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BAE Systems Secure KVM Gen2 8560943-2
CCEVS-VR-11304-2023 		MN67S140, RV3, FV12 - EAST JAPAN RAILWAY COMPANY SuicaII Contactless Smart Card IC Chip
BSI-DSZ-CC-0334-2006
name BAE Systems Secure KVM Gen2 8560943-2 MN67S140, RV3, FV12 - EAST JAPAN RAILWAY COMPANY SuicaII Contactless Smart Card IC Chip
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme US DE
status active archived
not_valid_after 12.01.2028 01.09.2019
not_valid_before 12.01.2023 01.01.2007
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-ci.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-vr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0334a.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/st_vid11304-st.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0334b.pdf
manufacturer BAE Systems Information and Electronic Systems, Inc. Matsushita Electric Industrial Co., Ltd.
manufacturer_web https://www.baesystems.com https://www.panasonic.net/
security_level {} EAL4
dgst 9674e40d5815c857 0dd69475f9213f4b
heuristics/cert_id CCEVS-VR-11304-2023 BSI-DSZ-CC-0334-2006
heuristics/cert_lab US BSI
heuristics/extracted_sars AGD_PRE.1, ASE_TSS.1, ADV_FSP.1, ALC_CMC.1, ASE_INT.1, ASE_SPD.1, AVA_VAN.1, ATE_IND.1, ALC_CMS.1, AGD_OPE.1, ASE_OBJ.2, ASE_CCL.1, ASE_ECD.1, ASE_REQ.2 ASE_ENV.1, ADV_RCR.1, ASE_INT.1, ADV_HLD.2, AGD_USR.1, ALC_DVS.2, ASE_REQ.1, ASE_PPC.1, ASE_DES.1, ADV_FSP.2, AVA_SOF.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, AGD_ADM.1, ALC_LCD.1, ATE_FUN.1, ADV_IMP.2, ATE_DPT.1, AVA_VLA.4, ASE_SRE.1, ASE_OBJ.1, ATE_IND.2, ADV_LLD.1, ADV_SPM.1, AVA_MSU.3
heuristics/extracted_versions 8560943, 2 -
heuristics/scheme_data
heuristics/protection_profiles 42cf355b24450489, 76f8f05a35d87f59, 814f66c77bc7f33b {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_vi_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/mod_km_v1.0.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp_psd_v4.0.pdf {}
pdf_data/cert_filename st_vid11304-ci.pdf
pdf_data/cert_keywords/cc_cert_id
  • US:
    • CCEVS-VR-VID11304-2023: 1
pdf_data/cert_keywords/cc_protection_profile_id
pdf_data/cert_keywords/cc_security_level
pdf_data/cert_keywords/cc_sar
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
pdf_data/cert_keywords/eval_facility
  • Leidos:
    • Leidos: 1
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /CreationDate: D:20230124105725-05'00'
  • /ModDate: D:20230124105725-05'00'
  • /Producer: iText 2.1.0 (by lowagie.com)
  • pdf_file_size_bytes: 180693
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename st_vid11304-vr.pdf 0334a.pdf
pdf_data/report_frontpage
  • DE:
  • US:
    • cert_id: CCEVS-VR-11304-2023
    • cert_item: for BAE Systems Secure KVM Gen2 8560943-2
    • cert_lab: US NIAP
  • DE:
    • cert_id: BSI-DSZ-CC-0334-2006
    • cert_item: MN67S140, RV3, FV12 – EAST JAPAN RAILWAY COMPANY SuicaII Contactless Smart Card IC Chip
    • cert_lab: BSI
    • developer: Matsushita Electric Industrial Co., Ltd. Certification Report BSI-DSZ-CC-0334-2006 ZS-01-01-F-329 V3.21 BSI - Bundesamt für Sicherheit in der Informationstechnik, Postfach 20 03 63, D-53133 Bonn Phone +49 228 9582-0, Fax +49 228 9582-455, Infoline +49 228 9582-111
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
  • US:
pdf_data/report_keywords/cc_cert_id
  • US:
    • CCEVS-VR-11304-2023: 1
  • DE:
    • BSI-DSZ-CC-0334: 2
    • BSI-DSZ-CC-0334-2006: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0002-2001: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 4: 1
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 15
    • EAL4 augmented: 3
    • EAL5: 6
    • EAL5+: 1
    • EAL6: 3
    • EAL7: 4
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 2
    • ACM_CAP: 2
    • ACM_CAP.4: 2
    • ACM_SCP: 2
    • ACM_SCP.2: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_HLD: 2
    • ADV_HLD.2: 1
    • ADV_IMP: 2
    • ADV_IMP.2: 5
    • ADV_INT: 2
    • ADV_LLD: 2
    • ADV_LLD.1: 1
    • ADV_RCR: 2
    • ADV_RCR.1: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 4
    • AGD_ADM.1: 1
    • AGD_USR: 2
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 6
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.1: 2
    • ALC_TAT: 2
    • ALC_TAT.1: 2
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_COV.2: 1
    • ATE_DPT: 2
    • ATE_DPT.1: 1
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_IND: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 2
    • AVA_MSU.3: 5
    • AVA_SOF: 4
    • AVA_SOF.1: 1
    • AVA_VLA: 4
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 6
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_APC_EXT.1: 1
    • FDP_CDS_EXT.1: 1
    • FDP_FIL_EXT: 1
    • FDP_IPC_EXT.1: 2
    • FDP_RIP: 1
    • FDP_SPR_EXT: 1
    • FDP_SWI_EXT.3: 1
  • FTA:
    • FTA_CIN_EXT.1: 2
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_CKM.1: 2
    • FCS_CKM.4: 2
    • FCS_COP: 2
    • FCS_RND.1: 1
  • FDP:
    • FDP_IFC.1: 1
    • FDP_ITC.1: 2
    • FDP_ITC.2: 2
    • FDP_ITT.1: 1
  • FMT:
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
    • FMT_MSA.2: 2
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_SEP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • A:
    • A.DES: 1
pdf_data/report_keywords/vendor
  • Infineon:
    • Infineon Technologies AG: 1
  • Philips:
    • Philips: 1
pdf_data/report_keywords/eval_facility
  • Leidos:
    • Leidos: 10
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • 3DES:
      • Triple-DES: 4
    • DES:
      • DES: 9
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 5
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • FI:
    • DFA: 1
    • Malfunction: 1
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • Physical Probing: 1
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/cplc_data
  • ICVersion:
    • IC Version: 2
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 2
    • AIS 34: 2
    • AIS 36: 3
  • ISO:
    • ISO/IEC 14443-2: 1
    • ISO/IEC 15408:1999: 1
    • ISO/IEC15408: 1999: 1
pdf_data/report_keywords/certification_process
  • OutOfScope:
    • out of scope: 2
    • using a USB connector. This device is not switched and does not use the KVM. The handgrip is out of scope and not part of the TOE. Host PC1 and Host PC2 output HDMI using the DisplayPort dual mode feature: 2
  • ConfidentialDocument:
    • COMPANY SuicaII Contactless Smardcard IC Chip, Version 5, BSI-DSZ-CC-0334, from 03.03.2006, (confidential document) B-21 BSI-DSZ-CC-0334-2006 Certification Report [9] Smartcard IC Platform Protection Profile: 1
    • MN67S140 Smartcard IC Security Target, 1.2, 02.02.2006, Matsushita Electric Industrial Co., Ltd. (confidential document) [6]. The evaluators verified, that the threats are countered and the security objectives for the: 1
    • MN67S140 Smartcard IC Security Target, 1.2, 02.02.2006, Matsushita Electric Industrial Co., Ltd. (confidential document) [7] MN67S140 Smartcard IC Security Target (ST-Lite), 1.2, 02.02.2006, Matsushita Electric: 1
pdf_data/report_metadata
  • /Author: BSI
  • /Company: BSI, Postfach 200363, 53133 Bonn
  • /CreationDate: D:20060315085757+01'00'
  • /Creator: Acrobat PDFMaker 7.0.5 für Word
  • /Keywords: Smart Card, Contactless, Certification Report, BSI
  • /ModDate: D:20060315085838+01'00'
  • /Producer: Acrobat Distiller 7.0.5 (Windows)
  • /SourceModified: D:20060315075736
  • /Subject: Contactless Smart Card
  • /Title: Certification Report BSI-DSZ-CC-0334-2006
  • pdf_file_size_bytes: 642460
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 48
pdf_data/st_filename st_vid11304-st.pdf 0334b.pdf
pdf_data/st_keywords/cc_cert_id
  • NL:
    • CC-1: 3
    • CC-2: 2
    • CC-3: 2
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0002: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 4
    • EAL4 augmented: 2
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.1: 1
    • ALC_CMS.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 2
    • ACM_CAP: 2
    • ACM_CAP.4: 1
    • ACM_SCP: 2
    • ACM_SCP.2: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 2
    • ADV_HLD.2: 2
    • ADV_IMP.2: 4
    • ADV_LLD.1: 2
    • ADV_RCR.1: 2
    • ADV_SPM.1: 5
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 2
    • AGD_USR: 2
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 4
    • ALC_LCD: 1
    • ALC_LCD.1: 2
    • ALC_TAT: 1
    • ALC_TAT.1: 2
  • ATE:
    • ATE_COV: 2
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_MSU.3: 4
    • AVA_SOF: 2
    • AVA_SOF.1: 1
    • AVA_VLA: 2
    • AVA_VLA.4: 4
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_AFL_EXT.1: 1
    • FDP_APC_EXT: 4
    • FDP_APC_EXT.1: 14
    • FDP_CDS_EXT.1: 9
    • FDP_CDS_EXT.1.1: 2
    • FDP_FIL_EXT: 9
    • FDP_FIL_EXT.1: 3
    • FDP_IPC_EXT.1: 10
    • FDP_IPC_EXT.1.1: 1
    • FDP_IPC_EXT.1.2: 1
    • FDP_PDC_EXT: 28
    • FDP_PDC_EXT.1: 7
    • FDP_PDC_EXT.1.1: 1
    • FDP_PDC_EXT.1.2: 1
    • FDP_PDC_EXT.1.3: 1
    • FDP_PDC_EXT.1.4: 1
    • FDP_PDC_EXT.1.5: 1
    • FDP_PDC_EXT.2: 4
    • FDP_PDC_EXT.3: 4
    • FDP_RIP: 8
    • FDP_RIP.1: 1
    • FDP_RIP_EXT.1: 7
    • FDP_RIP_EXT.1.1: 1
    • FDP_SPR_EXT: 9
    • FDP_SPR_EXT.1: 1
    • FDP_SWI_EXT.1: 7
    • FDP_SWI_EXT.1.1: 1
    • FDP_SWI_EXT.2: 9
    • FDP_SWI_EXT.2.1: 1
    • FDP_SWI_EXT.2.2: 1
    • FDP_SWI_EXT.3: 8
    • FDP_SWI_EXT.3.1: 1
    • FDP_UDF_EXT: 14
    • FDP_UDF_EXT.1: 2
  • FPT:
    • FPT_FLS_EXT.1: 7
    • FPT_FLS_EXT.1.1: 1
    • FPT_NTA_EXT.1: 7
    • FPT_NTA_EXT.1.1: 1
    • FPT_PHP.1: 6
    • FPT_PHP.1.1: 1
    • FPT_PHP.1.2: 1
    • FPT_PHP.3: 2
    • FPT_TST.1: 7
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
    • FPT_TST_EXT.1: 7
    • FPT_TST_EXT.1.1: 1
  • FTA:
    • FTA_CIN_EXT.1: 11
    • FTA_CIN_EXT.1.1: 1
    • FTA_CIN_EXT.1.2: 1
    • FTA_CIN_EXT.1.3: 1
  • FAU:
    • FAU_GEN.1: 1
    • FAU_SAS.1: 10
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 12
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 1
    • FCS_CKM.4: 9
    • FCS_CKM.4.1: 1
    • FCS_COP: 32
    • FCS_COP.1: 3
    • FCS_RND: 2
    • FCS_RND.1: 8
    • FCS_RND.1.1: 2
  • FDP:
    • FDP_ACC.1: 4
    • FDP_IFC.1: 17
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 1
    • FDP_ITC.1: 12
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITC.2: 12
    • FDP_ITC.2.1: 1
    • FDP_ITC.2.2: 1
    • FDP_ITC.2.3: 1
    • FDP_ITC.2.4: 1
    • FDP_ITC.2.5: 1
    • FDP_ITT.1: 11
    • FDP_ITT.1.1: 1
    • FDP_PHP.3: 1
  • FMT:
    • FMT_LIM.1: 9
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 9
    • FMT_LIM.2.1: 1
    • FMT_MSA.1: 1
    • FMT_MSA.2: 13
    • FMT_MSA.2.1: 1
    • FMT_MSA.3: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 24
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 10
    • FPT_ITT.1.1: 1
    • FPT_PHP: 1
    • FPT_PHP.3: 12
    • FPT_PHP.3.1: 1
    • FPT_SEP.1: 10
    • FPT_SEP.1.1: 1
    • FPT_SEP.1.2: 1
    • FPT_TDC.1: 1
  • FRU:
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
  • FTP:
    • FTP_ITC.1: 1
    • FTP_TRP.1: 1
pdf_data/st_keywords/cc_claims
  • OE:
    • OE.NO_SPECIAL_ANALOG_CAPABILITIES: 1
    • OE.NO_WIRELESS_DEVICES: 1
    • OE.PHYSICAL: 1
    • OE.TRUSTED_ADMIN: 1
    • OE.TRUSTED_CONFIG: 1
  • A:
    • A.DES: 5
  • O:
    • O.RND: 4
  • OE:
    • OE.DES: 10
  • T:
    • T.RND: 3
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 3
  • STMicroelectronics:
    • STM: 1
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
pdf_data/st_keywords/eval_facility
  • Leidos:
    • Leidos: 2
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • 3DES:
      • 3DES: 4
      • Triple-DES: 3
    • DES:
      • DES: 24
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 7
    • RNG: 4
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • physical tampering: 3
  • SCA:
    • side channel: 2
  • FI:
    • DFA: 3
    • Malfunction: 17
    • malfunction: 6
    • physical tampering: 1
  • SCA:
    • DPA: 4
    • Leak-Inherent: 19
    • Physical Probing: 3
    • Physical probing: 1
    • SPA: 3
    • physical probing: 5
    • timing attack: 1
  • other:
    • JIL: 2
    • reverse engineering: 2
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 5
  • FIPS:
    • FIPS PUB 46-3: 2
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 14443-2: 1
    • ISO/IEC 15408:1999: 1
pdf_data/st_metadata
  • /CreationDate: D:20230124105039-05'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /ModDate: D:20230124105039-05'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • pdf_file_size_bytes: 771042
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 46
  • /Author: boedekep
  • /CreationDate: D:20060202095700+01'00'
  • /Creator: pdfFactory Pro www.pdffactory.com
  • /Producer: pdfFactory Pro 2.46 (Windows XP Professional German)
  • /Title: ASE-Lite_MN67S140_eng_1.2.doc
  • pdf_file_size_bytes: 407378
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 76
state/cert/convert_garbage True False
state/cert/convert_ok True False
state/cert/download_ok True False
state/cert/extract_ok True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different