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XSmart OpenPlatform V1.0
KECS-ISIS-0189-2009 		Samsung S3CC9PB microcontroller (reference S3CC9PBX01)
ANSSI-CC-2002/25
name XSmart OpenPlatform V1.0 Samsung S3CC9PB microcontroller (reference S3CC9PBX01)
scheme KR FR
not_valid_after 01.06.2019 01.09.2019
not_valid_before 08.09.2009 01.01.2002
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ISIS-189-EN.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2002_25.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ISIS-189-ST-EN.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2002_25.pdf
manufacturer LG CNS Samsung Electronics Co., Ltd.
manufacturer_web https://www.lgcns.com/ https://www.samsung.com
security_level EAL4+, AVA_VAN.4 ADV_IMP.2, EAL4+, ALC_DVS.2, AVA_VLA.4
dgst a9830d5166296217 9aa2895387590839
heuristics/cert_id KECS-ISIS-0189-2009 ANSSI-CC-2002/25
heuristics/extracted_sars ASE_INT.1, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, ASE_SPD.1, ATE_DPT.2, ALC_LCD.1, AGD_OPE.1, AGD_PRE.1, ALC_CMS.4, ATE_FUN.1, APE_REQ.2, ADV_ARC.1, ASE_OBJ.2, APE_CCL.1, ADV_TDS.3, ALC_DVS.1, ADV_FSP.4, ATE_IND.2, AVA_VAN.4 ATE_COV.2, ADV_RCR.1, AVA_VLA.4, ALC_TAT.1, AVA_MSU.2, ADV_HLD.2, ATE_FUN.1, AGD_USR.1, ATE_IND.2, AGD_ADM.1, ADV_LLD.1, ALC_DVS.2, ALC_LCD.1, ADV_FSP.2, ADV_IMP.2, ATE_DPT.1, AVA_SOF.1, ADV_SPM.1
heuristics/extracted_versions 1.0 -
heuristics/report_references/directly_referenced_by {} ANSSI-CC-2004/08, ANSSI-CC-2004/06, ANSSI-CC-2004/07
heuristics/report_references/indirectly_referenced_by {} ANSSI-CC-2004/08, ANSSI-CC-2004/06, ANSSI-CC-2004/07
heuristics/scheme_data
pdf_data/report_filename ISIS-189-EN.pdf 2002_25.pdf
pdf_data/report_frontpage
  • FR:
  • FR:
pdf_data/report_keywords/cc_cert_id
  • FR:
    • Rapport de certification 2002/25: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4+: 1
    • EAL5+: 3
  • EAL:
    • EAL 1: 1
    • EAL 4: 5
    • EAL 7: 1
    • EAL1: 1
    • EAL4: 3
    • EAL7: 1
pdf_data/report_keywords/cc_sar
  • ADO:
    • ADO_DEL.1: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DVS.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • APE:
    • APE_CCL.1: 1
    • APE_REQ.2: 1
  • ASE:
    • ASE_ECD: 2
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.2: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.4: 1
  • ACM:
    • ACM_AUT.1: 1
    • ACM_CAP.4: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL.2: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP.2: 1
    • ADV_HLD.2: 1
    • ADV_IMP.2: 6
    • ADV_LLD.1: 1
    • ADV_RCR.1: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM.1: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS.2: 6
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_MSU.2: 1
    • AVA_SOF.1: 1
    • AVA_VLA.4: 8
pdf_data/report_keywords/vendor
  • Infineon:
    • Infineon: 1
    • Infineon Technologies: 1
  • Samsung:
    • Samsung: 17
pdf_data/report_keywords/eval_facility
  • KISA:
    • KISA: 1
  • Serma:
    • Serma Technologies: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • 3DES:
      • TDES: 5
    • DES:
      • DES: 1
  • miscellaneous:
    • SEED:
      • SEED: 2
  • DES:
    • DES:
      • DES: 4
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 3
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 1
  • SCA:
    • DPA: 1
    • SPA: 1
  • FI:
    • physical tampering: 1
pdf_data/report_keywords/standard_id
  • SCP:
    • SCP02: 1
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
pdf_data/report_metadata
  • /Author: Administrator
  • /CreationDate: D:20101026094200+09'00'
  • /Creator: PScript5.dll Version 5.2
  • /ModDate: D:20101026094226+09'00'
  • /Producer: Acrobat Distiller 7.0.5 (Windows)
  • /Title: Microsoft Word - XSmart_OpenPlatform_V1.0_KECS-ISIS-0189-2009_영문.docx
  • pdf_file_size_bytes: 484060
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 36
  • /Author: SGDN/DCSSI
  • /CreationDate: D:20030107150647Z00'00'
  • /Creator: FrameMaker 6.0
  • /ModDate: D:20030107155953Z00'00'
  • /Producer: Acrobat Distiller 5.0 (Windows)
  • /Subject: Samsung S3CC9PB microcontroller
  • /Title: Rapport de certification 2002-25
  • pdf_file_size_bytes: 240469
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 15
pdf_data/st_filename ISIS-189-ST-EN.pdf cible2002_25.pdf
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4+: 1
    • EAL5+: 3
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL4: 2
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADO:
    • ADO_DEL.1: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DVS.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • APE:
    • APE_CCL.1: 1
    • APE_REQ.2: 1
  • ASE:
    • ASE_ECD: 2
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.2: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.4: 1
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 2
    • ACM_SCP: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_IGS: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 1
    • ADV_LLD: 2
    • ADV_RCR: 2
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 1
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_TAT: 2
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 1
  • AVA:
    • AVA_MSU: 2
    • AVA_SOF: 2
    • AVA_VLA: 2
    • AVA_VLA.4: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAA.1: 1
  • FCS:
    • FCS_CKM.1: 2
    • FCS_CKM.4: 2
    • FCS_COP.1: 2
  • FDP:
    • FDP_ACC.2: 1
    • FDP_ACF.1: 2
    • FDP_IFC.1: 1
    • FDP_IFF.1: 2
    • FDP_SDI.1: 1
  • FIA:
    • FIA_ATD.1: 1
    • FIA_UAU.2: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_MOF.1: 2
    • FMT_MSA.1: 2
    • FMT_MSA.3: 2
    • FMT_SMR.1: 2
  • FPR:
    • FPR_UNO.1: 1
  • FPT:
    • FPT_PHP.2: 1
    • FPT_PHP.3: 1
    • FPT_TST.1: 2
pdf_data/st_keywords/cc_claims
  • A:
    • A.DEV_ORG: 1
    • A.DLV: 1
    • A.DLV_AUDIT: 1
    • A.DLV_PROTECT: 1
    • A.DLV_RESP: 1
    • A.KEY_DEST: 2
    • A.SOFT_ARCHI: 1
    • A.USE_DIAG: 1
    • A.USE_PROD: 1
    • A.USE_SYS: 1
    • A.USE_TEST: 1
  • O:
    • O.CLON: 1
    • O.CRYPTO: 2
    • O.DESIGN_ACS: 1
    • O.DEV_DIS: 1
    • O.DEV_TOOLS: 1
    • O.DIS_MECHANISM: 1
    • O.DIS_MEMORY: 1
    • O.DLV_AUDIT: 1
    • O.DLV_PROTECT: 1
    • O.DLV_RESP: 1
    • O.DSOFT_ACS: 1
    • O.FLAW: 1
    • O.IC_DLV: 1
    • O.KEY_DEST: 2
    • O.MASK_FAB: 1
    • O.MECH_ACS: 1
    • O.MOD_MEMORY: 1
    • O.OPERATE: 1
    • O.SOFT_ACS: 1
    • O.SOFT_DLV: 1
    • O.SOFT_MECH: 1
    • O.TAMPER: 1
    • O.TEST_OPERATE: 1
    • O.TOE_PRT: 1
    • O.USE_DIAG: 1
    • O.USE_SYS: 1
  • T:
    • T.CLON: 2
    • T.DIS_DEL: 2
    • T.DIS_DESIGN: 2
    • T.DIS_DSOFT: 2
    • T.DIS_INFO: 1
    • T.DIS_PHOTOMAS: 1
    • T.DIS_PHOTOMASK: 1
    • T.DIS_SOFT: 1
    • T.DIS_TEST: 1
    • T.DIS_TOOLS: 1
    • T.MOD_DEL: 2
    • T.MOD_DESIGN: 1
    • T.MOD_DSOFT: 1
    • T.MOD_PHOTOMA: 1
    • T.MOD_SOFT: 2
    • T.T_DEL: 2
    • T.T_PHOTOMASK: 2
    • T.T_PRODUCT: 2
    • T.T_SAMPLE: 2
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 1
    • Infineon Technologies: 1
  • Samsung:
    • Samsung: 1
pdf_data/st_keywords/eval_facility
  • KISA:
    • KISA: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • 3DES:
      • TDES: 5
    • DES:
      • DES: 1
  • miscellaneous:
    • SEED:
      • SEED: 2
  • DES:
    • DES:
      • DES: 6
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 3
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 1
  • SCA:
    • DPA: 1
    • SPA: 1
  • FI:
    • physical tampering: 6
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/standard_id
  • SCP:
    • SCP02: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation: 1
    • a smart card embedded software and an IC dedicated software (Test ROM code). The former is out of scope of the evaluation, while the latter is within the scope of the evaluation. The TOE submitted to the: 1
    • out of scope: 1
pdf_data/st_metadata
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  • /CreationDate: D:20101026094200+09'00'
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  • /ModDate: D:20101026094226+09'00'
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  • /Title: Microsoft Word - XSmart_OpenPlatform_V1.0_KECS-ISIS-0189-2009_영문.docx
  • pdf_file_size_bytes: 484060
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 36
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  • pdf_file_size_bytes: 267011
  • pdf_hyperlinks: {}
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  • pdf_number_of_pages: 31
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