • FDP_IFF.1: 2
    • FDP_SDI.1: 2
  • FIA:
    • FIA_ATD.1: 2
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 2
  • FPT:
    • FPT_PHP.2: 2
    • FPT_PHP.3: 2
    • FPT_TST.1: 2
pdf_data/report_keywords/vendor
  • Infineon:
    • Infineon: 1
    • Infineon Technologies AG: 1
  • Samsung:
    • Samsung: 10
pdf_data/report_keywords/eval_facility
  • Serma:
    • SERMA: 3
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 1
  • DES:
    • DES:
      • DES: 4
pdf_data/report_keywords/standard_id
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
pdf_data/report_metadata
  • /Author: blad
  • /CreationDate: D:20011019120110
  • /Creator: FrameMaker 6.0
  • /ModDate: D:20011019120227+02'00'
  • /Producer: Acrobat Distiller 4.05 for Windows
  • /Title: RapportCertification.book
  • pdf_file_size_bytes: 127795
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 13
  • /Author: DCSSI
  • /CreationDate: D:20040517150819+02'00'
  • /Creator: Acrobat PDFMaker 5.0 pour Word
  • /ModDate: D:20040517150839+03'00'
  • /Producer: Acrobat Distiller 5.0 (Windows)
  • /Subject: Micro-circuit SAMSUNG S3CC9P9
  • /Title: Rapport de certification 2004/06
  • pdf_file_size_bytes: 656869
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 26
pdf_data/st_filename cible2004_06.pdf
pdf_data/st_keywords/cc_cert_id
pdf_data/st_keywords/cc_protection_profile_id
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 2
    • EAL 4 augmented: 1
    • EAL4: 12
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 3
    • ACM_SCP: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_IGS: 3
  • ADV:
    • ADV_DVS.2: 1
    • ADV_FSP: 3
    • ADV_FSP.1: 1
    • ADV_HLD: 2
    • ADV_HLD.2: 1
    • ADV_IMP: 2
    • ADV_IMP.1: 2
    • ADV_IMP.2: 5
    • ADV_LLD: 2
    • ADV_LLD.1: 2
    • ADV_RCR: 3
    • ADV_RCR.1: 1
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 3
    • AGD_ADM.1: 1
    • AGD_USR: 3
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_TAT: 2
    • ALC_TAT.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_MSU: 2
    • AVA_SOF: 2
    • AVA_VLA: 2
    • AVA_VLA.4: 6
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_GEN.1: 2
    • FAU_SAA.1: 7
  • FCS:
    • FCS_CKM.1: 8
    • FCS_CKM.4: 7
    • FCS_COP.1: 8
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACC.2: 5
    • FDP_ACF.1: 6
    • FDP_IFC.1: 6
    • FDP_IFF.1: 6
    • FDP_ITC.1: 3
    • FDP_SDI.1: 5
  • FIA:
    • FIA_ATD.1: 7
    • FIA_UAU.2: 8
    • FIA_UID.1: 1
    • FIA_UID.2: 8
  • FMT:
    • FMT_MOF.1: 7
    • FMT_MSA.1: 6
    • FMT_MSA.2: 3
    • FMT_MSA.3: 7
    • FMT_SMR.1: 7
  • FPR:
    • FPR_UNO: 1
    • FPR_UNO.1: 4
  • FPT:
    • FPT_AMT.1: 2
    • FPT_PHP.2: 5
    • FPT_PHP.3: 5
    • FPT_TST.1: 8
pdf_data/st_keywords/cc_claims
  • A:
    • A.DEV_ORG: 2
    • A.DLV: 1
    • A.DLV_AUDIT: 2
    • A.DLV_PROTECT: 2
    • A.DLV_RESP: 2
    • A.KEY_DEST: 3
    • A.SOFT_ARCHI: 2
    • A.USE_DIAG: 2
    • A.USE_PROD: 2
    • A.USE_SYS: 2
    • A.USE_TEST: 2
  • O:
    • O.CLON: 3
    • O.CRYPTO: 3
    • O.DESIGN: 1
    • O.DESIGN_ACS: 2
    • O.DEV_DIS: 4
    • O.DEV_TOOLS: 3
    • O.DIS_: 3
    • O.DIS_ME: 1
    • O.DIS_MECHANISM: 4
    • O.DIS_MEMORY: 3
    • O.DLV_AUDIT: 1
    • O.DLV_PROTECT: 2
    • O.DLV_RESP: 2
    • O.DSOFT: 1
    • O.DSOFT_ACS: 2
    • O.FLAW: 3
    • O.IC_DLV: 2
    • O.KEY_: 1
    • O.KEY_DEST: 3
    • O.MASK: 1
    • O.MASK_FAB: 2
    • O.MECH: 1
    • O.MECH_ACS: 2
    • O.MOD_: 2
    • O.MOD_MEMORY: 5
    • O.OPER: 1
    • O.OPERATE: 7
    • O.SOFT: 1
    • O.SOFT_ACS: 2
    • O.SOFT_DLV: 2
    • O.SOFT_MECH: 1
    • O.TA: 1
    • O.TAMPER: 3
    • O.TEST_OPERATE: 2
    • O.TI: 1
    • O.TI_ACS: 1
    • O.TOE_PRT: 3
    • O.USE_DIAG: 1
    • O.USE_SYS: 2
  • T:
    • T.CLON: 12
    • T.DIS_DEL: 5
    • T.DIS_DESIGN: 10
    • T.DIS_DSOFT: 8
    • T.DIS_INFO: 4
    • T.DIS_PHOTOMASK: 6
    • T.DIS_SOFT: 7
    • T.DIS_TEST: 5
    • T.DIS_TOOLS: 5
    • T.MOD_DEL: 5
    • T.MOD_DESIGN: 10
    • T.MOD_DSOFT: 9
    • T.MOD_PHOTOMASK: 5
    • T.MOD_SOFT: 10
    • T.T_DEL: 6
    • T.T_PHOTOMASK: 6
    • T.T_PRODUCT: 7
    • T.T_SAMPLE: 8
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 6
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 13
pdf_data/st_keywords/asymmetric_crypto
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
pdf_data/st_keywords/crypto_scheme
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness
pdf_data/st_keywords/cipher_mode
pdf_data/st_keywords/ecc_curve
pdf_data/st_keywords/crypto_engine
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Physical Tampering: 1
    • physical tampering: 5
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/technical_report_id
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id
  • FIPS:
    • FIPS 186: 1
    • FIPS 46-2: 2
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation: 1
    • a smart card embedded software and an IC dedicated software (Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation. 10 To allow the: 1
    • out of scope: 1
pdf_data/st_metadata
  • /CreationDate: D:20040221110009
  • /Creator: AdobePS5.dll Version 5.0.1
  • /ModDate: D:20040221110011+09'00'
  • /Producer: Acrobat Distiller 4.0 for Windows
  • /Title: Microsoft Word - ST C9P9 v1.2_FEB 21_.doc
  • pdf_file_size_bytes: 651062
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 58
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/convert_ok False True
state/st/download_ok False True
state/st/extract_ok False True
state/st/pdf_hash Different Different
state/st/txt_hash Different Different