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BAE Systems Secure KVM Gen2 8560943-2
CCEVS-VR-11304-2023 		ST Engineering Data Diode Model 5282, version 2.2.1055 & Model 5283 version 2.2.1055
CSA_CC_21006
name BAE Systems Secure KVM Gen2 8560943-2 ST Engineering Data Diode Model 5282, version 2.2.1055 & Model 5283 version 2.2.1055
category Other Devices and Systems Boundary Protection Devices and Systems
scheme US SG
not_valid_after 12.01.2028 08.07.2027
not_valid_before 12.01.2023 08.07.2022
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-ci.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/[CER]%20ST%20Engineering%20Data%20Diode%20model%205282%20and%205283%20CC%20Certificate_signed.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-vr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/[CER]%20Certificate%20Report%20-%20ST%20Engineering%20Data%20Diode%20model%205282%20and%205283.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-st.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/[DD]%20STEng%20Data%20Diode%20Security%20Target_v4.0_EAL4.pdf
manufacturer BAE Systems Information and Electronic Systems, Inc. ST Engineering Electronics
manufacturer_web https://www.baesystems.com https://www.stengg.com
security_level {} EAL4+, AVA_VAN.5
dgst 9674e40d5815c857 1dab1c190f3b92d2
heuristics/cert_id CCEVS-VR-11304-2023 CSA_CC_21006
heuristics/cert_lab US []
heuristics/extracted_sars AGD_PRE.1, ASE_TSS.1, ADV_FSP.1, ALC_CMC.1, ASE_INT.1, ASE_SPD.1, AVA_VAN.1, ATE_IND.1, ALC_CMS.1, AGD_OPE.1, ASE_OBJ.2, ASE_CCL.1, ASE_ECD.1, ASE_REQ.2 ASE_INT.1, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, ASE_SPD.1, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, AGD_OPE.1, AGD_PRE.1, ALC_CMS.4, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.3, ATE_DPT.1, ASE_REQ.2, ALC_DVS.1, ADV_FSP.4, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions 8560943, 2 2.2.1055
heuristics/scheme_data
heuristics/protection_profiles 42cf355b24450489, 76f8f05a35d87f59, 814f66c77bc7f33b {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_vi_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_km_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp_psd_v4.0.pdf {}
pdf_data/cert_filename st_vid11304-ci.pdf [CER] ST Engineering Data Diode model 5282 and 5283 CC Certificate_signed.pdf
pdf_data/cert_keywords/cc_cert_id
  • US:
    • CCEVS-VR-VID11304-2023: 1
  • SG:
    • CSA_CC_21006: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/eval_facility
  • Leidos:
    • Leidos: 1
  • An:
    • An Security: 1
pdf_data/cert_metadata
  • /CreationDate: D:20230124105725-05'00'
  • /ModDate: D:20230124105725-05'00'
  • /Producer: iText 2.1.0 (by lowagie.com)
  • pdf_file_size_bytes: 180693
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /CreationDate: D:20220708024530+08'00'
  • /ModDate: D:20220711181729+08'00'
  • pdf_file_size_bytes: 495889
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename st_vid11304-vr.pdf [CER] Certificate Report - ST Engineering Data Diode model 5282 and 5283.pdf
pdf_data/report_frontpage
  • US:
    • cert_id: CCEVS-VR-11304-2023
    • cert_item: for BAE Systems Secure KVM Gen2 8560943-2
    • cert_lab: US NIAP
  • US:
pdf_data/report_keywords/cc_cert_id
  • US:
    • CCEVS-VR-11304-2023: 1
  • SG:
    • CSA_CC_21006: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 4: 2
    • EAL 4 augmented: 1
    • EAL4+: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ALC:
    • ALC_FLR: 1
  • ATE:
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_VAN: 3
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_APC_EXT.1: 1
    • FDP_CDS_EXT.1: 1
    • FDP_FIL_EXT: 1
    • FDP_IPC_EXT.1: 2
    • FDP_RIP: 1
    • FDP_SPR_EXT: 1
    • FDP_SWI_EXT.3: 1
  • FTA:
    • FTA_CIN_EXT.1: 2
pdf_data/report_keywords/cc_claims
  • OE:
    • OE.NETWORK: 1
    • OE.PHYSICAL: 1
    • OE.USER: 1
pdf_data/report_keywords/eval_facility
  • Leidos:
    • Leidos: 10
  • An:
    • An Security: 3
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-004: 1
    • CCMB-2018-04-003: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • OutOfScope:
    • out of scope: 2
    • using a USB connector. This device is not switched and does not use the KVM. The handgrip is out of scope and not part of the TOE. Host PC1 and Host PC2 output HDMI using the DisplayPort dual mode feature: 2
pdf_data/report_metadata
pdf_data/st_filename st_vid11304-st.pdf [DD] STEng Data Diode Security Target_v4.0_EAL4.pdf
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4+: 3
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 5
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_AFL_EXT.1: 1
    • FDP_APC_EXT: 4
    • FDP_APC_EXT.1: 14
    • FDP_CDS_EXT.1: 9
    • FDP_CDS_EXT.1.1: 2
    • FDP_FIL_EXT: 9
    • FDP_FIL_EXT.1: 3
    • FDP_IPC_EXT.1: 10
    • FDP_IPC_EXT.1.1: 1
    • FDP_IPC_EXT.1.2: 1
    • FDP_PDC_EXT: 28
    • FDP_PDC_EXT.1: 7
    • FDP_PDC_EXT.1.1: 1
    • FDP_PDC_EXT.1.2: 1
    • FDP_PDC_EXT.1.3: 1
    • FDP_PDC_EXT.1.4: 1
    • FDP_PDC_EXT.1.5: 1
    • FDP_PDC_EXT.2: 4
    • FDP_PDC_EXT.3: 4
    • FDP_RIP: 8
    • FDP_RIP.1: 1
    • FDP_RIP_EXT.1: 7
    • FDP_RIP_EXT.1.1: 1
    • FDP_SPR_EXT: 9
    • FDP_SPR_EXT.1: 1
    • FDP_SWI_EXT.1: 7
    • FDP_SWI_EXT.1.1: 1
    • FDP_SWI_EXT.2: 9
    • FDP_SWI_EXT.2.1: 1
    • FDP_SWI_EXT.2.2: 1
    • FDP_SWI_EXT.3: 8
    • FDP_SWI_EXT.3.1: 1
    • FDP_UDF_EXT: 14
    • FDP_UDF_EXT.1: 2
  • FPT:
    • FPT_FLS_EXT.1: 7
    • FPT_FLS_EXT.1.1: 1
    • FPT_NTA_EXT.1: 7
    • FPT_NTA_EXT.1.1: 1
    • FPT_PHP.1: 6
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 2
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
    • FPT_TST_EXT.1: 7
    • FPT_TST_EXT.1.1: 1
  • FTA:
    • FTA_CIN_EXT.1: 11
    • FTA_CIN_EXT.1.1: 1
    • FTA_CIN_EXT.1.2: 1
    • FTA_CIN_EXT.1.3: 1
  • FDP:
    • FDP_IFC.1: 2
    • FDP_IFC.2: 9
    • FDP_IFC.2.1: 1
    • FDP_IFC.2.2: 1
    • FDP_IFF: 1
    • FDP_IFF.1: 8
    • FDP_IFF.1.1: 1
    • FDP_IFF.1.3: 1
    • FDP_IFF.1.4: 1
    • FDP_IFF.1.5: 1
  • FMT:
    • FMT_MSA.3: 3
pdf_data/st_keywords/cc_claims
  • OE:
    • OE.NO_SPECIAL_ANALOG_CAPABILITIES: 1
    • OE.NO_WIRELESS_DEVICES: 1
    • OE.PHYSICAL: 1
    • OE.TRUSTED_ADMIN: 1
    • OE.TRUSTED_CONFIG: 1
  • A:
    • A.NETWORK: 4
    • A.PHYSICAL: 4
    • A.USER: 3
  • O:
    • O.ONEWAY: 2
  • OE:
    • OE.NETWORK: 3
    • OE.PHYSICAL: 3
    • OE.USER: 3
  • T:
    • T.RCVDATALEAK: 1
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 3
  • STMicroelectronics:
    • STM: 1
pdf_data/st_keywords/eval_facility
  • Leidos:
    • Leidos: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • physical tampering: 3
  • SCA:
    • side channel: 2
pdf_data/st_metadata
  • /CreationDate: D:20230124105039-05'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20230124105039-05'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • pdf_file_size_bytes: 771042
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 46
  • /Author: Tan Kok Kheng
  • /CreationDate: D:20220526092514+08'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20220708070046+08'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • /Title: Technical Manual Template
  • pdf_file_size_bytes: 516888
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 19
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