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BAE Systems Secure KVM Gen2 8560943-2
CCEVS-VR-11304-2023 		S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
BSI-DSZ-CC-0882-2013
name BAE Systems Secure KVM Gen2 8560943-2 S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme US DE
status active archived
not_valid_after 12.01.2028 01.09.2019
not_valid_before 12.01.2023 04.12.2013
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-ci.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-vr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-st.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882b_pdf.pdf
manufacturer BAE Systems Information and Electronic Systems, Inc. Samsung Electronics Co., Ltd.
manufacturer_web https://www.baesystems.com https://www.samsung.com
security_level {} ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 9674e40d5815c857 db89c868db0d272f
heuristics/cert_id CCEVS-VR-11304-2023 BSI-DSZ-CC-0882-2013
heuristics/cert_lab US BSI
heuristics/extracted_sars AGD_PRE.1, ASE_TSS.1, ADV_FSP.1, ALC_CMC.1, ASE_INT.1, ASE_SPD.1, AVA_VAN.1, ATE_IND.1, ALC_CMS.1, AGD_OPE.1, ASE_OBJ.2, ASE_CCL.1, ASE_ECD.1, ASE_REQ.2 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, APE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_FLR.3, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, APE_REQ.2, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, APE_CCL.1, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, APE_INT.1, APE_SPD.1, ATE_IND.2, APE_OBJ.2, ASE_CCL.1, ADV_SPM.1
heuristics/extracted_versions 8560943, 2 0, 32
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0801-2012
heuristics/report_references/indirectly_referenced_by {} BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0720-2011, BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0547-2009, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0801-2012
heuristics/scheme_data
heuristics/protection_profiles 42cf355b24450489, 76f8f05a35d87f59, 814f66c77bc7f33b f6d23054061d72ba
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_vi_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_km_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp_psd_v4.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename st_vid11304-ci.pdf
pdf_data/cert_keywords/cc_cert_id
  • US:
    • CCEVS-VR-VID11304-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
pdf_data/cert_keywords/cc_security_level
pdf_data/cert_keywords/cc_sar
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
pdf_data/cert_keywords/eval_facility
  • Leidos:
    • Leidos: 1
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /CreationDate: D:20230124105725-05'00'
  • /ModDate: D:20230124105725-05'00'
  • /Producer: iText 2.1.0 (by lowagie.com)
  • pdf_file_size_bytes: 180693
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename st_vid11304-vr.pdf 0882a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • US:
    • cert_id: CCEVS-VR-11304-2023
    • cert_item: for BAE Systems Secure KVM Gen2 8560943-2
    • cert_lab: US NIAP
  • DE:
    • cert_id: BSI-DSZ-CC-0882-2013
    • cert_item: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
  • US:
pdf_data/report_keywords/cc_cert_id
  • US:
    • CCEVS-VR-11304-2023: 1
  • DE:
    • BSI-DSZ-CC-0801-2012: 3
    • BSI-DSZ-CC-0882: 1
    • BSI-DSZ-CC-0882-2013: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 4: 2
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL1: 7
    • EAL2: 3
    • EAL3: 4
    • EAL4: 7
    • EAL5: 7
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 2
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_APC_EXT.1: 1
    • FDP_CDS_EXT.1: 1
    • FDP_FIL_EXT: 1
    • FDP_IPC_EXT.1: 2
    • FDP_RIP: 1
    • FDP_SPR_EXT: 1
    • FDP_SWI_EXT.3: 1
  • FTA:
    • FTA_CIN_EXT.1: 2
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 24
pdf_data/report_keywords/eval_facility
  • Leidos:
    • Leidos: 10
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
      • Triple-DES: 2
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 12
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS 46: 1
    • AIS31: 3
pdf_data/report_keywords/certification_process
  • OutOfScope:
    • out of scope: 2
    • using a USB connector. This device is not switched and does not use the KVM. The handgrip is out of scope and not part of the TOE. Host PC1 and Host PC2 output HDMI using the DisplayPort dual mode feature: 2
  • ConfidentialDocument:
    • 2013-11-27, TÜViT (confidential document) [11] Project < Kansa > Life Cycle Definition (Class ALC_CMC.4/CMS.5), Version 1.4, 2013-10-21: 1
    • Electronics (confidential document) [12] S3CS9AB 32-Bit CMOS Microcontroller for Smart Card User’s manual, Version 1.00, April 2013: 1
    • Report Summary (ETR Summary), BSI-DSZ-CC-0882, S3CS9AB Revision 0, Version 3, 2013-11-27, TÜViT (confidential document) [10] ETR for composite evaluation according to AIS 36 for the Product S3CS9AB Revision 0, Version: 1
    • Software (Project Kansa), BSI-DSZ-CC-0882-2013, Version 1.9, 2013-10-21, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [8: 1
pdf_data/report_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20140205100058+01'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software, Samsung Electronics"
  • /ModDate: D:20140206085959+01'00'
  • /Producer: LibreOffice 3.6
  • /Subject: Common Criteria Certification
  • /Title: Certification Report BSI-DSZ-CC-0882-2013
  • pdf_file_size_bytes: 996795
  • pdf_hyperlinks: https://www.bsi.bund.de/zertifizierung, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 38
pdf_data/st_filename st_vid11304-st.pdf 0882b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_AFL_EXT.1: 1
    • FDP_APC_EXT: 4
    • FDP_APC_EXT.1: 14
    • FDP_CDS_EXT.1: 9
    • FDP_CDS_EXT.1.1: 2
    • FDP_FIL_EXT: 9
    • FDP_FIL_EXT.1: 3
    • FDP_IPC_EXT.1: 10
    • FDP_IPC_EXT.1.1: 1
    • FDP_IPC_EXT.1.2: 1
    • FDP_PDC_EXT: 28
    • FDP_PDC_EXT.1: 7
    • FDP_PDC_EXT.1.1: 1
    • FDP_PDC_EXT.1.2: 1
    • FDP_PDC_EXT.1.3: 1
    • FDP_PDC_EXT.1.4: 1
    • FDP_PDC_EXT.1.5: 1
    • FDP_PDC_EXT.2: 4
    • FDP_PDC_EXT.3: 4
    • FDP_RIP: 8
    • FDP_RIP.1: 1
    • FDP_RIP_EXT.1: 7
    • FDP_RIP_EXT.1.1: 1
    • FDP_SPR_EXT: 9
    • FDP_SPR_EXT.1: 1
    • FDP_SWI_EXT.1: 7
    • FDP_SWI_EXT.1.1: 1
    • FDP_SWI_EXT.2: 9
    • FDP_SWI_EXT.2.1: 1
    • FDP_SWI_EXT.2.2: 1
    • FDP_SWI_EXT.3: 8
    • FDP_SWI_EXT.3.1: 1
    • FDP_UDF_EXT: 14
    • FDP_UDF_EXT.1: 2
  • FPT:
    • FPT_FLS_EXT.1: 7
    • FPT_FLS_EXT.1.1: 1
    • FPT_NTA_EXT.1: 7
    • FPT_NTA_EXT.1.1: 1
    • FPT_PHP.1: 6
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 2
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
    • FPT_TST_EXT.1: 7
    • FPT_TST_EXT.1.1: 1
  • FTA:
    • FTA_CIN_EXT.1: 11
    • FTA_CIN_EXT.1.1: 1
    • FTA_CIN_EXT.1.2: 1
    • FTA_CIN_EXT.1.3: 1
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 4
    • FCS_COP: 8
    • FCS_COP.1: 9
    • FCS_RNG: 6
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • OE:
    • OE.NO_SPECIAL_ANALOG_CAPABILITIES: 1
    • OE.NO_WIRELESS_DEVICES: 1
    • OE.PHYSICAL: 1
    • OE.TRUSTED_ADMIN: 1
    • OE.TRUSTED_CONFIG: 1
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 3
  • STMicroelectronics:
    • STM: 1
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/eval_facility
  • Leidos:
    • Leidos: 2
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
  • TRNG:
    • DTRNG: 18
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 3
  • ECB:
    • ECB: 4
  • OFB:
    • OFB: 2
pdf_data/st_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • physical tampering: 3
  • SCA:
    • side channel: 2
  • FI:
    • Malfunction: 24
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 31: 2
    • AIS31: 1
    • BSI-AIS31: 3
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_metadata
  • /CreationDate: D:20230124105039-05'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20230124105039-05'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • pdf_file_size_bytes: 771042
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 46
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company: Samsung Electronics
  • /CreationDate: D:20131021190305+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /ModDate: D:20140206090253+01'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20131021100233
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1315207
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 57
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