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BAE Systems Secure KVM Gen2 8560943-2
CCEVS-VR-11304-2023 		NXP SN300 B2 Series - Secure Element version SN300_SE B2.1.001 JB
NSCIB-CC-2200030-02-CR
name BAE Systems Secure KVM Gen2 8560943-2 NXP SN300 B2 Series - Secure Element version SN300_SE B2.1.001 JB
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme US NL
not_valid_after 12.01.2028 19.11.2029
not_valid_before 12.01.2023 19.11.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-ci.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2200030-02.1-Cert.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-vr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2200030-02-CR.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-st.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2200030-02-STLite_v09.pdf
manufacturer BAE Systems Information and Electronic Systems, Inc. NXP Semiconductors Germany GmbH
manufacturer_web https://www.baesystems.com https://www.nxp.com
security_level {} ALC_FLR.1, EAL5+, AVA_VAN.5, ASE_TSS.2, ALC_DVS.2
dgst 9674e40d5815c857 cd79a4200be9f14f
heuristics/cert_id CCEVS-VR-11304-2023 NSCIB-CC-2200030-02-CR
heuristics/cert_lab US
heuristics/extracted_sars AGD_PRE.1, ASE_TSS.1, ADV_FSP.1, ALC_CMC.1, ASE_INT.1, ASE_SPD.1, AVA_VAN.1, ATE_IND.1, ALC_CMS.1, AGD_OPE.1, ASE_OBJ.2, ASE_CCL.1, ASE_ECD.1, ASE_REQ.2 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ALC_FLR.1, ADV_CMS.5, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ALC_TAT.2, ASE_TSS.2, ADV_TDS.4, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions 8560943, 2 2.1.001
heuristics/report_references/directly_referenced_by {} NSCIB-CC-2200041-03-CR
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-2200041-03-CR
heuristics/scheme_data
heuristics/st_references/directly_referencing {} NSCIB-CC-2200030-01-CR
heuristics/st_references/indirectly_referencing {} NSCIB-CC-2200030-01-CR
heuristics/protection_profiles 42cf355b24450489, 76f8f05a35d87f59, 814f66c77bc7f33b cf0f01bcd7be3e9c
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_vi_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_km_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp_psd_v4.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename st_vid11304-ci.pdf NSCIB-CC-2200030-02.1-Cert.pdf
pdf_data/cert_keywords/cc_cert_id
  • US:
    • CCEVS-VR-VID11304-2023: 1
  • NL:
    • NSCIB-2200030-02: 1
    • NSCIB-CC-2200030-02: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 7: 1
    • EAL2: 1
    • EAL5: 1
    • EAL5 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.3: 1
  • ASE:
    • ASE_TSS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP: 1
    • NXP Semiconductors: 1
pdf_data/cert_keywords/eval_facility
  • Leidos:
    • Leidos: 1
  • TUV:
    • TÜV Informationstechnik: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408-1: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 18045:2008: 1
pdf_data/cert_metadata
  • /CreationDate: D:20230124105725-05'00'
  • /ModDate: D:20230124105725-05'00'
  • /Producer: iText 2.1.0 (by lowagie.com)
  • pdf_file_size_bytes: 180693
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Wim Ton
  • /CreationDate: D:20250129091455+00'00'
  • /Creator: Microsoft® Word 2021
  • /ModDate: D:20250129091455+00'00'
  • /Producer: Microsoft® Word 2021
  • /Title: NSCIB Certificate
  • pdf_file_size_bytes: 87710
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename st_vid11304-vr.pdf NSCIB-CC-2200030-02-CR.pdf
pdf_data/report_frontpage
  • NL:
  • US:
    • cert_id: CCEVS-VR-11304-2023
    • cert_item: for BAE Systems Secure KVM Gen2 8560943-2
    • cert_lab: US NIAP
  • NL:
    • cert_id: NSCIB-CC-2200030-02-CR
    • cert_item: NXP SN300 B2 Series - Secure Element version SN300_SE B2.1.001 JB
    • cert_lab: TÜV Informationstechnik GmbH
    • developer: NXP Semiconductors Germany GmbH
  • US:
pdf_data/report_keywords/cc_cert_id
  • US:
    • CCEVS-VR-11304-2023: 1
  • NL:
    • NSCIB-2200030-02: 1
    • NSCIB-CC-2200030-02: 2
    • NSCIB-CC-2200030-02-CR: 11
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 5: 1
    • EAL 5 augmented: 1
    • EAL4: 1
    • EAL5: 1
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ALC:
    • ALC_DVS.2: 2
    • ALC_FLR.1: 2
  • ASE:
    • ASE_TSS.2: 2
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_APC_EXT.1: 1
    • FDP_CDS_EXT.1: 1
    • FDP_FIL_EXT: 1
    • FDP_IPC_EXT.1: 2
    • FDP_RIP: 1
    • FDP_SPR_EXT: 1
    • FDP_SWI_EXT.3: 1
  • FTA:
    • FTA_CIN_EXT.1: 2
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 13
    • NXP Semiconductors: 3
pdf_data/report_keywords/eval_facility
  • Leidos:
    • Leidos: 10
  • TUV:
    • TÜV Informationstechnik: 3
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • SCA:
    • side-channel: 1
  • other:
    • JIL: 2
    • JIL-AAPS: 1
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 2
pdf_data/report_keywords/standard_id
  • ISO:
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • OutOfScope:
    • out of scope: 2
    • using a USB connector. This device is not switched and does not use the KVM. The handgrip is out of scope and not part of the TOE. Host PC1 and Host PC2 output HDMI using the DisplayPort dual mode feature: 2
pdf_data/report_metadata
pdf_data/st_filename st_vid11304-st.pdf NSCIB-CC-2200030-02-STLite_v09.pdf
pdf_data/st_keywords/cc_cert_id
  • NL:
    • NSCIB-2200030-01: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL5: 13
    • EAL5 augmented: 2
    • EAL5+: 3
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ADV:
    • ADV_ARC.1: 5
    • ADV_CMS.4: 1
    • ADV_CMS.5: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 2
    • ADV_FSP.2: 3
    • ADV_FSP.4: 4
    • ADV_FSP.5: 5
    • ADV_IMP.1: 6
    • ADV_INT.2: 1
    • ADV_TDS.1: 5
    • ADV_TDS.3: 2
    • ADV_TDS.4: 3
  • AGD:
    • AGD_OPE.1: 4
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 2
    • ALC_CMS: 1
    • ALC_CMS.4: 2
    • ALC_CMS.5: 4
    • ALC_DEL.1: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR.1: 6
    • ALC_LCD.1: 3
    • ALC_TAT.1: 4
    • ALC_TAT.2: 2
  • ASE:
    • ASE_CCL: 2
    • ASE_CCL.1: 2
    • ASE_ECD: 1
    • ASE_ECD.1: 3
    • ASE_INT: 2
    • ASE_INT.1: 4
    • ASE_OBJ.2: 3
    • ASE_REQ: 2
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD: 2
    • ASE_SPD.1: 2
    • ASE_TSS: 2
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV.1: 1
    • ATE_COV.2: 2
    • ATE_DPT.1: 1
    • ATE_DPT.3: 2
    • ATE_FUN.1: 7
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 5
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_AFL_EXT.1: 1
    • FDP_APC_EXT: 4
    • FDP_APC_EXT.1: 14
    • FDP_CDS_EXT.1: 9
    • FDP_CDS_EXT.1.1: 2
    • FDP_FIL_EXT: 9
    • FDP_FIL_EXT.1: 3
    • FDP_IPC_EXT.1: 10
    • FDP_IPC_EXT.1.1: 1
    • FDP_IPC_EXT.1.2: 1
    • FDP_PDC_EXT: 28
    • FDP_PDC_EXT.1: 7
    • FDP_PDC_EXT.1.1: 1
    • FDP_PDC_EXT.1.2: 1
    • FDP_PDC_EXT.1.3: 1
    • FDP_PDC_EXT.1.4: 1
    • FDP_PDC_EXT.1.5: 1
    • FDP_PDC_EXT.2: 4
    • FDP_PDC_EXT.3: 4
    • FDP_RIP: 8
    • FDP_RIP.1: 1
    • FDP_RIP_EXT.1: 7
    • FDP_RIP_EXT.1.1: 1
    • FDP_SPR_EXT: 9
    • FDP_SPR_EXT.1: 1
    • FDP_SWI_EXT.1: 7
    • FDP_SWI_EXT.1.1: 1
    • FDP_SWI_EXT.2: 9
    • FDP_SWI_EXT.2.1: 1
    • FDP_SWI_EXT.2.2: 1
    • FDP_SWI_EXT.3: 8
    • FDP_SWI_EXT.3.1: 1
    • FDP_UDF_EXT: 14
    • FDP_UDF_EXT.1: 2
  • FPT:
    • FPT_FLS_EXT.1: 7
    • FPT_FLS_EXT.1.1: 1
    • FPT_NTA_EXT.1: 7
    • FPT_NTA_EXT.1.1: 1
    • FPT_PHP.1: 6
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 2
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
    • FPT_TST_EXT.1: 7
    • FPT_TST_EXT.1.1: 1
  • FTA:
    • FTA_CIN_EXT.1: 11
    • FTA_CIN_EXT.1.1: 1
    • FTA_CIN_EXT.1.2: 1
    • FTA_CIN_EXT.1.3: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 5
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_RNG: 6
    • FCS_RNG.1: 3
  • FDP:
    • FDP_IFC.1: 7
    • FDP_ITT.1: 6
    • FDP_SDC: 1
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 1
    • FDP_SDI: 4
    • FDP_SDI.1: 1
    • FDP_SDI.2: 3
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 4
    • FMT_LIM.2: 3
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
  • FRU:
    • FRU_FLT.2: 8
  • FTP:
    • FTP_FLS.1: 1
pdf_data/st_keywords/cc_claims
  • OE:
    • OE.NO_SPECIAL_ANALOG_CAPABILITIES: 1
    • OE.NO_WIRELESS_DEVICES: 1
    • OE.PHYSICAL: 1
    • OE.TRUSTED_ADMIN: 1
    • OE.TRUSTED_CONFIG: 1
  • O:
    • O.RND: 1
    • O.RND_HW: 4
  • T:
    • T.RND: 1
    • T.RND_HW: 3
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 3
  • STMicroelectronics:
    • STM: 1
  • NXP:
    • NXP: 111
    • NXP Semiconductors: 29
pdf_data/st_keywords/eval_facility
  • Leidos:
    • Leidos: 2
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 2
  • DES:
    • DES:
      • DES: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 2
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • CFB:
    • CFB: 1
  • CTR:
    • CTR: 1
  • GCM:
    • GCM: 2
  • OFB:
    • OFB: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • physical tampering: 3
  • SCA:
    • side channel: 2
  • FI:
    • Malfunction: 5
    • malfunction: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
    • side channel: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 140-3: 2
  • ISO:
    • ISO/IEC 7816: 4
pdf_data/st_metadata
  • /CreationDate: D:20230124105039-05'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20230124105039-05'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • pdf_file_size_bytes: 771042
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 46
  • /Author: NXP B.V.
  • /CreationDate: D:20230509104646+02'00'
  • /Creator: DITA Open Toolkit 3.3.1
  • /Keywords: NXP, ASE, SN300 B2 Single Chip Secured (NFC) Controller Series, Single Chip Secure Element and NFC Controller, Common Criteria, EAL5 augmented
  • /Producer: Apache FOP Version 2.3
  • /Subject: NXP SN300 B2 Series - Secure Element
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 846702
  • pdf_hyperlinks: mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 37
state/cert/convert_garbage True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different