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BAE Systems Secure KVM Gen2 8560943-2
CCEVS-VR-11304-2023 		S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
BSI-DSZ-CC-0882-V2-2019
name BAE Systems Secure KVM Gen2 8560943-2 S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme US DE
status active archived
not_valid_after 12.01.2028 11.12.2024
not_valid_before 12.01.2023 11.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-ci.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-vr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-st.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882V2b_pdf.pdf
manufacturer BAE Systems Information and Electronic Systems, Inc. Samsung Electronics Co., Ltd.
manufacturer_web https://www.baesystems.com https://www.samsung.com
security_level {} ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 9674e40d5815c857 f97de67112a8125c
heuristics/cert_id CCEVS-VR-11304-2023 BSI-DSZ-CC-0882-V2-2019
heuristics/cert_lab US BSI
heuristics/extracted_sars AGD_PRE.1, ASE_TSS.1, ADV_FSP.1, ALC_CMC.1, ASE_INT.1, ASE_SPD.1, AVA_VAN.1, ATE_IND.1, ALC_CMS.1, AGD_OPE.1, ASE_OBJ.2, ASE_CCL.1, ASE_ECD.1, ASE_REQ.2 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions 8560943, 2 0, 32
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0882-2013
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0720-2011, BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0547-2009, BSI-DSZ-CC-0882-2013, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0801-2012
heuristics/scheme_data
heuristics/protection_profiles 42cf355b24450489, 76f8f05a35d87f59, 814f66c77bc7f33b f6d23054061d72ba
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_vi_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_km_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp_psd_v4.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename st_vid11304-ci.pdf 0882V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • US:
    • CCEVS-VR-VID11304-2023: 1
  • DE:
    • BSI-DSZ-CC-0882-V2-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Samsung:
    • Samsung: 1
pdf_data/cert_keywords/eval_facility
  • Leidos:
    • Leidos: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /CreationDate: D:20230124105725-05'00'
  • /ModDate: D:20230124105725-05'00'
  • /Producer: iText 2.1.0 (by lowagie.com)
  • pdf_file_size_bytes: 180693
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20191216114820+01'00'
  • /Creator: Writer
  • /Keywords: S3CS9AB, 32-Bit, RISC, Microcontroller, Smart Cards, Samsung
  • /ModDate: D:20191216143837+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated SoftwarefromSamsung Electronics
  • /Title: Certification Report BSI-DSZ-CC-0882-V2-2019
  • pdf_file_size_bytes: 289486
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename st_vid11304-vr.pdf 0882V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • US:
    • cert_id: CCEVS-VR-11304-2023
    • cert_item: for BAE Systems Secure KVM Gen2 8560943-2
    • cert_lab: US NIAP
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0882-V2-2019
    • cert_item: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
  • US:
pdf_data/report_keywords/cc_cert_id
  • US:
    • CCEVS-VR-11304-2023: 1
  • DE:
    • BSI-DSZ-CC-0882-2013: 3
    • BSI-DSZ-CC-0882-V2-2019: 15
  • NL:
    • CC-0882-2013: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0035-2007: 1
    • BSI-CC-PP-0035-2007: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 1
    • EAL5: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 2
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_APC_EXT.1: 1
    • FDP_CDS_EXT.1: 1
    • FDP_FIL_EXT: 1
    • FDP_IPC_EXT.1: 2
    • FDP_RIP: 1
    • FDP_SPR_EXT: 1
    • FDP_SWI_EXT.3: 1
  • FTA:
    • FTA_CIN_EXT.1: 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 20
pdf_data/report_keywords/eval_facility
  • Leidos:
    • Leidos: 10
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 4
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 9
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 3
  • OFB:
    • OFB: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 47: 1
    • AIS31: 3
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • OutOfScope:
    • out of scope: 2
    • using a USB connector. This device is not switched and does not use the KVM. The handgrip is out of scope and not part of the TOE. Host PC1 and Host PC2 output HDMI using the DisplayPort dual mode feature: 2
  • ConfidentialDocument:
    • 16] SITE TECHNICAL AUDIT REPORT (STAR), PKL Co., Ltd., Cheonan, Version 4, 02- 12-2019, TÜViT (confidential document) [17] SITE TECHNICAL AUDIT REPORT (STAR), Toppan Photomasks Korea Ltd., Korea Icheon, Version 1: 1
    • IC Dedicated Software, BSI-DSZ-CC-0882-V2-2019, Version 2.2, 14-10- 2019, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [8: 1
    • Report Summary (ETR Summary), BSI-DSZ-CC-0882-V2, S3CS9AB Revision 0, Version 3, 02-12-2019, TÜViT (confidential document) [9] Security Target Lite of S3CS9AB 32-Bit RISC Microcontroller for Smart Cards with specific IC: 1
    • TÜViT (confidential document) 21 / 25 Certification Report BSI-DSZ-CC-0882-V2-2019 C. Excerpts from the Criteria For the: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • evaluation according to AIS 36 for the Product S3CS9AB Revision 0, Version 3, 02-12-2019, TÜViT (confidential document) [11] SC100 Reference Manual, Version 0.0, 15-07-2013, Samsung Electronics [12] S3CS9AB 32-Bit CMOS: 1
pdf_data/report_metadata
pdf_data/st_filename st_vid11304-st.pdf 0882V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_AFL_EXT.1: 1
    • FDP_APC_EXT: 4
    • FDP_APC_EXT.1: 14
    • FDP_CDS_EXT.1: 9
    • FDP_CDS_EXT.1.1: 2
    • FDP_FIL_EXT: 9
    • FDP_FIL_EXT.1: 3
    • FDP_IPC_EXT.1: 10
    • FDP_IPC_EXT.1.1: 1
    • FDP_IPC_EXT.1.2: 1
    • FDP_PDC_EXT: 28
    • FDP_PDC_EXT.1: 7
    • FDP_PDC_EXT.1.1: 1
    • FDP_PDC_EXT.1.2: 1
    • FDP_PDC_EXT.1.3: 1
    • FDP_PDC_EXT.1.4: 1
    • FDP_PDC_EXT.1.5: 1
    • FDP_PDC_EXT.2: 4
    • FDP_PDC_EXT.3: 4
    • FDP_RIP: 8
    • FDP_RIP.1: 1
    • FDP_RIP_EXT.1: 7
    • FDP_RIP_EXT.1.1: 1
    • FDP_SPR_EXT: 9
    • FDP_SPR_EXT.1: 1
    • FDP_SWI_EXT.1: 7
    • FDP_SWI_EXT.1.1: 1
    • FDP_SWI_EXT.2: 9
    • FDP_SWI_EXT.2.1: 1
    • FDP_SWI_EXT.2.2: 1
    • FDP_SWI_EXT.3: 8
    • FDP_SWI_EXT.3.1: 1
    • FDP_UDF_EXT: 14
    • FDP_UDF_EXT.1: 2
  • FPT:
    • FPT_FLS_EXT.1: 7
    • FPT_FLS_EXT.1.1: 1
    • FPT_NTA_EXT.1: 7
    • FPT_NTA_EXT.1.1: 1
    • FPT_PHP.1: 6
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 2
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
    • FPT_TST_EXT.1: 7
    • FPT_TST_EXT.1.1: 1
  • FTA:
    • FTA_CIN_EXT.1: 11
    • FTA_CIN_EXT.1.1: 1
    • FTA_CIN_EXT.1.2: 1
    • FTA_CIN_EXT.1.3: 1
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 4
    • FCS_COP: 8
    • FCS_COP.1: 9
    • FCS_RNG: 6
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • OE:
    • OE.NO_SPECIAL_ANALOG_CAPABILITIES: 1
    • OE.NO_WIRELESS_DEVICES: 1
    • OE.PHYSICAL: 1
    • OE.TRUSTED_ADMIN: 1
    • OE.TRUSTED_CONFIG: 1
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 3
  • STMicroelectronics:
    • STM: 1
  • Samsung:
    • Samsung: 2
pdf_data/st_keywords/eval_facility
  • Leidos:
    • Leidos: 2
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
  • TRNG:
    • DTRNG: 19
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 4
  • OFB:
    • OFB: 2
pdf_data/st_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • physical tampering: 3
  • SCA:
    • side channel: 2
  • FI:
    • Malfunction: 24
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 31: 2
    • AIS31: 1
    • BSI-AIS31: 3
  • CC:
    • CCMB-2017-04-001: 3
    • CCMB-2017-04-002: 3
    • CCMB-2017-04-003: 3
    • CCMB-2017-04-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_metadata
  • /CreationDate: D:20230124105039-05'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20230124105039-05'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • pdf_file_size_bytes: 771042
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 46
  • /Author: Junghyun KIM
  • /CreationDate: D:20191210200347+09'00'
  • /Creator: Microsoft® Word 2016
  • /Keywords: Security Lite Target of S3CS9AB
  • /ModDate: D:20191210200715+09'00'
  • /Producer: Microsoft® Word 2016
  • /Subject: Security Lite Target of S3CS9AB
  • /Title: Security Lite Target
  • pdf_file_size_bytes: 785729
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 57
state/cert/convert_garbage True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different